JP2001085822A - Method for manufacturing transfer plate and the transfer plate, and method for manufacturing wiring board and the wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transfer plate, with which a conductive layer which is formed as a wiring layer, can be transferred to a wiring board with a strong adhesive strength in the transfer of the wiring layer which is formed on the transfer plate by selective plating to the wiring board via an insulating resin layer, and a method for manufacturing the transfer plate. SOLUTION: A method for manufacturing a transfer plate 150, provided with conductive layers 130 and adhesive insulating layers 140 which are sequentially formed in prescribed shapes on the conductive surface of a base substrate 110 as transferred layers to be transferred to an objective member from the substrate 110 side by selective plating, includes a resist pattern forming process for forming an insulating resist pattern 120A which becomes a plating mask and has an opening, having a prescribed shape on the conductive surface of the base substrate 110 (a), a plating process for forming the conductive layer 130 on the conductive surface of the substrate 110 exposed through the opening by plating (b), and a roughening process for physically roughening the exposed surface of the plated conductive layer 130. The method also includes an adhesive insulating layer forming process for forming the adhesive insulating layer 140 on the roughened surface of the conductive layer 130 through electrodeposition.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive layer which is a wiring layer on a wiring substrate when a wiring layer selectively plated on a transfer plate is transferred to a wiring substrate via an insulating resin layer. And a method of manufacturing the same, and a method of manufacturing a wiring board capable of forming a conductive layer as a wiring layer with good adhesion by using such a transfer plate.

[0002]

2. Description of the Related Art In recent years, CSP (Chip Scaling) has been developed with the increasing integration and performance of semiconductor devices.
e Package) is rapidly progressing in high-density mounting such as miniaturization of semiconductor packages and bare chip mounting. Along with this, for printed wiring boards,
From single-sided wiring to double-sided wiring, multi-layering, thinning and weight reduction are being promoted. As a method of manufacturing a printed circuit board,
Mainly, the subtractive method and the additive method are used. The subtractive method is a method of forming a conductive circuit by etching a copper-clad laminate using photolithography technology, which is technically completed and low in cost, but is limited by the thickness of the copper foil, etc. Therefore, it is difficult to form fine wiring. In the additive method, after applying a catalyst on a substrate, a plating resist is formed, and an electroless plating process is performed to form a conductor circuit.
Although fine wiring can be formed, the cost is high and the reliability is difficult. In the case of a multi-layer substrate, a method is used in which a single-sided or double-sided printed wiring board prepared by the above method is laminated under pressure with a prepreg, and a through hole is formed for interlayer connection, and electroless plating or the like is applied inside. It is done by. The production of a multilayer substrate using the multilayer printed wiring board produced by the above subtractive method has limitations on the precision of through-holes of the double-sided printed wiring board and miniaturization of etching processing, and it has been difficult to reduce the production cost. .

On the other hand, in recent years, a build-up type multilayer printed wiring board formed by stacking circuit patterns on the surface of a core substrate via an insulating layer has attracted attention as satisfying the above requirements. In this build-up type multilayer printed wiring board, the wiring pitch is the same as that of the conventional multilayer printed wiring board in which the conductor circuits of each layer are connected by through holes after the multilayering at once, since the wiring is not disturbed by the through holes However, the wiring density is improved. However, it is difficult to correct a defect in an intermediate step, and the process is complicated, which hinders a reduction in manufacturing cost.

Under such circumstances, CSP (Chip Sca)
(Le Package) In response to high-density mounting such as miniaturization of semiconductor packages and bare chip mounting, wiring layers formed by selective plating on a transfer plate may be a single layer or a plurality of layers, and an insulating resin layer in order. Attempts have been made to form a wiring substrate for an interposer, a semiconductor device, or the like by transferring and forming the wiring substrate through a substrate. Japanese Patent Application Laid-Open No. 8-116172 discloses that after a conductive layer serving as a wiring layer is selectively plated on a transfer plate, an insulating resin layer is further formed on the conductive layer by electrodeposition, and the electrodeposition is formed. Using the insulating resin layer as an adhesive layer, through this,
A method for forming a wiring layer on a wiring substrate is described.
In addition, as a method for forming an adhesive layer (insulating resin layer) for fixing the plating-formed wiring layer to a wiring substrate (also referred to as a base substrate) and insulating between overlapping wirings, there are other printing methods. And a photolithography method of a photosensitive resin. The printing method is based on printing such as screen printing, and is mass-produced and inexpensive, but has a problem in accuracy and is not suitable for forming a high-precision and high-density wiring. The photolithography method using a photosensitive resin is suitable for forming high-precision and high-density wiring, but requires a long process, a long working time, is complicated, requires expensive equipment, and results in high cost.

The above-mentioned method of manufacturing a wiring board by transfer can cope with miniaturization of wiring, can form multilayer wiring, and is excellent in mass productivity. However, in the case of this method, the adhesion between the wiring and the insulating resin layer largely depends on the surface treatment of the conductive layer to be the wiring, and good adhesion cannot be obtained stably. Had become.

