JPH11244795A - Substrate washing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate washing apparatus capable of uniformly washing the surface of a substrate and having high washing effect. SOLUTION: A brush holding part 9 is attached to the under surface of the leading end part of the brush arm 8 provided in a rotatable manner by an arm driving part 7 and a horn 10 is attached to the underside of the brush holding part 9 and a washing brush 11 is provided to the underside of the leading end part of the horn 10. An ultrasonic vibrator 12 is attached to the side surface of the brush holding part 9 and a pure water ejecting nozzle 15 is attached to the underside of the leading end part of the nozzle arm 14 provided to an arm driving part 13 in a revolvable manner and an ultrasonic vibrator 16 is attached to the pure water ejecting nozzle 15. The ultrasonic vibrators 12, 16 are driven by a high frequency oscillator 17.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a substrate cleaning apparatus for cleaning a surface of a substrate with a cleaning brush and a cleaning liquid.

[0002]

2. Description of the Related Art A substrate cleaning apparatus is used for cleaning the surface of a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display, and a substrate for a photomask. In substrate cleaning equipment,
Fine particles adhering to the surface of the substrate during the processing of the substrate are removed with a cleaning liquid such as pure water or a cleaning brush.

In recent years, as the degree of integration of LSIs (large-scale integrated circuits) has increased, the diameter of fine particles allowed on the surface of a substrate has decreased. As the diameter of the fine particles adhering to the surface of the substrate becomes smaller, the adhesive force due to van der Waals force becomes stronger, and a strong peeling force is required to remove the fine particles from the surface of the substrate.

Usually, in a brush cleaning type substrate cleaning apparatus, a cleaning liquid such as pure water is supplied to the surface of the substrate while rotating the substrate, and the cleaning brush is rotated or the cleaning brush is rotated without rotating the cleaning brush. The cleaning brush is scanned from the center to the outer periphery of the substrate by pressing the substrate against the substrate. Thus, the entire surface of the substrate is cleaned with the cleaning brush and the cleaning liquid.

[0005]

FIG. 6 is a schematic diagram showing a positional relationship between a cleaning brush and a substrate during cleaning. The brush cleaning mechanism using the cleaning liquid and the cleaning brush will be described with reference to FIG. Here, a description will be given of a planar brush which is often used for cleaning a semiconductor wafer, a glass substrate for a liquid crystal display device, and the like.

Usually, a hydrophilic material is used as the material of the cleaning brush 40. The brush cleaning is performed on the substrate 100 having a surface as hydrophilic as possible. Therefore, the rotating substrate 100 and the cleaning brush 4
Between 0 and 0, there is a very thin water film 200 due to surface tension and hydroplane phenomenon. This water film 200
Cleaning brush 4 for fine particles 300 having a diameter smaller than
0 means no direct impact. Therefore, the smaller the thickness of the water film 200, the higher the cleaning effect.

Therefore, a constant pressing load is applied to the cleaning brush 40 under the condition that a constant water film 200 is formed between the cleaning brush 40 and the substrate 100, so that the water film 20 is formed.
The thickness of 0 is reduced to provide a stable cleaning ability. In this case, the higher the pressing load of the cleaning brush 40 is, the higher the cleaning effect can be obtained.

Accordingly, the cleaning brush 40 must be within the allowable range.
The cleaning effect can be enhanced by increasing the pressing load of the substrate, but the increase in the pressing load increases the amount of warpage of the substrate as the diameter of the substrate increases. As a result, the angle formed between the cleaning brush 40 and the substrate 100 may be changed, resulting in uneven cleaning, or damage to the substrate 100 such as cracks. Therefore, a sufficiently large pressing load cannot be applied to the cleaning brush 40.

When a substrate having a hydrophobic surface is cleaned with a hydrophobic cleaning brush, a water film is not present and the cleaning brush directly contacts the surface of the substrate. Not only will it not be exhibited, but also fine particles will be applied to the surface of the substrate.

