JPH11261074A - 半導体装置およびその作製方法 - Google Patents
半導体装置およびその作製方法Info
- Publication number
- JPH11261074A JPH11261074A JP10082947A JP8294798A JPH11261074A JP H11261074 A JPH11261074 A JP H11261074A JP 10082947 A JP10082947 A JP 10082947A JP 8294798 A JP8294798 A JP 8294798A JP H11261074 A JPH11261074 A JP H11261074A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- film
- valve metal
- metal film
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Thin Film Transistor (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10082947A JPH11261074A (ja) | 1998-03-13 | 1998-03-13 | 半導体装置およびその作製方法 |
| US09/210,781 US6369410B1 (en) | 1997-12-15 | 1998-12-15 | Semiconductor device and method of manufacturing the semiconductor device |
| US10/101,830 US6613614B2 (en) | 1997-12-15 | 2002-03-21 | Semiconductor device and method of manufacturing the semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10082947A JPH11261074A (ja) | 1998-03-13 | 1998-03-13 | 半導体装置およびその作製方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11261074A true JPH11261074A (ja) | 1999-09-24 |
| JPH11261074A5 JPH11261074A5 (OSRAM) | 2005-07-21 |
Family
ID=13788423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10082947A Withdrawn JPH11261074A (ja) | 1997-12-15 | 1998-03-13 | 半導体装置およびその作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11261074A (OSRAM) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102665537A (zh) * | 2009-11-11 | 2012-09-12 | 卡兹欧洲公司 | 用于动脉血压监测器的袖带 |
| JP2015079265A (ja) * | 1999-10-29 | 2015-04-23 | 株式会社半導体エネルギー研究所 | 電子装置 |
| US9290695B2 (en) | 2013-04-19 | 2016-03-22 | Joled Inc | Method for manufacturing a thin-film semiconductor device using an etching solution for an aluminum oxide film |
-
1998
- 1998-03-13 JP JP10082947A patent/JPH11261074A/ja not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015079265A (ja) * | 1999-10-29 | 2015-04-23 | 株式会社半導体エネルギー研究所 | 電子装置 |
| CN102665537A (zh) * | 2009-11-11 | 2012-09-12 | 卡兹欧洲公司 | 用于动脉血压监测器的袖带 |
| US9290695B2 (en) | 2013-04-19 | 2016-03-22 | Joled Inc | Method for manufacturing a thin-film semiconductor device using an etching solution for an aluminum oxide film |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20041201 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20041201 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20070123 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070130 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20070222 |