JP2010238744A - Ultrasonic cleaning unit, and ultrasonic cleaning device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ultrasonic cleaning unit and an ultrasonic cleaning device which can suppress an amount of use of a cleaning liquid without damaging a cleaning substance. <P>SOLUTION: This ultrasonic cleaning unit 20 includes an ultrasonic transfer means 25 disposed so as to oppose a cleaning face Sa of a cleaning substance S with a gap, an ultrasonic vibrator 23 provided in the ultrasonic transfer means 25 for applying ultrasonic waves to a cleaning liquid L on the cleaning face Sa via the ultrasonic transfer means 25, and a liquid guiding means 40 which has a flow path 40a in which the cleaning liquid L circulates in an outer peripheral side face of the ultrasonic transfer means 25 to surround it, and which is arranged to be closer to the cleaning face Sa than the ultrasonic transfer means 25 for discharging the cleaning liquid L to the gap. This ultrasonic cleaning unit 20 can maintain the cleaning liquid L between the ultrasonic transfer means 25 and the cleaning substance S, and can carry out ultrasonic cleaning efficiently with a small amount of cleaning liquid without damaging the cleaning substance. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

The present invention relates to an ultrasonic cleaning unit and an ultrasonic cleaning apparatus that perform processing such as cleaning by irradiating a liquid with ultrasonic waves.

In a manufacturing process of a semiconductor substrate or a glass substrate for a liquid crystal display device, it is necessary to clean and remove submicron order particles or the like attached to an object to be cleaned such as a glass substrate before and after various fine processing. Therefore, 500kHz to 1.5MH with little damage to the object to be cleaned.
An ultrasonic cleaning method is generally used in which cleaning is performed by irradiating a cleaning liquid to which an ultrasonic wave having a high frequency of z is applied.

In addition, in recent years, there has been disclosed an ultrasonic cleaning apparatus that supplies a cleaning liquid to the upper surface of an object to be cleaned and applies ultrasonic waves to the cleaning liquid on the object to be cleaned (for example, Patent Document 1).

This ultrasonic cleaning apparatus includes a cylindrical ultrasonic wave application head arranged substantially perpendicular to the upper surface of the object to be cleaned. The ultrasonic wave application head has an ultrasonic transmission means at its lower end and an internal part. Are provided with an ultrasonic vibrator for oscillating ultrasonic waves, a cooling means for cooling the ultrasonic vibrator, and a nozzle for supplying a cleaning liquid to the upper surface of the object to be cleaned on the outer side.

JP 2003-31540 A

The ultrasonic cleaning apparatus that brings the above-described ultrasonic transmission means close to the surface to be cleaned has the following problems. That is, if the distance between the ultrasonic transmission means and the object to be cleaned is large, the necessary amount of cleaning liquid for satisfying this distance increases, resulting in high costs. In particular, in the surface treatment of fine structures, a cleaning liquid having a low surface tension, such as hydrofluorocarbon, is used to suppress damage caused by residual liquid, but a liquid having a low surface tension maintains a liquid film on the surface of the object to be cleaned. It is difficult to use a large amount of cleaning liquid. For this reason, it is necessary to keep the ultrasonic transmission means as close as possible to the surface of the object to be cleaned and to reduce the amount of cleaning liquid used.

However, if the distance between the ultrasonic transmission means and the object to be cleaned is small, the surface of the object to be cleaned has minute undulations and uneven thickness of the object to be cleaned. When the ultrasonic cleaning unit is moved, it is conceivable that the ultrasonic transmission means and the object to be cleaned come into contact with each other, and the wiring and the like formed on the surface of the object to be cleaned are destroyed.

Therefore, the present invention distributes the cleaning liquid to the outer peripheral side surface of the ultrasonic transmission means so that the cleaning liquid is maintained between the ultrasonic transmission means and the object to be cleaned without damaging the object to be cleaned. An object of the present invention is to provide an ultrasonic cleaning unit and an ultrasonic cleaning apparatus that perform efficient ultrasonic cleaning with a small amount of cleaning liquid.