As described above, in the brush cleaning type substrate cleaning apparatus, the cleaning brush is reciprocated from the central portion of the substrate to the outer peripheral portion while rotating the substrate. The relative speed between the brush and the substrate decreases. At the point where the center of the cleaning brush coincides with the center of the substrate, the relative speed between the cleaning brush and the substrate is substantially zero, so that the impact force for separating the fine particles from the substrate is the lowest, and the cleaning ability is reduced. On the other hand, since the relative speed between the cleaning brush and the substrate increases at the outer peripheral portion of the substrate, the impact force for separating the fine particles from the substrate is maximized, and the cleaning ability is increased. As described above, in the conventional brush cleaning type substrate cleaning apparatus, there is a difference in cleaning performance between the central portion and the outer peripheral portion of the substrate.

On the other hand, there has been proposed an ultrasonic cleaning type substrate cleaning apparatus in which ultrasonic vibration is applied to a cleaning liquid to enhance the cleaning effect of the substrate. In this ultrasonic cleaning type substrate cleaning apparatus, the ability to peel fine particles from the substrate is high, but the ability to discharge the peeled fine particles out of the substrate without reattaching to the substrate is inferior. It is said that the brush cleaning method has higher overall cleaning ability than the ultrasonic cleaning method.

In order to take advantage of both the brush cleaning method and the ultrasonic cleaning method, as shown in FIG.
A substrate cleaning apparatus having a cleaning brush and an ultrasonic nozzle has been proposed. In this substrate cleaning apparatus, the cleaning brush 6
Arm 60 and ultrasonic nozzle 71 for holding the nozzle 1
Is provided, and the cleaning brush 61 and the ultrasonic nozzle 71 are reciprocated on the substrate 100. From the ultrasonic nozzle 71, pure water to which ultrasonic vibration is applied is discharged.

However, in this substrate cleaning apparatus, the time when the ultrasonic nozzle 71 applies an impact force to separate the fine particles from the surface of the substrate 100 and the time when the separated fine particles are discharged out of the substrate 100 by the cleaning brush 61 are slightly different. In particular, at the center of the substrate 100, the separated fine particles may adhere to the substrate 100 again. Therefore, the advantages of the brush cleaning method and the ultrasonic cleaning method cannot be fully utilized.

An object of the present invention is to provide a substrate cleaning apparatus which can uniformly clean the surface of a substrate and has a high cleaning effect.

[0015]

A substrate cleaning apparatus according to a first aspect of the present invention is a substrate cleaning apparatus for cleaning a substrate, wherein the substrate holding means holds a substrate, and the substrate holding means is rotationally driven. Driving means, and a cleaning brush provided so as to be able to contact the surface of the substrate held by the substrate holding means,
A first ultrasonic vibration applying means for applying ultrasonic vibration to the cleaning brush.

In the substrate cleaning apparatus according to the present invention, the substrate holding means for holding the substrate is rotationally driven by the driving means. The cleaning brush to which the ultrasonic vibration is applied by the first ultrasonic vibration applying means comes into contact with the surface of the rotating substrate, and the fine particles attached to the surface of the substrate are separated from the substrate and discharged out of the substrate.

In this case, since the sound pressure load by the ultrasonic vibration is superimposed on the static load of the cleaning brush, a high load is momentarily applied to the cleaning brush. Thereby, the impact force for peeling off the fine particles attached to the surface of the substrate without applying a large pressing load to the cleaning brush increases.

Since the relative speed between the cleaning brush and the substrate is higher at the outer peripheral portion of the substrate surface than at the central portion of the substrate surface, the closer the outer peripheral portion of the substrate is, the more the fine particles are separated from the substrate by the contact of the cleaning brush. The effect is higher. On the other hand, the number of times the cleaning brush vibrates per unit length of the substrate is greater at the central portion of the substrate surface than at the outer peripheral portion of the substrate surface, so that the ultrasonic vibration of the cleaning brush separates the fine particles from the substrate. Will be higher. As a result, the effect of separating the fine particles from the central portion to the outer peripheral portion of the substrate becomes uniform.

Therefore, the surface of the substrate can be uniformly cleaned and a high cleaning effect can be obtained.

