JP2000183502A - Member for transfer, conductive pattern transferred body, and manufacture of member for transfer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve capability of being transferred to a body to be transferred and prevent occurrences of bleeding during transferring by composing a member for transfer of at least one conductive layer formed on a conductive substrate and an insulating resin layer formed thereon, and controlling the percentage of the solvent content in the insulating resin layer to a specific value. SOLUTION: An electrically insulating photoresist layer 2 is formed on a conductive substrate 1, exposed to light, and developed to form an electrical insulating mask pattern 2'. A conductive layer 3 is formed on the non-mask area by electrolytic plating, and an insulating resin layer 4 is selectively deposited thereon by electrodeposition. Since the insulating resin layer 4 thus formed by electrodeposition contains solvent, the workpiece is dried before a transferring process to control the percentage of the solvent content to a range of 50-75 wt.%. As a result, when the conductive layer with the pattern formed thereon is transferred to a substrate to be transferred, a bleeding phenomenon does not occur.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a transfer member having a fine pattern and a method for manufacturing the same. In particular, a conductive layer patterned on a substrate, which can be used for manufacturing a multilayer printed wiring board, a metal base printed wiring board, a package suspension, a suspension with wiring for a hard disk magnetic head, a coil wiring for a non-contact IC card, and the like. And a method for manufacturing the same.

[0002]

2. Description of the Related Art Due to the rapid development of technology in the electric field, as represented by CSP, semiconductor packages have been reduced in size, the number of pins has been increased, the fine pitch has been increased, bare chip mounting,
High-density packaging technology, such as miniaturization of electronic components, is rapidly developing. Along with this, the mounting density of printed wiring boards has also progressed in the form of higher density in the layer direction with the shift to single-sided wiring, double-sided wiring, multi-layering, and thinning, and further thinning has been promoted.

[0003] A subtractive method and an additive method are generally used for forming a copper pattern on such a printed wiring board.

In the subtractive method, typically, after making a hole in a copper-clad laminate, copper plating is performed on the inside and surface of the hole, an etching resist is formed by a photolithographic method, and then the copper-clad board is removed. This is a method of forming a conductor circuit by etching. Although this method is technically almost completed and low in cost, the formation of a fine pattern is limited due to restrictions such as the thickness of the copper foil during etching. In addition, the production of a multilayer printed wiring board using a double-sided circuit board produced by the above-described subtractive method has a limit in terms of the precision of drilling for double-sided processing and a high density from the aspect of miniaturization limit, It was also difficult to reduce the manufacturing cost.

[0005] On the other hand, in the additive method, typically, after a catalyst nucleus is provided on a substrate, a plating resist pattern is formed on a non-circuit pattern forming portion, and an electroless copper plating process is performed on the resist pattern to form a laminate. This is a method of forming a conductive circuit pattern on an exposed portion by electroless copper plating or the like. This method can form a fine pattern, but requires cost reduction and further improvement in reliability.

A multilayer printed wiring board is manufactured by press-stacking a single-sided or double-sided substrate prepared by the above method together with a prepreg in a B-stage state in which a glass cloth is impregnated with an epoxy resin or the like. The prepreg plays the role of an adhesive for each layer. In such a multilayer printed wiring board, the conductor circuits of each layer are usually connected by forming through holes that are subjected to electroless plating or the like after collective multilayering. Further improvement is required.

In recent years, a multilayer printed wiring board of a build-up type, which is formed by stacking circuit patterns on the surface of a core substrate via an insulating layer, has been attracting attention as satisfying the above requirements. Since this multilayer printed wiring board of the build-up system is manufactured by alternately performing etching of the copper plating layer and patterning of the photosensitive resin, high-definition wiring and interlayer connection at an arbitrary position are possible. Further, compared to a conventional multilayer printed wiring board using through holes, the wiring density is improved even if the wiring pitch is the same because the wiring is not obstructed by the through holes.

However, in this method, since the copper plating and the photo-etching are performed alternately a plurality of times, the process becomes complicated. In addition, since a series of processes are stacked one by one on a substrate, if a trouble occurs in an intermediate step, it is difficult to remanufacture a product, which hinders a reduction in manufacturing cost.

Further, in the conventional multilayer printed wiring board, since the connection between the layers is made by forming via holes, a complicated photolithography step is required, which hinders a reduction in manufacturing cost.

