JP2000101238A - Member for transfer and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transfer member for transferring wiring layers which enables manufacture of a multilayer wiring board provided with multiple wiring layers transferred to a base board in sequence which can comply with fine and high-density wiring, does not require complicated manufacturing steps, exhibits high productivity, is suitable for mass production and high to quality. SOLUTION: A transfer member is used for forming a conductive layer as wiring part on a material which is an object of transfer through an adhesive insulating layer as an adhesive layer. In this case, the member is provided with at least a conductive substrate 110 in plate form which can be plated and exhibits a peeling property; a polyimide resin layer 120 which is stacked on one side of the conductive substrate 110, and is provided with a first opening part 125 in a specified form corresponding to the form of a wiring part to be formed; a conductive layer 140 as wiring part which is formed by plating on one side of the conductive substrate 110 in such a way that the first opening of the polyimide resin layer 120 is filled; and a metal layer 130 which is stacked on the polyimide resin layer 120, includes a wiring area and an area for forming an adhesive insulating layer serving as an adhesive layer at the time of transfer of the wiring part, and is provided with a second opening 135 which is larger than these areas.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer member used for manufacturing a wiring board and a method for manufacturing the same, and more particularly to a transfer member capable of manufacturing a multilayer wiring board having high definition wiring with high productivity. It relates to the manufacturing method.

[0002]

2. Description of the Related Art With the rapid development of semiconductor manufacturing technology,
As typified by CSP (Chip Size Package), high-density mounting techniques such as miniaturization of semiconductor packages and bare chip mounting are rapidly progressing. Along with that, printed wiring boards have also changed from single-sided wiring to double-sided wiring,
Further, multilayering, thinning and weight reduction are being promoted. At present, a subtractive method and an additive method are mainly used for manufacturing a printed wiring board. The subtractive method is a method of forming a circuit pattern by etching a copper-clad laminate. This subtractive method is technically highly complete and low in cost, but it is difficult to form a fine pattern due to restrictions such as the thickness of the copper foil. on the other hand,
In the additive method, a plating resist is formed on a portion of the laminate containing a catalyst for electroless plating other than a circuit pattern forming portion, and a circuit pattern is formed on an exposed portion of the laminate by electroless copper plating or the like. How to This additive method can form a fine pattern,
There are difficulties in cost and reliability.

In the case of a multilayer wiring board, a method of laminating a single-sided or double-sided printed wiring board prepared by the above method or the like together with a prepreg in a semi-cured state in which a glass cloth is impregnated with an epoxy resin or the like is laminated under pressure. Is used. In this case, the prepreg plays a role of an adhesive for each layer, and a connection between the layers is made by forming a through hole and performing electroless plating or the like inside. However, the production of a multilayer wiring board using a double-sided printed wiring board manufactured by the above-described subtractive method requires the precision of drilling for forming a hole for forming a through-hole of the double-sided printed wiring board, and the etching processing. There is a limit to high density from the aspect of miniaturization,
It was also difficult to reduce the manufacturing cost.

On the other hand, a multilayer printed wiring board of a built-up type, which is formed by stacking circuit patterns on the surface of a core substrate via an insulating layer, has been attracting attention to satisfy the above-mentioned requirements in recent years. In this multi-layer printed wiring board of the built-up type, the wiring pitch is reduced because the wiring is not disturbed by the through hole compared with the conventional multilayer printed wiring board in which the conductor circuits of each layer are connected by the through hole after the multilayering at once. Even with the same, the wiring density is improved. However, it is difficult to correct a defect in an intermediate step, and the process is complicated, which hinders reduction in manufacturing cost.

[0005] In order to solve the above-mentioned problems, a multilayer wiring board which can cope with miniaturization and high-density wiring, does not require a complicated process, and can be mass-produced is sequentially transferred onto a base substrate. Multilayer wiring board provided with a plurality of wiring portions, wherein the wiring portion of each layer is fixed to a base substrate or a lower wiring portion by an insulating resin layer formed below the wiring portion, and a manufacturing method thereof A method has been proposed.

In manufacturing such a multilayer wiring board, it is necessary to further form an insulating resin layer on the wiring portion in a state where the wiring portion is formed on the transfer master by plating in a predetermined wiring shape. It is necessary to form an insulating resin layer in a shape along the wiring portion on the side of the base substrate for making the wiring substrate to which the wiring portion is to be transferred. In this state, the wiring portion of the transfer master is removed. Transfer is formed on the base substrate side via an insulating resin layer. At the time of transfer, it is difficult to control the space between the transfer master and the base substrate surface to a desired value over the entire transfer surface. The thickness cannot be made uniform over the entire area of the wiring portion, and the non-uniformity of the thickness of the insulating layer may affect the electrical characteristics and cause a problem. For example, Japanese Patent Application Laid-Open No. HEI 8-116172 discloses a method in which a wiring portion is formed on a transfer master by plating in a predetermined wiring shape, and an insulating resin layer is further formed on the wiring portion by electrodeposition. It is shown. In this method, as schematically shown in FIG. 6, a photoresist layer 620 is formed on a conductive substrate 610 when a transfer plate is manufactured.
(A)) A photoresist layer 620 is formed in a predetermined shape by performing exposure and development through a predetermined photomask (FIG. 6B), and is exposed from the opening 625 of the photoresist layer 620. A conductive layer 630 is formed in the region by electrolytic plating (FIG. 6C), and an insulating resin layer 640 is selectively deposited on the exposed region of the conductive layer 630 by an electrodeposition method (FIG. 6D )) Then, the insulating resin layer 640 side is pressed against the transfer material 650 (FIG. 6).
(E)) the conductive substrate 610 is coated with a photoresist layer 620;
At the same time, the conductive layer 630 serving as a wiring portion is transferred and formed on the transfer target material 650 via the insulating resin layer 640.
(FIG. 6F) In this method, since the insulating resin layer is formed by the electrodeposition method, the film thickness distribution in the pattern tends to increase due to the occurrence of electric field concentration or the like. As a result, there is a high possibility that the thickness of the insulating resin layer varies greatly in the transfer process. The thickness of the insulating resin layer depends on the drying conditions after electrodeposition,
Since it is determined by factors such as heating temperature and pressure during transfer, it is difficult to set and control conditions. Depending on the dispenser coating method or printing coating method, an insulating resin layer is formed on the wiring part of the transfer master, or it is insulated in the shape along the wiring part on the base substrate side for making the wiring board to transfer the wiring part Even when a conductive resin layer is formed, it is difficult at present to control the coating film thickness uniformly.