According to a second aspect of the present invention, there is provided a substrate cleaning apparatus according to the first aspect of the present invention, comprising: a cleaning liquid supply unit for supplying a cleaning liquid onto the substrate held by the substrate holding unit; And a second ultrasonic vibration applying means for applying ultrasonic vibration to the cleaning liquid supplied onto the substrate.

In this case, the ultrasonic vibration is applied to the cleaning liquid by the second ultrasonic vibration applying means, and the cleaning liquid to which the ultrasonic vibration is applied is supplied onto the substrate by the cleaning liquid supply means. This further enhances the effect of separating the fine particles from the substrate.

The substrate cleaning apparatus according to a third aspect of the present invention is the substrate cleaning apparatus according to the second aspect, wherein the cleaning liquid supply means includes a cleaning liquid discharge nozzle for discharging a cleaning liquid.
The ultrasonic vibration applying means includes an ultrasonic vibrator provided in the cleaning liquid discharge nozzle.

In this case, the ultrasonic vibration is applied to the cleaning liquid discharged from the cleaning liquid discharge nozzle by the ultrasonic vibration of the ultrasonic vibrator provided in the cleaning liquid discharge nozzle.

A substrate cleaning apparatus according to a fourth aspect of the present invention comprises:
In the configuration of the substrate cleaning apparatus according to the second or third aspect, the first ultrasonic vibration applying means amplifies the ultrasonic vibration generated by the ultrasonic vibrator and the ultrasonic vibration to the cleaning brush. And a horn for transmission.

In this case, since the ultrasonic vibration generated by the ultrasonic vibrator is amplified by the horn and transmitted to the cleaning brush, a sufficiently large sound pressure load is applied to the cleaning brush. Thereby, a sufficiently high cleaning effect can be obtained.

According to a fifth aspect of the present invention, there is provided a substrate cleaning apparatus comprising:
In the configuration of the substrate cleaning apparatus according to the second or third aspect, the first ultrasonic vibration applying means includes an ultrasonic vibrator and a cooling means for cooling the ultrasonic vibrator.

In this case, the ultrasonic vibration generated by the ultrasonic vibrator is applied to the cleaning brush. In particular, since the ultrasonic vibrator is cooled by the cooling means, electric energy is efficiently converted to ultrasonic vibration energy without being consumed as heat energy, and the life of the ultrasonic vibrator is prolonged.

A substrate cleaning apparatus according to a sixth aspect of the present invention is the substrate cleaning apparatus according to the second aspect, wherein the cleaning liquid supply means includes a cleaning liquid storing section having an opening and storing the cleaning liquid, and a cleaning brush. Is inserted into the opening so that the cleaning liquid in the cleaning liquid reservoir can leak, and the first and second ultrasonic vibration applying means apply ultrasonic vibration to the cleaning brush via the cleaning liquid in the cleaning liquid storage. It has an ultrasonic vibrator.

The cleaning liquid stored in the cleaning liquid storage section is supplied onto the substrate through a gap between the cleaning brush and the edge of the opening, and the cleaning brush inserted into the opening of the cleaning liquid storage section is used for cleaning the substrate. Contact the surface.

In this case, the ultrasonic vibration is applied to the cleaning liquid and the cleaning brush in the cleaning liquid storage section by the common ultrasonic vibrator. Therefore, it is possible to press the surface of the substrate with the cleaning brush to which the ultrasonic vibration is applied in a compact configuration, and to supply the cleaning liquid to which the ultrasonic vibration is applied to the surface of the substrate at substantially the same position as the cleaning brush.

Thus, the fine particles adhering to the surface of the substrate can be reliably separated from the substrate and discharged out of the substrate. As a result, a sufficiently high cleaning effect can be obtained.

A substrate cleaning apparatus according to a seventh aspect of the present invention is the substrate cleaning apparatus according to the sixth aspect, further comprising a cleaning liquid circulation system for supplying the cleaning liquid to the cleaning liquid storage section and returning the cleaning liquid from the cleaning liquid storage section. It is a thing.

In this case, since the cleaning liquid can be circulated through the cleaning liquid reservoir by the cleaning liquid circulation system, the cleaning liquid also functions as cooling means.

