JP2555228Y2 - Dicing equipment - Google Patents

Description

[Detailed description of the invention]

[0001]

The present invention relates to a dicing apparatus,
More particularly, the present invention relates to a dicing apparatus for cutting a semiconductor wafer into dice.

[0002]

2. Description of the Related Art When a semiconductor wafer (hereinafter referred to as "work") is cut into a dice by a dicing apparatus, the work fixed on a sheet is vacuum-sucked to a cutting table via the sheet and cut by the dicing apparatus. Cut with a blade (hereinafter referred to as "blade").

[0003]

However, in the conventional dicing apparatus, when a conductive material for electrode contact such as Au deposited on the wafer surface adheres between the abrasive grains of the blade during the cutting of the wafer, There is a disadvantage that the conductive material grows in a snowball manner and causes clogging of the blade, making it impossible to cut by the blade.

The present invention has been made in view of such circumstances, and has as its object to provide a dicing apparatus that prevents clogging of a blade.

[0005]

According to the present invention, there is provided a dicing apparatus for sucking a wafer fixed on a sheet onto a table and cutting the wafer into a dice with a cutting blade. Vibration generating means is provided between the wafer and the table, and the vibration generating means applies vibration to the wafer being cut in a direction perpendicular to the surface of the wafer.

[0006]

According to the present invention, the vibration generating means mounted on the table is driven to vibrate the wafer within a range that does not adversely affect the chips of the wafer, and the wafer is cut into a dice by the cutting blade. As a result, the conductive material for electrode contact such as Au adhered between the abrasive grains of the cutting blade is separated from the cutting blade while growing in a snowball manner due to the vibration of the wafer, thereby preventing the cutting blade from being clogged. Can be.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the dicing apparatus according to the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a perspective view showing an embodiment of a dicing apparatus 10 according to the present invention. The dicing apparatus 10 has a cutting table 12, a blade 14, and the like. An arc-shaped suction surface 16 is formed at the center of the surface of the cutting table 12. A work 20 fixed on the sheet 18 is attached to the suction surface 16 as shown in FIG.
Is adsorbed in vacuum. On the surface of the work 20,
A conductive material for electrode contacts, such as Au, is vapor-deposited, and the periphery of the sheet 18 is fixed by a frame plate 22.

Further, a piezo element 2 as a vibration generating means
Are attached at regular intervals on the surface of the cutting table 12 and on the periphery of the suction surface 16. These piezo elements 24, 24... Are embedded in the cutting table 12 with their respective ultrasonic oscillation surfaces 24a, 24a.

On the other hand, the blade 14 is
6 is fixed to the spindle 28, and the drive motor 26
, The workpiece 20 is rotated at a high speed in the clockwise direction, and the workpiece 20 can be cut into predetermined dice-like chips. When the work 20 is cut, the blade 14 is cooled and cleaned by cutting water and cleaning water jetted from a cutting water injection nozzle and a cleaning water injection nozzle (not shown), and the processing accuracy of the work 20 is maintained. .

Next, the operation of the dicing apparatus 10 configured as described above will be described. First, the work 20 is
It is adsorbed on the adsorption surface 16 of the cutting table 12 via the sheet 18. After the workpiece 20 is finely aligned, the piezo elements 24, 24 embedded in the surface of the cutting table 12 are driven to direct the piezo elements 24, 24,... From the ultrasonic oscillation surfaces 24a, 24a. The work 20 is vibrated via the sheet 18 within a range that does not adversely affect the chip.

Then, while vibrating the work 20 as described above, the blade 14 is rotated at a high speed in a clockwise direction to cut the work 20 into predetermined die-shaped chips.
As a result, the conductive material for electrode contact such as Au adhered between the abrasive grains of the work 20 during the cutting of the work 20 becomes the work 2
Work 20 in the middle of growing snowball by zero vibration
From the abrasive grains. Therefore, clogging of the blade 14 due to the conductive material can be prevented.
The work 20 can be continuously cut.

[0012]

As described above, according to the dicing apparatus according to the present invention, the vibration generating means attached to the table is driven so that the A adhered between the abrasive grains of the cutting blade during cutting.
Since the electrode contact conductive material such as u is separated from the cutting blade by the vibration of the wafer, it is possible to prevent the cutting blade from being clogged.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of a dicing apparatus according to the present invention.

FIG. 2 is a cross-sectional view showing an embodiment during wafer cutting.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Dicing device 12 ... Cutting table 14 ... Blade 16 ... Suction surface 18 ... Sheet 20 ... Work 24 ... Piezo element 26 ... Drive motor

Claims (1)

(57) [Scope of request for utility model registration] In a dicing apparatus for adsorbing a wafer fixed on a sheet to a table and cutting the wafer into dice with a cutting blade, vibration generating means is provided between the sheet and the table.
In the wafer being cut by the vibration generating means,
A dicing apparatus for applying vibration in a direction perpendicular to the surface of the wafer .