In order to achieve the above object, an ultrasonic cleaning unit of the present invention is provided with ultrasonic transmission means arranged to face the surface to be cleaned of the object to be cleaned with a gap, and the ultrasonic transmission means. An ultrasonic transducer that applies ultrasonic waves to the cleaning liquid on the surface to be cleaned via the ultrasonic transmission means;
A flow path through which the cleaning liquid flows is surrounded by an outer peripheral side surface of the ultrasonic transmission means, is disposed closer to the surface to be cleaned than the ultrasonic transmission means, and guides the cleaning liquid to the gap. And a liquid means.

Further, the ultrasonic cleaning apparatus of the present invention includes the ultrasonic cleaning unit disposed opposite to the surface to be cleaned of the object to be cleaned, a holding unit that holds the ultrasonic cleaning unit and is capable of reciprocating, and the ultrasonic cleaning unit. A spin processing unit that is disposed to face the sonic cleaning unit and that rotates the object to be cleaned is provided.

According to the present invention, the cleaning liquid is circulated on the outer peripheral side surface of the ultrasonic transmission means, and the cleaning liquid is maintained between the ultrasonic transmission means and the target object, thereby damaging the target object. In addition, efficient ultrasonic cleaning can be performed with a small amount of cleaning liquid.

The block diagram of the ultrasonic cleaning apparatus which concerns on the 1st Embodiment of this invention. The block diagram of the opening part of the sound wave provision head which concerns on the 1st Embodiment of this invention. 1 is a cross-sectional view above an ultrasonic head according to a first embodiment of the present invention. The figure which showed the distance relationship between the ultrasonic diaphragm which concerns on the 1st Embodiment of this invention, a liquid guide tube, and a to-be-cleaned surface. The block diagram of the opening part of the ultrasonic wave provision head which concerns on 2nd Embodiment. The block diagram of the opening part of the ultrasonic wave provision head which concerns on 3rd Embodiment.

  Hereinafter, embodiments of the present invention will be described.

(First embodiment)
FIG. 1 is a configuration diagram of an ultrasonic cleaning apparatus according to the first embodiment of the present invention.

As shown in FIG. 1, the ultrasonic cleaning apparatus includes a spin processing unit 10 that holds and rotates an object to be cleaned S such as a semiconductor substrate such as a silicon wafer or a glass substrate for a liquid crystal display device,
A cleaning liquid L (not shown) is supplied to the object to be cleaned S, and an ultrasonic cleaning unit 20 is provided to apply ultrasonic waves to the cleaning liquid L to clean the surface to be cleaned.

The spin processing unit 10 has a bottomed cylindrical cup body 11. The cup body 11 is disposed so that the opening 11a faces upward, and the bottom 11b has a cleaning liquid L after the cleaning process.
Are provided with a plurality of outlets 12.

A motor 13 is disposed below the cup body 11. The drive shaft 13a of the motor 13 is
It penetrates the bottom wall of the cup body 11, and its midway part is rotatably supported by the bearing 14.

A rotary table 15 is provided substantially horizontally at the upper end of the drive shaft 13a. Rotary table 1
A plurality of support pins 16 are arranged at equal intervals on the outer periphery of the upper surface of 5.
And the peripheral portion of the object to be cleaned S are engaged with each other so that the object to be cleaned S can be held almost horizontally.

On the other hand, the ultrasonic cleaning unit 20 has an ultrasonic wave application head 21. The ultrasonic wave applying head 21 is disposed to face the surface Sa to be cleaned S, and can move back and forth on the surface to be cleaned by driving the swing arm 22.

  FIG. 2 is a configuration diagram of the ultrasonic wave applying head 21.

As shown in FIG. 2, the ultrasonic wave application head 21 has a head main body 21a, and the head main body 21a is opened toward the surface to be cleaned Sa.