[0034]

FIG. 1 is a schematic sectional view of a substrate cleaning apparatus according to a first embodiment of the present invention, and FIG. 2 is a schematic plan view of the substrate cleaning apparatus of FIG.

As shown in FIG. 1, a substrate holding portion 2 for holding a substrate 100 in a horizontal posture by suction is provided in a housing 1. The substrate holding unit 2 is fixed to a tip of a rotation shaft 4 of the motor 3 and is configured to be rotatable around a vertical axis. Around the substrate holding unit 2, a cleaning liquid scattering prevention cup 5 is provided so as to be vertically movable so as to surround the substrate 100. A discharge port 6 for discharging pure water as a cleaning liquid is provided on the lower surface of the cup 5.

On one side of the cup 5, a brush arm 8 is provided rotatably about a vertical axis by an arm driving unit 7. A brush holder 9 is attached to the lower surface of the tip of the brush arm 8. The brush holder 9 is configured to be able to rotate around a vertical axis by a motor built in the brush arm 8. A horn 10 having a gradually decreasing diameter is attached to the lower surface of the brush holding unit 9, and a cleaning brush 11 is provided on the lower surface of the tip of the horn 10. An ultrasonic vibrator 12 is attached to a side surface of the brush holding unit 9.

On the other side of the cup 5, a nozzle arm 14 is provided so as to be rotatable around a vertical axis by an arm driving unit 13. A pure water discharge nozzle 15 for discharging pure water as a cleaning liquid is attached to the lower surface side of the tip of the nozzle arm 14. This pure water discharge nozzle 1
An ultrasonic vibrator 16 is attached to 5. Pure water is supplied to the pure water discharge nozzle 15 from a pure water supply source (not shown).

The ultrasonic vibrator 12 attached to the brush holder 9 and the ultrasonic vibrator 16 attached to the pure water discharge nozzle 15 are driven by a high-frequency oscillator 17,
For example, it vibrates at 100 kHz. The control unit 18 controls the rotation of the motor 3, the rotation and vertical movement of the brush arm 8 by the arm driving unit 7, the nozzle arm 1 by the arm driving unit 13
4 controls the rotation and vertical movement of the brush 4, the rotation of the brush holder 9, the driving of the ultrasonic oscillators 12 and 16 by the high-frequency oscillator 17, and the discharge of pure water from the pure water discharge nozzle 15.

As shown in FIG. 2, the substrate 100 is
1, the brush arm 8 is rotated by the arm driving unit 7 around the rotation axis P2 in the direction of arrow R1, and the nozzle arm 14 is rotated by the arm driving unit 13 around the rotation axis P3 by the arrow R2. In the direction of.

At the time of cleaning, the brush arm 8 rotates around the rotation axis P2 while the brush holding unit 9 rotates, and the cleaning brush 11 contacts the surface of the substrate 100 while the cleaning brush 11 is in contact with the surface of the substrate 100.
Reciprocate from the center of the to the outer periphery on one side. In addition, the nozzle arm 14 rotates around the rotation axis P3, and the pure water discharge nozzle 15 moves to above the substrate 100 to discharge pure water. In this case, a constant static load is applied to the cleaning brush 11. In addition, the ultrasonic transducers 12 and 16 of FIG. Ultrasonic transducer 12
Is amplified by the horn 10 and transmitted to the cleaning brush 11. The ultrasonic vibration by the ultrasonic vibrator 16 is applied to the pure water discharged from the pure water discharge nozzle 15.

In this embodiment, the substrate holding unit 2 corresponds to the substrate holding unit, the motor 3 corresponds to the driving unit, and the ultrasonic vibrator 12 corresponds to the first ultrasonic vibration applying unit. Also,
The pure water discharge nozzle 15 corresponds to a cleaning liquid supply unit and a cleaning liquid discharge nozzle, and the ultrasonic vibrator 16 corresponds to a second ultrasonic vibration applying unit.

FIG. 3 is a diagram showing a time characteristic of the total brush pressure of the cleaning brush 11 in the substrate cleaning apparatus of FIG.

