JP2010171067A - Cutting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the cutting device in which a generally used cutting tool not imparting supersonic vibration can be attached to a rotating spindle for supersonic vibration cutting. <P>SOLUTION: The tool attaching portion 422 of a rotating spindle 42 is constituted so that a mounter 10 capable of mounting a cutting blade 152, which is a cutting tool different from a supersonic vibration cutting tool, can be attached detachably, wherein the mounter 10 includes a boss 110, and a flange 120 formed to project from the boss in the radial direction in order to support the cutting tool, and the boss is attached detachably to the tool attaching portion by means of a fastening bolt 130. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a cutting apparatus for cutting a workpiece such as a semiconductor wafer or an optical device wafer while applying ultrasonic vibration to a cutting blade.

  In the semiconductor device manufacturing process, a plurality of regions are partitioned by dividing lines called streets arranged in a lattice pattern on the surface of a substantially wafer-shaped semiconductor wafer, and devices such as ICs, LSIs, etc. are partitioned in the partitioned regions. Form. Then, the semiconductor wafer is cut along the streets to divide the region in which the device is formed to manufacture individual semiconductor chips. In addition, optical device wafers with gallium nitride compound semiconductors laminated on the surface of sapphire substrates are divided into individual light emitting diodes, laser diodes, CCDs and other optical devices by cutting along the streets. It's being used.

  The above-described cutting along the wafer street is usually performed by a cutting device called a dicer. This cutting apparatus includes a chuck table for holding a workpiece such as a wafer, a cutting means for cutting the workpiece held on the chuck table, and a cutting for relatively moving the chuck table and the cutting means. And feeding means. The cutting means includes a cutting tool having a rotary spindle and a cutting tool equipped with a cutting blade mounted on the spindle, and a cutting unit having a drive mechanism for rotationally driving the rotary spindle. In such a cutting apparatus, the cutting tool and the work piece held on the chuck table are relatively cut and fed while rotating the cutting tool at a rotational speed of 20000 to 40000 rpm.

  However, a wafer having a wafer substrate having a high hardness such as sapphire, lithium tantalate, or altic is very difficult if not impossible to cut with a cutting blade.

In order to solve the above-described problem, an ultrasonic vibrator is disposed on a rotating spindle on which a cutting tool equipped with a cutting blade is mounted, and an AC voltage is applied to the ultrasonic vibrator to thereby apply an ultrasonic voltage to the cutting blade. There has been proposed a cutting method in which cutting is performed while applying sonic vibration. A cutting tool used in this cutting method includes a vibration transmission member attached to a rotary spindle, and a cutting blade attached to the vibration transmission member, and transmits ultrasonic vibration that vibrates in the axial direction of the rotary spindle. Is converted into radial vibration, and radial ultrasonic vibration is applied to the cutting blade. (For example, refer to Patent Document 1.)
Japanese Patent No. 3469516

  In the above-described cutting apparatus for ultrasonic vibration cutting, when cutting a material having a relatively low hardness such as a silicon wafer, the cutting operation is performed without applying ultrasonic vibration to the ultrasonic vibration cutting tool. However, the ultrasonic vibration cutting tool attached to the rotary spindle of a cutting device for ultrasonic vibration cutting is expensive with a special configuration, and an expensive ultrasonic vibration cutting tool is also used for cutting work that does not impart ultrasonic vibration. There is a problem that it must be uneconomical. Therefore, it is desired that general cutting without applying ultrasonic vibration can be performed by attaching a general cutting tool to a rotary spindle in a cutting apparatus for ultrasonic vibration cutting.

  However, the vibration transmission member (blade base) of a cutting tool for ultrasonic vibration cutting and the blade base of a cutting tool that does not impart ultrasonic vibration, which are generally used, have different configurations. It is impossible to mount a cutting tool that does not impart ultrasonic vibration generally used for a rotary spindle in the above cutting apparatus.

  The present invention has been made in view of the above-mentioned facts, and its main technical problem is to mount a cutting tool that does not impart ultrasonic vibration, which is generally used for a rotary spindle in a cutting apparatus for ultrasonic vibration cutting. It is in providing the cutting device which can do.