The ultrasonic wave applying head 21 is bonded and fixed to the disk-shaped ultrasonic vibrator 23, a cooling device 24 for cooling the ultrasonic vibrator 23 above the ultrasonic vibrator 23, and the ultrasonic vibrator 23. A cylindrical ultrasonic vibration plate 25 (ultrasonic transmission means) disposed opposite to the object to be cleaned is provided, and a liquid introduction pipe 40 (liquid introduction means) for supplying the cleaning liquid L to the object to be cleaned S.

The ultrasonic vibrator 23 is provided above the ultrasonic vibration plate 25, and the member may be a piezoelectric element such as PZT or lead titanate.

An RF power supply 26 is connected to the ultrasonic transducer 23 via a power supply line, and is configured to control the oscillation of ultrasonic vibrations by controlling and driving it. For example, the ultrasonic transducer 23 performs ultrasonic vibration of about 1.5 MHz when electric power of about 20 W is applied.

A matching circuit 27 is provided between the RF power supply 26 and the ultrasonic transducer 23. The matching circuit 27 is for matching the impedance between the RF power source 26 and the ultrasonic transducer 23, and the power supplied from the RF power source 26 is converted into ultrasonic waves most efficiently by the ultrasonic transducer 23. Is predetermined.

A cooling device 24 is provided above the ultrasonic transducer 23. The cooling device 24 is provided with a cooling water passage 28 and a cooling water supply / discharge port 29 for supplying and discharging the cooling water. The cooling water supply / discharge port 29 is connected to a cooling water supply source and a cooling water discharge unit (not shown).

The ultrasonic vibration plate 25 applies the ultrasonic wave generated by the ultrasonic vibrator 23 to the surface Sa to be cleaned Sa.
Is transferred to the cleaning liquid L discharged and is bonded and fixed to the ultrasonic transducer 23 by an upper end surface 25a formed in a flat shape. On the other hand, the lower end surface 25b is formed to protrude toward the surface to be cleaned Sa. In this example, the lower end surface 25b is a surface to be cleaned Sa as it goes to the center in the radial direction.
Although it is formed in the curved surface which protrudes to the side, it is not restricted to this.

Note that a notch portion may be provided at the center portion in the radial direction on the lower end surface 25 b of the ultrasonic vibration plate 25. By adopting such a configuration, even if the ultrasonic wave reflected by the surface to be cleaned Sa enters the ultrasonic vibration plate 25, it is refracted when passing through the notch, so that the upper end surface 2 of the ultrasonic vibration plate 25 is refracted.
It is difficult for ultrasonic waves to enter the ultrasonic transducer 23 fixed to 5a.

The member of the ultrasonic vibration plate 25 is composed of any one of an ultrasonic lens using SiO2, SiC, sapphire glass, stainless steel, or Ta. Ultrasonic diaphragm 25
Is in direct contact with the cleaning liquid L, so that depending on the type of cleaning liquid L, the components may elute and the object to be cleaned S
On the contrary, it is conceivable to contaminate. Therefore, it is necessary to appropriately select the material depending on the type of the cleaning liquid L to be used.

The liquid guide tube 40 includes an outer wall 40a surrounding the outer peripheral side surface of the ultrasonic vibration plate 25, and a cleaning liquid channel 40b (channel) through which the cleaning liquid L supplied from the supplied cleaning liquid supply port 30 flows. The cleaning liquid L circulated through the cleaning liquid channel 40b is discharged from the front end of the outer wall 40a to the object to be cleaned S. In this example, the liquid guide tube 40 is integrally formed with the opening of the ultrasonic wave application head main body 21a. However, the present invention is not limited to this. For example, the ultrasonic wave application head main body 2
It may be separately provided inside the opening of 1a.