[0006]

As described above, the wiring layer selectively plated on the transfer plate can be formed as a single layer or a plurality of layers.
In order to form a wiring board for an interposer, semiconductor device, etc. by sequentially transferring and forming the wiring board through an insulating resin layer to stabilize the adhesion between the wiring of the transfer plate and the insulating resin layer. It has been demanded to obtain a good result. According to the present invention, when a wiring layer selectively plated on a transfer plate is transferred and formed on a wiring substrate via an insulating resin layer, a conductive layer serving as a wiring layer is formed on the wiring substrate. To provide a method for producing a transfer plate capable of transferring an image with good adhesion.

[0007]

According to the method of manufacturing a transfer plate of the present invention, as a transfer layer to be transferred to a member to be transferred, a conductive plate formed by selective plating of a predetermined shape on the conductive surface of a base substrate from the substrate side. A method for producing a transfer plate comprising a conductive layer and an adhesive / insulating insulating layer provided on the conductive layer, the method comprising: (a) plating a base substrate having a conductive surface on a conductive surface; A resist pattern forming step of forming an insulating resist pattern having openings of a predetermined shape to be a mask; (b)
A plating step of forming a conductive layer on the conductive surface exposed from the opening by a plating method, and (c) physically roughening the exposed surface of the plated conductive layer. A step of performing a roughening treatment step and (d) a step of forming an adhesive adhesive layer on the roughened conductive layer by an electrodeposition method. It is. Further, the method for producing a transfer plate of the present invention is a method for producing a transfer plate in which, as a transfer layer to be transferred to a member to be transferred, only a conductive layer formed by selective plating with a predetermined shape on a conductive surface of a base substrate. A method comprising, in order, (A) a resist pattern forming step of forming an insulating resist pattern having an opening of a predetermined shape, which serves as a plating mask, on a conductive surface of a base substrate having a conductive surface; (B) a plating step of forming a conductive layer on a conductive surface exposed from the opening by a plating method, and (C) physically exposing a surface portion of the exposed portion of the conductive layer formed by plating. And performing a roughening step of roughening. And
In the above, the resist pattern, after forming the conductive layer,
It is characterized in that it is peeled off before the surface roughening step. Further, in the above, the resist pattern is peeled off after the roughening step. Further, the plating step described above is characterized in that a barrier metal layer is provided above and / or below the first conductive layer serving as a main material of the conductive layer. In the above, the surface roughening process is a wet blast process, and the resist pattern is made of a cyclized rubber-based resist.

[0008] The transfer plate of the present invention is characterized by being produced by the above-described method for producing a transfer plate.

According to a method of manufacturing a wiring board of the present invention, a transfer member is provided, wherein the transfer plate side of the transfer plate is provided with an adhesive resin layer on the surface thereof if necessary. After the transfer plate and the member to be transferred are thermocompression-bonded to the conductive layer forming surface of the wiring substrate, the base plate of the transfer plate is removed while leaving only the transfer layer of the transfer plate on the member to be transferred. It is characterized by peeling.

A wiring board according to the present invention is manufactured by the above-described method for manufacturing a wiring board.

[0011]

According to the method for manufacturing a transfer plate of the present invention, when the wiring layer formed by selective plating on the transfer plate is transferred to the wiring substrate via the insulating resin layer by the above-described structure, An object of the present invention is to provide a method for manufacturing a transfer plate capable of transferring a conductive layer, which is a wiring layer, onto a wiring substrate with good adhesion. Specifically, as a transfer layer to be transferred to a member to be transferred, a conductive layer formed by selective plating of a predetermined shape on the conductive surface of the base substrate from the substrate side, and an adhesive layer on the conductive layer A method of manufacturing a transfer plate provided with an insulating layer, comprising: (a) an insulating resist having an opening of a predetermined shape to serve as a plating mask on a conductive surface of a base substrate having a conductive surface; Forming a pattern, a resist pattern forming step, and (b) forming a resist pattern on the conductive surface exposed from the opening;
A plating step of forming a conductive layer by a plating method,
(C) a surface roughening step of physically roughening the exposed surface of the plated conductive layer; and (d) an adhesive property on the roughened conductive layer. By performing the step of forming an insulating layer by an electrodeposition method and a step of forming an adhesive adhesive layer,
Alternatively, as a transfer layer to be transferred to a member to be transferred, a method of manufacturing a transfer plate provided with only a conductive layer formed by selective plating on a conductive surface of a base substrate,
A resist pattern forming step of sequentially forming (A) an insulating resist pattern having an opening of a predetermined shape, which serves as a plating mask, on the conductive surface of the base substrate having the conductive surface; On the conductive surface exposed from the opening, a plating step of forming a conductive layer by a plating method,
This is achieved by performing (C) a roughening treatment step of physically roughening the surface of the exposed portion of the conductive layer formed by plating. That is, by forming a resist pattern on the conductive surface of the base substrate and forming a conductive layer on the conductive surface exposed from the opening of the resist pattern, a conductive layer serving as a wiring portion is finely and accurately formed. In the preparation of the transfer plate, a selective plating is formed on the transfer plate by performing a roughening treatment step of physically roughening the exposed surface of the conductive layer formed by plating. When the conductive layer as the wiring layer is transferred and formed on the wiring substrate via the insulating resin layer, the conductive layer can be transferred onto the wiring substrate with good adhesion. In particular, this is possible because the surface roughening process is a wet blasting process. More specifically, when the resist pattern is made of a cyclized rubber-based resist, the resist pattern is made of a wet blast resistant film. Works well and is satisfactory in quality.
In addition, when the resist is not removed after the wet blasting, a cyclized rubber-based resist is preferable as the resist (resist pattern).
When the resist is stripped, the resist pattern is preferably an acrylic dry film resist. However, when the resist pattern is an acrylic-based or dry film resist, the step of forming an adhesive adhesive layer on the roughened conductive layer by an electrodeposition method involves the following steps. Instead, an adhesive layer (adhesive adhesive layer) is formed on the member to be transferred. That is, only the conductive layer formed by selective plating is used as a transfer layer for transferring to the member to be transferred.