In order to solve the above problems, there is provided a multilayer printed wiring board having a substrate and a plurality of wiring pattern layers sequentially transferred onto the substrate, wherein each wiring pattern layer comprises a conductive layer and a conductive layer. Alternatively, a device having an insulating resin layer fixed to a lower wiring pattern layer and a method of manufacturing the same have been proposed (Japanese Patent Application Laid-Open No. Hei 8-116172).

The transfer member formed by this method is schematically shown in FIG. First, an electrically insulating mask pattern 2 ′ obtained by exposing and developing a photoresist on a conductive substrate 1 with a predetermined mask is formed. Further, a conductive layer 3 is formed on a non-mask portion of the electrically insulating mask pattern 2 'by electrolytic plating. The insulating resin layer 4 is selectively deposited on the conductive layer 3 by an electrodeposition method. With such a transfer member, the pattern of the conductive layer 3 is transferred to the transfer target material via the insulating resin layer 4 having adhesiveness, and finally, a target wiring pattern substrate such as a printed wiring board is obtained.

In the above method, in order to form the insulating resin layer 4, the resin is deposited by an electrodeposition method. The electrodeposition liquid for forming the insulating resin layer 4 contains a solvent, and it is necessary to perform drying after forming the insulating resin layer 4. Due to this drying step, the following problems have occurred. First, the insulating resin layer exposed to high temperature during drying softens, causing the problem of bleeding in which the insulating resin layer protrudes around the conductive layer pattern. That is, it is not possible to maintain a proper film thickness. Next, when the pattern of the conductive layer 3 is transferred onto the substrate to be transferred via the insulating resin layer 4 formed by electrodeposition, the insulating resin layer 4 is heated at the time of transfer,
And the pressure causes a phenomenon of bleeding that protrudes around the pattern of the conductive layer 3. When forming a high-definition pattern or when laminating, this bleed affects the accuracy of other patterns, which is a serious problem.

[0013]

SUMMARY OF THE INVENTION The present invention has been made under such circumstances, and the insulating resin layer exposed to a high temperature during drying softens, and the insulating resin layer forms a conductive layer pattern. Problem of bleeding which protrudes into the periphery of the conductive layer 3 through the insulating resin layer 4 formed by electrodeposition.
When the pattern is transferred onto the substrate to be transferred, the problem that the insulating resin layer 4 bleeds around the pattern of the conductive layer 3 due to the temperature and pressure at the time of transfer is solved. An object of the present invention is to provide a transfer member capable of forming a pattern without any problem and a method of manufacturing the same.

[0014]

According to the present invention, there is provided a transfer member comprising:
A conductive substrate having conductivity on at least one surface, and at least one conductive layer formed on the conductive substrate,
The insulating resin layer was formed on the conductive layer, and the solvent content in the insulating resin layer was 50 to 75%.

Further, the transfer member of the present invention comprises a conductive substrate having conductivity on at least one surface, an electrically insulating mask pattern formed on the conductive substrate, and a mask pattern of the conductive substrate. It comprises at least one conductive layer formed on the non-mask portion on the formed side, and an insulating resin layer formed on the conductive layer, wherein the solvent content in the insulating resin layer is 50 to 75%. The configuration was as follows.

The method for manufacturing a transfer member according to the present invention comprises the steps of forming at least one conductive layer on a conductive substrate having conductivity on at least one surface thereof; Forming an insulating resin layer on the insulating resin layer by an electrodeposition method, and drying the electrodeposition solvent remaining in the insulating resin layer at a temperature lower than the softening temperature of the insulating resin layer before drying. It was a step comprising the steps performed below.

