JP4763389B2 - Cutting tools - Google Patents

Description

  The present invention relates to a cutting tool provided with a grindstone blade, and more particularly to a cutting tool used in a cutting apparatus that cuts a workpiece such as a semiconductor wafer or an optical device wafer while applying ultrasonic vibration to the grindstone blade.

  In the semiconductor device manufacturing process, a plurality of regions are partitioned by dividing lines called streets arranged in a lattice pattern on the surface of a substantially wafer-shaped semiconductor wafer, and devices such as ICs, LSIs, etc. are partitioned in the partitioned regions. Form. Then, the semiconductor wafer is cut along the streets to divide the region in which the device is formed to manufacture individual semiconductor chips. In addition, optical device wafers with gallium nitride compound semiconductors laminated on the surface of sapphire substrates are divided into individual light emitting diodes, laser diodes, CCDs and other optical devices by cutting along the streets. It's being used.

  The above-described cutting along the wafer street is usually performed by a cutting device called a dicer. This cutting apparatus includes a chuck table for holding a workpiece such as a wafer, a cutting means for cutting the workpiece held on the chuck table, and a cutting for relatively moving the chuck table and the cutting means. And feeding means. The cutting means includes a cutting tool including a rotating spindle and a grindstone blade mounted on the spindle, and a spindle unit including a drive mechanism for driving the rotating spindle to rotate. In such a cutting apparatus, the cutting tool and the work piece held on the chuck table are relatively cut and fed while rotating the cutting tool at a rotational speed of 20000 to 40000 rpm.

  However, brittle hard materials such as silicon, sapphire, silicon nitride, glass, and lithium tantalate are used for the wafer on which the device is formed. There is a problem of lowering. Also, a wafer with high Mohs hardness such as sapphire is very difficult if not impossible to cut with a grindstone blade.

In order to solve the above-described problems, an ultrasonic vibrator is disposed on a rotating spindle on which a cutting tool equipped with a grinding wheel blade is mounted, and an AC voltage is applied to the ultrasonic vibrator, thereby superposing the grinding wheel blade. There has been proposed a cutting method in which cutting is performed while applying sonic vibration. (For example, refer to Patent Document 1.)
Japanese Patent No. 3469516

A cutting tool used in the above-described cutting method includes a vibration transmission member attached to a rotary spindle, and a grindstone blade in which abrasive grains such as diamond are fixed to the vibration transmission member by nickel plating. Thus, by using the integrated cutting tool with the grinding wheel blade fixed to the vibration transmitting member by plating, ultrasonic vibration can be reliably transmitted to the grinding wheel blade. However, a grindstone blade in which abrasive grains such as diamond are fixed by nickel plating is not necessarily suitable for cutting all workpieces. Depending on the material of the workpiece, a resin bond grindstone in which abrasive grains are bonded by resin bonds. It is desirable to be able to select a blade, a metal bond grindstone blade in which abrasive grains are bonded by metal bond, and a vitrified bond grindstone blade in which abrasive grains are bonded by vitrified bond.
Further, when it is desired to finish the thickness of the grindstone blade to a desired thickness, the grindstone blade is sandwiched between the bottom plate and the upper plate and lapping is performed, for example, a grindstone blade having a thickness of 50 μm is 45 μm. However, the grindstone blade fixed to the vibration transmission member by plating has a problem that the vibration transmission member becomes an obstacle and cannot be lapped.

  The present invention has been made in view of the above facts, and the main technical problem thereof is that a grindstone blade formed by fixing abrasive grains with various bonding agents can be mounted, and the grindstone blade is lapped. It is another object of the present invention to provide a cutting tool capable of finishing to a desired thickness.

In order to solve the main technical problem, according to the present invention, a cutting tool to be mounted on a rotary spindle provided with ultrasonic vibration means,
A vibration transmission member attached to the rotary spindle, and an annular grindstone blade attached to the vibration transmission member and having an opening in the center,
Whetstone blade and a fixed part of the cutting edge portion and the inner peripheral portion of the outer peripheral portion, the fixed portion is fixed by bonding agent to the end face of the mounting portion of the vibration transmitting member,
A cutting tool is provided.

