CN1927537A - Cutting tool - Google Patents
Cutting tool Download PDFInfo
- Publication number
- CN1927537A CN1927537A CN 200610128077 CN200610128077A CN1927537A CN 1927537 A CN1927537 A CN 1927537A CN 200610128077 CN200610128077 CN 200610128077 CN 200610128077 A CN200610128077 A CN 200610128077A CN 1927537 A CN1927537 A CN 1927537A
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- China
- Prior art keywords
- grinding wheel
- transmission member
- mentioned
- vibration transmission
- main shaft
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- Granted
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- 238000005520 cutting process Methods 0.000 title claims abstract description 64
- 230000005540 biological transmission Effects 0.000 claims abstract description 52
- 239000007767 bonding agent Substances 0.000 claims abstract description 23
- 230000007246 mechanism Effects 0.000 claims description 48
- 238000009434 installation Methods 0.000 claims description 17
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 238000012546 transfer Methods 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000012545 processing Methods 0.000 abstract description 3
- 239000006061 abrasive grain Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 15
- 239000002245 particle Substances 0.000 description 10
- 230000008569 process Effects 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 229910052594 sapphire Inorganic materials 0.000 description 4
- 239000010980 sapphire Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910001651 emery Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000008520 organization Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- -1 gallium nitride compound Chemical class 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Images
Abstract
The invention provides a cutting tool capable of mounting a whetstone blade formed by fixing abrasive grains with various bonding agents, and of finishing the whetstone blade into a desired thickness by lapping processing thereof. The cutting tool mounted on a rotary spindle including ultrasonic vibration means disposed thereon, comprises: a vibration transmission member mounted on the rotary spindle; and an annular whetstone blade mounted on the vibration transmission member and having an opening at the center thereof. The whetstone blade includes a cutting blade of an appearance and a fixed part of an inner periphery, and the fixed part is fixed to a mounting part of the vibration transmission part with a bonding agent.
Description
Technical field
The present invention relates to have the cutting element of grinding wheel, relate to employed cutting element in the topping machanism that when grinding wheel is applied ultrasonic vibration, machined objects such as semiconductor wafer and optical device wafer is cut in more detail.
Background technology
In semiconductor devices manufacturing process, on the surface of the semiconductor wafer that is roughly the disk shape, utilize the preset lines of cutting apart that is arranged in cancellate so-called scribe line, the surface is divided into a plurality of sub-districts, in the district of this division, form devices such as IC, LSI.Then, semiconductor wafer is cut, be divided into the zone that is formed with device respectively, make each semiconductor chip along scribe line.And, on the surface of sapphire substrate, made stacked optical device wafer such as gallium nitride compound semiconductor also along the scribe line cutting, be divided into each optical devices such as light emitting diode, laser diode, CCD, be widely used in electrical equipment.
Cutting along the scribe line of above-mentioned wafer utilizes the topping machanism of so-called saw blade to carry out usually.This topping machanism has: to the absorptive table that machined objects such as wafer keep, be used for the cutting mechanism that cut by the machined object that this absorptive table kept and make absorptive table and cutting connecting gear that cutting mechanism relatively moves.Cutting mechanism comprises: cutting element has rotary main shaft and the grinding wheel that is installed on this rotary main shaft; And main axle unit, have the driving mechanism that is used for rotary main shaft is rotated driving.In such topping machanism, Yi Bian cutting element is rotated according to the rotary speed of 20000～40000rmp, Yi Bian make the machined object that is kept on cutting element and the absorptive table relatively cut transmission.
However, form the wafer of device, adopt crisp hard materials such as silicon, sapphire, silicon nitride, glass, lithium tantalate.If utilize grinding wheel to cut, the problem of existence is to produce breach on the section, and device quality is reduced.And sapphire etc. are the high wafer of third constellations hardness not, though be not to cut with grinding wheel, in fact very difficult.
In order to address the above problem, a kind of like this cutting process has been proposed, promptly on the rotary main shaft that the cutting element with grinding wheel has been installed, ultrasonic oscillator is set, by on this ultrasonic oscillator, applying alternating voltage, cut (for example, referring to patent documentation 1 (No. 3469516 communique of Japan Patent)) when on grinding wheel, applying ultrasonic vibration.