The transfer plate of the present invention can be manufactured as described above to manufacture a wiring board in which a conductive layer is formed with good adhesion to a wiring board via an insulating resin layer.

In the method of manufacturing a wiring board according to the present invention, the conductive layer is transferred to the wiring board via the insulating resin layer by transferring and forming a wiring portion on the wiring board using the transfer plate of the present invention. It is possible to manufacture a wiring board formed with good adhesion.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described with reference to the drawings. 1 (a) to 1 (f) are schematic process sectional views of a characteristic portion of a first example of an embodiment of a method of manufacturing a transfer plate according to the present invention, and FIGS. 1 (a) to 1 (h). FIG. 1 is a schematic process sectional view of a characteristic portion of a first example of an embodiment of a method of manufacturing a wiring board of the present invention, and FIG. 1 (f) is an example of a first example of an embodiment of a transfer plate of the present invention. FIG. 1H is a partial sectional view of a first example of the embodiment of the wiring board of the present invention, and FIG.
2A to 2E are schematic process sectional views of a characteristic portion of a second example of the embodiment of the transfer plate manufacturing method of the present invention.
2A to 2G are schematic sectional views showing the process steps of the characteristic part of the second example of the embodiment of the method of manufacturing a wiring board according to the present invention.
FIG. 2E is a partial cross-sectional view of a second embodiment of the transfer plate of the present invention, and FIG. 2G is a partial cross-sectional view of the second embodiment of the wiring board of the present invention. It is. 1 and 2, 110
Is a conductive substrate, 120 is a resist, 120A is a resist, 125 is an opening, 130 is a conductive layer (wiring portion), 13
0S is a roughened surface, 140 is an electrodeposition resin layer (adhesive adhesive layer), 150 is a transfer plate, 180 is a wiring substrate (transferred member), 190 is a wiring substrate, 210 is a conductive substrate, 220
Is a resist, 225 is an opening, 230 is a conductive layer (wiring portion), 230S is a roughened surface, 250 is a transfer plate, 270 is an adhesive insulating layer, 280 is a wiring substrate (transferred member),
290 is a wiring board.

First, a first example of an embodiment of a method for producing a transfer plate of the present invention will be described with reference to FIGS. 1 (a) to 1 (f). In this example, as a transfer layer for transferring to a member to be transferred, a conductive layer 130 formed by selective plating of a predetermined shape on one surface of a conductive substrate 110 such as stainless steel from the conductive substrate 110 side; This is a method for manufacturing a transfer plate in which an electrodeposition resin layer, which is an adhesive and adhesive layer, is provided on 130. First, a photosensitive resist 120 is applied on one surface of the conductive substrate 110 (FIG. 1A) (FIG. 1B).
An insulating resist pattern 120A having an opening 125 of a predetermined shape to be a plating mask is formed. (Figure 1
(C) Examples of the material of the conductive substrate 110 include copper, nickel, stainless steel, iron, aluminum, and 42 alloy.
It is preferable that the conductive layer 130 to be plated is easily peeled off, and specifically, a stainless steel material, a titanium material, or the like is preferable. In this example, the conductive substrate 110 is used as the base substrate of the transfer plate. However, a substrate having at least a surface having conductivity, such as a resin film metalized by sputtering or the like, may be used as the base substrate. The resist pattern 120A is not particularly limited as long as it has plating resistance and good processability. The formation of the resist pattern 120 is not particularly limited, such as a photoresist method, a screen printing method, and a precision dispensing method. However, a photoresist method is preferable because a fine pattern is formed. When acid resistance, solvent resistance, voltage resistance and the like are required for the treatment, use of a photoresist is particularly preferred. As the photoresist for forming the resist pattern 120, a cyclized rubber-based resist, a thermosetting acrylic resist, a melamine-based resist, a water-soluble colloid-based photoresist, or the like can be used. In addition, if necessary, pre-plating treatment is performed.