It is desirable that the vibration transmitting member mounting portion is provided with a position restricting portion into which the opening of the grindstone blade is fitted.
Further, it is desirable that the hardness of the bond agent in a cured state is set to be Shore D60 or more in order to reduce that the vibration amplitude applied to the grindstone blade varies depending on the hardness.

  Since the cutting tool according to the present invention is configured so that the fixed portion of the inner peripheral portion of the annular grindstone blade is fixed to the mounting portion of the vibration transmitting portion with a bonding agent, the abrasive grains are fixed with various bonding agents. A grindstone blade can be mounted. Further, the annular grindstone blade can be finished to a desired thickness by lapping before being fixed to the mounting portion of the vibration transmitting portion with a bonding agent.

  Hereinafter, a preferred embodiment of a cutting tool constructed according to the present invention will be described in more detail with reference to the accompanying drawings.

  FIG. 1 shows a perspective view of a cutting apparatus equipped with a cutting tool constructed according to the present invention. The cutting device in the illustrated embodiment includes a device housing 2 having a substantially rectangular parallelepiped shape. In the apparatus housing 2, a chuck table 3 for holding a workpiece is disposed so as to be movable in a direction indicated by an arrow X that is a cutting feed direction. The chuck table 3 includes a suction chuck support 31 and a suction chuck 32 disposed on the suction chuck support 31. A workpiece is illustrated on a holding surface which is the upper surface of the suction chuck 32. Suction holding is performed by operating a suction means that does not. The chuck table 3 is configured to be rotatable by a rotation mechanism (not shown). The chuck table 31 is provided with a clamp 33 for fixing a support frame that supports a wafer, which will be described later, via a protective tape as a workpiece. The chuck table 3 configured as described above can be moved in a cutting feed direction indicated by an arrow X by a cutting feed means (not shown).

  The cutting apparatus shown in FIG. 1 includes a spindle unit 4 as cutting means. The spindle unit 4 is mounted on a moving base (not shown) and is moved in an indexing direction indicated by an arrow Y perpendicular to the cutting feed direction indicated by the arrow X by indexing feeding means (not shown), and a cutting direction by a notch feeding means (not shown). It can be moved in the direction indicated by the arrow Z. The spindle unit 4 will be described with reference to FIG.

  The spindle unit 4 shown in FIG. 2 includes a spindle housing 41, a rotating spindle 42 that is rotatably disposed in the spindle housing 41, and a cutting tool 43 that is attached to the tip of the rotating spindle 42. . The spindle housing 41 is formed in a substantially cylindrical shape and includes a shaft hole 411 penetrating in the axial direction. A rotary spindle 42 that is inserted through a shaft hole 411 formed in the spindle housing 41 includes a tool mounting portion 422 provided with a screw hole 421 at a front end portion thereof, and a central portion thereof in a radial direction. A protruding thrust bearing flange 423 is provided. In this way, the rotary spindle 42 disposed through the shaft hole 411 formed in the spindle housing 41 is rotatably supported by high-pressure air supplied between the inner wall of the shaft hole 411.

  A cutting tool 43 mounted on a tool mounting portion 422 provided at the tip of the rotary spindle 42 includes a vibration transmitting member 44 and an annular grindstone that is mounted on the vibration transmitting member 44 and has a circular opening 451 at the center. It consists of a blade 45. The vibration transmitting member 44 includes a central large-diameter portion 441, a first small-diameter portion 442 formed so as to protrude coaxially from one end surface 441a of the central large-diameter portion 441, and an other end surface 441b of the central large-diameter portion 441. And a second small diameter portion 443 formed so as to protrude coaxially. One end surface 441a of the central large-diameter portion 441 is a mounting surface for the grindstone blade 45, and a position restricting portion 444 into which the opening 451 of the grindstone blade 45 is fitted protrudes from the one end surface 441a by about 1 mm. The first small diameter portion 442 and the second small diameter portion 443 are formed to have the same outer diameter and the same length. The thus formed vibration transmitting member 44 is formed with a through hole 445 that penetrates the center of the shaft.