In FIG. 3, W1 is a static load applied to the cleaning brush 11. W2 is a sound pressure load due to ultrasonic vibration from the ultrasonic transducer 12. Assuming that the frequency of the ultrasonic vibration is f, the period of the sound pressure load is 1 / f.

As shown in FIG. 3, a sound pressure load W2 due to ultrasonic vibration is superimposed on a fixed stationary load W1. This makes it possible to instantaneously apply a much higher load than when only a constant static load is applied to the cleaning brush 11. At the same time, pure water to which ultrasonic vibration has been applied by the ultrasonic vibrator 16 is supplied onto the substrate 100. Therefore, it is possible to increase the impact force for removing the fine particles attached to the surface of the substrate 100 without applying a large pressing load to the cleaning brush 11.

The outer periphery of the surface of the substrate 100
Since the relative speed between the cleaning brush 11 and the substrate 100 is higher than the central portion of the surface of the substrate 100, the effect of separating the fine particles from the substrate 100 by contact of the cleaning brush 11 becomes higher as the cleaning brush 11 comes closer to the outer peripheral portion of the surface of the substrate 100. .

On the other hand, the number of times the cleaning brush 11 vibrates at a central portion of the surface of the substrate 100 per unit length of the substrate 100 is larger than that at an outer peripheral portion of the surface of the substrate 100. For example, a substrate 100 having a diameter of 300 mm is 2,000 rpm.
When the outer periphery of the substrate 100 rotates by 1 cm, the cleaning brush 11 vibrates 32.2 times, and as the cleaning brush 11 approaches the center of the surface of the substrate 100, the cleaning brush 11 The number of vibrations per 100 unit lengths increases. Thereby, the effect of separating the fine particles from the substrate 100 by the ultrasonic vibration of the cleaning brush 11 is enhanced.

Therefore, the effect of separating the fine particles from the center of the substrate 100 toward the outer periphery becomes substantially uniform. As a result, the surface of the substrate 100 can be uniformly cleaned and a high cleaning effect can be obtained.

In this embodiment, the brush holder 9 is configured to be able to rotate, but the brush holder 9 may be configured not to rotate.

FIG. 4 is a schematic sectional view showing the structure of a main part of a substrate cleaning apparatus according to a second embodiment of the present invention.

In the substrate cleaning apparatus shown in FIG. 4, a cooling water reservoir 20 having a cooling water inlet 21 and a cooling water outlet 22 is provided.
Is provided. A cooling water supply pipe 23 is attached to a cooling water inlet 21 of the cooling water storage unit 20, and a cooling water discharge pipe 24 is attached to a cooling water outlet 22.
Cooling water is supplied into the cooling water storage section 20 through the cooling water supply pipe 23, and the cooling water in the cooling water storage section 20 is discharged through the cooling water discharge pipe 24.

An opening 25 is provided on the lower surface of the cooling water storage section 20, and a cleaning brush 26 is mounted in the opening 25. The cleaning brush 26 includes a brush portion 26a and a brush holding portion 26b. The brush holding portion 26b is provided on the bottom edge of the cooling water storage portion 20 so that the brush portion 26a protrudes downward from the opening 25 of the cooling water storage portion 20. Supported. This cooling water storage section 20 is attached to the lower surface side of the tip end of the brush arm 8 in FIG.

An ultrasonic vibrator 27 is mounted on the brush holding portion 26b of the cleaning brush 26. The ultrasonic vibrator 27 is driven by the high frequency oscillator 17. In the substrate cleaning apparatus of the present embodiment, the ultrasonic vibration by the ultrasonic vibrator 27 is directly applied to the brush part 26a via the brush holding part 26b. In particular, since the ultrasonic vibrator 27 is cooled by the cooling water, electric energy is efficiently converted into ultrasonic vibration energy without being consumed as heat energy, and the life of the ultrasonic vibrator 27 is extended. .