The employed cutting element of above-mentioned cutting process is made of the grinding wheel that is installed in the vibration transmission member on the rotary main shaft and abrasive particles such as diamond are fixed on this vibration transmission member by nickel plating.Like this, utilize to be fixed to grinding wheel on the vibration transmission member and incorporate cutting element through electroplating, can be to grinding wheel the ultrasonic vibration reliable delivery.Yet, the grinding wheel that is not limited to fix with nickel plating abrasive particle such as diamond is applicable to the cutting of all machined objects, preferably can according to the material of machined object select by resinoid bond come in conjunction with abrasive particle the resinoid bonded wheel sheet, come to come ceramic bonding grinding wheel with metallic bond in conjunction with abrasive particle in conjunction with the bonding grinding wheel of the metal of abrasive particle and vitrified bond.
And, the thickness of grinding wheel is trimmed under the situation of desired thickness in hope, grinding wheel is clamped in the chassis and goes up between the dish and carry out attrition process, can be for example thickness the thickness that the grinding wheel of 50 μ m is adapted to 45 μ m.But the problem that exists is: be fixed in the grinding wheel on the vibration transmission member with galvanoplastic, vibration transmission member causes obstacle, can not implement attrition process.
Summary of the invention
The scheme that The present invention be directed to above-mentioned situation and propose, its main purpose provides a kind of following cutting element, the grinding wheel that this cutting element can form fixing abrasive particle with various bonding agents installs, and can carry out attrition process to grinding wheel and it is trimmed to desired thickness.
In order to solve above-mentioned major technique problem, cutting element is installed on the rotary main shaft that is provided with ultrasonic vibration mechanism, it is characterized in that:
Have: vibration transmission member is installed on the above-mentioned rotary main shaft; And circular grinding wheel is installed on the above-mentioned vibration transmission member, has opening at central portion,
Above-mentioned grinding wheel has the cutting blade of peripheral part and the fixed part of inner circular part, and said fixing portion utilizes the installation portion of adhesive securement in above-mentioned vibration transfer part.
The installation portion that is preferably in above-mentioned vibration transfer part is provided with position restriction portion, the opening of chimeric above-mentioned grinding wheel in this position restriction portion.
And the hardness of best above-mentioned bonding agent is set at Shore D more than 60.
The invention effect
Cutting element of the present invention utilizes bonding agent that the fixed part of the interior perimembranous of circular grinding wheel is fixed to the installation portion that vibrates transfer part, so the grinding wheel that can form fixing abrasive particle with various bonding agents is installed.And, before circular grinding wheel is vibrating the installation portion of transfer part by adhesive securement, can be trimmed to required thickness by attrition process.
Description of drawings
Fig. 1 is the stereogram that the topping machanism of the cutting element that constitutes by the present invention has been installed.
Fig. 2 is the sectional drawing of the main axle unit installed on the topping machanism shown in Figure 1.
Fig. 3 is the key diagram that is illustrated in the remover working procedure of coating in the method for fixed emery wheel sheet on the vibration transmission member that constitutes cutting element of the present invention.
Fig. 4 is illustrated in the adhesive applicating operation in the method for fixed emery wheel sheet on the vibration transmission member that constitutes cutting element of the present invention and the key diagram of blade bonding process.
Fig. 5 is the key diagram that is illustrated in the pressurized adhesion operation in the method for fixed emery wheel sheet on the vibration transmission member that constitutes cutting element of the present invention.
Fig. 6 is illustrated in the hardness of the bonding agent of bonding grinding wheel on the vibration transmission member and the curve map of the relation of ultrasonic vibration amplitude that grinding wheel is applied.
The specific embodiment
Following with reference to accompanying drawing, illustrate in greater detail preferred forms according to the cutting element of the present invention's formation.
Fig. 1 is the stereogram that the topping machanism of the cutting element that constitutes by the present invention has been installed.The topping machanism of illustrated embodiment has the crust of the device 2 that is roughly the Nogata shape.In this crust of the device 2, keep the absorptive table 3 of machined object to be arranged to and on the arrow directions X of cutting direction of transfer, to move.Absorptive table 3 has sucker supporting station 31 and the sucker 32 that is located on this sucker supporting station 31, by the action of not shown adsorbing mechanism, machined object absorption is remained on this maintenance face above sucker 32.And absorptive table 3 can rotate by not shown rotating mechanism.And, on absorptive table 31, be provided with clamper 33, be used for fixing scaffold, so that by the following wafer of boundary belt supporting as machined object.The absorptive table 3 that constitutes like this relies on not shown cutting connecting gear, can move up the cutting sender shown in the arrow X.