[0007]

SUMMARY OF THE INVENTION Under the above circumstances, the present invention provides a base, which can cope with miniaturization and high-density wiring, does not require complicated processes, has good productivity, and is suitable for mass production. In order to provide a transfer member for transferring a wiring layer, it is possible to manufacture a multi-layer wiring board capable of responding to quality with a multi-layer wiring board having a plurality of wiring portions sequentially transferred on a substrate. There is something to do. Specifically, the present invention provides a transfer member capable of improving the uniformity of the thickness of an insulating resin layer for fixing a wiring portion to be transferred. Another object is to provide a method for manufacturing such a transfer member.

[0008]

According to the present invention, there is provided a transfer member comprising:
A transfer member for transferring and forming a conductive layer to be a wiring portion to a transfer-receiving material through an adhesive-insulating layer serving as an adhesive layer, via the adhesive-insulating layer; A plate-shaped conductive base material that can be plated and has plating releasability, and a first opening that is laminated on one surface of the conductive base material and is opened in a predetermined shape according to a shape of a wiring portion to be manufactured. A polyimide resin layer provided with a portion, a conductive layer serving as a wiring portion provided by plating on one surface of the conductive base material so as to fill the first opening of the polyimide resin layer; A second layer which is laminated on the polyimide resin layer and includes a wiring portion region and a region where a tacky adhesive insulating layer serving as an adhesive layer for transferring the wiring portion is formed, and is opened in a region larger than these regions. And a metal layer provided with an opening. Further, in the above, the adhesive layer is provided on the surface of the conductive layer which is to be the wiring portion on the side opposite to the conductive base material, and the wiring portion and the adhesive on the wiring portion are provided on the polyimide resin layer. A second opening including a region of the adhesive insulating layer and opening a region larger than the region is provided, and the laminated metal layer is provided.
Further, the conductive substrate is made of stainless steel. In the above, the metal layer is a copper layer or a copper alloy layer. In the above, the bonding between the polyimide resin layer and the conductive substrate and the bonding between the polyimide resin layer and the metal layer are performed using a thermoplastic polyimide resin. Further, the above-mentioned adhesive and adhesive insulating layer is characterized by being an electrodeposition product. Here, the term "adhesiveness" as used herein means to indicate tackiness or adhesiveness, and more specifically, to indicate tackiness or adhesiveness at normal temperature or when heated. The term "adhesive insulating layer" refers to an insulating resin layer having adhesive properties. Further, the conductive substrate having plating releasability means that the conductive layer formed by plating on the conductive substrate is easily peeled. Further, the formation region of the adhesive-insulating layer serving as the adhesive layer includes at least a predetermined region on the wiring portion of the transfer member or a part of the wiring formation region of the material to be transferred onto which the wiring portion is formed. The formation region of the adhesive / insulating layer, which is a predetermined region, has a shape corresponding to the wiring shape and may extend over the entire wiring portion formation region, or may be a part thereof.

The method for manufacturing a transfer member according to the present invention is a transfer member for transferring and forming a conductive layer serving as a wiring portion onto a material to be transferred via an adhesive adhesive layer serving as an adhesive layer. At least, a plate-shaped conductive substrate that can be plated and has plating releasability, and a first layer that is laminated on one surface of the conductive substrate and is opened in a predetermined shape according to the shape of a wiring portion to be manufactured. A polyimide resin layer provided with an opening, and a conductive layer serving as a wiring portion provided by plating on one surface of the conductive base material so as to fill the first opening of the polyimide resin layer, Laminated on the polyimide resin layer, including a wiring portion region and a formation region of an adhesive adhesive layer serving as an adhesive layer when transferring the wiring portion, and opening in a region larger than these regions. Of a transfer member having a metal layer provided with an opening A (A) metal layer, a polyimide resin layer, and a conductive base material capable of being plated and having plating releasability are sequentially laminated on a surface of the metal layer with respect to a base material laminated in this order in advance. Forming an etching-resistant first mask for etching the second opening; and (B) etching a portion of the metal layer of the base material exposed from the first mask to form a second opening. A first etching step of forming a portion, and (C) etching of a first opening on the metal layer of the substrate and the surface of the polyimide after removing the first mask on the substrate. Forming a second mask having an etching resistance, and (D) etching a portion of the polyimide resin layer of the substrate exposed from the second mask to form a first opening. Process and (E) a second mask on the substrate After 剥膜,
Forming a conductive layer to be a wiring in a portion exposed from the second opening of the conductive base material capable of plating and having plating releasability. Further, the method for producing a transfer member according to the present invention includes a transfer member for transferring and forming a conductive layer serving as a wiring portion to a material to be transferred via an adhesive adhesive layer serving as an adhesive layer. A plate-shaped conductive base material that can be plated and has plating releasability, and a first opening that is laminated on one surface of the conductive base material and is opened in a predetermined shape according to a shape of a wiring portion to be manufactured. A polyimide resin layer provided with a portion, a conductive layer serving as a wiring portion provided by plating on one surface of the conductive base material so as to fill the first opening of the polyimide resin layer; A second layer which is laminated on the polyimide resin layer and includes a wiring portion region and a region where a tacky adhesive insulating layer serving as an adhesive layer for transferring the wiring portion is formed, and is opened in a region larger than these regions. And a metal layer provided with an opening of the transfer member. Thus, in order, (A) a metal layer, a polyimide resin layer, and a conductive base material capable of being plated and having plating releasability are laminated in this order in advance on the metal layer surface with a second Forming an etching-resistant first mask for etching the opening, and (B) etching a portion of the metal layer of the base material exposed from the first mask to form a second opening. A first etching step to be formed, and (C) a resist for etching a first opening on the surface of the metal layer and the polyimide of the substrate after the first mask on the substrate is stripped. Forming a second mask having an etching property, and (D) etching a portion of the polyimide resin layer of the base material exposed from the second mask to form a first opening. (E) stripping the second mask on the substrate After,
Forming a conductive layer to be a wiring in a portion exposed from the second opening of a conductive base material capable of plating and having plating releasability; and (F) on a conductive layer exposed portion to be a wiring Forming an adhesive-insulating layer on the substrate, and the step of forming the adhesive-insulating layer comprises electrodepositing the adhesive-insulating layer. It is characterized by the following. And the above plating is possible,
Further, the conductive base material having plating releasability is stainless steel. Further, in the above, the metal layer is a copper layer or a copper alloy layer. In the above, the bonding between the polyimide resin layer and the conductive substrate and the bonding between the polyimide resin layer and the metal layer are performed using a thermoplastic polyimide resin. Further, in the above, the etching-resistant first mask and the etching-resistant second mask are made of a photoresist film. In the above, the etching of the polyimide resin layer in the second etching step is performed by plasma etching.