Next, a conductive layer 130 serving as a wiring portion is formed by plating on a predetermined region of one surface of the conductive substrate 110 exposed from the opening 125 of the resist pattern 120A by electrolytic plating (also referred to as electrodeposition). (FIG. 1 (d)) The formation of the conductive layer 130 by electrolytic plating is performed according to a known plating method, and as a material for forming the conductive layer,
Although it is formed by electrolytic plating and is not particularly limited, a copper plating layer or a copper alloy plating layer is usually used as a main material of the wiring from the viewpoint of conductivity and cost. When the main material of the wiring is a copper plating layer or a copper alloy plating layer, a barrier metal layer is disposed above and / or below the first conductive layer serving as the main material to prevent ion migration. Is preferred. Usually, a copper plating layer is used in terms of conductivity and cost. The material for forming the barrier metal layer is not particularly limited as long as it is formed by electrolytic plating. For example, nickel, a nickel alloy, a tin-nickel alloy, chromium, gold, and the like can be mentioned from the viewpoint of preventing ion migration, but nickel or a nickel alloy is preferable as the first barrier metal layer 140 from the viewpoint of cost.

Next, the exposed surface of the plated conductive layer is physically roughened by wet blasting. (FIG. 1E) Thereby, the surface 130S of the conductive layer can be controlled to a desired roughness. As the roughness of the surface 130S of the conductive layer, the center line average roughness Ra is 0.05 μm to 0.5 μm.
Is preferable. In the wet blasting process, an abrasive such as alumina is mixed in water, and this is applied to the surface of the conductive layer.
It is physically roughened.

Next, an electrodeposited resin layer 140 is formed on the roughened conductive layer 130 by an electrodeposition method, and further, if necessary, dried and heat-treated to obtain a viscous material for transfer. A transfer plate 150 is formed using the conductive layer 130 and the electrodeposited resin layer 140 as a transfer layer as an adhesive insulating layer. (FIG. 1 (f)) As the electrodeposited resin layer 140, any material that exhibits an adhesive property at room temperature or by heating and has an insulating property can be used. Examples include natural resin, acrylic resin, polyester resin, alkyd resin, maleated oil resin, polybutadiene resin, epoxy oil and fat, polyamide resin, polyimide resin, and the like. In particular, insulation, chemical stability,
A polyimide resin is preferable from the viewpoint of strength and the like, and a thermoplastic resin and a thermosetting resin can be used. Thus, the transfer plate 150 is formed.

Next, a first example of an embodiment of a method of manufacturing a wiring board according to the present invention will be described with reference to FIGS. 1 (a) to 1 (h). First, as described above, the transfer plate 150 shown in FIG. 1 (f) is formed by the transfer plate manufacturing method of the present invention. Next, the transfer plate 150 is oriented such that the electrodeposition resin layer 140 side of the transfer plate 150 faces the surface of the wiring substrate 180 on which the wiring is formed.
0 and the wiring substrate 180 by thermocompression bonding (FIG. 1 (g)).
The conductive substrate 110 of the transfer plate and the resist pattern 120A are peeled off, leaving only the transfer layer. Further, if necessary, heat treatment is performed and the electrodeposition resin layer 140 is cured to obtain the wiring substrate 190. (Fig. 1 (h))

As a modified example of the method of manufacturing the transfer plate of the first example, instead of forming the electrodeposited resin layer 140 of the first example, a pressure-sensitive adhesive insulating layer is formed by plating by a printing method or a dispenser method. There is a method of forming the conductive layer on the conductive layer 130. Also in this case, as the adhesive adhesive layer, it can be used as long as it has an adhesive property at room temperature or under heating and has an insulating property. Specifically, a natural resin, an acrylic resin,
Polyester resins, alkyd resins, maleated oil resins, polybutadiene resins, epoxy resins, polyamide resins, polyimide resins, and the like are examples of the polymer compound that forms the adhesive adhesive layer. In particular, insulation,
It is preferable to use a polyimide resin from the viewpoint of chemical stability and strength, and thermoplastic and thermosetting resins can be used. In addition, in the method of manufacturing the transfer plate of the first example, the transfer is performed with the resist pattern 120A attached, but in some cases, the resist pattern 120A is
After the formation of the conductive layer 130 and before the surface roughening treatment (FIG. 1D)
To be removed, or the resist pattern 120A
Is preferably removed after the surface roughening treatment step (FIG. 1E).