Topping machanism shown in Figure 1 has the main axle unit 4 as cutting mechanism.Main axle unit 4 is installed on the not shown mobile base station, by not shown index feed mechanism, with the index direction shown in the perpendicular arrow Y of the cutting direction of feed shown in the above-mentioned arrow X on move; And, on the direction shown in the arrow Z of incision direction, move by not shown incision feed mechanism.Following with reference to Fig. 2, this main axle unit 4 is described.
Above-mentioned circular grinding wheel 45 is made of the cutting blade 452 of peripheral part and the fixed part 453 of interior perimembranous.This ring-type grinding wheel 45 can adopt following various blade: after by metal-plated such as nickel abrasive particle being bonded on the face of circular aluminium sheet, aluminium sheet is removed in corrosion, thereby forms circular electroforming blade; Form circular resin bonding blade with resinoid bond in conjunction with abrasive particle; Form the bonding blade of circular metal with metallic bond in conjunction with abrasive particle; And come bound abrasive grains to form circular ceramic bonding blade etc. with vitrified bond.This circular grinding wheel 45, the installed surface that utilizes suitable bonding agent the fixed part 453 of interior perimembranous to be fixed to the central large-diameter portion 441 of vibration transmission member 44 is on the end face 441a.At this moment, by the opening 451 and position restriction portion 444 tablings of grinding wheel 45, the installation portion that grinding wheel 45 is fixed on the central large-diameter portion 441 of vibration transmission member 44 reliably is on the assigned position of an end face 441a.
Following with reference to Fig. 3～Fig. 5, the i.e. method on end face 441a of installation portion that grinding wheel 45 is fixed to the central large-diameter portion 441 of vibration transmission member 44 is described.And, before being fixed on the vibration transmission member 44, preferably grinding wheel 45 is carried out attrition process to grinding wheel 45, be trimmed to required thickness.
For grinding wheel 45 is fixed on the vibration transmission member 44, at first, shown in Fig. 3 (a), a face of grinding wheel 45 is placed on the end face 441a of central large-diameter portion 441 of vibration transmission member 44.At this moment, the opening 451 of grinding wheel 45 is fitted to position restriction portion 444.Then, as Fig. 3 (b) with (c), the outer peripheral edges portion of the fitting portion between the position restriction portion 444 of the opening 451 of grinding wheel 45 and vibration transmission member 44 and the central large-diameter portion 441 of vibration transmission member 44 and near the side of the grinding wheel 45 this outer peripheral edges portion, coating remover 456 (remover working procedure of coating).
Then, take off grinding wheel 45 from vibration transmission member 44 shown in Fig. 4 (a), the installation portion that transmits 44 central large-diameter portion 441 in vibration i.e. end face 441a coating epoxy resin or propylene class bonding agent 455 (adhesive applicating operation).And, the hardness of the best bonding agent that adopts 455 under solid state according to JIS K 6253 Xiao third constellations D hardness more than 60.And, shown in Fig. 4 (b), the fixed part 453 (blade bonding process) of bonding grinding wheel 45 is installed on an end face 441a of the central large-diameter portion 441 that has applied bonding agent 455.At this moment, make the opening 451 and position restriction portion 444 tablings of grinding wheel 45.
Carry out after the above-mentioned blade bonding process, the fixedly operation of pressurizeing is pressurizeed to the fixed part 453 of grinding wheel 45, is adhered on the end face 441a as the installation portion of the central large-diameter portion 441 of vibration transmission member 44.At first shown in Fig. 5 (a), pressurization is fixedly in the operation, and the vibration transmission member 44 that grinding wheel 45 is bonded on the end face 441a of central large-diameter portion 441 places on the downside anchor clamps 10 that pressurize.Pressurization downside anchor clamps 10 are formed by discoid metal material, and heart portion is provided with embedded hole 101 therein, and this embedded hole 101 is used for the 2nd minor diameter part 443 tablings with vibration transmission member 44.Insert the 2nd minor diameter part 443 of vibration transmission member 44 at the embedded hole 101 of the pressurization downside anchor clamps 10 that constitute like this, so the central large-diameter portion 441 of vibration transmission member 44 is installed on the pressurization downside anchor clamps 10.