[0010]

According to the transfer member of the present invention having such a configuration, it is possible to cope with miniaturization and high-density wiring, no complicated process is required, and the productivity is good for mass production. It is possible to provide a transfer member for transferring a wiring layer in order to manufacture a multilayer wiring board capable of responding to quality with a multilayer wiring board having a plurality of wiring portions sequentially transferred thereon. Specifically, in the case of the transfer member of the present invention, at the time of transfer, the metal layer functions as a spacer, and the thickness of the insulating resin layer can be controlled to the thickness of the metal layer. The management becomes easy irrespective of the pressure of the pressure bonding, and the thickness of the insulating resin layer can be controlled without depending on the pressure of the pressure bonding. Thus, when the transfer member of the present invention is used, the insulating resin layer can be made uniform over the entire surface of the multilayer wiring board to be manufactured, and as a result, the electrical characteristics, particularly the insulating characteristics, can be made uniform. The manufacturing process of the wiring board can be easily controlled. Specifically, a transfer member for transfer-forming a conductive layer serving as a wiring portion to a transfer-receiving material via an adhesive-insulating layer serving as an adhesive layer, and is at least plateable, And a plate-shaped conductive base material having plating releasability, and a polyimide laminated on one surface of the conductive base material and provided with a first opening having a predetermined shape according to the shape of a wiring portion to be produced. A resin layer, a conductive layer serving as a wiring part provided by plating on one surface of the conductive base material so as to fill the first opening of the polyimide resin layer, and A second opening is provided which includes a region where the adhesive portion is formed by laminating the wiring portion region and the adhesive layer when the wiring portion is transferred, and which is opened in a region larger than these regions. This is achieved by providing a metal layer. In particular, in a configuration in which an adhesive insulating layer is provided on the surface of the conductive layer serving as the wiring portion opposite to the conductive substrate, the adhesive adhesive layer is formed by electrodeposition. In some cases, subsequent to the plating of the conductive layer to be the wiring portion, the adhesive and adhesive insulating layer can be formed by electrodeposition, so that the transfer member can be manufactured efficiently. In addition, by using a dispenser coating method or a printing coating method, a tacky insulating layer is formed on the wiring portion of the transfer member, or a tacky adhesive is formed on the wiring portion forming region on the wiring substrate side as the material to be transferred. Compared with the formation of the insulating layer, the operation is not complicated, and the control of the formation position accuracy of the adhesive adhesive layer is not required.

The conductive substrate is not particularly limited as long as it can be plated and has plating releasability, but stainless steel is a preferred example. The metal layer can function as a spacer and has good processability, and preferably has good adhesiveness and adhesion to the polyimide resin layer, and examples thereof include a copper layer and a copper alloy layer. In addition, when performing adhesion between the polyimide resin layer and the conductive base material and adhesion between the polyimide resin layer and the metal layer with a thermoplastic polyimide resin, it is possible to use a ready-made polyimide film for the polyimide resin layer. It has the advantage of being possible.

The method for manufacturing a transfer member of the present invention having such a configuration makes it possible to provide the above-described method for manufacturing a transfer member for transferring a wiring layer of the present invention.
The step of forming the adhesive adhesive layer includes forming the adhesive adhesive layer on the wiring portion of the transfer member by a dispenser coating method or print coating method, or forming the wiring portion on the wiring board side. Although an adhesive layer may be formed on the wiring portion, the formation of electrodeposition on the wiring portion of the transfer member is advantageous in terms of workability and quality.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a partial cross-sectional view of a first embodiment of the transfer member of the present invention, FIG. 2 is a partial cross-sectional view of a second embodiment of the transfer member of the present invention, FIG. FIG. 4 is a cross-sectional view for explaining the transfer of the transfer member of the first example shown in FIG. 1, and FIG. 4 is a cross-sectional view for explaining the transfer of the transfer member of the second example shown in FIG. FIG. 5 is a process chart showing a first example and a second example of the method for manufacturing a transfer member of the present invention. In FIGS. 1 to 5, for simplicity,
An adhesive layer for bonding the conductive base material to the polyimide resin layer and bonding the polyimide resin layer to the metal layer are not shown. 1 to 5, reference numerals 101 and 102 denote transfer members,
10 is a conductive substrate, 120 is a polyimide resin layer, 125
Is a first opening, 130 is a metal layer, 135 is a second opening, 140 is a conductive layer, 160 is an insulating resin layer, 165 is an insulating resin layer, 210 is a base material, 220 and 230 are photoresists,
Reference numerals 225 and 235 indicate openings, and reference numeral 310 indicates a material to be transferred.

First, an embodiment of the transfer member of the present invention will be described. First, a first example of an embodiment of the transfer member of the present invention will be described with reference to FIG. In the first example, a conductive adhesive layer serving as an adhesive layer at the time of transfer is not provided on the conductive layer 140 serving as a wiring portion. The conductive layer serving as a wiring portion is provided on the conductive layer 140 by a dispenser coating method or a printing coating method, and the conductive layer serving as a wiring portion is transferred to a material to be transferred via an adhesive insulating layer. Is a transfer member. In the first example, a plate-shaped conductive substrate 110 that can be plated and has plating releasability, and the conductive substrate 110
A polyimide resin layer 120 having a first opening 125 opened in a predetermined shape according to the shape of a wiring portion to be formed by laminating on one surface of the substrate, and filling the first opening 125 of the polyimide resin layer 120. A conductive layer 1 serving as a wiring portion provided by plating on one surface of a conductive substrate 110;
40 and a region larger than these regions, including a region where the adhesive portion is formed on the polyimide resin layer 120 so as to serve as an adhesive layer when transferring the wiring portion region and the wiring portion. And a metal layer 130 provided with a second opening 135 that is opened by the above.