As in the substrate cleaning apparatus shown in FIG. 1, a pure water discharge nozzle 15 is attached to the lower surface of the tip of the nozzle arm 11, and an ultrasonic vibrator 16 is attached to the pure water attachment nozzle 15. The ultrasonic vibrator 16 is also driven by the high frequency oscillator 17. The configuration of the other parts of the substrate cleaning apparatus of the present embodiment is the same as the configuration of the substrate cleaning apparatus of FIG.

In this embodiment, the ultrasonic vibrator 27 corresponds to the first ultrasonic vibration applying means, and the cooling water storage section 20, the cooling water supply pipe 23 and the cooling water discharge pipe 24 correspond to the cooling means.

In the substrate cleaning apparatus of this embodiment, since the sound pressure load due to the ultrasonic vibration of the ultrasonic vibrator 27 is superimposed on the static load of the cleaning brush 26, a high load is momentarily applied to the cleaning brush 26. . Further, pure water to which ultrasonic vibration has been applied by the ultrasonic vibrator 16 is supplied onto the substrate 100 by the pure water discharge nozzle 15. As a result, a large pressing load is not applied to the cleaning brush 26 and the substrate 100
The impact force for peeling off the fine particles adhered to the surface can be increased. Therefore, the surface of the substrate 100 can be uniformly cleaned and a high cleaning effect can be obtained.

FIG. 5 is a schematic sectional view showing the structure of a main part of a substrate cleaning apparatus according to a third embodiment of the present invention.

In the apparatus for cleaning a substrate shown in FIG. 5, a pure water storage section 30 having a pure water inlet 31 and a pure water outlet 32 is provided. A pure water supply pipe 33 for guiding pure water from a pure water supply source is attached to a pure water inlet 31 of the pure water storage unit 30, and a pure water outlet 32 supplies pure water of the pure water storage unit 30 with pure water. A pure water return pipe 34 for returning to the source is attached. The pure water reservoir 30 is attached to the lower surface of the tip of the brush arm 8 in FIG.

An opening 35 is provided on the lower surface of the pure water storage section 30, and a cleaning brush 36 is mounted in the opening 35. The cleaning brush 36 includes a brush portion 36a and a brush holding portion 36b. The brush holding portion 36b is formed on the bottom edge of the pure water storage portion 30 so that the brush portion 36a protrudes downward from the opening 35 of the pure water storage portion 30. Supported. The diameter of the brush portion 36 a is formed smaller than the diameter of the opening 35. Thereby, pure water can leak from the gap between the brush portion 36a and the edge of the opening 35.

An ultrasonic vibrator 37 is mounted above the brush holding portion 36b of the cleaning brush 36. The ultrasonic vibrator 37 is driven by the high frequency oscillator 17. The ultrasonic vibration generated by the ultrasonic vibrator 37 is applied to the cleaning brush 36 through pure water in the pure water storage unit 30. The configuration of the other parts of the substrate cleaning apparatus of the present embodiment is the same as the configuration of the substrate cleaning apparatus of FIG.

In this embodiment, the ultrasonic vibrator 37 corresponds to a common ultrasonic vibrator, and the pure water storage unit 30 corresponds to a cleaning liquid supply unit and a cleaning liquid storage unit. The pure water supply pipe 33 and the pure water return pipe 34 correspond to a cleaning liquid circulation system.

In the substrate cleaning apparatus of this embodiment, the cleaning brush 36 is pressed against the surface of the rotating substrate 100 with a constant static load, and the ultrasonic vibration is applied by the ultrasonic vibrator 37 to the cleaning brush via pure water. 36. Further, the pure water to which the ultrasonic vibration is applied by the ultrasonic vibrator 37 is applied to the brush portion 36 a of the cleaning brush 16 and the opening 3.
5 is supplied onto the substrate 100 from the gap between the edge of the substrate 5.

As described above, the surface of the substrate 100 is pressed by the cleaning brush 36 to which the ultrasonic vibration has been applied, and pure water to which the ultrasonic vibration has been applied is applied to the surface of the substrate 100 substantially at the same position as the cleaning brush 36. Can be supplied. As a result, the fine particles adhering to the surface of the substrate 100 are
It can be reliably separated from the substrate and discharged out of the substrate 100.