  The annular grindstone blade 45 includes a cutting edge portion 452 on the outer peripheral portion and a fixed portion 453 on the inner peripheral portion. This annular grindstone blade 45 is an electroformed blade formed in an annular shape by bonding the abrasive grains to one side of an annular aluminum plate with a metal plating such as nickel and then removing the aluminum plate by etching. Resin bond blade formed by bonding resin with an annular bond, metal bond blade formed by bonding abrasive grains with metal bond, formed by ring bonding, and vitrified bond formed by bonding abrasive grains with vitrified bond A blade or the like can be used. In such an annular grindstone blade 45, the fixing portion 453 of the inner peripheral portion is fixed to one end surface 441a which is a mounting surface of the central large diameter portion 441 of the vibration transmitting member 44 by an appropriate bonding agent. At this time, by fitting the opening 451 of the grindstone blade 45 to the position restricting portion 444, the grindstone blade 45 is securely fixed at a predetermined position on the one end surface 441a that is the mounting portion of the central large diameter portion 441 of the vibration transmitting member 44. Is done.

Here, a method of fixing the grindstone blade 45 to the one end surface 441a that is the mounting portion of the central large diameter portion 441 of the vibration transmitting member 44 will be described with reference to FIGS. In addition, before fixing the grindstone blade 45 to the vibration transmission member 44, it is desirable that the grindstone blade 45 is lapped to finish to a desired thickness.
In order to fix the grindstone blade 45 to the vibration transmission member 44, first, one surface of the grindstone blade 45 is placed on one end surface 441a of the central large diameter portion 441 of the vibration transmission member 44 as shown in FIG. . At this time, the opening 451 of the grindstone blade 45 is fitted into the position restricting portion 444. 3 (b) and 3 (c), the fitting portion between the opening 451 of the grindstone blade 45 and the position restricting portion 444 of the vibration transmitting member 44 and the outside of the central large diameter portion 441 of the vibration transmitting member 44. The release material 456 is applied to the side surface of the grindstone blade 45 in the vicinity of the peripheral edge and the outer peripheral edge (release agent application step).

  Next, as shown in FIG. 4 (a), the grindstone blade 45 is removed from the vibration transmission member 44, and an epoxy or acrylic bond is attached to one end surface 441a, which is the mounting portion of the central large diameter portion 441 of the vibration transmission member 44. An agent 455 is applied (bond agent application step). Note that it is desirable to use a bond agent 455 having a cured state hardness of JIS K 6253 Shore D hardness of 60 or more. Then, as shown in FIG. 4B, the fixed portion 453 of the grindstone blade 45 is placed on and bonded to one end surface 441a of the central large diameter portion 441 coated with the bonding agent 455 (blade bonding step). At this time, the opening 451 of the grindstone blade 45 is fitted into the position restricting portion 444.

  After performing the above-described blade bonding step, the pressure fixing step of pressing the fixing portion 453 of the grindstone blade 45 and fixing it to the one end surface 441a that is the mounting portion of the central large diameter portion 441 of the vibration transmitting member 44 is performed. In the pressure fixing step, first, as shown in FIG. 5A, the vibration transmitting member 44 in which the grindstone blade 45 is bonded to the one end surface 441 a of the central large diameter portion 441 is set on the pressure lower jig 10. The pressurizing lower jig 10 is formed of a disk-shaped metal material, and a fitting hole 101 into which the second small diameter portion 443 of the vibration transmitting member 44 is fitted is provided at the center thereof. By fitting the second small diameter portion 443 of the vibration transmitting member 44 into the fitting hole 101 of the pressurizing lower jig 10 thus configured, the center of the vibration transmitting member 44 is placed on the pressurizing lower jig 10. The large diameter portion 441 is set.