The conductive substrate 110 is not particularly limited as long as it can be plated and has plating releasability. Specifically, for example, stainless steel (SU)
S304) and the like. The metal layer 140 can function as a spacer at the time of transfer, and preferably has a good etching property, a good adhesive property with the polyimide resin layer 120, and a good fixing property, and a copper layer or a copper alloy layer is preferable. Examples include, but are not limited to: In addition, nickel, stainless steel, aluminum, 4
2 Alloy, tantalum, chromium, and the like that can be etched. Incidentally, as a treatment for improving the plating releasability, the surface of the conductive substrate 110 is oxidized with chromic acid or the like to form an oxide film, and a conductive layer 140 that becomes a wiring layer formed by plating; Oxidation treatment that makes it difficult to cause metal bonding with the conductive substrate 110 is given. The conductive substrate 110 is made of an iron-nickel-chromium-based metal or an iron-chromium-based metal including stainless steel.
When 0 is copper plating or copper plating with nickel as a base, the oxidation treatment for imparting the above-mentioned releasability is more effective. In this example, the bonding between the polyimide resin layer 120 and the conductive substrate 110 and the bonding between the polyimide resin layer 120 and the metal layer 140 are performed using a thermoplastic polyimide resin as an adhesive layer. The adhesive strength is strong and practical. As described above, FIG. 1 omits the adhesive layer. Conductive base material 11
0, the adhesive layer 130 is not always necessary for lamination with the polyimide resin layer 120 and the metal layer 140. The conductive layer 140 is preferably made of copper or a copper alloy from the viewpoint of conductivity and cost, but is not limited thereto. Conductive substrate 1
10, the thickness of the polyimide resin layer 120 and the metal layer 140 are respectively 20 to 30 μm, 1 to 50 μm, and 10 to
50 μm is preferred.

The transfer member 101 is press-bonded to the material to be transferred, and the conductive layer 140 serving as a wiring portion is fixed to the material to be transferred by an adhesive insulating layer, whereby the wiring portion is transferred to the material to be transferred. To make a wiring board,
By the transfer, a wiring portion composed of the conductive layer 140 having a surface reflecting the surface shape of the conductive substrate 110 is obtained on the transfer target material. As the signal speed of the circuit increases, the conductive layer 1
Since the surface shape of the conductive base material 40 affects the electrical characteristics, the surface roughness of the conductive base 110 on the side where the conductive layer 140 is formed is an average surface roughness Ra = 0.01 to 0.3 μm.
(Measured with a stylus type surface roughness meter), it is preferable to have a relatively small roughness, especially Ra = 0.01 to 0.15 μm.
A conductive substrate 110 having a roughness of m is preferred.

Next, a second embodiment of the transfer member according to the present invention will be described with reference to FIG. In the second example, an adhesive resin layer 160 serving as an adhesive layer at the time of transfer is provided on the conductive layer 140 serving as a wiring portion with respect to the transfer member 101 of the first example. The transfer member is a transfer member for transferring and forming the conductive layer 140 serving as a wiring portion to the transfer material via the adhesive resin layer 160 having the adhesive property at the time of transfer. The metal layer 130 includes a conductive layer 140 serving as a wiring portion provided by plating and an area of an adhesive resin layer 160 having an adhesive property on the conductive layer 140, and a second opening which opens an area larger than the area. An opening 135 is provided and laminated on the polyimide resin layer 120. It is the same as the first example except that it has an adhesive resin layer 160. The adhesive resin layer 160 may be any one that exhibits tackiness at room temperature or by heating, and the polymer used may be a synthetic polymer resin having tackiness. As the synthetic polymer resin, an acrylic resin, a polyester resin, a maleated oil resin, a polybutadiene resin, an epoxy resin, a polyamide resin, a polyimide resin, or the like can be used alone or as a mixture of any combination of these resins. . Further, the above synthetic resin may be used in combination with a crosslinkable resin such as a melamine resin, a phenol resin, and a urethane resin polyester resin. Further, in order to impart tackiness to the polymer resin, a tackifying resin such as a rosin-based resin, a terpene-based resin, or a petroleum resin can be added as necessary. In particular, the adhesive resin layer 160 serving as an adhesive layer is preferably a polyimide resin in terms of insulation, strength, and chemical stability. When the adhesive resin layer 160 is formed by electrodeposition, the polymer resin is electrodeposited in a state of being solubilized in water by being neutralized with an alkaline or acidic substance, or in a water-dispersed state. Subject to law.

Next, an example of the transfer of the transfer member 101 of the first example to the material to be transferred will be briefly described with reference to FIG. First, a first example of transfer will be described. Transfer member 101
The insulating resin layer 165 is formed only on the conductive layer 140 serving as the wiring portion in FIG. 3A by a dispenser coating method.
Is applied. The coating 135 may be slightly applied on the polyimide resin layer 120 in the opening 135 of the metal layer 130, but the opening region is sufficiently left. Next, the transfer material 31
The metal layer 130 side of the transfer member is directed to the 0 side (FIG. 3).
(C)), and press-bond both. (FIG. 3D) The thickness of the insulating resin layer 165 becomes equal to the thickness of the metal layer 130 serving as a spacer by the pressure bonding, and the thickness of the insulating resin layer 16 is increased.
5 fits in the opening 135. Next, the transfer member 1 is removed while leaving the conductive layer 140 and the insulating resin layer 165 to be wiring portions.
01 from the transfer material 310 side, and the transfer material 310
Then, the conductive layer 140 is transferred while being bonded and fixed via the insulating resin layer 165. (FIG. 3E) In this manner, the conductive layer 140 is transferred from the transfer member 101 to the transfer target material 310 side via the insulating resin layer 165.