In order to solve the main technical problem, according to the present invention, a chuck table for holding a workpiece, a rotating spindle, ultrasonic vibration means disposed on the rotating spindle, and a tip of the rotating spindle are provided. A cutting unit including an ultrasonic vibration cutting tool for cutting a workpiece mounted on the tool mounting portion and held on the chuck table; and a power supply unit that applies high-frequency power to the ultrasonic vibration unit. Equipped,
The ultrasonic vibration cutting tool has a vibration transmission composed of a cylindrical boss portion having a through-hole in the shaft center and a disk-like blade mounting portion formed to project radially from an intermediate portion in the axial direction of the boss portion. And a cutting bolt mounted on the blade mounting portion of the vibration transmitting member, and a fastening bolt disposed through the through hole provided in the boss portion is connected to the tool mounting portion of the rotary spindle. In the cutting device to be mounted on the tool mounting portion by screwing into the female screw formed in
A mounter capable of mounting a cutting tool different from the ultrasonic vibration cutting tool on the tool mounting portion of the rotary spindle is configured to be removable.
The mounter includes a boss portion having a through hole in the shaft center and a flange portion that protrudes in the radial direction from the boss portion and supports the cutting tool, and is inserted through the through hole provided in the boss portion. The fastening bolt disposed in this manner is detachably mounted on the tool mounting portion by screwing into a female screw formed on the tool mounting portion of the rotary spindle.
A cutting device is provided.

  According to the present invention, an ultrasonic vibration cutting tool and a mounter for mounting a cutting tool that does not impart ultrasonic vibration, which is generally used differently from the ultrasonic vibration cutting tool, can be attached to and detached from the tool mounting portion of the rotary spindle. Therefore, when performing ultrasonic vibration cutting, attach the ultrasonic vibration cutting tool directly to the tool mounting part, and when performing general cutting without applying ultrasonic vibration to the cutting blade, It is possible to mount a cutting tool that does not impart ultrasonic vibration that is generally used while mounting the mounter. Therefore, when performing general cutting without applying ultrasonic vibration to the cutting blade, it is not necessary to use an expensive cutting tool for ultrasonic vibration cutting, which is economical.

The perspective view of the cutting device comprised according to this invention. Sectional drawing which shows the state which mounted | wore the ultrasonic vibration cutting tool with the tool mounting part of the rotating spindle which comprises the cutting unit with which the cutting apparatus shown in FIG. 1 is equipped. FIG. 3 is a perspective view of a mounter that is detachably mounted on a tool mounting portion of a rotary spindle that constitutes the cutting unit shown in FIG. 2. Sectional drawing of the mounter shown in FIG. The principal part sectional drawing which shows the state which mounted | wore the cutting tool which does not provide an ultrasonic vibration to the mounter with which the tool mounting part of the rotating spindle which comprises a cutting unit was mounted | worn.

  Hereinafter, a preferred embodiment of a cutting device configured according to the present invention will be described in more detail with reference to the accompanying drawings.

  FIG. 1 shows a perspective view of a cutting device constructed in accordance with the present invention. The cutting device in the illustrated embodiment includes a device housing 2 having a substantially rectangular parallelepiped shape. In the apparatus housing 2, a chuck table 3 for holding a workpiece is disposed so as to be movable in a direction indicated by an arrow X that is a cutting feed direction. The chuck table 3 includes a suction chuck support 31 and a suction chuck 32 disposed on the suction chuck support 31. A workpiece is illustrated on a holding surface which is the upper surface of the suction chuck 32. Suction holding is performed by operating a suction means that does not. The chuck table 3 is configured to be rotatable by a rotation mechanism (not shown). The chuck table 3 is provided with a clamp 33 for fixing a support frame that supports a wafer, which will be described later, via a protective tape as a workpiece. The chuck table 3 configured as described above can be moved in a cutting feed direction indicated by an arrow X by a cutting feed means (not shown).