Similarly, as a modified example of the transfer plate of the first example, a printing method, instead of the electrodeposition resin layer 140 of the first example,
One in which an adhesive adhesive layer is formed on the conductive layer 130 formed by plating by a dispenser method may be used.

Next, a second example of the embodiment of the method for producing a transfer plate of the present invention will be described with reference to FIGS. 2 (a) to 2 (e). This embodiment is a transfer plate in which only a conductive layer 230 of a predetermined shape is selectively plated on one surface of a conductive substrate 110 such as stainless steel as a transfer layer to be transferred to a member to be transferred. It is a manufacturing method of. The surface of the exposed portion of the conductive layer formed by plating is physically roughened by the wet blasting process of the first example (FIG. 1E), and the transfer plate 250 (FIG. 2E) is used as it is. (E)), and the description of the processing is omitted here. 2 (a) to 2 (e) correspond to FIG.
This corresponds to the steps from (a) to FIG. 1 (e). Thus, the transfer plate 250 is manufactured.

Next, a second embodiment of the method for manufacturing a wiring board according to the present invention will be described with reference to FIGS. 2 (a) to 2 (g). First, as described above, the transfer plate 250 shown in FIG. 2E is formed by the method of manufacturing a transfer plate according to the second embodiment of the present invention. Next, the transfer plate 250 and the wiring substrate 280 are thermocompression-bonded, with the conductive layer 230 side of the transfer plate 250 facing the surface of the wiring substrate 280 on which the adhesive adhesive layer 270 forming the wiring is formed (FIG. 2 (f)), leaving only the transfer layer, peeling off the conductive substrate 210 of the transfer plate and the resist pattern 220A, and further performing a heat treatment as necessary.
The adhesive-insulating layer 270 is cured to obtain a wiring board 290. (FIG. 2 (g)) As the adhesive / insulating layer 270, any material having an adhesive property at room temperature or under heating and having an insulating property can be used. Resin, polyester resin, alkyd resin,
Maleated oil-based resins, polybutadiene-based resins, epoxy-based resins, polyamide-based resins, polyimide-based resins, and the like are listed as polymer compounds that form the adhesive adhesive layer, and include printing methods, dispenser methods, and photosensitive resin It can be formed on a wiring substrate by a lithography method or the like. In particular,
A polyimide resin is preferable from the viewpoint of insulation properties, chemical stability, strength, and the like, and a thermoplastic resin and a thermosetting resin can be used.

The method of manufacturing the wiring board of the first and second examples shown in FIGS. 1 and 2 is a method in which one wiring layer is formed. Two or more layers,
A method for forming a wiring substrate formed on the wiring substrate 180 (280) can also be mentioned. Also in this case, it is preferable that each of the wiring layers is formed by plating and forming a barrier metal layer on or below the conductive layer as the main material. That is, the adhesive and adhesive insulating layer 140 (270) and the wiring layer are repeatedly laminated from the wiring substrate 180 (280) side in accordance with the number of wiring layers.

[0025]

The present invention will be further described with reference to examples. (Example 1) In Example 1, the transfer plate of the first example shown in FIG. 1 (f) was manufactured by the method of manufacturing the transfer plate of the first example shown in FIGS. 1 (a) to 1 (f). The wiring board is manufactured and manufactured using the method of manufacturing a wiring board of the first example (FIGS. 1A to 1H).
This is one in which the wiring board shown in FIG. FIG.
It will be described based on.

First, the transfer plate 150 was manufactured as follows. Stainless steel plate SUS3 with thickness of 0.1mm
04CSP (manufactured by Nippon Steel Corporation) is used as a conductive substrate 110 (FIG. 1A), which is a base substrate of a transfer plate, and one surface thereof is covered with a cyclized rubber negative photoresist O.
MR-85 (manufactured by Tokyo Ohka Kogyo Co., Ltd., 100 cps)
Is applied to a thickness of about 2 μm and pre-baked in a clean oven at 85 ° C. for 30 minutes (FIG. 1B). Then, using a predetermined pattern plate corresponding to the shape of the conductive layer 130 to be formed, Exposure was performed under the following conditions, developed with a developer (OMR developer, manufactured by Tokyo Ohka Kogyo Co., Ltd.), and rinsed with a rinse solution (OMR rinse solution, manufactured by Tokyo Oka Kogyo Co., Ltd.). Next, post-baking was performed in a clean oven at 145 ° C. for 30 minutes to form a resist pattern 120A. (Fig. 1 (c)) (Exposure conditions) Contact exposure machine Dainippon Screen Mfg. Co., Ltd. P-202-G Vacuum evacuation 30 seconds Exposure time 30 count

Next, the conductive substrate 110 on which the resist pattern 120A has been formed is immersed in a copper sulfate plating bath having the following composition, facing the phosphorous copper electrode, and connected to the cathode of a DC power supply. And a current density of 2 A / dm ² for 25 minutes, and the exposed portion of the conductive substrate 110 not coated with the resist pattern 120A has a thickness of about 10 μm and a wiring main material. A copper plating layer was formed. (FIG. 1 (d)) (Plating bath _{composition) CuSO 4 · 5H 2 O 70g} / l H 2 SO 4 200g / l HCl 0.15ml / l (60ppm as Cl) Cu-Board HA MJ (Ebara-Udylite Co., Ltd. 10ml / l