Next, a second example of transfer will be described. In the second example, the insulating resin layer 165 is applied to a region of the transfer material corresponding to the conductive layer 140 of the transfer member 101 by a dispenser coating method or a screen printing method, and is transferred to the transfer material 310 side. With the metal member 130 side of the member for use facing (FIG. 3 (f)), the two members are aligned and then pressure-bonded.
(FIG. 3G) It is necessary that the insulating resin layer 165 be accommodated in the opening 135 at the time of pressure bonding, and there are many restrictions on applying the insulating resin layer 165 to the material 310 to be transferred. As in the first example, the thickness of the insulating resin layer 165 is reduced by compression so that the metal layer 13 serving as a spacer is formed.
0, and the insulating resin layer 165 is
Fits within 5. Next, as in the first example, the transfer member 101 is peeled off from the transfer material 310 side, leaving the conductive layer 140 and the insulating resin layer 165 to be the wiring portions.
The conductive layer 140 is transferred to the substrate 10 with the conductive layer 140 adhered and fixed via the insulating resin layer 165. (FIG. 3 (h)) Thus, the conductive layer 140 is transferred from the transfer member 101.
Is transferred to the transfer material 310 via the insulating resin layer 165. In the second example, as compared with the first example, the positioning at the time of crimping is required, and there is troublesome management of the positional accuracy.

Next, an example of the transfer of the transfer member 102 to the material to be transferred in the second example will be briefly described with reference to FIG. On the conductive layer 140 which is to be a wiring portion of the transfer member 102 (FIG. 4A), an adhesively formed insulating resin layer 160 which has already been formed by electrodeposition is provided. With the metal layer 130 of the transfer member facing the transfer material 310 (FIG. 4B), both are pressed. (FIG. 4 (c)) As in the first and second examples, the insulating resin layer 1 is pressed by crimping.
The thickness of 60 is the thickness of the metal layer 130 serving as a spacer, and the insulating resin layer 160 fits in the opening 135. Next, the conductive layer serving as a wiring portion and the insulating resin layer 165 are formed.
The transfer member 101 is separated from the transfer material 310 side, and the conductive layer 140 is formed on the transfer material 310 by the insulating resin layer 1.
The image is transferred in a state where the film is adhered and fixed via 65. (FIG. 4
(D)) Thus, the conductive layer 140 is transferred from the transfer member 102.
Is transferred to the transfer material 310 via the insulating resin layer 165. When the transfer member 102 is used, the transfer member 1
As in the case of using No. 01, there is no need to manage the positional accuracy for forming the insulating resin layer or to perform the positioning.

Next, an embodiment of the method for manufacturing a transfer member of the present invention will be described. First, a first example of an embodiment of a method for manufacturing a transfer member of the present invention will be described with reference to FIG. The first example is a method of manufacturing the transfer member 101 shown in FIG. 1 in which the conductive layer 140 serving as a wiring portion is not provided with a viscous insulating resin layer serving as an adhesive layer during transfer. This is one example. First, a substrate 210 in which a conductive substrate 110, a polyimide resin layer 120, and a metal layer 130 are laminated in this order via an adhesive layer is prepared. (FIG. 5
(A)) As described above, the adhesive layer for bonding the conductive substrate 110 to the polyimide resin layer 120 and bonding the polyimide resin layer 120 to the metal layer 130 are omitted in FIG. I have. As the material of each part, the material described in the description of the transfer member 101 of the first example shown in FIG. 1 is used. Usually, a substrate 210 on which a stainless steel, a polyimide resin, and a copper layer are laminated is used. Next, the metal layer 130 of the substrate 210
On the surface side, an etching-resistant photoresist 220 that can withstand a subsequent etching process is applied (FIG. 5B), and is exposed using a predetermined photomask, and is subjected to processing such as development and drying. A photoresist 220 is formed in a predetermined shape. (FIG. 5C) Here, the photoresist 220 is formed in a predetermined shape to form an etching-resistant mask in a subsequent etching step. The method of forming the etching-resistant mask is as follows. However, it is not limited to. For example, a screen printing coating method, a precision dispenser coating method, or the like can be used. However, when a fine mask is formed, a method using a photoresist is preferable. As the photoresist, a water-soluble colloid-based photoresist such as casein or PVA, a dry film resist, or the like can be used.
Next, the metal layer 130 is etched using the photoresist 220 having a predetermined shape as an etching resistant mask,
The metal layer 130 having the second opening 135 is formed.
(FIG. 5D) Thereby, the surface of the polyimide resin layer 120 is exposed. As the etching of the metal layer 130, wet etching is generally used, but not particularly limited thereto, and dry etching may be used. As an etchant in wet etching, a known etchant suitable for the material of the metal layer 130 is used. For example, ferric chloride solution, cupric chloride solution, stainless steel, ferric chloride solution for 42 alloy and nickel, and sodium hydroxide aqueous solution for aluminum are used as etchants for copper and copper alloys. Next, after removing the photoresist 220 with a predetermined stripper, the metal layer 130 of the base 210 is removed.
The surface side is covered with an etch-resistant photoresist 230 that withstands subsequent etching steps. (FIG. 5E) The photoresist 220 is stripped by dipping in a predetermined stripper or spraying the stripper with a spray. casein,
For peeling off PVA, dry film resist or the like, an alkaline aqueous solution such as heated sodium hydroxide is used.
Next, in the same manner as in the processing of the photoresist 220, using a predetermined photomask,
The photoresist 230 is formed into a predetermined shape by exposing 0, performing processing such as development and drying. (FIG. 5 (f)) As the photoresist 230, a novolak-based resist having good processing resistance is used because it is subjected to plasma etching, but dry film resist, casein, PV
A can also be applied depending on the thickness of the polyimide to be etched. Next, the polyimide resin layer 120, which is exposed from the opening 235 of the photoresist 230 in a predetermined shape, is penetrated by plasma etching using oxygen plasma or the like to form a first opening 125. (FIG. 5 (g)) Examples of the wet etching method include a method of immersing in a high-temperature, high-concentration aqueous sodium hydroxide solution and a method of immersing in a mixed solution of hydrazine and ethylenediamine. Next, the photoresist 230 is removed with a predetermined stripper. (FIG. 5
(H)) The photoresist 230 is peeled off by dipping in a predetermined peeling liquid or spraying the peeling liquid with a saffle. A novolak-based positive resist uses a water-soluble organic solvent such as acetone or an aqueous solution of TMHA (tetramethylammonium hydroxide), and is used to remove casein, PVA, dry film resist, and the like. And the like. Next, a conductive layer 140 serving as a wiring portion is formed by plating in the first opening 125 of the polyimide resin layer 120 of the base 210. (FIG. 5
(I) The formation of the conductive layer 140 is performed according to a known plating method. As the conductive layer 140, copper, silver, gold, nickel,
Although chromium, zinc, tin, platinum and the like can be mentioned, copper plating is preferred from the viewpoint of processability and cost. As described above, the transfer member 101 shown in FIG. 1 is manufactured.