  The cutting apparatus shown in FIG. 1 includes a cutting unit 4. The cutting unit 4 is mounted on a moving base (not shown) and is moved in an indexing direction indicated by an arrow Y perpendicular to the cutting feed direction indicated by the arrow X by an indexing feeding means (not shown). It can be moved in the direction indicated by the arrow Z. The cutting unit 4 will be described with reference to FIG.

  The cutting unit 4 shown in FIG. 2 includes a spindle housing 41, a rotating spindle 42 rotatably disposed in the spindle housing 41, and an ultrasonic vibration cutting tool 43 attached to the tip of the rotating spindle 42. is doing. The spindle housing 41 is formed in a substantially cylindrical shape and includes a shaft hole 411 penetrating in the axial direction. The rotary spindle 42 disposed through the shaft hole 411 formed in the spindle housing 41 is provided with a tool mounting portion 422 provided with a female screw hole 421 at the front end portion thereof, and a radial direction at the center portion thereof. A thrust bearing flange 423 formed so as to protrude from the center is provided. In this way, the rotary spindle 42 disposed through the shaft hole 411 formed in the spindle housing 41 is rotatably supported by high-pressure air supplied between the inner wall of the shaft hole 411.

  An ultrasonic vibration cutting tool 43 mounted on a tool mounting portion 422 provided at the tip of the rotary spindle 42 includes a vibration transmission member 44 as a blade base and an annular cutting mounted on the vibration transmission member 44. It consists of a blade 45. In the illustrated embodiment, the vibration transmitting member 44 is made of aluminum, and is formed to protrude in the radial direction at a cylindrical boss portion 441 having a through hole 441a in the axial center and an axially intermediate portion of the boss portion 441. And a disk-shaped blade mounting portion 442. In the illustrated embodiment, the cutting blade 45 mounted on the vibration transmitting member 44 is plated with abrasive grains such as nickel on the right side in FIG. 2 of the blade mounting portion 442 of the vibration transmitting member 44, that is, on the side surface 442a on the rotary spindle 42 side. It consists of electroformed blades joined together. The cutting blade to be mounted on the blade mounting portion 442 of the vibration transmitting member 44 includes a resin bond grindstone blade in which abrasive grains are bonded by resin bond, a metal bond grindstone blade in which abrasive grains are bonded by metal bond, and vitrified bond of abrasive grains. A vitrified bond grindstone blade or the like that is bonded together by using can be used.

  The illustrated ultrasonic vibration cutting tool 43 includes a first end surface 441b facing the right end surface of the boss portion 441 constituting the vibration transmitting member 44, i.e., the rotary spindle 42, and a left end surface of the boss portion 441 in FIG. Spacers 46 and 46 made of synthetic resin are mounted on the second end surface 441c facing the head of a fastening bolt 47 as a fixing member. In the ultrasonic vibration cutting tool 43 configured as described above, the fastening bolt 47 provided by being inserted through the through hole 441 a provided in the boss portion 441 is provided with the female screw provided on the tool mounting portion 422 of the rotary spindle 42. By being screwed into the hole 421, the rotary spindle 42 is detachably mounted.

  The illustrated cutting unit 4 includes an electric motor 5 for rotationally driving a rotary spindle 42. The illustrated electric motor 5 is constituted by a permanent magnet motor. The permanent magnet type electric motor 5 is disposed in a spindle housing 41 on the outer peripheral side of the rotor 51 and a rotor 51 made of a permanent magnet mounted on a motor mounting portion 424 formed in an intermediate portion of the rotary spindle 42. The stator coil 52 is included. In the electric motor 5 configured in this manner, the rotor 51 is rotated by applying AC power to the stator coil 52 by power supply means described later, and the rotating spindle 42 to which the rotor 51 is mounted is rotated.