Next, the conductive substrate 110 on which the copper plating layer has been formed is immersed in a watt nickel plating bath having the following composition in opposition to the electrolytic nickel anode. At a current density of dm ² for 5 minutes, a portion having a thickness of 1.0
An ion migration barrier layer composed of a nickel plating layer was formed to a thickness of μm. (Watts nickel plating bath conditions) Watts nickel plating bath composition _{NiSO 4 · 6H 2 O 300g /} l NiCl 4 · 6H 2 O 40g / l H 3 BO 3 40g / l PC nickel A-1 (Uemura & Co., Ltd.) 10 ml / L PC Nickel A-2 (manufactured by Uemura Kogyo Co., Ltd.) 1 ml / l Bath temperature 55 ° C pH 4.0 In this way, on the conductive substrate 110 in order from the surface,
A wiring portion (corresponding to the conductive layer 130) composed of two layers of copper and nickel was formed. (Fig. 1 (d))

Next, with the resist pattern attached, the surface of the conductive layer 130 of the conductive substrate 110 was subjected to wet blasting under the following processing conditions, washed sufficiently with water, and dried. (Wet blasting conditions) Apparatus Wet blasting cell manufactured by Macho Co., Ltd. Abrasive material Polygonal alumina # 1000, average particle size about 11.5 μm Abrasive material concentration 20% Pump pressure 0.6 kg / cm ² Air pressure 1.0 kg / cm ² Processing speed 5 mm / sec Projection distance 20 mm Projection angle 90 degrees The roughness of the surface 130S of the conductive layer 130 was set to 0.15 μm as a center line average roughness Ra.

Next, the electrodeposition liquid was adjusted as follows, and an insulating adhesive-insulating insulating layer 140 was electrodeposited on the conductive layer 130. (FIG. 1 (f)) <Manufacture of polyimide varnish> An eleven-volume, three-neck separable flask was equipped with a stainless steel squirrel stirrer, a nitrogen inlet tube, and a reflux condenser with a ball condenser tube on a trap with a stopcock. Install a cooler. While flowing in a nitrogen stream, the separable flask was placed in a silicone bath equipped with a temperature controller and heated. The reaction temperature is indicated by bath temperature. 3,
32.22 g (0.1 mol) of 4,3 ′, 4′-benzophenonetetracarboxylic dianhydride (hereinafter referred to as BTDA), bis (4- (3-aminophenoxy) phenyl)
21.63 g (0.05 mol) of sulfone (m-BAPS), 1.5 g (0.015 mol) of γ-valerolactone, 2.37 g (0.03 mol) of pyridine, NMP
200 g (abbreviation of N-methyl-2-pyrrolidone) and 30 g of toluene were added, and the mixture was stirred at room temperature for 30 minutes (200 rpm) in a silicon bath while passing nitrogen, and then heated to 18
The reaction is carried out at 0 ° C. for 1 hour with stirring at 200 rpm. Remove 15 ml of toluene-water distillate, air-cool,
BTDA 16.11 g (0.05 mol), 3,5 diaminobenzoic acid (hereinafter referred to as DABz) 15.22 g (0.
1 mol), 119 g of NMP and 30 g of toluene,
After stirring at room temperature for 30 minutes (200 rpm), the temperature was raised, and the mixture was heated and stirred at 180 ° C. to obtain a toluene-water distillate of 15%.
Remove ml. Thereafter, the reaction was completed by heating and stirring at 180 ° C. for 3 hours while removing the toluene-water distillate out of the system. A 20% polyimide varnish was obtained. The acid equivalent (the amount of polymer per COO is 1554) is 70
It is. <Preparation of electrodeposition liquid> 100 g of 20% concentration polyimide varnish
3SN (NMP: tetrahydrothiophene-1, l-
Dioxide = 1: 3 (weight) mixed solution) 150 g, benzyl alcohol 75 g, methylmorpholine 5.0 g
(Neutralization rate: 200%) and 30 g of water are stirred to prepare an aqueous electrodeposition solution. The obtained aqueous electrodeposition solution was prepared using polyimide 7.4.
%, PH 7.8, is a dark reddish brown transparent liquid. <Electrodeposition conditions> The conductive substrate 110 having the wiring portion (conductive layer 130) was opposed to a stainless steel cathode (SUS430MA, manufactured by Nippon Steel Corporation), and the electrode for the anion-type insulating resin layer adjusted as described above was adjusted. After being immersed in the liquid, the conductive substrate 310 was used as a cathode, and a voltage of 100 V was applied thereto for 3 minutes using a DC power supply. Then, the substrate was washed with water, dried on a hot plate at 80 ° C. for 30 minutes, and formed on the conductive layer 130. An electrodeposition resin layer made of the above polyimide having a thickness of 10 μm was formed, and this was used as an adhesive insulating layer 140 at the time of transfer. This allows
A transfer plate was formed.