Next, a second embodiment of the method for manufacturing a transfer member according to the present invention will be described with reference to FIG. Second
2 is a method of manufacturing the transfer member 102 shown in FIG. 2 in which an adhesive resin layer 160 serving as an adhesive layer at the time of transfer is provided on the conductive layer 140 serving as a wiring portion. It is an example. In the second example, as in the first example, after the state shown in FIG.
An insulating resin layer 160 is formed by electrodeposition (FIG. 5 (j)).
Things. As the insulating resin layer 160 in the case of electrodeposition, any material may be used as long as it has electrodeposition properties and exhibits adhesiveness at room temperature or by heating. For example, as the polymer to be used, anionic or cationic synthetic polymer resin having adhesiveness can be exemplified. As the anionic synthetic polymer resin, an acrylic resin, a polyester resin, a maleated oil resin, a polybutadiene resin, an epoxy resin, a polyamide resin, a polyimide resin alone, or as a mixture of any combination of these resins Can be used. Further, the above-mentioned anionic synthetic resin may be used in combination with a crosslinkable resin such as a melamine resin, a phenol resin and a urethane resin. In addition, as the cationic synthetic polymer resin, an acrylic resin, an epoxy resin, a urethane resin, a polybutadiene resin, a polyamide resin, a polyimide resin, or the like can be used alone or as a mixture of any combination thereof. Further, the above cationic synthetic polymer resin and a crosslinkable resin such as a polyester resin and a urethane resin may be used in combination. In addition, in order to impart tackiness to the polymer resin, rosin-based, terpene-based,
It is also possible to add a tackifier resin such as a petroleum resin as needed. The polymer resin is subjected to an electrodeposition method in a state of being neutralized by an alkaline or acidic substance and solubilized in water, or in a water-dispersed state. Anionic synthetic polymer resins are neutralized with amines such as trimethylamine, diethylamine, dimethylethanolamine and diisopropanolamine, ammonia and inorganic alkalis such as caustic potash, and cationic synthetic polymer resins are acetic acid, formic acid, propione Neutralize with acids such as acid and lactic acid. Then, the polymer resin solubilized in the neutralized water is used in a state of being diluted with water as a water dispersion type or a solution type.

The present invention will be further described with reference to examples.

EXAMPLE 1 Example 1 is an example in which the transfer member of the first example shown in FIG. 1 was manufactured by the method of manufacturing the transfer member of the first example shown in FIG. A description will be given based on FIG. First, 25 μm thick stainless steel (SUS30
4TA), a conductive base material 110 made of 4 μm, a polyimide resin layer 120 having a thickness of 14 μm, and a metal layer 130 made of a copper layer having a thickness of 10 μm laminated in this order via an adhesive layer made of a thermoplastic polyimide resin. Metal-clad polyimide base material (Neoflex manufactured by Mitsui Chemicals, Inc.) as base material 21
0 was prepared. (FIG. 5 (a))

Next, casein FR-15 (manufactured by Fuji Pharmaceutical Co., Ltd.) containing 10% aqueous solution of ammonium bichromate was applied to the metal layer 130 side of the substrate 210 by a spinner, and a clean oven at 80 ° C. After pre-baking for 30 minutes in the atmosphere (FIG. 5 (b)), exposure was performed using a photomask having a predetermined pattern under the following conditions, and the exposure was performed at 50 °
C was developed with warm water. Next, the film was immersed in a 10% chromic anhydride aqueous solution for 10 seconds, washed with water and dried, and then post-baked in a clean oven at 200 ° C. for 30 minutes to form a photoresist 220 in a predetermined shape. (FIG. 5 (c)) The opening width of the photoresist was about 5 μm. (Exposure conditions) Adhesion exposure machine P-202-G (manufactured by Dainippon Screen Mfg. Co., Ltd.) Vacuum evacuation 30 seconds Exposure time 300 counts Next, using a photoresist 220 of a predetermined shape as an etching resistant mask, a ferric chloride solution was used. The metal layer 130 was etched under the following conditions to provide a second opening 135. (FIG. 5 (d)) Thereby, the surface of the polyimide resin layer 120 was exposed. (Etching conditions) Spray processing equipment EX-42E (manufactured by Yoshitani Co., Ltd.) Etchant Ferric chloride solution 30 Baume Liquid temperature 50 ° C. Sfrey pressure 3 kgf / cm ² Processing time 1 minute

Next, the whole was immersed in a 5% aqueous solution of sodium hydroxide at 80 ° C. for 10 minutes to form a photoresist 220
After peeling, was sufficiently washed with water, neutralized with 10% sulfuric acid, washed with water and dried. Thereafter, the metal layer 13 of the base 210 is
The 0 side is covered with a photoresist 225 made of AZ LP-10 (manufactured by Hoechst Japan KK),
Pre-baked in oven C for 30 minutes. (FIG. 5
(E)) Next, using a photomask having a predetermined pattern,
Exposure was performed under the following conditions, developed with an AZ 30N developer (manufactured by Hoechst Japan KK) for 1 minute, and post-baked on a hot plate at 120 ° C. for 2 minutes to form a photoresist 225 in a predetermined shape. (FIG. 5F) The opening width of the photoresist was about 40 μm. (Exposure conditions) Close contact exposure machine P-202-G (manufactured by Dainippon Screen Mfg. Co., Ltd.) Vacuum evacuation 30 seconds Exposure time 600 count

The etching of the polyimide resin layer 120 was performed as follows, and a first opening 125 was provided in the polyimide resin layer 120. (FIG. 6 (g)) (etching conditions) Apparatus: high-frequency parallel plate type RIE dry etching apparatus etching _{gas: O 2 / CF 4 = 80} : 20 Total gas amount 50sccm total gas pressure 30 Pa RF output: 250 W Etching time: 30 minutes

Next, AZ Remover 100 (manufactured by Hoechst Japan KK) heated to 70 ° C.
After immersion for minutes, the photoresist 225 was peeled off, washed sufficiently with water and dried. (FIG. 5H) Next, the first opening 125 of the polyimide resin layer 120 is formed.
Was plated on the conductive substrate 110 exposed from the first opening so as to fill the gap. (FIG. 5 (i)) In the copper plating, the conductive base material 110 is immersed in a copper sulfate plating bath having the following composition with the conductive base material 110 facing the phosphorous copper electrode, and the phosphorous copper electrode is electrically connected to the anode of the DC power supply. The conductive substrate 110 was connected to the cathode, and a current density of 3 A / dm ² was supplied for 22 minutes to form a conductive layer 140 made of copper plating and having a thickness of 14 μm. (Composition of sulfuric acid copper plating _{bath) CuSO 4 · 5H 2 O 75g} / l H 2 SO 4 180g / l HCl 0.15ml / l (60ppm as Cl) Cu-Board HA MU 10ml / l ( Ebara-Udylite Co., Ltd. Thus, the transfer member 101 of the first example shown in FIG. 1 was manufactured.