Further, the transfer member of the present invention includes a step of forming an electrically insulating mask pattern on a conductive substrate having conductivity on at least one surface, and a step of forming a mask pattern on the conductive substrate. Forming at least one conductive layer on the non-mask portion, forming an insulating resin layer on the conductive layer by electrodeposition, at a temperature lower than the softening temperature of the insulating resin layer before drying. And drying the electrodeposition solvent remaining in the insulating resin layer under reduced pressure.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The method of the present invention will be described in detail with reference to FIG. First, as shown in (A) and (B), an electrically insulating photoresist layer 2 is formed on a conductive substrate 1.
To form Next, as shown in (C), an electrical insulating mask pattern 2 'is formed by performing exposure and development via a predetermined photomask. Further, as shown in (D), a conductive layer 3 is formed on the non-mask portion of the electrically insulating mask pattern 2 'by electrolytic plating. And (E)
As shown in FIG. 1, an insulating resin layer 4 is selectively deposited on the conductive layer 3 by an electrodeposition method. In the transfer member thus formed, the conductive layer 3 is finally transferred to the material to be transferred via the insulating resin layer 4 having adhesiveness to obtain a target wiring pattern substrate such as a printed wiring board. . At this time,
Since the conductive layer 3 is transferred to the material to be transferred via the insulating resin layer 4, the material of the material to be transferred may be a conductor such as a metal, or may be an insulating substrate. In the conventional method for forming a wiring pattern of a printed wiring board, the substrate is limited to an insulating substrate. Therefore, a pattern of the conductive layer 3 is formed on a transfer-receiving substrate having conductivity, such as a metal substrate, and is used as a circuit. What can be done is one of the outstanding features of the present invention.

Hereinafter, the method for producing a transfer member of the present invention will be described in more detail.

Formation of Insulating Resin Layer The insulating resin layer used in the transfer member of the present invention is typically formed on the surface of a conductive layer by an electrodeposition method. The properties required for the insulating resin layer are electrical insulation, heat resistance, and adhesiveness. In particular, electrical insulation and heat resistance must be satisfied at a high level. The material of the insulating resin layer used in the transfer member of the present invention has adhesive properties at room temperature or by heating. The transfer member is pressed against the substrate to be transferred, and the conductive layer is covered with the insulating resin layer. Those that can be fixed to the transfer material are preferable. In addition, since the insulating resin layer is exposed to a high temperature in a later step such as solder bump connection, it is preferable that the material of the insulating resin layer also has heat resistance. It is also preferable to use a substance that can be liquefied by electrodeposition, for example, an ionic polymer compound.

Examples of the ionic polymer compound contained in the electrodeposition solution for forming the insulating resin layer include natural resins, acrylic resins, polyester resins, alkyd resins, and maleated oil resins. , Polybutadiene resin, epoxy resin, polyamide resin, polyimide resin and the like. Examples of the anionic polymer compound include those having an anionic group such as a carboxyl group, and examples of the cationic polymer compound include those having a cationic group such as an amino group. In the present invention, an optimal ionic polymer compound can be appropriately selected according to the performance required for the insulating resin layer. If necessary, a rosin-based, terpene-based, petroleum-based tackifier or the like can be used together with these ionic polymer compounds.

The resin contained in the electrodeposition solution for forming the insulating resin layer is preferably a polyimide resin. Since the polyimide resin satisfies electrical insulation and heat resistance at a high level, the characteristics of the polyimide resin when used as an insulating resin layer are extremely excellent.

The above-mentioned various polymer compounds can be electrodeposited in a state of being added to a solvent and further neutralized by an alkaline substance or an acidic substance and solubilized in water, or dispersed in water. Examples of usable solvents include N
Aprotic polar solvents such as -methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide, dimethylsulfoxide, γ-butyrolactone, tetramethylurea, hexamethylphosphortriamide, methyl acetate, ethyl acetate Esters such as n-propyl acetate, n-butyl acetate, methyl methoxypropionate, ethyl ethoxypropionate, diethyl oxalate, diethyl malonate, ethyl lactate, n-propyl lactate, n-butyl lactate, acetone, methyl ethyl ketone, Examples include ketones such as methyl isobutyl ketone and cyclohexanone; phenols such as phenol, m-cresol, xylenol, and halogenated phenol; and aromatics such as benzyl alcohol and toluene. In particular, when a polyimide resin is used, a solvent system mainly containing N-methyl-2-pyrrolidone is preferable. In addition, as the acidic or alkaline substance for neutralization, in the case of an anionic polymer compound, for example, trimethylamine, diethylamine, amines such as dimethylethanolamine, ammonia, and inorganic alkali such as potassium hydroxide can be neutralized. it can. In the case of a cationic polymer compound, for example, acetic acid,
It can be neutralized with acids such as formic acid, propionic acid and lactic acid.

The insulating resin layer formed by the electrodeposition method as described above contains a solvent, and therefore needs to be dried before the transfer step. In particular, in the case of an electrodeposition solution containing a polyimide resin, in order to maintain the stability of the electrodeposition solution of the polyimide resin, several kinds of solvents are contained in a large amount, and this drying step should be strictly controlled. Is required.