Next, the adhesive insulating layer 1 of the transfer plate 150
The 40 side is made of 25 μm thick stainless steel (SUS304T
A, a wiring substrate 180 made of Nippon Steel Corporation)
Of the transfer plate 150 and the wiring substrate 180 at a temperature of 160 ° C. and a pressure of 1 kg / cm ² toward the surface on which the wiring is to be formed.
Crimping (FIG. 1 (g)), leaving only the transfer layer, the transfer plate 15
The conductive substrate 110 of No. 0 and the resist pattern 120A were peeled off to obtain a wiring board 190. (FIG. 1 (h)) As a result of measuring the peel strength of the conductive layer 130 of the wiring board thus obtained under the following conditions, a value of 0.89 kg / cm ² was obtained. (Peel strength measurement conditions) Measuring device Bond tester 2400PC (manufactured by Dage) Peeling angle 90 ° Peeling speed 50 mm / min

(Embodiment 2) The embodiment 2 is based on the method of manufacturing the transfer plate of the second embodiment shown in FIGS. 2A to 2E by using the method of the first embodiment shown in FIG. A transfer plate is manufactured, and a method of manufacturing a wiring board according to a second example using the transfer plate (see FIGS.
(G)), the wiring board shown in FIG. 2 (g) was manufactured. A description will be given based on FIG. In the second embodiment, similarly to the first embodiment, the resist pattern 220A and the conductive layer 130 are formed by using a 0.1 mm thick stainless steel plate (SUS30).
4CSP (H), manufactured by Nippon Steel Corporation), and subjected to wet blasting in the same manner as in Example 1 to expose the exposed surface of the plated conductive layer. The part was physically roughened to obtain a transfer plate 250. (FIG. 1E) Here, the description of the processing is omitted.

Next, the conductive layer 130 side of the transfer plate 250 is turned to the adhesive adhesive layer 170 of the wiring substrate 280 made of stainless steel (SUS304TA, manufactured by Nippon Steel Corporation) having a thickness of 25 μm. 250 and wiring substrate 2
80 is pressed at 160 ° C. under a pressure of 1 kg / cm ² (FIG. 1 (g)). After holding for 30 seconds, only the transfer layer is left, and the conductive substrate 210 of the transfer plate 250 and the resist pattern 220A are peeled off. Thus, a wiring board 290 was obtained. (Figure 2
(G)) The surface 230S of the conductive layer 230 has a center line average roughness Ra of 0.15 μm, which is almost the same as that of the embodiment.
m. Adhesive insulating layer 2 on wiring substrate 280
The formation of 70 is performed by applying a polyimide ink for printing (UPICOAT FS-100L, manufactured by Ube Industries) on a wiring substrate 280 using a spinner, and forming the ink in a clean oven.
Dry at 15 ° C. for 15 minutes to form. Thereafter, for the purpose of curing the adhesive insulating layer 270, a nitrogen flow of 250 is performed.
Curing was carried out for 1 hour in a clean oven at ℃. The peel strength of the conductive layer 230 of the wiring board thus obtained was measured under the following conditions, and as a result, it was 1.09 kg / cm ^2.
Was obtained. (Peel strength measurement conditions) Measuring device Bond tester 2400PC (manufactured by Dage) Peeling angle 90 ° Peeling speed 50 mm / min

(Comparative Example 1) A transfer plate was prepared in the same manner as in Example 1 except that the wet blast treatment of the conductive layer 130 was not performed in the preparation of the transfer plate of Example 1. Then, using this, a wiring board was manufactured in the same manner as in Example 1. The peel strength of the conductive layer of the wiring board thus obtained was measured in the same manner as in Example 1, and as a result, a value of 0.25 kg / cm ² was obtained.

Comparative Example 2 A transfer plate was prepared in the same manner as in Example 2 except that the wet blast treatment of the conductive layer 230 was not performed in the preparation of the transfer plate of Example 2. Then, using this, a wiring board was manufactured in the same manner as in Example 2. The peel strength of the conductive layer of the wiring board thus obtained was measured in the same manner as in Example 2, and as a result, a value of 0.35 kg / cm ² was obtained.

Thus, the peel strength of the conductive layer of the wiring board in Example 1 in which wet blasting was performed was larger than the peel strength of the conductive layer of the wiring board in Comparative Example 1 in which wet blasting was not performed. It can be seen that the wiring board in Example 1 has better adhesion between the conductive layer and the wiring board than the wiring board in Comparative Example 1. Similarly, the peel strength of the conductive layer of the wiring board in Example 2 in which wet blasting was performed was larger than the peel strength of the conductive layer of the wiring board in Comparative Example 2 in which wet blasting was not performed. It can be seen that the wiring board of Example 2 has better adhesion between the conductive layer and the wiring board than the wiring board of Comparative Example 2.