The transfer member 10 thus manufactured
1 and the thickness of the conductive layer 140 serving as a wiring portion is 25 μm.
Prior to transfer onto a transfer material made of stainless steel foil (SUS304TA), an insulating resin (UPA221C, manufactured by Ube Industries, Ltd.) is applied to the conductive layer 140 serving as a wiring portion of the transfer member 101 by a dispenser coating method. After applying to a thickness of about 13 μm and heat-treating at 200 ° C. for 1 hour, the transfer member 101 is applied to the transfer material at a pressure of 1 kgf /
cm ^{2 at} a temperature of 250 ° C.
The conductive layer 140 which becomes a wiring layer by peeling was transferred to the material to be transferred via an insulating resin (UPA221C manufactured by Ube Industries, Ltd.), but the entire conductive layer 140 was transferred.
In addition, the thickness of the adhesive layer 160 over the front surface of the material to be transferred was approximately 10 μm, the same as the thickness of the metal layer 130.

(Embodiment 2) In Embodiment 2, the second embodiment shown in FIG.
Of the transfer member 102 according to the first embodiment.
A transfer member 102 is produced by forming an adhesive resin layer 160 by electrodeposition on a conductive layer 140 made of copper plating of the transfer member 101 prepared in the above step.
Here, only the method for forming the electrodeposited adhesive resin layer 160 by electrodeposition will be described below. The electrodeposition of the adhesive resin layer 160 is performed by immersing the conductive substrate 110 on which the conductive layer 140 has been formed and the stainless steel electrode in opposition to each other, and immersing the electrodeposited liquid in the following manner. , A conductive base material 1 on the anode of the DC power supply
10 and a stainless steel electrode connected to the cathode,
Electrodeposition was performed for 3 minutes at a voltage of 00V. Thereafter, this is dried on a hot plate at 80 ° C. for 3 minutes, and a 10 μm-thick adhesive resin layer 160 having a thickness of 10 μm is formed on the conductive layer 140.
Was formed. As a result, the transfer member 102 of the second example
Was produced. (FIG. 5 (j))

Incidentally, a polyimide varnish was prepared as follows, and an electrodeposition solution was adjusted. <Production of Polyimide Varnish> A stainless steel squirrel stirrer, a nitrogen inlet tube, and a reflux condenser equipped with a cooling tube with a ball on a trap with a stopcock are attached to an 11-volume three-neck separable flask. While flowing in a nitrogen stream, the separable flask was placed in a silicone bath equipped with a temperature controller and heated. The reaction temperature is indicated by bath temperature. 3,
32.22 g (0.1 mol) of 4,3 ′, 4′-benzophenonetetracarboxylic dianhydride (hereinafter referred to as BTDA), bis (4- (3-aminophenoxy) phenyl)
21.63 g (0.05 mol) of sulfone (m-BAPS), 1.5 g (0.015 mol) of palerolactone, 2.4 g (0.03 mol) of pyridine, NMP (short for N-methyl-2-pyrrolidone) After adding 200 g and toluene 30 g, the mixture is stirred at room temperature for 30 minutes (200 rpm) in a silicon bath while passing nitrogen, and then heated to 180 ° C. for 1 hour while stirring at 200 rpm. After removing 15 ml of toluene-water effluent, air-cooled, BTDA6.
11 g (0.05 mol), 3,216 diaminobenzoic acid (hereinafter referred to as DABz) 15.216 g (0.1 mol), N
After adding 119 g of MP and 30 g of toluene and stirring at room temperature for 30 minutes (200 rpm), the temperature was raised to 180 g.
The mixture was heated and stirred at ℃ to remove 15 ml of toluene-water effluent. Then, while removing the toluene-water outflow outside the system,
The reaction was completed by heating and stirring at 180 ° C. for 3 hours. 2
0% polyimide varnish was obtained. Acid equivalent (1 COOH
The amount of polymer per unit is 1554) is 70. <Preparation of electrodeposition liquid> 100 g of 20% concentration polyimide varnish
3SN (NMP: tetrahydrothiophene-1, l-
Dioxide = 1: 3 (weight) mixed solution) 150 g, benzyl alcohol 75 g, methylmorpholine 5.0 g
(Neutralization rate: 200%) and 30 g of water are stirred to prepare an aqueous electrodeposition solution. The obtained aqueous electrodeposition solution was prepared using polyimide 7.4.
%, PH 7.8, is a dark reddish brown transparent liquid.

The transfer member 10 thus manufactured
2 is a stainless steel foil with a thickness of 25 μm (SUS304TA)
Pressure 1 kgf / cm ² , temperature 20
The substrate 210 was peeled off by pressing under the condition of 0 ° C., and the conductive layer 140 serving as a wiring layer was transferred and formed on the material to be transferred via the adhesive-insulating layer 160. All of the transferred and adhesive-insulating layer 160 was able to be set to approximately 10 μm over the front surface of the material to be transferred, similarly to the thickness of the metal layer 130.

[0032]

As described in detail above, the present invention can cope with miniaturization and high-density wiring, does not require a complicated process, has good productivity, and is suitable for mass production. It is possible to provide a transfer member for transferring a wiring layer, which makes it possible to manufacture a multilayer wiring board that can also be used with high quality by using a multilayer wiring board provided with a plurality of wiring portions. More specifically, the present invention provides a transfer member capable of improving the uniformity of the thickness of an insulating resin layer for fixing a wiring portion to be transferred.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional view of an example of an embodiment of a transfer member of the present invention.

FIG. 2 is a partial cross-sectional view of two embodiments of a transfer member according to the present invention.

FIG. 3 is a cross-sectional view for explaining transfer of the transfer member of the first example.