  The illustrated cutting unit 4 includes an ultrasonic transducer 6 that is disposed on a rotary spindle 42 and applies ultrasonic vibration to a cutting blade 45. The ultrasonic transducer 6 includes an annular piezoelectric body 61 that is polarized in the axial direction of the rotary spindle 42, and two annular electrode plates 62 and 63 that are respectively attached to both side polarization surfaces of the piezoelectric body 61. It is made up of. The piezoelectric body 61 is made of piezoelectric ceramics such as barium titanate, lead zirconate titanate, and lithium tantalate. The ultrasonic transducer 6 configured as described above is mounted on the rotary spindle 42, and generates ultrasonic vibration when AC power having a predetermined frequency is applied to the electrode plates 62 and 63 by power supply means described later. A plurality of ultrasonic transducers 6 may be arranged in the axial direction of the rotary spindle 42.

The illustrated cutting unit 4 includes power supply means 7 that applies AC power to the ultrasonic vibrator 6 and applies AC power to the electric motor 5.
The power supply means 7 includes a rotary transformer 8 disposed at the rear end of the cutting unit 4. The rotary transformer 8 includes a power receiving unit 81 disposed at the rear end of the rotary spindle 42 and a power feeding unit 82 disposed opposite to the power receiving unit 81 and disposed at the rear end portion of the spindle housing 41. is doing. The power receiving means 81 includes a rotor side core 811 attached to the rotary spindle 42 and a power receiving coil 812 wound around the rotor side core 811. One end of the power receiving coil 812 of the power receiving means 81 configured as described above is connected to the electrode plate 62 of the ultrasonic transducer 6, and the other end is connected to the electrode plate 63. The power supply means 82 includes a stator side core 821 disposed on the outer peripheral side of the power reception means 81 and a power supply coil 822 disposed on the stator side core 821. The power supply coil 822 of the power supply means 82 configured in this way is supplied with AC power via the electrical wirings 73 and 74.

  The power supply means 7 shown in the figure has an AC power supply 91 for AC power supplied to the power supply coil 822 of the rotary transformer 8, a current adjustment means 92 as power adjustment means, and a frequency of AC power supplied to the power supply means 82. Frequency adjusting means 93 to be adjusted, control means 94 for controlling the current adjusting means 92, the frequency adjusting means 93, and the like, and the type of cutting tool mounted on the rotary spindle 42 tool mounting portion 422 and the like are input to the control means 94. Input means 95 is provided. The power supply means 7 shown in FIG. 2 supplies AC power to the stator coil 52 of the electric motor 5 through the control circuit 96 and the electric wirings 521 and 522.

The illustrated cutting unit 4 is configured as described above, and the operation thereof will be described below.
When performing the cutting operation, AC power is supplied from the power supply means 7 to the stator coil 52 of the electric motor 5. As a result, the electric motor 5 rotates and the rotating spindle 42 rotates, and the cutting blade 45 attached to the vibration transmitting member 44 of the ultrasonic vibration cutting tool 43 attached to the front end of the rotating spindle 42 is rotated.

  On the other hand, the power supply means 7 controls the current adjusting means 92 and the frequency converting means 93 by the control means 94 to control the voltage of the AC power to a predetermined voltage, and the frequency of the AC power is set to a predetermined frequency (for example, 53 kHz). And is supplied to the power supply coil 822 of the power supply means 82 constituting the rotary transformer 8. When AC power having a predetermined frequency is applied to the feeding coil 822 as described above, AC power having a predetermined frequency is interposed between the electrode plate 62 and the electrode plate 63 of the ultrasonic transducer 6 via the power receiving coil 812 of the rotating power receiving means 81. Is applied. As a result, the ultrasonic transducer 6 is repeatedly displaced in the radial direction and vibrates ultrasonically. This ultrasonic vibration is transmitted to the vibration transmission member 44 of the ultrasonic vibration cutting tool 43 via the rotary spindle 42, and the vibration transmission member 44 ultrasonically vibrates in the radial direction. Accordingly, the cutting blade 45 attached to the vibration transmitting member 44 vibrates ultrasonically in the radial direction.