Shown in Fig. 5 (a),, then shown in Fig. 5 (b), pressurization upside anchor clamps 11 are installed on vibration transmission member 44 and grinding wheel 45 on pressurization downside anchor clamps 10 if the central large-diameter portion 441 of vibration transmission member 44 is installed.Pressurization upside anchor clamps 11 are the same with above-mentioned pressurization downside anchor clamps 10, formed by discoid metal material, and heart portion is provided with embedded hole 111 therein, is used for the 1st minor diameter part 442 tablings with vibration transmission member 44.And, in Fig. 5 (b) of pressurization upside anchor clamps 11 below, around embedded hole 111, be provided with recess 112, the thickness of the above-mentioned position of its depth ratio restriction portion 444 is dark.The perisporium diameter of this recess 112 forms bigger slightly than the diameter of position restriction portion 444.Be entrenched in the 1st minor diameter part 442 of vibration transmission member 44 by the embedded hole 111 of the pressurization upside anchor clamps 11 that will constitute like this, be placed in below the pressurization downside anchor clamps 11 on the central large-diameter portion 441 of vibration transmission member 44 among Fig. 5 (b) of bonding grinding wheel 45 above.
And, at Fig. 5 (a) of pressurization downside anchor clamps 10 with (b), by recess 102 is set below, recess 112 set on size and the above-mentioned pressurization upside anchor clamps 11 is identical, pressurization downside anchor clamps 10 and pressurization upside anchor clamps 11 become same shape, and these two kinds of anchor clamps all can be used for any in downside anchor clamps and the upside anchor clamps.And, by on pressurization downside anchor clamps 10 and below recess 102 is set, and on pressurization upside anchor clamps 11 and below recess 112 is set, thereby also can carry out above-mentioned operation even turn upside down respectively.
Then, shown in Fig. 5 (b), (for example 0.4～0.5MPa) carries out about 12 hours pressurization to pressurization downside anchor clamps 10 and pressurization upside anchor clamps 11 to pressure according to the rules.Its result, the utilization of the fixed part 452 of grinding wheel 45 is coated in the bonding agent 445 (referring to Fig. 4 (a)) on the end face 441a of central large-diameter portion 441 of vibration transmission member 44, and an end face 441a who is bonded in this central authorities' large-diameter portion 441 goes up (pressurized adhesion operation).At this moment, because above-mentioned pressurization, can overflow bonding agent 455a from the outer peripheral edges portion of the central large-diameter portion 441 of the fitting portion of the position restriction portion 444 of the opening 451 of grinding wheel 45 and vibration transmission member 44 and vibration transmission member 44, on the coated remover 456 in the outer peripheral edges portion of the bonding agent 455a that this overflows attached to the central large-diameter portion 441 of above-mentioned grinding wheel 45 and vibration transmission member 44 (referring to (b) of Fig. 3 and (c)).So, after taking off cutting element 45 from pressurization downside anchor clamps 10 and pressurization upside anchor clamps 11, by above-mentioned remover 456 is peeled off, as mentioned above, also can remove the bonding agent 455a that overflows, described cutting element 45 an end face 441a of the central large-diameter portion 441 of vibration transmission member 44 has again gone up grinding wheel 45 bonding.
Return Fig. 2 and go on to say, screw togather with screwed hole 421 on the instrument installation portion 422 that is located at rotary main shaft 42, the cutting element 43 of said structure is installed on the rotary main shaft 42 by the fastening bolt 46 that insertion is arranged in the reach through hole 445.And, in the time of on the instrument installation portion 422 that cutting element 43 is installed to rotary main shaft 42, between instrument installation portion 422 and the 1st minor diameter part 442 and between the head of the 2nd minor diameter part 443 and fastening bolt 46, sandwiched the liner 47,47 that constitutes by synthetic resin.