3A is a longitudinal sectional view above the ultrasonic head 21 in the present embodiment, and FIG.
) Is an AA cross-sectional view in (a). The ultrasonic vibrator 23 is bonded and fixed to the upper end surface 25a of the ultrasonic vibration plate 25, and the lower end surface 25b has a cylindrical shape protruding downward (spherical in this example). The liquid guide tube 40 has a substantially concentric cylindrical shape with the ultrasonic vibration plate 25, and the ultrasonic vibration plate 25 is formed by an outer wall 40 a that is radially expanded from the outer peripheral side surface of the ultrasonic vibration plate 25.
Covering. A cleaning liquid channel 40 b through which the cleaning liquid flows is provided between the ultrasonic vibration plate 25 and the liquid guide pipe 40.

The liquid guide tube 40 in this example has a convex shape in the vertically downward direction, and a step is provided in the width of the flow path 40b. However, the present invention is not limited to this. The interval between the liquid tube 40 may be single. However, in order to prevent a large amount of the cleaning liquid L from being discharged from the cleaning liquid supply port 30, it is preferable that the distance between the ultrasonic vibration plate 25 and the liquid guide pipe 40 is narrow.

FIG. 4 is a diagram showing the distance relationship among the ultrasonic vibration plate 25, the liquid guide tube 40, and the surface to be cleaned Sa in the present embodiment. The distance P is the distance from the front end h of the outer wall 40a to the surface to be cleaned Sa, and the distance Q is the surface to be cleaned from the approach point m closest to the surface to be cleaned Sa on the lower end surface 25b of the ultrasonic vibration plate 25. The distance from the object S to the surface to be cleaned Sa.

Here, the distance P must be the same as or smaller than the distance Q. Specifically, when the distance Q from the approach point m on the lower end surface 25b to the surface Sa to be cleaned is 3 mm, the outer wall 40a
It is desirable that the distance P from the tip h of the surface to be cleaned Sa is 1 mm to 3 mm. When the distance P from the front end h of the outer wall 40a to the surface Sa to be cleaned is 1 mm or less, the swing arm 2
When 2 reciprocates on the surface to be cleaned, the tip of the liquid guide tube 40 engages with the support pin 16 and the cleaning efficiency may be reduced. Therefore, the distance P is preferably set to 1 mm or more.

  Next, the operation when using the ultrasonic cleaning apparatus having the above configuration will be described.

When the object to be cleaned S is supported by the support pins 16 on the turntable 15, the object to be cleaned S is rotated in the circumferential direction, and the cleaning liquid L is supplied from the cleaning liquid supply port 30 to the liquid introduction pipe 40. The cleaning liquid L that has flowed in passes through the liquid guide pipe 40 and is discharged onto the surface to be cleaned Sa of the object to be cleaned S. When the space between the ultrasonic vibration plate 25 and the surface Sa to be cleaned S is filled with the cleaning liquid L, the ultrasonic vibrator 23
Is driven to apply ultrasonic waves from the ultrasonic vibration plate 25 to the cleaning liquid L on the surface Sa to be cleaned S.

The liquid guide tube 40 is installed substantially concentrically with the ultrasonic vibration plate 25, and is provided so as to cover the outer peripheral side surface of the ultrasonic vibration plate 25. For this reason, the cleaning liquid L supplied from the cleaning liquid supply port 30 flows into the liquid introduction pipe 40 and is discharged onto the surface to be cleaned Sa of the object to be cleaned S. The distance P between the tip end h of the outer wall 40a of the liquid guide tube 40 and the surface Sa to be cleaned is determined by the ultrasonic diaphragm 2
5 is equal to or smaller than the distance Q between the approach point m of the lower end surface 25b and the surface to be cleaned Sa. For this reason, the cleaning liquid L discharged from the liquid guide tube 40 is subjected to flow resistance between the liquid guide tube 40 and the surface Sa to be cleaned, and is held between the target object S and the ultrasonic vibration plate 25. It will be.

That is, since it is possible to prevent the cleaning liquid L from flowing out and prevent it from being easily discharged to the outside, a small amount of the cleaning liquid L can be used to clean the surface to be cleaned Sa and the lower end surface of the ultrasonic vibration plate 25. It becomes possible to maintain the liquid between 25b.