  The cutting apparatus in the illustrated embodiment mounts a cutting tool that does not impart ultrasonic vibration, which is generally used, different from the ultrasonic vibration cutting tool 43, to the tool mounting portion 422 provided at the tip of the rotary spindle 42. A mounter 10 shown in FIGS. 3 and 4 is provided. The mounter 10 includes a boss portion 110 having a through-hole 111 in the shaft center, and a flange portion 120 that protrudes from the boss portion 110 in the radial direction and supports a cutting tool described later. In FIG. 4, a boss portion 110 constituting the mounter 10 is provided with a fitting recess 112 into which the tip of the tool mounting portion 422 provided at the tip of the rotary spindle 42 is fitted. In the left end portion, an accommodation recess 113 for accommodating a head of a fastening bolt described later is provided. Further, a male screw 114 is formed on the outer peripheral surface of the left end portion in FIG. 4 of the boss portion 110 constituting the mounter 10. An annular clamping surface 121 is provided on the outer peripheral portion of the left side surface of the flange portion 120 constituting the mounter 10 in FIG. In the mounter 10 configured as described above, the fastening bolt 130 that is disposed through the through hole 111 provided in the boss portion 110 is screwed into the female screw hole 421 provided in the tool mounting portion 422 of the rotary spindle 42. By combining, the rotary spindle 42 is detachably mounted.

  As shown in FIG. 5, the mounting tool 10 configured as described above is detachably mounted with a cutting tool 150 that does not impart ultrasonic vibration, which is generally used, which is different from the ultrasonic vibration cutting tool 43 described above. The cutting tool 150 is a so-called hub blade, and is a disk-shaped blade base 151 having a hole 151 a that fits into the boss 110 constituting the mounter 10, and the outer peripheral side surface of the blade base 151. And a cutting blade 152 attached to the head. The cutting blade 152 of the cutting tool 150 is constituted by an electroformed blade in which abrasive grains are bonded to the side surface of an annular blade base 151 made of aluminum by metal plating such as nickel in the illustrated embodiment. The cutting tool 150 configured as described above is formed on the outer peripheral surface of the boss portion 110 constituting the mounter 10 by fitting the hole 151 a provided in the blade base 151 into the boss portion 110 constituting the mounter 10. The fastening nut 140 is screwed onto the male screw 114. As a result, the cutting tool 150 is clamped and fixed by the annular clamping surface 121 and the fastening nut 140 of the flange portion 120 in which the blade base 151 constitutes the mounter 10. FIG. 5 shows an example in which a cutting tool 150 called a so-called hub blade is mounted on the mounter 10, but a cutting tool called a washer-blade made of an annular blade can be similarly attached to and detached from the mounter 10. It can also be installed.

  Returning to FIG. 1 and continuing the description, the cutting apparatus in the illustrated embodiment takes an image of the surface of the workpiece held on the chuck table 3 and cuts it by the ultrasonic vibration cutting tool 43 or the cutting tool 150. Alignment means 11 for detecting a region to be provided is provided. The alignment unit 11 includes an imaging unit including an optical unit such as a microscope or a CCD camera. In addition, the cutting apparatus includes a display unit 12 that displays an image or the like captured by the alignment unit 11.

  In the cassette mounting area 13a of the apparatus housing 2, a cassette mounting table 13 for mounting a cassette for storing a workpiece is disposed. The cassette mounting table 13 is configured to be movable in the vertical direction by lifting means (not shown). On the cassette mounting table 13, a cassette 14 for storing a semiconductor wafer W as a workpiece is placed. The semiconductor wafer W accommodated in the cassette 14 has a lattice street formed on the surface, and devices such as capacitors, LEDs, and circuits are formed in a plurality of rectangular areas partitioned by the lattice street. . The semiconductor wafer W thus formed is accommodated in the cassette 14 with the back surface adhered to the front surface of the protective tape T mounted on the annular support frame F.

  Further, the cutting device in the illustrated embodiment is a semiconductor wafer W accommodated in a cassette 14 placed on a cassette placement table 13 (a state in which the wafer is supported on an annular frame F via a protective tape T). Is carried out on the chuck table 3, the unloading means 16 for unloading the semiconductor wafer W to the temporary table 15, the first transport means 17 for transporting the semiconductor wafer W unloaded onto the temporary table 15 onto the chuck table 3, and the chuck table 3. A cleaning unit 18 for cleaning the semiconductor wafer W and a second transport unit 19 for transporting the semiconductor wafer W cut on the chuck table 3 to the cleaning unit 18 are provided.