The main axle unit 4 of illustrated embodiment has and is used for rotary main shaft 42 is rotated drive electric motor 5.Illustrated motor 5 is made of permanent-magnet motor.Permanent magnet motor 5 has: by the rotor 51 that permanent magnet constitutes, be installed on the pars intermedia of rotary main shaft 42 on the formed motor installation portion 424; And stator coil 52, be located on the main shaft shell 41 of outer circumferential side of this rotor 51.The motor 5 of Gou Chenging by applying the friendship turnover rate by following electric power feed mechanism to stator coil 52, makes rotor 51 rotations like this, makes rotary main shaft 4 rotations that this rotor 51 has been installed.
The main axle unit 4 of illustrated embodiment has ultrasonic oscillator 6, is used for applying ultrasonic vibration to the grinding wheel 45 that is located on the rotary main shaft 42.Ultrasonic oscillator 6 has: circular piezoelectrics 61, rotary main shaft 42 axially on polarized; And 2 circular electrode plate 62,63, be installed on the both sides plane of polarization of these piezoelectrics 61.Piezoelectrics 61 are made of piezoelectric ceramics such as barium titanate, lead zirconate titanate, lithium tantalates.If like this ultrasonic oscillator 6 that constitutes is installed on the rotary main shaft 42, apply the AC power of assigned frequency by following electric power feed mechanism to battery lead plate 62,63, then can produce ultrasonic vibration.And ultrasonic oscillator 6 also can be provided with a plurality of in the axial direction.
The main axle unit 4 of illustrated embodiment has electric power feed mechanism 7, is used for applying AC power to above-mentioned ultrasonic oscillator 6, and applies AC power to above-mentioned motor 5.
Electric power feed mechanism 7 has the rotary transformer 8 of the rearward end that is located at main axle unit 4.Rotary transformer 8 has: be subjected to electrical mechanisms 81, it is arranged on the rear end of rotary main shaft 42; And administration of power supply 82, it is arranged on this opposite that is subjected to electrical mechanisms 81, is positioned on the rearward end of main shaft shell 41.Had by electrical mechanisms 81: rotor-side magnetic core 811, it is installed on the rotary main shaft 42; And being subjected to electric coil 812, it is wrapped on this rotor-side magnetic core 811.An end that is subjected to electric coil 812 that is subjected to electrical mechanisms 81 of Gou Chenging is connected on the battery lead plate 61 of above-mentioned ultrasonic oscillator 6 like this; The other end is connected on the battery lead plate 62.Above-mentioned administration of power supply 82 has: stator side magnetic core 821, and it is arranged in the outer circumferential side that is subjected to electrical mechanisms 81; And power supply coil 822, it is arranged on this stator side magnetic core 821, and the power supply coil 822 of the administration of power supply 82 of Gou Chenging is supplied with alternating electromotive force by electric wiring 73,74 like this.
The electric power feed mechanism 7 of illustrated embodiment has: the AC power 91 of alternating electromotive force is used for power supply coil 822 power supplies to above-mentioned rotary transformer 8; Voltage adjustment mechanism 92 is as the electric power guiding mechanism; Frequency guiding mechanism 93 is used to adjust the frequency to the alternating electromotive force of above-mentioned administration of power supply 82 supplies; Controlling organization 94 is used to control voltage adjustment mechanism 92 and frequency guiding mechanism 93; And input mechanism 95, be used for the amplitude of ultrasonic vibration from cutting tip 45 to the input of this controlling organization that apply to etc.And electric power feed mechanism 7 shown in Figure 2 is by control circuit 96 and electric wiring 521,522, to the stator coil 52 supply alternating electromotive forces of above-mentioned motor 5.
The main axle unit 4 of illustrated embodiment as above constitutes, below its effect of explanation.
When carrying out cutting operation, from the stator coil 52 supply alternating electromotive forces of electric power feed mechanism 7 to motor 5.Its result, motor 5 rotations, rotary main shaft 42 rotations make that the grinding wheel 45 on the vibration transmission member 44 that is installed in cutting element 43 rotates, this cutting element 43 is installed on the front end of this rotary main shaft 42.