If the central large-diameter portion 441 of the vibration transmitting member 44 is set on the pressurizing lower jig 10 as shown in FIG. 5 (a), the vibration transmitting member 44 and the grindstone as shown in FIG. 5 (b). The pressure upper jig 11 is set on the blade 45. The pressurization upper jig 11 is formed of a disk-like metal material similarly to the pressurization lower jig 10, and the first small diameter part 442 of the vibration transmission member 44 is fitted to the center part thereof. A hole 111 is provided. Further, a concave portion 112 deeper than the thickness of the position restricting portion 444 is provided around the fitting hole 111 on the lower surface of the pressurizing upper jig 11 in FIG. The diameter of the peripheral wall of the recess 112 is slightly larger than the diameter of the position restricting portion 444. By fitting the fitting hole 111 of the pressurizing upper jig 11 configured in this way into the first small diameter portion 442 of the vibration transmitting member 44, the lower surface of the pressurizing upper jig 11 is moved to the vibration transmitting member 44. The grindstone blade 45 bonded to the central large diameter portion 441 is set on the upper surface in FIG.
5 (a) and 5 (b) of the pressurizing lower jig 10 is provided with a recess 102 having the same dimensions as the recess 112 provided in the pressurizing upper jig 11 on the lower surface thereof, thereby reducing the pressurizing lower jig. The tool 10 and the pressure upper jig 11 have the same shape, and both jigs can be used for both the lower jig and the upper jig. In addition, by providing the concave portions 102 on the upper and lower surfaces of the pressurizing lower jig 10 and providing the concave portions 112 on the upper and lower surfaces of the pressurizing upper jig 11, the above-described operation can be performed even if the upper and lower sides are inverted. Can do.

  Next, as shown in FIG. 5B, the pressurization lower jig 10 and the pressurization upper jig 11 are pressurized with a predetermined pressure W (for example, 0.4 to 0.5 MPa) for about 12 hours. As a result, the fixed portion 452 of the grindstone blade 45 is bonded to one end surface 441a of the central large-diameter portion 441 of the vibration transmitting member 44 by the bonding agent 455 (see FIG. 4A). It is fixed to the end surface 441a (pressure fixing step). At this time, due to the pressurization, the bonding agent protrudes from the fitting portion between the opening 451 of the grindstone blade 45 and the position restricting portion 444 of the vibration transmission member 44 and the outer peripheral edge portion of the central large diameter portion 441 of the vibration transmission member 44. In some cases, the protruding bond agent 455a is applied to the outer peripheral edge portion of the central large-diameter portion 441 of the grindstone blade 45 and the vibration transmitting member 44 (see FIGS. 3B and 3C). Stick on top. Therefore, after removing the cutting tool 45 having the grindstone blade 45 fixed to the one end surface 441a of the central large diameter portion 441 of the vibration transmitting member 44 from the pressurization lower jig 10 and the pressurization upper jig 11, the release agent 456 described above. The bonding agent 455a that protrudes as described above can also be removed by peeling the film.

  Returning to FIG. 2, the description will be continued. In the cutting tool 43 configured as described above, the tightening bolt 46 disposed through the through hole 445 is screwed on the tool mounting portion 422 of the rotary spindle 42. By screwing into the hole 421, the rotary spindle 42 is mounted. Note that when the cutting tool 43 is mounted on the tool mounting portion 422 of the rotary spindle 42, the tool mounting portion 422 and the first small diameter portion 442 and the second small diameter portion 443 and the head of the tightening bolt 46 are connected. Between the spacers 47 and 47 made of synthetic resin are interposed.

  The spindle unit 4 in the illustrated embodiment includes an electric motor 5 for driving the rotary spindle 42 to rotate. The illustrated electric motor 5 is constituted by a permanent magnet motor. The permanent magnet type electric motor 5 is disposed in a spindle housing 41 on the outer peripheral side of the rotor 51 and a rotor 51 made of a permanent magnet mounted on a motor mounting portion 424 formed in an intermediate portion of the rotary spindle 42. The stator coil 52 is included. In the electric motor 5 configured in this manner, the rotor 51 is rotated by applying AC power to the stator coil 52 by power supply means described later, and the rotating spindle 42 to which the rotor 51 is mounted is rotated.