The cutting operation by the cutting apparatus configured as described above will be briefly described mainly with reference to FIG.
First, ultrasonic vibration cutting that performs cutting while applying ultrasonic vibration to the cutting blade will be described. When performing ultrasonic vibration cutting, a cutting tool 43 for ultrasonic vibration cutting is mounted on the tool mounting portion 422 of the rotary spindle 42 as shown in FIG. Then, the code number of the corresponding cutting tool is input from the input means 95.

  As described above, when the ultrasonic vibration cutting tool 43 is mounted on the tool mounting portion 422 of the rotary spindle 42 and the code number of the corresponding cutting tool is input from the input means 95, the cutting apparatus performs a cutting operation. That is, the semiconductor wafer W accommodated in a predetermined position of the cassette 14 placed on the cassette placement table 13 is positioned at the carry-out position when the cassette placement table 13 moves up and down by a lifting means (not shown). Next, the unloading means 16 moves forward and backward to unload the semiconductor wafer W positioned at the unloading position onto the temporary table 15. The semiconductor wafer W carried out to the temporary placement table 15 is transferred onto the chuck table 3 by the turning operation of the transfer means 17. When the semiconductor wafer W is placed on the chuck table 3, suction means (not shown) is operated to suck and hold the semiconductor wafer W on the chuck table 3. The support frame F that supports the semiconductor wafer W via the protective tape T is fixed by the clamp 33. In this way, the chuck table 3 holding the semiconductor wafer W is moved to just below the alignment means 11. When the chuck table 3 is positioned immediately below the alignment means 11, the street formed on the semiconductor wafer W is detected by the alignment means 11, and the cutting unit 4 is moved and adjusted in the direction of the arrow Y, which is the indexing direction. A precision alignment operation with the cutting blade 45 of the sonic vibration cutting tool 43 is performed (alignment process).

  Thereafter, AC power is supplied to the stator coil 52 of the electric motor 5 from the power supply means 7 shown in FIG. As a result, the electric motor 5 rotates and the rotary spindle 42 rotates, and the cutting blade 45 attached to the vibration transmission member 44 of the ultrasonic vibration cutting tool 43 attached to the tool attachment portion 422 of the rotary spindle 42 rotates. I'm damned. Then, the cutting blade 45 is cut and fed by a predetermined amount in the direction indicated by the arrow Z in FIG. 1, and the chuck table 3 holding the semiconductor wafer W is sucked and held in the direction indicated by the arrow X which is the cutting feed direction (the rotation axis of the cutting blade 45 and The semiconductor wafer W held on the chuck table 3 is cut along a predetermined street by the cutting blade 45 by moving at a predetermined cutting feed rate in a direction orthogonal to the vertical direction. In this cutting process, AC power having a frequency corresponding to the code number of the cutting tool input from the power supply means 7 to the ultrasonic vibrator 6 by the input means 95 is applied. As a result, as described above, the ultrasonic transducer 6 is ultrasonically vibrated by being repeatedly displaced in the radial direction. This ultrasonic vibration is transmitted to the vibration transmission member 44 of the ultrasonic vibration cutting tool 43 via the rotary spindle 42, and the vibration transmission member 44 ultrasonically vibrates in the radial direction. Accordingly, since the cutting blade 45 mounted on the blade mounting portion 442 of the vibration transmitting member 44 is ultrasonically vibrated in the radial direction, the cutting resistance by the cutting blade 45 can be reduced, and the wafer W is difficult to cut such as sapphire. Even so, it can be easily cut.