On the other hand, electric power feed mechanism 7 is controlled voltage adjustment mechanism 92 and frequency guiding mechanism 93 by controlling organization 94, the Control of Voltage of alternating electromotive force is arrived assigned voltage, and, the frequency transformation of alternating electromotive force is become assigned frequency (for example 20kHz), supply to the power supply coil 822 of the administration of power supply 82 that constitutes rotary transformer 8.If apply the alternating electromotive force of assigned frequency to power supply coil 822 like this, then by rotation be subjected to electrical mechanisms 81 be subjected to electric coil 812, between the battery lead plate 62 of ultrasonic oscillator 6 and battery lead plate 63, apply the alternating electromotive force of assigned frequency.Its result, ultrasonic oscillator 6 is displacement repeatedly diametrically, carries out ultrasonic vibration.This ultrasonic vibration is delivered to the vibration transmission member 44 of cutting element 43 by rotary main shaft 42, and vibration transmission member 44 is carried out ultrasonic vibration diametrically.So the grinding wheel 45 that is installed on the vibration transmission member 44 carries out ultrasonic vibration diametrically.And, be applied to the amplitude of the ultrasonic vibration on the grinding wheel 45, be directly proportional with the electric weight of alternating electromotive force on being applied to ultrasonic oscillator 6.But the inventor etc. distinguish amplitude stability when to apply voltage be 50v～60v by experiment.And, the known amplitude that is applied to the ultrasonic vibration on the grinding wheel 45, different and different according to the hardness under the state that solidifies at above-mentioned bonding agent.
Following with reference to Fig. 6, describe the relationship of amplitude of the ultrasonic vibration that is applied on the hardness of above-mentioned bonding agent and the grinding wheel 45 in detail.
Fig. 6 is the experimental result by following measurement, a plurality of cutting elements 43 have promptly been prepared, this cutting element 43 is to utilize the different bonding agent of hardness that the grinding wheel 45 that is made of the electroforming blade is bonded on the vibration transmission member 44, this cutting element 43 is installed in respectively on the rotary main shaft 42 of main axle unit shown in Figure 24, applying frequency to ultrasonic oscillator 6 is that 20kHz, voltage are the alternating voltage of 55v, has upwards measured amplitude in the footpath of grinding wheel 45.
From Fig. 6, can judge, come the amplitude of bonding grinding wheel 45 to be about about 1.5 μ m with the bonding agent of Shore D 28.5.If the bonding agent with Shore D 60 comes bonding grinding wheel 45, then the amplitude of grinding wheel 45 is about 4.5 μ m.And if the hardness of bonding agent is Shore D more than 70, then the amplitude of grinding wheel 45 is more than the 5 μ m.In ultrasonic vibration processing, preferably the amplitude of the grinding wheel that processing is worked is more than the 4 μ m, so preferably adopt the bonding agent of Shore D more than 60.
Turn back to Fig. 1, go on to say.The topping machanism of illustrated embodiment has position registration mechanism 12, is used for being made a video recording in the surface of the machined object that kept on the above-mentioned absorptive table 3, is used to detect the zone that should be cut by above-mentioned grinding wheel 45.This position registration mechanism 12 has the image mechanism that microscope and ccd video camera etc. are made of optical facilities.And topping machanism has indication mechanism 13, is used to show the image taken by position registration mechanism 12 etc.
Film magazine rest area 14a in said apparatus shell 2 is provided with film magazine mounting table 14, is used to place the film magazine of machined object of packing into.This film magazine mounting table 14 constitutes and can move up at upper and lower by not shown elevating mechanism.On film magazine mounting table 14, place the film magazine 15 that is used to put into machined object 100.Put into the machined object 100 of film magazine 15, be formed with cancellate scribe line, be formed with devices such as capacitor, LED and circuit at a plurality of rectangle regions of dividing by this cancellate line on the surface of wafer.The machined object 100 of Xing Chenging is put into film magazine 15 like this, and it puts into state is that its back side sticks on the surface of the boundary belt of being installed on the annular support framework 101 102.
And, the topping machanism of illustrated embodiment, have: take out of mechanism 17, be used for taking out of machined object 100 (being supported in state on the ring-shaped frame 101 by boundary belt 102) on interim mounting table 16, this machined object is put into the film magazine 15 that is positioned on the film magazine mounting table 14; Connecting gear 18 is used for to transmitting the machined object 100 of having taken out of on the interim mounting table 16 on the above-mentioned absorptive table 3; Wiper mechanism 19 is used to clean the machined object 100 that has carried out machining on absorptive table 3; And clean connecting gear 20, be used in wiper mechanism 19, transmitting the machined object 100 that on absorptive table 3, has carried out machining.