FIG. 4 is a cross-sectional view for explaining transfer of a transfer member according to a second example.

FIG. 5 is a process diagram showing a process of a first example and a process of a second example of the embodiment of the method for manufacturing a transfer member of the present invention.

FIG. 6 is a view for explaining a conventional transfer member and a method for manufacturing the same.

[Explanation of symbols]

 101, 102 transfer member 110 conductive substrate 120 polyimide resin layer 125 first opening 130 metal layer 135 second opening 140 conductive layer 160, 165 insulating resin layer 210 base 220, 230 photoresist 225, 235 Opening 310 Transfer receiving material 610 Conductive substrate 620 Photoresist layer 625 Opening 630 Conductive layer 640 Insulating resin layer 650 Transfer receiving material

Claims (14)

[Claims] 1. A transfer member for transferring and forming a conductive layer serving as a wiring portion to a transfer material via a viscous insulating layer serving as an adhesive layer, wherein at least a transferable member is provided.
And a plate-shaped conductive base material having plating releasability, and a polyimide laminated on one surface of the conductive base material and provided with a first opening having a predetermined shape according to the shape of a wiring portion to be produced. A resin layer, a conductive layer serving as a wiring part provided by plating on one surface of the conductive base material so as to fill the first opening of the polyimide resin layer, and A second opening is provided which includes a region where the adhesive portion is formed by laminating the wiring portion region and the adhesive layer when the wiring portion is transferred, and which is opened in a region larger than these regions. A transfer member, comprising: a metal layer; 2. The wiring layer according to claim 1, wherein an adhesive insulating layer is provided on a surface of the conductive layer which is to be a wiring portion on a side opposite to the conductive substrate, and the wiring portion is provided on the polyimide resin layer. And a second metal layer having a second opening that opens a region larger than the region including a region of the adhesive and adhesive layer thereon. Parts. 3. The transfer member according to claim 1, wherein the conductive substrate is made of stainless steel. 4. The transfer member according to claim 1, wherein the metal layer is a copper layer or a copper alloy layer. 5. The method according to claim 1, wherein the bonding between the polyimide resin layer and the conductive substrate and the bonding between the polyimide resin layer and the metal layer are performed using a thermoplastic polyimide resin. Transfer member. 6. The transfer member according to claim 1, wherein the adhesive adhesive layer is an electrodeposition product. 7. A transfer member for transferring and forming a conductive layer serving as a wiring portion to a transfer-receiving material via an adhesive-insulating layer serving as an adhesive layer, at least being capable of plating and exfoliating plating. A plate-shaped conductive base material having a property, a polyimide resin layer provided on a first surface of the conductive base material, provided with a first opening having a predetermined shape according to a shape of a wiring portion to be formed; , So as to fill the first opening of the polyimide resin layer,
A conductive layer serving as a wiring portion provided by plating on one surface of the conductive base material, and an adhesive layer which is laminated on the polyimide resin layer to transfer the wiring region and the wiring portion And a metal layer provided with a second opening that is open in a region larger than these regions, including a formation region of an adhesive adhesive layer to be formed, A (A) metal layer, a polyimide resin layer, and a conductive base material capable of being plated and having plating releasability are preliminarily laminated on the base material, and a second opening is formed on the surface of the metal layer. A step of forming an etching-resistant first mask for etching, and (B) a step of etching a portion of the metal layer of the base material exposed from the first mask to form a second opening. 1 etching process and (C)
Removing the first mask on the substrate, forming an etching-resistant second mask for etching the first opening on the metal layer of the substrate and the surface of the polyimide; and (D) a second etching step of forming a first opening by etching a portion of the polyimide resin layer of the substrate exposed from the second mask; and (E) a second mask on the substrate. Forming a conductive layer serving as a wiring in a portion exposed from the second opening of the conductive base material which can be plated and has plating releasability after the film is removed. A method for manufacturing a transfer member. 8. A transfer member for transferring and forming a conductive layer serving as a wiring portion to a transfer-receiving material via an adhesive-insulating layer serving as an adhesive layer, at least capable of plating and peeling off plating. A plate-shaped conductive base material having a property, a polyimide resin layer provided on a first surface of the conductive base material, provided with a first opening having a predetermined shape according to a shape of a wiring portion to be formed; , So as to fill the first opening of the polyimide resin layer,
A conductive layer serving as a wiring portion provided by plating on one surface of the conductive base material, and an adhesive layer which is laminated on the polyimide resin layer to transfer the wiring region and the wiring portion And a metal layer provided with a second opening that is open in a region larger than these regions, including a formation region of an adhesive adhesive layer to be formed, A (A) metal layer, a polyimide resin layer, and a conductive base material capable of being plated and having plating releasability are preliminarily laminated on the base material, and a second opening is formed on the surface of the metal layer. A step of forming an etching-resistant first mask for etching, and (B) a step of etching a portion of the metal layer of the base material exposed from the first mask to form a second opening. 1 etching process and (C)
Removing the first mask on the substrate, forming an etching-resistant second mask for etching the first opening on the metal layer of the substrate and the surface of the polyimide; and (D) a second etching step of forming a first opening by etching a portion of the polyimide resin layer of the substrate exposed from the second mask; and (E) a second mask on the substrate. Forming a conductive layer serving as a wiring in a portion exposed from the second opening of the conductive base material capable of plating and having plating releasability after the film is removed, and (F) wiring is performed. Forming a viscous insulating layer on the exposed portion of the conductive layer. 9. The method for producing a transfer member according to claim 8, wherein the step of forming the adhesive-bonding insulating layer comprises electrodepositing the adhesive-sticking insulating layer. 10. The method for producing a transfer member according to claim 7, wherein the conductive substrate capable of being plated and having plating releasability is stainless steel. 11. The method for manufacturing a transfer member according to claim 7, wherein the metal layer is a copper layer or a copper alloy layer. 12. The method according to claim 7, wherein the bonding between the polyimide resin layer and the conductive substrate and the bonding between the polyimide resin layer and the metal layer are performed using a thermoplastic polyimide resin. A method for producing a transfer member. 13. The method for manufacturing a transfer member according to claim 7, wherein the first etching-resistant mask and the second etching-resistant mask are made of a photoresist film. 14. The method for manufacturing a transfer member according to claim 7, wherein the etching of the polyimide resin layer in the second etching step is performed by plasma etching.