JPH11260767A - Cutting table of dicing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the work cutting accuracy, by manufacturing a table base and porous member for sucking an adhesive sheet to be mounted thereon from materials having equal linear expansion coefficients. SOLUTION: The cutting table 12 is composed of a table base 23 and porous members 34. The table base 32 is made of ceramics and formed like a tray and the porous member 34 is glass-fused with specified gap in a recess of the table base 32. A suction unit is connected to an air hole 36 bored through a central part of the table base 32 and driven to suck an adhesive sheet 14 to the porous member 34 to hold a work 16 with the cutting table 12. The porous member 34 is made of ceramics so that the linear expansion coefficient (7.4×10<-16> / deg.C) is equal to that of the ceramic table base 32.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting table for a dicing apparatus, and more particularly to a cutting table for holding a semiconductor wafer when the semiconductor wafer is cut into dice by the dicing apparatus.

[0002]

2. Description of the Related Art A dicing apparatus includes a cutting blade.
Is a device for rotating a semiconductor wafer (work) into a dice by rotating at a high speed. The work is bonded to the adhesive sheet, and the work is held on the cutting table via the adhesive sheet by adsorbing the adhesive sheet on the cutting table.

A conventional cutting table is constructed by bonding a ceramic porous member to a SUS table base. The adhesive sheet is adsorbed by the porous member, and the work is held on the cutting table. The work held on the cutting table is cut by the blade together with the adhesive sheet.

When starting the cutting, a contact cutter set for setting a reference position of the blade is performed in advance. This contact cutter set is an operation of setting a blade position at that time as a reference position by bringing the blade into contact with a table base and conducting the blade, and the cutting amount of the blade is set based on the reference position.

[0005]

However, when the conventional cutting table is used, even when the cutting amount of the blade is set to a constant value, the actual cutting amount may fluctuate and a shortage of cutting may occur. Therefore, there is a disadvantage that the cutting accuracy of the work is poor. The present invention has been made in view of such circumstances, and provides a cutting table of a dicing apparatus that can improve the cutting accuracy of a workpiece.

[0006]

According to the present invention, there is provided a dicing apparatus for cutting a work into a predetermined shape by rotating a cutting blade. In a cutting table that holds a work via an adhesive sheet by suction, the cutting table includes a tray-shaped table base member and a porous member attached to the table base member and sucking the adhesive sheet. The table base and the porous member are made of materials having the same linear expansion coefficient.

[0007] The present invention confirms that the cutting amount fluctuates due to the bending of the porous member due to the bimetal effect of the cutting table, and to prevent the bending of the porous member, a table base and a porous member are provided. And were made of materials having the same linear expansion coefficient. Thus, according to the present invention, the bending of the porous member due to the bimetal effect can be suppressed, so that the cutting accuracy of the work can be improved.

In order to suppress the bending of the porous member, it is preferable that the table base and the porous member are made of a material having a small coefficient of linear expansion and a material having corrosion resistance. For this reason, in the present invention, the table base and the porous member are made of ceramic. This allows
The cutting accuracy of the work can be further improved. Further, according to the present invention, the reference position of the cutting blade is set by sintering the conductive ceramic on a part of the table base member and bringing the cutting blade into contact with the conductive ceramic to conduct electricity. Thereby, the cutting table of the present invention can implement the contact cutter set without any trouble.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A cutting table of a dicing apparatus according to the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a perspective view of a dicing apparatus 10, and FIG. 2 is a sectional view of a cutting table 12 according to an embodiment of the present invention.

[0010] The dicing apparatus 10 shown in these figures comprises:
This is a device that finely aligns the work 16 held on the cutting table 12 via the adhesive sheet 14 and then cuts the work 16 into a dice with a blade 18 that rotates at a high speed. When cutting the work 16, in order to maintain the processing accuracy of the work 16, the cleaning water is directed from the pair of cleaning water injection nozzles 20, 20 and the cutting water injection nozzle 22 toward both surfaces of the blade 18 during cutting of the work,
The blade 18 is cooled and washed by spraying cutting water. In FIG. 1, reference numeral 24 denotes a tube that supplies cleaning water to the cleaning water injection nozzles 20, 20, and reference numeral 26 denotes a tube that supplies cutting water to the cutting water injection nozzle 22. Reference numeral 28 denotes a drive motor for the blade 18, and reference numeral 30 denotes a flange cover.