Since pure water can be circulated through the pure water supply pipe 33, the pure water reservoir 30, and the pure water return pipe 34, the pure water functions as a cooling means. Thereby, the electric energy is efficiently converted into the energy of the ultrasonic vibration without being consumed as the heat energy, and the life of the ultrasonic vibrator 37 is extended.

As a result, the substrate 1 has a compact configuration.
00 can be uniformly cleaned and a high cleaning effect can be obtained.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a substrate cleaning apparatus according to a first embodiment of the present invention.

FIG. 2 is a schematic plan view of the substrate cleaning apparatus of FIG.

FIG. 3 is a diagram showing a time characteristic of a total brush pressure of a cleaning brush in the substrate cleaning apparatus of FIG. 1;

FIG. 4 is a schematic cross-sectional view illustrating a configuration of a main part of a substrate cleaning apparatus according to a second embodiment of the present invention.

FIG. 5 is a schematic sectional view showing a configuration of a main part of a substrate cleaning apparatus according to a third embodiment of the present invention.

FIG. 6 is a schematic diagram illustrating a positional relationship between a cleaning brush and a substrate during cleaning.

FIG. 7 is a schematic plan view of a substrate cleaning apparatus having a cleaning brush and an ultrasonic nozzle.

[Explanation of symbols]

 2 Substrate holding unit 3 Motor 7, 13 Arm driving unit 8 Brush arm 9 Brush holding unit 10 Horn 11, 26, 36 Cleaning brush 12, 16, 27, 37 Ultrasonic vibrator 14 Nozzle arm 15 Pure water discharge nozzle 17 High frequency oscillator 18 Control part 20 Cooling water storage part 26a, 36a Brush part 26b, 36b Brush holding part 30 Pure water storage part 33 Pure water supply pipe 34 Pure water return pipe 25, 35 Opening

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI H01L 21/304 644 H01L 21/304 644B

Claims (7)

[Claims] 1. A substrate cleaning apparatus for cleaning a substrate, comprising: substrate holding means for holding a substrate; driving means for driving the substrate holding means to rotate; and contacting a surface of the substrate held by the substrate holding means. A substrate cleaning apparatus comprising: a cleaning brush provided so as to be capable of being provided; and first ultrasonic vibration applying means for applying ultrasonic vibration to the cleaning brush. 2. A cleaning liquid supply means for supplying a cleaning liquid onto a substrate held by the substrate holding means, and a second ultrasonic vibration for applying ultrasonic vibration to the cleaning liquid supplied onto the substrate by the cleaning liquid supply means. 2. The substrate cleaning apparatus according to claim 1, further comprising: an applying unit. 3. The cleaning liquid supply unit includes a cleaning liquid discharge nozzle that discharges a cleaning liquid, and the second ultrasonic vibration applying unit includes an ultrasonic vibrator provided on the cleaning liquid discharge nozzle. The substrate cleaning apparatus according to claim 2, wherein 4. The ultrasonic vibration applying means includes an ultrasonic vibrator and a horn for amplifying ultrasonic vibration generated by the ultrasonic vibrator and transmitting the amplified ultrasonic vibration to the cleaning brush. The substrate cleaning apparatus according to claim 1, wherein 5. The apparatus according to claim 1, wherein the first ultrasonic vibration applying means includes an ultrasonic vibrator and cooling means for cooling the ultrasonic vibrator. Substrate cleaning equipment. 6. The cleaning liquid supply means includes a cleaning liquid storing section having an opening and storing the cleaning liquid, wherein the cleaning brush is inserted into the opening so that the cleaning liquid in the cleaning liquid storing section can leak. 3. The apparatus according to claim 2, wherein the first and second ultrasonic vibration applying means include a common ultrasonic vibrator for applying ultrasonic vibration to the cleaning brush via the cleaning liquid in the cleaning liquid storage section. A substrate cleaning apparatus as described in the above. 7. The substrate cleaning apparatus according to claim 6, further comprising a cleaning liquid circulation system for supplying a cleaning liquid to the cleaning liquid storage section and returning the cleaning liquid from the cleaning liquid storage section.