In the drying step of the insulating resin layer after the electrodeposition,
One of the important factors is the solvent content in the insulating resin layer after drying. A preferred range of the solvent content in the insulating resin layer after drying is 50 to 75 wt%, and a particularly preferred range is 60 to 70 wt%. When the content of the solvent in the insulating resin layer after drying is less than 50 wt%, the content of the residual electrodeposition solvent serving as a plasticizer in the insulating resin layer is reduced. Of the adhesive is insufficient. Then, when the transfer layer is used to transfer the conductive layer on which the pattern is formed to the substrate to be transferred via the insulating resin layer, the transferability becomes inappropriate, and a good transfer wiring pattern cannot be obtained. When the solvent content in the insulating resin layer after drying exceeds 75 wt%, the solvent content in the insulating resin layer is too large, and the conductive layer on which the pattern is formed via the insulating resin layer is covered. When transferring to a transfer substrate, the insulating resin layer is transferred by temperature and pressure during transfer.
The phenomenon of bleeding which protrudes around the pattern of the conductive layer occurs, and when forming a high-definition pattern or when laminating, the bleeding at the time of transfer affects other pattern accuracy, which is a serious problem.

Also important in the drying step are the pressure and temperature during drying. Examples of the solvent used for the electrodeposition solvent include, for example, those mainly composed of N-methyl-2-pyrrolidone. However, since such a solvent has a high boiling point, it is necessary to raise the drying temperature. However, if the drying temperature is excessively high and is set to a temperature exceeding the softening point of the insulating resin layer containing the solvent, the insulating resin layer softens during drying, and the insulating resin layer becomes conductive layer. Bleeding that protrudes around the pattern occurs, and at the same time, the film shape changes greatly, causing a problem that the required film thickness cannot be maintained after transfer. Conversely, if the drying temperature is simply set to be equal to or lower than the softening point of the insulating resin layer, the solvent drying property becomes inappropriate, and an appropriate solvent content of the insulating resin layer cannot be obtained.
As a method for solving the above problem, a method has been found in which the atmospheric pressure during drying is reduced and drying is performed at a temperature lower than the softening point of the insulating resin layer containing a solvent. This makes it possible to obtain a solvent content of the insulating resin layer suitable for transfer without bleeding even with a high boiling point solvent.

The specific drying pressure and temperature are pressure 1
A preferable temperature at 00 mmHg is 60 to 120 ° C.
It is. If the temperature is higher than the preferable range, the insulating resin layer is softened during drying as described above, which causes a problem of bleeding in which the insulating resin layer protrudes around the conductive layer pattern. On the other hand, when the temperature is lower than the preferable range, the solvent drying property becomes inappropriate, and it becomes impossible to obtain an appropriate solvent content of the insulating resin layer.

The thickness of the insulating resin layer is not particularly limited as long as the adhesive property and the required insulating property are satisfied, but it is generally 1 to 100 μm, preferably 10 to 100 μm. It is 50 μm.

The material of the conductive substrate used in the transfer member of the conductive substrate present invention,
The material is not particularly limited as long as it is copper or a conductive substrate, and specific examples of the material include stainless steel, copper, copper alloy, and Kovar.

The thickness of such a conductive substrate is not particularly limited, but is preferably about 0.05 to 1.0 mm. In addition, the transfer member of the present invention is used by transferring a wiring pattern by pressing the transfer member to the transfer object and fixing the conductive layer to the transfer object by an insulating resin layer having an adhesive property. . Therefore, a conductive layer having a surface on which the surface shape of the conductive substrate is reflected by the transfer is obtained. Therefore, the surface roughness of the conductive substrate is determined by measuring the center line average roughness Ra = 0.0 when measured with a contact surface roughness meter.
The conductive substrate preferably has a relatively small roughness of 1 to 0.3 μm, and particularly preferably has a roughness of Ra = 0.01 to 0.15 μm.

Further, if necessary, Ni-
A P plating layer may be formed. This Ni-P plating layer obtains adhesiveness that causes appropriate separation at the interface between the conductive layer and the conductive substrate when the pattern of the conductive layer is transferred to the member to be transferred via the insulating resin layer, and at the same time, An object is to provide an adhesive property such that the conductive layer does not peel off from the conductive substrate during the step of manufacturing the transfer member, that is, to provide an appropriate adhesive property between the conductive layer and the conductive substrate.