  The spindle unit 4 in the illustrated embodiment includes an ultrasonic transducer 6 that is disposed on the rotary spindle 42 and applies ultrasonic vibration to the grindstone blade 45. The ultrasonic vibrator 6 includes an annular piezoelectric body 61 polarized in the axial direction of the rotary spindle 42 and two annular electrode plates 62 and 63 attached to both side polarization surfaces of the piezoelectric body 61. It has become. The piezoelectric body 61 is made of piezoelectric ceramics such as barium titanate, lead zirconate titanate, and lithium tantalate. The ultrasonic transducer 6 configured as described above is mounted on the rotary spindle 42, and generates ultrasonic vibration when AC power having a predetermined frequency is applied to the electrode plates 62 and 63 by power supply means described later. A plurality of ultrasonic transducers 6 may be arranged in the axial direction.

The spindle unit 4 in the illustrated embodiment includes power supply means 7 that applies AC power to the ultrasonic vibrator 6 and applies AC power to the electric motor 5.
The power supply means 7 includes a rotary transformer 8 disposed at the rear end of the spindle unit 4. The rotary transformer 8 includes a power receiving unit 81 disposed at the rear end of the rotary spindle 42 and a power feeding unit 82 disposed opposite to the power receiving unit 81 and disposed at the rear end portion of the spindle housing 41. is doing. The power receiving means 81 includes a rotor side core 811 attached to the rotary spindle 42 and a power receiving coil 812 wound around the rotor side core 811. One end of the power receiving coil 812 of the power receiving means 81 configured in this way is connected to the electrode plate 61 of the ultrasonic transducer 6, and the other end is connected to the electrode plate 62. The power supply means 82 includes a stator side core 821 disposed on the outer peripheral side of the power reception means 81 and a power supply coil 822 disposed on the stator side core 821. The power supply coil 822 of the power supply means 82 configured in this way is supplied with AC power via the electrical wirings 73 and 74.

  The power supply means 7 in the illustrated embodiment includes an AC power supply 91 for AC power supplied to the power supply coil 822 of the rotary transformer 8, a voltage adjustment means 92 as power adjustment means, and AC power supplied to the power supply means 82. Frequency adjusting means 93 for adjusting the frequency of the power, control means 94 for controlling the voltage adjusting means 92 and the frequency adjusting means 93, and input means 95 for inputting the amplitude of the ultrasonic vibration applied to the cutting blade 45 to the control means. It has. The power supply means 7 shown in FIG. 2 supplies AC power to the stator coil 52 of the electric motor 5 through the control circuit 96 and the electric wirings 521 and 522.

The spindle unit 4 in the illustrated embodiment is configured as described above, and the operation thereof will be described below.
When performing the cutting operation, AC power is supplied from the power supply means 7 to the stator coil 52 of the electric motor 5. As a result, the electric motor 5 rotates and the rotary spindle 42 rotates, and the grindstone blade 45 attached to the vibration transmission member 44 of the cutting tool 43 attached to the tip of the rotary spindle 42 is rotated.

  On the other hand, the power supply means 7 controls the voltage adjusting means 92 and the frequency converting means 93 by the control means 94 to control the voltage of the AC power to a predetermined voltage, and the frequency of the AC power is set to a predetermined frequency (for example, 20 kHz). And is supplied to the power supply coil 822 of the power supply means 82 constituting the rotary transformer 8. When AC power having a predetermined frequency is applied to the feeding coil 822 as described above, AC power having a predetermined frequency is interposed between the electrode plate 62 and the electrode plate 63 of the ultrasonic transducer 6 via the power receiving coil 812 of the rotating power receiving means 81. Is applied. As a result, the ultrasonic transducer 6 is repeatedly displaced in the radial direction and vibrates ultrasonically. This ultrasonic vibration is transmitted to the vibration transmission member 44 of the cutting tool 43 via the rotary spindle 42, and the vibration transmission member 44 ultrasonically vibrates in the radial direction. Therefore, the grindstone blade 45 attached to the vibration transmitting member 44 vibrates ultrasonically in the radial direction. The amplitude of the ultrasonic vibration applied to the grindstone blade 45 is proportional to the amount of AC power applied to the ultrasonic vibrator 6, but according to experiments conducted by the present inventors, the applied voltage is 50 to 60V. It was found that the amplitude was stable. It was also found that the amplitude of ultrasonic vibration applied to the grindstone blade 45 varies depending on the hardness of the bond agent in a cured state.