[0037]

According to the present invention, as described above, when a wiring layer selectively formed on a transfer plate is transferred to a wiring substrate via an insulating resin layer, the wiring layer is formed on the wiring substrate. It has become possible to provide a method of manufacturing a transfer plate that can transfer a conductive layer with good adhesion. At the same time, using such a transfer plate, it has become possible to provide a wiring substrate that can form a conductive layer as a wiring layer with good adhesion.

[Brief description of the drawings]

FIGS. 1 (a) to 1 (f) are schematic process sectional views of a characteristic portion of a first example of an embodiment of a method of manufacturing a transfer plate according to the present invention, and FIGS. 1 (h) is a schematic process sectional view of a characteristic portion of a first example of an embodiment of a method of manufacturing a wiring board of the present invention, and FIG. 1 (f) is a first example of a transfer plate of the present invention.
FIG. 1H is a partial cross-sectional view of a first example of the embodiment of the wiring board of the present invention.

FIGS. 2A to 2E are schematic process cross-sectional views of a characteristic portion of a second example of the embodiment of the method of manufacturing a transfer plate according to the present invention, and FIGS. 2 (g) is a schematic process sectional view of a characteristic portion of a second example of the embodiment of the method of manufacturing a wiring board of the present invention, and FIG. 2 (e) is a second example of the transfer plate of the present invention.
FIG. 2 (g) is a partial cross-sectional view of a second example of the embodiment of the wiring board of the present invention.

[Explanation of symbols]

 Reference Signs List 110 conductive substrate 120 resist 120A resist pattern 125 opening 130 conductive layer (wiring portion) 130S roughened surface 140 electrodeposition resin layer (adhesive insulating layer) 150 transfer plate 180 wiring substrate (transferred member) 190 Wiring board 210 Conductive substrate 220 Resist 220A Resist pattern 225 Opening 230S Roughened surface 240 Electrodeposited resin layer (adhesive adhesive layer) 250 Transfer plate 270 Adhesive adhesive layer 280 Wiring substrate (transferred member 290) Wiring board

Claims (10)

[Claims] 1. A transfer layer for transferring to a member to be transferred, a conductive layer formed by selective plating of a predetermined shape on a conductive surface of a base substrate from the substrate side, and an adhesive layer on the conductive layer. A method of manufacturing a transfer plate provided with an insulating layer, in order,
(A) on a conductive surface of a base substrate having a conductive surface,
A resist pattern forming step of forming an insulating resist pattern having an opening of a predetermined shape to be a plating mask, and (b) plating of forming a conductive layer on the conductive surface exposed from the opening by a plating method. (C) a surface roughening treatment step of physically roughening the surface of the exposed portion of the conductive layer formed by plating, and (d) a surface roughening treatment on the roughened conductive layer. And a step of forming an adhesive insulating layer by forming an adhesive insulating layer by an electrodeposition method. 2. A method for producing a transfer plate, wherein only a conductive layer formed by selective plating of a predetermined shape is provided on a conductive surface of a base substrate as a transfer layer to be transferred to a member to be transferred.
A resist pattern forming step of sequentially forming (A) an insulating resist pattern having an opening of a predetermined shape, which serves as a plating mask, on the conductive surface of the base substrate having the conductive surface; On the conductive surface exposed from the opening, a plating step of forming a conductive layer by a plating method,
(C) a roughening treatment step of physically roughening the surface of the exposed portion of the plated conductive layer. 3. The method for producing a transfer plate according to claim 1, wherein the resist pattern is peeled off after the formation of the conductive layer and before the roughening step. 4. The method for producing a transfer plate according to claim 1, wherein the resist pattern is peeled off after the roughening step. 5. The plating step according to any one of claims 1 to 4, wherein the plating step is performed on an upper side of the first conductive layer which is a main material of the conductive layer and / or
Alternatively, a method for producing a transfer plate, wherein a barrier metal layer is provided on the lower side. 6. The method for producing a transfer plate according to claim 1, wherein the surface roughening step is wet blasting. 7. The method according to claim 6, wherein the resist pattern comprises a cyclized rubber-based resist. 8. A transfer plate produced by the method for producing a transfer plate according to claim 1. 9. A wiring board, which is a member to be transferred, wherein the transfer layer side of the transfer plate is provided with an adhesive resin layer on its surface, if necessary, using the transfer plate according to claim 8. After the transfer plate and the member to be transferred are thermocompression-bonded toward the conductive layer formation surface, the base substrate of the transfer plate is peeled off, leaving only the transfer layer of the transfer plate on the member to be transferred. Method for manufacturing a wiring board. 10. A wiring board manufactured by the method for manufacturing a wiring board according to claim 9.