Formation of Electrically Insulating Mask Pattern The method and material for forming the electrically insulating mask pattern used for the transfer member of the present invention are not particularly limited as long as the insulating layer can be patterned. This method includes, for example, photoresist, screen printing, and precision dispensing. Among them, it is preferable to use a photoresist that is advantageous for forming a fine pattern. Further, since acid resistance, solvent resistance, voltage resistance, and the like may be required in a later step, it is more preferable to use one having such characteristics. Particularly preferred specific examples include a cyclized rubber-based photoresist, a thermosetting acrylic-based resist, a melamine-based resist, and a water-soluble colloid-based photoresist.

The electrically insulating mask pattern used for the transfer member of the present invention is typically formed as follows.
A photoresist layer is formed on a surface of the conductive substrate. Next, the photoresist layer is irradiated with ultraviolet rays through a photomask having a predetermined pattern, followed by development and post-baking. Thus, a predetermined pattern of an electrically insulating mask pattern is formed on the surface of the conductive substrate.

Formation of Conductive Layer The method and material for forming the conductive layer used in the transfer member of the present invention are not particularly limited as long as they can be used for ordinary wiring boards. A typical example is a method of forming a pattern of a conductive layer on a non-mask portion by an electrodeposition method. The pattern formation of the conductive layer by the electrodeposition method can be performed according to a known plating method. The material for forming the conductive layer is preferably a material on which a conductive thin film is formed by an electrodeposition method, and examples thereof include copper, silver, gold, palladium, nickel, chromium, zinc, tin, and platinum. From the viewpoint of forming a fine pattern, the thickness of the conductive layer is preferably thinner (typically because the resist is thin and thus becomes mushroom-shaped), and preferably from 5 to
It is 30 μm, more preferably 5 to 20 μm, particularly preferably 5 to 15 μm.

Further, a barrier conductive layer may be formed on the conductive layer as needed. In general, when a metal such as copper is used for the conductive layer, a phenomenon in which ions such as copper are eluted into the insulating resin layer, that is, ion migration occurs, and the insulating resin layer has a thickness of 10 μm in a high temperature and high humidity environment.
If it is relatively thin, the insulation may be adversely affected. The barrier conductive layer also has the effect of preventing such ion migration. Further, the barrier conductive layer also has an effect of improving the adhesion between the conductive layer and the insulating resin layer. Materials for forming the barrier conductive layer include:
Preferably, a metal having a stable oxide film and hardly causing migration, specifically, nickel, chromium, tin, a tin alloy, a tin-nickel alloy, or the like can be used. In this case, when the conductive layer is covered with a magnetic material such as nickel, the high-frequency characteristics are improved. The thickness of the barrier conductive layer is not particularly limited, but is preferably about 0.5 to 1.0 μm.

[0036]

EXAMPLE 1 A transfer member was prepared by the following steps using a stainless steel plate (SUS304, thickness 0.15 mm) as a conductive substrate.

(1) Formation of Electrically Insulating Mask Pattern A cyclized rubber-based negative photoresist (OMR85 35cP manufactured by Tokyo Ohka Kogyo Co., Ltd.)
μm thickness and 85 ℃ clean oven 30
Pre-baked for minutes. After that, using a photomask having a wiring pattern, exposure is performed under the following conditions, developed with a developer (OMR developer manufactured by Tokyo Ohka Kogyo Co., Ltd.), and rinsed (OMR rinse solution manufactured by Tokyo Oka Kogyo Co., Ltd.) Rinsed. Next, the substrate coated with the photoresist is
Post bake for 30 minutes in a 45 ° C. clean oven,
An electrically insulating mask pattern was completed. Exposure conditions Contact exposure machine Dainippon Screen Mfg. Co., Ltd. P-202-G Vacuum evacuation 30 seconds Exposure 30 count