Here, the relationship between the hardness of the bond agent and the amplitude of ultrasonic vibration applied to the grindstone blade 45 will be described with reference to FIG.
6 shows a plurality of cutting tools 43 in which a grindstone blade 45 made of an electroformed blade is fixed to a vibration transmission member 44 with a bonding agent having different hardness, and each is mounted on the rotary spindle 42 of the spindle unit 4 shown in FIG. This is an experimental result in which an AC voltage having a frequency of 20 kHz and a voltage of 55 V is applied to the ultrasonic vibrator 6 and the amplitude is measured in the radial direction of the grindstone blade 45.
As can be seen from FIG. 6, the amplitude of the grindstone blade 45 fixed by the bond agent of Shore D28.5 is about 1.5 μm. When the grindstone blade 45 is fixed by the bond agent of Shore D60, the amplitude of the grindstone blade 45 is about 4.5 μm. Further, when the hardness of the bond agent becomes Shore D70 or more, the amplitude of the grindstone blade 45 becomes 5 μm or more. The amplitude of the grindstone blade that contributes to machining in ultrasonic vibration machining is preferably 4 μm or more, and therefore it is desirable to use a bond agent of Shore D60 or more.

  Referring back to FIG. 1, the description of the cutting apparatus in the illustrated embodiment is for imaging the surface of the workpiece held on the chuck table 3 and detecting the region to be cut by the grindstone blade 45. The alignment means 12 is provided. The alignment unit 12 includes an imaging unit including an optical unit such as a microscope or a CCD camera. In addition, the cutting apparatus includes a display unit 13 that displays an image or the like captured by the alignment unit 12.

  In the cassette mounting area 14a of the apparatus housing 2, a cassette mounting table 14 for mounting a cassette for storing a workpiece is disposed. The cassette mounting table 14 is configured to be movable in the vertical direction by lifting means (not shown). On the cassette mounting table 14, a cassette 15 for storing the workpiece 100 is mounted. The workpiece 100 accommodated in the cassette 15 has a grid-like street formed on the surface of the wafer, and capacitors, LEDs, circuits, and other devices are formed in a plurality of rectangular areas partitioned by the grid-like street. Has been. The workpiece 100 formed in this way is accommodated in the cassette 15 with the back surface adhered to the surface of the protective tape 102 attached to the annular support frame 101.

  Further, the cutting device in the illustrated embodiment is a state in which the workpiece 100 (supported on the annular frame 101 via the protective tape 102) is accommodated in the cassette 15 placed on the cassette placement table 14. ) To the temporary table 16, to the workpiece table 100 conveyed to the chuck table 3, and to the workpiece cut on the chuck table 3. A cleaning unit 19 for cleaning the workpiece 100 and a cleaning / conveying unit 20 for conveying the workpiece 100 cut on the chuck table 3 to the cleaning unit 19 are provided.

The operation of the cutting apparatus configured as described above will be briefly described mainly with reference to FIG.
The workpiece 100 accommodated in a predetermined position of the cassette 15 placed on the cassette placement table 14 is positioned at the unloading position by the vertical movement of the cassette placement table 14 by an unillustrated lifting means. Next, the unloading means 17 moves forward and backward to unload the workpiece 100 positioned at the unloading position onto the temporary placement table 16. The workpiece 100 carried out to the temporary placement table 16 is transferred onto the chuck table 3 by the turning operation of the transfer means 18. When the workpiece 100 is placed on the chuck table 3, suction means (not shown) is operated to suck and hold the workpiece 100 on the chuck table 3. The support frame 101 that supports the workpiece 100 via the protective tape 102 is fixed by the clamp 33. The chuck table 3 holding the workpiece 100 in this way is moved to a position immediately below the alignment means 11. When the chuck table 3 is positioned directly below the alignment means 11, the street formed on the workpiece 100 is detected by the alignment means 12, and the spindle unit 4 is moved and adjusted in the direction of the arrow Y, which is the indexing direction. The precision alignment operation | work with the grindstone blade 45 of the cutting tool 43 is performed.