  Next, general cutting that performs cutting without applying ultrasonic vibration to the cutting blade will be described. When cutting without applying ultrasonic vibration to the cutting blade, the mounter 10 is mounted on the tool mounting portion 422 of the rotary spindle 42 as shown in FIG. 5, and ultrasonic vibration generally used for the mounter 10 is applied. A cutting tool 150 is mounted. Next, AC power is supplied to the stator coil 52 of the electric motor 5 from the power supply means 7 shown in FIG. As a result, the electric motor 5 rotates and the rotary spindle 42 rotates, and the generally used cutting tool 150 attached to the tool mounting portion 422 of the rotary spindle 42 via the mounter 10 does not apply ultrasonic vibration. The cutting blade 152 is rotated. Then, the cutting blade 152 is cut and fed by a predetermined amount in the direction indicated by the arrow Z in FIG. 1, and the chuck table 3 holding the semiconductor wafer W is sucked and held in the direction indicated by the arrow X which is the cutting feed direction (the rotation axis of the cutting blade 152 The semiconductor wafer W held on the chuck table 3 is cut along a predetermined street by the cutting blade 152 by moving at a predetermined cutting feed speed in a direction orthogonal to the vertical direction. In this cutting process, AC power is not applied from the power supply means 7 to the ultrasonic transducer 6. Therefore, general cutting without applying ultrasonic vibration to the cutting blade 152 is performed.

  As described above, in the cutting apparatus in the illustrated embodiment, the mounter 10 for mounting the ultrasonic vibration cutting tool 43 and the generally used cutting tool 150 that does not impart ultrasonic vibration to the tool mounting portion 422 of the rotary spindle 42. Therefore, when performing ultrasonic vibration cutting, the ultrasonic vibration cutting tool 43 is directly mounted on the tool mounting portion 422 and general cutting without applying ultrasonic vibration to the cutting blade is performed. In this case, it is possible to mount the mounter 10 on the tool mounting portion 422 and mount the cutting tool 150 that does not apply ultrasonic vibration that is generally used. Therefore, it is economical because it is not necessary to use an expensive cutting tool 43 for ultrasonic vibration cutting when performing general cutting without applying ultrasonic vibration to the cutting blade.

2: Device housing 3: Chuck table mechanism 30: Chuck table 4: Cutting unit 41: Spindle housing 42: Rotating spindle 421: Mounter mounting part 5: Mounter 51: Connecting part 52: Mounting part 53: Restricting part 6: Ultrasonic vibration Cutting tool for cutting 61: Vibration transmitting member 62: Cutting blade 6a: A cutting tool that does not apply ultrasonic vibration generally used 61a: Blade base 62a: Cutting blade 7: Fastening bolt 8: Fastening nut 9: Electric motor 10: Ultrasonic vibrator 11: Power supply means 12: Rotary transformer 121: Power receiving means 122: Power supply means 13: AC power supply 14: Current adjustment means 15: Frequency adjustment means 16: Control means 17: Input means 20: Alignment means 21 : Display means 22: Cassette mounting table 23: Power Tsu DOO 24: temporary Table 25: carrying-out means 26: conveying means 27: cleaning means

Claims (1)

A chuck table for holding a workpiece, a rotating spindle, ultrasonic vibration means disposed on the rotating spindle, and a workpiece mounted on a tool mounting portion provided at the tip of the rotating spindle and held on the chuck table A cutting unit comprising an ultrasonic vibration cutting tool for cutting an object, and a power supply means for applying high-frequency power to the ultrasonic vibration means,
The ultrasonic vibration cutting tool has a vibration transmission composed of a cylindrical boss portion having a through-hole in the shaft center and a disk-like blade mounting portion formed to project radially from an intermediate portion in the axial direction of the boss portion. And a cutting bolt mounted on the blade mounting portion of the vibration transmitting member, and a fastening bolt disposed through the through hole provided in the boss portion is connected to the tool mounting portion of the rotary spindle. In the cutting device to be mounted on the tool mounting portion by screwing into the female screw formed in
A mounter capable of mounting a cutting tool different from the ultrasonic vibration cutting tool on the tool mounting portion of the rotary spindle is configured to be removable.
The mounter includes a boss portion having a through hole in the shaft center and a flange portion that protrudes in the radial direction from the boss portion and supports the cutting tool, and is inserted through the through hole provided in the boss portion. The fastening bolt disposed in this manner is detachably mounted on the tool mounting portion by screwing into a female screw formed on the tool mounting portion of the rotary spindle.
The cutting device characterized by the above.

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