(2) Formation of Conductive Layer The conductive substrate on which the above-mentioned electrically insulating mask pattern was formed was immersed in a copper sulfate plating bath having the following composition in opposition to the phosphorous copper anode, and the conductive substrate was As a cathode, a current was supplied for 25 minutes at a current density of ² A / dm ² by a DC power supply. As a result, a conductive layer pattern of copper plating having a thickness of 10 μm was formed on the non-mask portion of the conductive substrate. In addition,
No copper plating soaked between the electrically insulating mask pattern and the conductive substrate. Composition of copper sulfate plating bath (bath temperature 30 ° C.) CuSO ₄ .5H ₂ O 100 g / l H ₂ SO ₄ 180 g / l HCl 0.15 ml / l Brightener 10 ml / l (Cu-Board HA MU Ebara Ujilight Co., Ltd.) ) Made water

(3) Formation of Insulating Resin Layer (Preparation of Polyimide Electrodeposition Solution) (i) Preparation of Polyimid Varnish A reflux condenser equipped with a cooling tube with a ball was mounted on a trap with a cock. The separable flask was immersed and heated in a silicone bath equipped with a temperature controller while flowing a nitrogen stream. The reaction temperature was indicated by bath temperature.

3,4,3 ', 4'-Benzophenonetetracarboxylic dianhydride (hereinafter referred to as BDTA) 64.4
4 g (0.2 mol), 43.26 g of bis (4- (3-aminophenoxy) phenyl) sulfone (m-BAPS)
(0.10 mol), 3.00 g of γ-valerolactone
(0.03 mol), pyridine 4.74 g (0.06 mol), N-methyl-2-pyrrolidone (NMP) 400
g and 90 g of toluene, and the mixture is stirred at room temperature for 30 minutes (200 rpm) in a silicon bath while passing nitrogen, and then heated to 180 ° C. for 1 hour with stirring at 200 rpm. Removing 15 ml of toluene-water distillate,
Air-cooled, BTDA 32.22 g (0.1 mol), 3,
15.22 g of 5-diaminobenzoic acid (DABz) (0.
1 mol), 119 g of NMP and 30 g of toluene,
After stirring at room temperature for 30 minutes (200 rpm), the temperature was raised and the mixture was heated and stirred at 180 ° C., and toluene-water distillate 15 ml
Is removed. Thereafter, while removing the toluene-water distillate outside the system, the reaction was completed by heating and stirring at 180 ° C. for 3 hours. By this operation, a 20% polyimide varnish was obtained. Acid equivalent (the amount of polymer per COOH is 85
1.74) is 65.87.

(Ii) Preparation of electrodeposition solution NMP was added to the obtained 20% concentration polyimide varnish,
To 1000 g of a 15% polyimide varnish, 1-
450 g of acetonaphthone and 6.5 g of triethylamine were added, and 375 g of water was added dropwise with stirring to prepare an aqueous electrodeposition solution. Then, the solid content concentration is 8.9% and the pH is 7.9.
Was obtained.

(Electrodeposition) A conductive substrate having the pattern of the conductive layer is immersed in the above-mentioned electrodeposition solution of the insulating resin layer facing a stainless steel cathode (SUS430MA), and the conductive substrate is used as an anode. A current of 150 V was applied for 5 minutes by a direct current, followed by washing with water to obtain an insulating resin layer.

(4) Drying The above insulating resin layer was dried under a reduced pressure of 100 mmHg.
Drying was performed at a temperature of 90 ° C. for 20 minutes. At this time, the thickness of the insulating resin layer was 12 μm. As a result, the solvent content in the dried insulating resin layer was 65%.

(5) Transfer The transfer member obtained in the above steps was placed on a 30 μm thick stainless steel foil (SUS304TA) at a pressure of 210 ° C. and a pressure of 1 k.
The conductive substrate was peeled off and transferred under pressure of g / cm ² , and the pattern was transferred. The bleed at the time of transfer was also at an extremely good level. Further, a wiring pattern was formed under the same conditions to obtain a printed wiring board.

Example 2 A transfer member was prepared in exactly the same manner as in Example 1 except that the drying time in the step (4) was 23 minutes. At that time,
The solvent content in the insulating resin layer after drying was 60%.

Example 3 A transfer member was prepared in exactly the same manner as in Example 1 except that the drying time in the step (4) was 18 minutes. At that time,
The solvent content in the dried insulating resin layer was 70%.

Example 4 A transfer member was prepared in exactly the same manner as in Example 1 except that the drying time in the step (4) was 28 minutes. At that time,
The solvent content in the insulating resin layer after drying was 50%.