  Thereafter, the grindstone blade 45 is cut and fed by a predetermined amount in the direction indicated by the arrow Z and rotated in the predetermined direction, while the chuck table 3 holding the workpiece 100 is sucked and held in the direction indicated by the arrow X which is the cutting feed direction (the grindstone blade) The semiconductor wafer 100 held on the chuck table 3 is cut along a predetermined street by the grindstone blade 45 by moving at a predetermined cutting feed rate in a direction orthogonal to the rotation axis 45. In this cutting step, AC power having a frequency of 20 kHz and a voltage of 55 V is applied to the ultrasonic transducer 6 by the power supply means 7. As a result, as described above, the ultrasonic transducer 6 is ultrasonically vibrated by being repeatedly displaced in the radial direction. This ultrasonic vibration is transmitted to the vibration transmission member 44 of the cutting tool 43 via the rotary spindle 42, and the vibration transmission member 44 ultrasonically vibrates in the radial direction. Therefore, the grindstone blade 45 attached to the vibration transmitting member 44 vibrates ultrasonically in the radial direction. Therefore, since the cutting resistance by the grindstone blade 45 is reduced, even if the wafer 100 is a difficult-to-cut material such as sapphire, it can be easily cut.

The perspective view of the cutting device with which the cutting tool comprised according to this invention was mounted | worn. Sectional drawing of the spindle unit with which the cutting apparatus shown in FIG. 1 is equipped. Explanatory drawing which shows the peeling agent application | coating process in the method of fixing a grindstone blade to the vibration transmission member which comprises the cutting tool by this invention. Explanatory drawing which shows the bond agent application | coating process and blade adhesion | attachment process in the method of fixing a grindstone blade to the vibration transmission member which comprises the cutting tool by this invention. Explanatory drawing which shows the pressure adhering process in the method of fixing a grindstone blade to the vibration transmission member which comprises the cutting tool by this invention. The graph which shows the relationship between the hardness of the bond agent which adheres a grindstone blade to a vibration transmission member, and the amplitude of the ultrasonic vibration provided to a grindstone blade.

Explanation of symbols

2: Device housing 3: Chuck table mechanism 30: Chuck table 4: Spindle unit 41: Spindle housing 42: Rotating spindle 43: Cutting tool 44: Vibration transmitting member 45: Grinding wheel blade 5: Electric motor 6: Ultrasonic vibrator 7: Power supply means 8: Rotary transformer 81: Power reception means 82: Power supply means 91: AC power supply 92: Voltage adjustment means 93: Frequency adjustment means 94: Control means 95: Input means 12: Alignment means 13: Display means 15: Cassette 16: Temporary table 17: Unloading means 18: Conveying means 19: Cleaning means 20: Cleaning and conveying means

Claims (3)

A cutting tool to be mounted on a rotating spindle provided with ultrasonic vibration means,
A vibration transmission member attached to the rotary spindle, and an annular grindstone blade attached to the vibration transmission member and having an opening in the center,
Whetstone blade and a fixed part of the cutting edge portion and the inner peripheral portion of the outer peripheral portion, the fixed portion is fixed by bonding agent to the end face of the mounting portion of the vibration transmitting member,
A cutting tool characterized by that. Cutting tools of the the mounting portion of the vibration transmission member, the position regulating portion opening of the whetstone blade is fitted is provided, according to claim 1, wherein. The cutting tool according to claim 1 or 2, wherein the bond agent has a hardness in a cured state set to be Shore D60 or more in order to reduce that the vibration amplitude applied to the grindstone blade varies depending on the hardness.

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