Below mainly with reference to Fig. 1, the action of the topping machanism of the above structure of simple declaration.
The machined object of being put on the assigned position of the film magazine of being placed on the film magazine mounting table 14 15 100 moves up and down film magazine mounting table 14 by utilizing not shown elevating mechanism, thereby machined object is positioned to take out of on the position.Then, take out of mechanism 17 action of advancing and retreat, take out of locational machined object 100 and take out of on the interim mounting table 16 being positioned at.Taken out of the machined object 100 on the interim mounting table 16, the spinning movement by connecting gear 18 is sent on the above-mentioned absorptive table 3.If machined object 100 is placed on the absorptive table 3, then not shown adsorbing mechanism moves, and machined object 100 is adsorbed onto on the absorptive table 3.And, come scaffold 101 that machined object 100 is supported fixing by above-mentioned clamper 33 by boundary belt 102.Like this, keep the absorptive table 3 of machined object 100 be moved to position registration mechanism 11 just below.When absorptive table 3 position alignment machine 11 just below when location, detect formed scribe line on the machined object 100 by position registration mechanism 12, make main axle unit 4 on arrow Y direction, move adjusting, the grinding wheel 45 of scribe line and cutting element 43 is carried out precision positions aim at operation as index direction.
Then, make grinding wheel 45 measure the incision feeding in accordance with regulations on one side to the direction shown in the arrow Z, and on prescribed direction, rotate, the absorptive table 3 that makes absorption maintenance machined object 100 on one side cuts feed speed in accordance with regulations and moves on the direction (with the perpendicular direction of the rotating shaft of grinding wheel 45) shown in the arrow X of conduct cutting direction of feed.Thus, the semiconductor wafer 100 that remains on the absorptive table 3 utilizes grinding wheel 45 to cut off along the regulation scribe line.In this cutting process, utilize electric power feed mechanism 7 to apply for example alternating electromotive force of frequency 20kHz, voltage 55v to ultrasonic oscillator 6.Its result, as mentioned above, ultrasonic oscillator 6 is displacement repeatedly diametrically, carries out ultrasonic vibration.This ultrasonic vibration is delivered to by rotary main shaft 42 on the vibration transmission member 44 of cutting element 43, and vibration transmission member 44 is carried out ultrasonic vibration diametrically.So the grinding wheel of being installed on the vibration transmission member 44 45 carries out ultrasonic vibration diametrically.Therefore, the cutting resistance that grinding wheel 45 causes reduces, so, even being materials of difficulty such as sapphire cutting, wafer 100 also can be easy to cut.
Claims (3)
1, a kind of cutting element is installed on the rotary main shaft that is provided with ultrasonic vibration mechanism, it is characterized in that:
Have: vibration transmission member is installed on the above-mentioned rotary main shaft; And circular grinding wheel is installed on the above-mentioned vibration transmission member, has opening at central portion,
Above-mentioned grinding wheel has the cutting blade of peripheral part and the fixed part of inner circular part, and said fixing portion utilizes the installation portion of adhesive securement in above-mentioned vibration transfer part.
2, cutting element as claimed in claim 1 is characterized in that, is provided with position restriction portion on the installation portion of above-mentioned vibration transfer part, the opening of chimeric above-mentioned grinding wheel in this position restriction portion.