Example 5 A transfer member was prepared in exactly the same manner as in Example 1 except that the drying time in the step (4) was 15 minutes. At that time,
The solvent content in the dried insulating resin layer was 75%.

Comparative Example 1 A transfer member was prepared in exactly the same manner as in Example 1 except that the drying time in the step (4) was 35 minutes. At that time,
The solvent content in the insulating resin layer after drying was 40%.

Comparative Example 2 A transfer member was prepared in exactly the same manner as in Example 1 except that the drying in the step (4) was not performed. At that time, the solvent content in the insulating resin layer after drying was 80%.

Using the transfer members of Examples 1 to 5 and Comparative Examples 1 and 2, a 30 μm thick stainless steel foil (SUS
304TA), the conductive substrate was peeled off and transferred at 210 ° C. under a pressure of 1 kg / cm ² . The transfer results are summarized in Table 1.

[0052]

[Table 1]

As shown in Table 1, the solvent content in the dried insulating resin layer that satisfies both the suitability for the bleeding during transfer and the transferability to the object to be transferred is 50 to 75%. Was. Further, the most preferable range was 60 to 70%.
As described above, by appropriately controlling the solvent content in the insulating resin layer after drying, a transfer member having good transferability to the transfer target body and free from the problem of bleeding during transfer can be obtained. It was proved that it could be done.

Example 6 The drying pressure in step (4) was 100 mmHg and the drying temperature was 1
20 ° C., and the solvent content of the insulating resin layer after drying is 65
%, And the drying time was 4 min. The other conditions were the same as in Example 1 to produce a transfer member.

Comparative Example 3 The drying pressure in step (4) was 100 mmHg and the drying temperature was 1
30 ° C., and the solvent content of the insulating resin layer after drying is 65
% And the drying time was 2 min. The other conditions were the same as in Example 1 to produce a transfer member.

Comparative Example 4 The drying pressure in step (4) was 100 mmHg and the drying temperature was 4
0 ° C., and the solvent content of the insulating resin layer after drying is 65%
The drying time was 110 minutes so that The other conditions were the same as in Example 1 to produce a transfer member.

Comparative Example 5 The drying pressure in step (4) was 100 mmHg and the drying temperature was 2
0 ° C., and the solvent content of the insulating resin layer after drying is 65%
The drying time was set to 700 minutes so that The other conditions were the same as in Example 1 to produce a transfer member.

Comparative Example 6 The drying pressure in step (4) was 760 mmHg and the drying temperature was 1
30 ° C., and the solvent content of the insulating resin layer after drying is 65
% And the drying time was 5 min. The other conditions were the same as in Example 1 to produce a transfer member.

Comparative Example 7 The drying pressure in step (4) was 760 mmHg and the drying temperature was 1
20 ° C., and the solvent content of the insulating resin layer after drying is 65
% And the drying time was 30 min. The other conditions were the same as in Example 1 to produce a transfer member.

Comparative Example 8 The drying pressure in step (4) was 760 mmHg and the drying temperature was 9
0 ° C., and the solvent content of the insulating resin layer after drying is 65%
The drying time was 75 min so that The other conditions were the same as in Example 1 to produce a transfer member.

Using the transfer members obtained in Examples 1 and 6 and Comparative Examples 3 to 8, a stainless steel foil (SUS304TA) having a thickness of 30 μm was placed at 210 ° C. and a pressure of 1 kg / cm 2.
Pressing was performed under the conditions of ² , the conductive substrate was peeled off, and transfer was performed. The transfer results are shown in Table 2.

[0062]

[Table 2]

As shown in Table 2, the electrodeposition solvent remaining in the insulating resin layer was dried under reduced pressure at a temperature lower than the softening temperature (130 ° C.) of the insulating resin layer before drying, so that the bleed during drying was reduced. Suitable results (Examples 6 and 1) satisfying both the suitability and the drying suitability were obtained. On the other hand, when drying without decompression (drying pressure 760 mmH
g), there was no drying temperature range that satisfies both the suitability for burrito and the suitability for drying.