The cutting table 12 comprises a table base 32 and a porous member 34, as shown in FIG. The table base 32 is made of ceramic and formed in a tray shape.
The porous member 34 is glass-welded to the concave portion with a predetermined gap. A vent 36 is formed in the center of the table base 32, and a suction device (not shown) is connected to the vent 36. Therefore, when the suction device is driven, the adhesive sheet 14 is
The work 16 is held on the cutting table 12 by being sucked to the work table 4.

The porous member 34 is made of ceramic so that the linear expansion coefficient (7.4 × 10 ⁻⁶ / ° C.) is equal to that of the ceramic table base 32. Thereby, even if the cutting table 12 is heated by the heat generated at the time of cutting, the bimetal effect does not occur in the cutting table 12, so that the bending of the porous member 34 due to the bimetal effect can be suppressed.

On the table base 32, a conductive ceramic 38 is sintered. The conductive ceramic 38 is formed on a part of the upper edge of the table base 32 and is connected to a circuit for performing a contact cutter set. This circuit is closed when the blade 18 contacts the conductive ceramic 38, and the position of the blade 18 when closed is set as a reference position.
The cutting amount of the work 16 by the blade 18 is set based on the reference position.

[0014] Such a cutting table 12
It is manufactured by the following procedure. First, the porous member 34 is glass-welded to the table base 32, and then the conductive ceramic 38 is sintered to the table base 32. Next, the surface of the cutting table 12 (the porous member 34)
And the surface of the conductive ceramic 38) are polished and flattened. By this procedure, the cutting table 12 is manufactured.

Next, the effects of the cutting table 12 configured as described above will be described. First, the cutting table 12 of the present embodiment has a table base 3
2 and the porous member 34 are made of a material (ceramic) having the same linear expansion coefficient, so that the bending of the porous member 34 due to the bimetal effect can be suppressed. Therefore,
When this cutting table 12 is used, the work 1
6 can improve the cutting accuracy.

The table base 32 and the porous member 3
Since No. 4 is manufactured from a ceramic having a small coefficient of linear expansion and corrosion resistance, the cutting accuracy of the work can be further improved, and the cutting accuracy can be stably maintained. Further, in the cutting table 12, a conductive ceramic 38 is provided on a part of the table base 32.
, The contact cutter set can be implemented without any trouble.

In this embodiment, the table base 32 and the porous member 34 are made of ceramic. However, the present invention is not limited to this. For example, a material having a small linear expansion coefficient such as engineering plastic resin may be used.
In addition, any material having corrosion resistance can be used.

[0018]

As described above, according to the cutting table of the dicing apparatus according to the present invention, since the table base and the porous member are made of materials having the same linear expansion coefficient, the cutting accuracy of the work can be improved. Can be.
Further, in the present invention, since the table base and the porous member are made of ceramic, the cutting accuracy of the work can be further improved.

Further, according to the present invention, since the conductive ceramic is sintered on a part of the table base member, the contact cutter set can be implemented without any trouble.

[Brief description of the drawings]

FIG. 1 is a perspective view of a dicing apparatus to which a cutting table according to an embodiment of the present invention is applied.

FIG. 2 is a cross-sectional view of the cutting table according to the embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Dicing apparatus 12 ... Cutting table 14 ... Adhesive sheet 16 ... Work 18 ... Blade 32 ... Table base 34 ... Porous member 38 ... Conductive ceramic

Claims (3)

[Claims] 1. A cutting table which is used in a dicing apparatus which cuts a work into a predetermined shape by rotating a cutting blade, and which holds the work via the adhesive sheet by sucking an adhesive sheet to which the work is bonded. In the above, the cutting table is composed of a tray-shaped table base member and a porous member attached to the table base member and adsorbing the adhesive sheet, and the table base and the porous member have a linear expansion coefficient. A cutting table for a dicing apparatus, wherein the cutting table is made of a material having the same size. 2. The cutting table according to claim 1, wherein said table base member and said porous member are made of ceramic. 3. A conductive ceramic is sintered on a part of the table base member, and the cutting blade is brought into contact with the conductive ceramic to make it conductive, thereby setting a reference position of the cutting blade. The cutting table of the dicing apparatus according to claim 2, wherein