3, cutting element as claimed in claim 1 or 2 is characterized in that, the hardness of above-mentioned bonding agent is set at Shore D more than 60.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005256116A JP4763389B2 (en) | 2005-09-05 | 2005-09-05 | Cutting tools |
| JP256116/2005 | 2005-09-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1927537A true CN1927537A (en) | 2007-03-14 |
| CN100593454C CN100593454C (en) | 2010-03-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200610128077A Active CN100593454C (en) | 2005-09-05 | 2006-09-01 | Cutting tool |
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| Country | Link |
|---|---|
| JP (1) | JP4763389B2 (en) |
| CN (1) | CN100593454C (en) |
Cited By (10)
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| CN102218710A (en) * | 2010-04-16 | 2011-10-19 | 邢志胜 | Grinding wheel and fixing disc thereof |
| CN101422875B (en) * | 2007-10-30 | 2012-01-11 | 株式会社迪思科 | Gringding wheel |
| CN102398228A (en) * | 2010-09-08 | 2012-04-04 | 株式会社迪思科 | Cutting Grinding Wheel |
| CN101497150B (en) * | 2008-02-01 | 2012-10-10 | 鸿富锦精密工业（深圳）有限公司 | Laser device for cutting |
| CN104786110A (en) * | 2014-01-20 | 2015-07-22 | 浙江大学 | Axial ultrasonic vibration high-speed grinding device oriented to finish machining of inner circle of miniature bearing |
| CN105437067A (en) * | 2015-12-04 | 2016-03-30 | 北京中电科电子装备有限公司 | Ultrasonic air static pressure main shaft device and dicing saw |
| CN107498464A (en) * | 2017-09-05 | 2017-12-22 | 上海运申制版模具有限公司 | A kind of device and method of two-sided glue sticking emery wheel and abrasive disc |
| CN107855835A (en) * | 2017-10-12 | 2018-03-30 | 佛山汇众森泰科技有限公司 | A kind of jade sanding apparatus to be worked using ultrasonic wave |
| CN112658818A (en) * | 2020-12-19 | 2021-04-16 | 华中科技大学 | Ultrasonic vibration auxiliary grinding device for ultra-precision machining of wafer |
| US11712783B2 (en) | 2019-04-11 | 2023-08-01 | Disco Corporation | Hubbed blade |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2008302471A (en) * | 2007-06-07 | 2008-12-18 | Disco Abrasive Syst Ltd | Cutting blade |
| JP2021013967A (en) * | 2019-07-10 | 2021-02-12 | 株式会社ディスコ | Cutting blade fixing method, mount, and cutting blade |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3036348B2 (en) * | 1994-03-23 | 2000-04-24 | 三菱マテリアル株式会社 | Truing device for wafer polishing pad |
| JPH09239667A (en) * | 1996-03-06 | 1997-09-16 | Toyota Autom Loom Works Ltd | Polishing tool |
| JP3469488B2 (en) * | 1999-01-21 | 2003-11-25 | 株式会社アルテクス | Ultrasonic vibration cutting device |
-
2005
- 2005-09-05 JP JP2005256116A patent/JP4763389B2/en active Active
-
2006
- 2006-09-01 CN CN200610128077A patent/CN100593454C/en active Active
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101422875B (en) * | 2007-10-30 | 2012-01-11 | 株式会社迪思科 | Gringding wheel |
| CN101497150B (en) * | 2008-02-01 | 2012-10-10 | 鸿富锦精密工业（深圳）有限公司 | Laser device for cutting |
| CN102218710A (en) * | 2010-04-16 | 2011-10-19 | 邢志胜 | Grinding wheel and fixing disc thereof |
| CN102398228A (en) * | 2010-09-08 | 2012-04-04 | 株式会社迪思科 | Cutting Grinding Wheel |
| CN104786110A (en) * | 2014-01-20 | 2015-07-22 | 浙江大学 | Axial ultrasonic vibration high-speed grinding device oriented to finish machining of inner circle of miniature bearing |
| CN104786110B (en) * | 2014-01-20 | 2017-07-18 | 浙江大学 | It is a kind of to vibrate high-speed grinding device towards the axial ultrasonic that miniature bearing inner circle is finished |
| CN105437067A (en) * | 2015-12-04 | 2016-03-30 | 北京中电科电子装备有限公司 | Ultrasonic air static pressure main shaft device and dicing saw |
| CN107498464A (en) * | 2017-09-05 | 2017-12-22 | 上海运申制版模具有限公司 | A kind of device and method of two-sided glue sticking emery wheel and abrasive disc |
| CN107855835A (en) * | 2017-10-12 | 2018-03-30 | 佛山汇众森泰科技有限公司 | A kind of jade sanding apparatus to be worked using ultrasonic wave |
| US11712783B2 (en) | 2019-04-11 | 2023-08-01 | Disco Corporation | Hubbed blade |
| CN112658818A (en) * | 2020-12-19 | 2021-04-16 | 华中科技大学 | Ultrasonic vibration auxiliary grinding device for ultra-precision machining of wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007073586A (en) | 2007-03-22 |
| CN100593454C (en) | 2010-03-10 |
| JP4763389B2 (en) | 2011-08-31 |
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