The solvent content of the insulating resin layer used in these Examples and Comparative Examples before drying was 80%, and the softening point of the insulating resin layer at this time was 130 ° C. this is,
It was measured by the following method. Using a test pattern mask having a line width of 100 μm, the transfer member, which had been subjected to the formation of the insulating resin layer in the same manner as in Example 1, was sealed in a transparent airtight container equipped with a valve that operates only in the exhaust direction. While gradually increasing the temperature, the line width of the insulating resin layer on the conductive layer is measured with a microscope as needed. Then, when the temperature reached a certain temperature, the line width sharply increased, and the temperature at which the width increased by 70 μm or more on one side was defined as the softening temperature. At this time, a solvent having the same composition as the electrodeposition solvent is sealed in the closed container so as not to directly touch the transfer member in a liquid state, and the sealed container is always viewed with saturated vapor of the electrodeposition solvent, and has a softening temperature. During the measurement, the solvent in the insulating resin layer volatilizes so that the solvent content does not change.

According to the results shown in Table 2, when the insulating resin layer was dried under reduced pressure at a temperature lower than the softening point of the insulating resin layer before drying, the insulating resin layer exposed to a high temperature during the drying softened and the conductive layer became conductive. The problem of the bleeding at the time of drying that protrudes around the pattern and the problem of proper drying when a high boiling point solvent used as an electrodeposition solvent for the insulating resin layer of the present invention is dried at a low temperature under normal pressure. It was proved that both of the problems of drying suitability, which is not possible, were satisfied, and a good transfer member was obtained.

[0066]

According to the present invention, by appropriately controlling the content of the solvent in the insulating resin layer after drying, the transferability to the object to be transferred is good and the problem of bleeding at the time of transfer does not occur. A transfer member is obtained. In addition, by performing drying under reduced pressure at a temperature lower than the softening point of the insulating resin layer before drying, the insulating resin layer exposed to a high temperature during drying softens and protrudes around the conductive layer pattern. And the problem of drying suitability that, under normal pressure, when a high boiling solvent used as an electrodeposition solvent for the insulating resin layer of the present invention is dried at a low temperature, drying cannot be performed properly. A satisfactory transfer member can be obtained by satisfying both aptitudes.

[Brief description of the drawings]

FIG. 1 is a schematic explanatory view showing a method for manufacturing a transfer member of the present invention.

FIG. 2 is a schematic view showing a structure of a transfer member of the present invention.

[Explanation of symbols]

 1. 1. conductive substrate Electrically insulating photoresist layer 2 '. 2. Electrical insulating mask pattern Conductive layer 4. Insulating resin layer

Claims (9)

[Claims] A conductive substrate having conductivity on at least one surface thereof, at least one conductive layer formed on the conductive substrate, and an insulating resin layer formed on the conductive layer; A transfer member, wherein the solvent content in the insulating resin layer is 50 to 75%. A conductive substrate having conductivity on at least one surface thereof, an electrically insulating mask pattern formed on the conductive substrate, and a non-mask portion of the conductive substrate on the side where the mask pattern is formed. Transfer comprising at least one conductive layer formed and an insulating resin layer formed on the conductive layer, wherein the solvent content in the insulating resin layer is 50 to 75%. Parts. 3. The transfer member according to claim 1, wherein the conductive layer is formed using an electrodeposition method. 4. A conductive pattern transfer member obtained by transferring the transfer member according to claim 1 onto a metal transfer member. 5. A step of forming at least one conductive layer on a conductive substrate having conductivity on at least one surface thereof, and forming an insulating resin layer on the conductive layer by electrodeposition. Forming, and drying the electrodeposition solvent remaining in the insulating resin layer under reduced pressure at a temperature lower than the softening temperature of the insulating resin layer before drying. Member manufacturing method. 6. A step of forming an electrically insulating mask pattern on a conductive substrate having conductivity on at least one side surface, and at least one layer on a non-mask portion of the conductive substrate on the side where the mask pattern is formed. A step of forming a conductive layer, a step of forming an insulating resin layer on the conductive layer by an electrodeposition method, and forming the insulating resin layer in the insulating resin layer at a temperature lower than a softening temperature of the insulating resin layer before drying. A method for producing a transfer member, comprising: a step of drying a remaining electrodeposition solvent under reduced pressure. 7. The transfer member manufacturing method according to claim 5, wherein the solvent content of the insulating resin layer after drying is 50 to 75%. 8. The method according to claim 5, wherein the formation of the conductive layer is performed by using an electrodeposition method. 9. The method according to claim 5, wherein said electrically insulating mask pattern is formed using a photoresist.
8. The method for producing a transfer member according to any one of 8 above.