In particular, even when a liquid having a low surface tension, such as hydrofluorocarbon, hydrofluoroether, perfluorocarbon, or hydrochlorofluorocarbon, is used as the cleaning liquid L, the cleaning liquid L is cleaned with the surface to be cleaned Sa and the ultrasonic vibration plate 25. Therefore, the cleaning process can be performed with a small amount of the cleaning liquid L.

As described above, when performing ultrasonic cleaning using the ultrasonic cleaning apparatus in the present embodiment,
Compared to conventional ultrasonic cleaning methods, damage to wiring and damage to the crystalline state of substances that make up the substrate can be reduced as much as possible, greatly improving the yield in the manufacturing process of semiconductor devices and liquid crystal display devices. It becomes possible to make it.

(Second Embodiment)
FIG. 5 is a configuration diagram of the opening of the ultrasonic wave applying head 21 according to the second embodiment of the present invention. The basic configuration of the opening of the ultrasonic wave application head 21 is not changed from that in the first embodiment, but in this embodiment, the inner wall 40c of the liquid guide tube 40 (liquid guide means) is provided separately. The inner wall 40c of the liquid guide tube 40 is bonded so as to cover the outer peripheral side surface of the ultrasonic vibration plate 25 with the ultrasonic vibration plate 25 substantially concentrically, and the liquid guide pipe 40 is spaced from the inner wall 40c at a constant interval in the diameter expansion direction. An outer wall 40a of the tube 40 is provided.

The distance R between the tip t of the inner wall 40c and the surface to be cleaned Sa is larger than the distance P from the tip h of the outer wall 40a of the liquid guide tube 40 to the surface to be cleaned Sa. However, the distance R is equal to or smaller than the distance Q from the approach point m of the ultrasonic vibration plate 25 to the surface to be cleaned Sa. As described above, the liquid guide tube 40 of the present embodiment is formed of a thin tube on the outer periphery of the lower end surface 25b of the ultrasonic vibration plate 25, and a portion for discharging the cleaning liquid L is greatly opened.

For the inner wall 40c of the liquid guide tube 40, for example, an ultrasonic absorbing member such as a fluororesin may be used. When applying an ultrasonic wave to the cleaning liquid L, the ultrasonic wave oscillated by the ultrasonic vibrator 23 may be reflected by the side surface of the liquid guide tube 40 and a part of the ultrasonic wave may be incident on the ultrasonic vibrator 23. This is because the outer periphery of the ultrasonic vibration plate 25 is covered with the absorbing member to prevent the reflected wave from entering the ultrasonic vibrator 23.

  Next, the operation of this embodiment will be described.

The inner wall 40c of the liquid guiding tube 40 is bonded so as to be concentric with the ultrasonic vibration plate 25,
Since the outer wall 40a of the liquid guide tube 40 is provided in a concentric columnar shape at regular intervals, the cleaning liquid L supplied from the cleaning liquid supply port 30 flows between the inner wall 40c and the outer wall 40a and is cleaned. The material S is discharged to the surface to be cleaned Sa.

Since the distance R from the tip portion t of the inner wall 40a to the surface to be cleaned Sa is larger than the distance P from the tip portion h of the outer wall 40a of the liquid guide tube 40 to the surface to be cleaned Sa, the cleaning liquid L is introduced into the liquid. The outer wall 40a of the tube 40 receives flow resistance and is always filled between the cleaning object S and the ultrasonic vibration plate 25.

That is, since it is possible to prevent the cleaning liquid L from flowing out and prevent it from being easily discharged to the outside, a small amount of the cleaning liquid L can be used to clean the surface to be cleaned Sa and the lower end surface of the ultrasonic cleaning plate 25. The cleaning liquid L between 25b can be maintained and cleaning can be performed efficiently.

In addition, since the liquid guide tube 40 of the present embodiment is finely configured around the lower end surface 25b of the ultrasonic vibration plate 25, a large amount of the cleaning liquid L does not flow out from the cleaning liquid supply port 30 at once.
Further, since the liquid guide tube 40 is greatly opened around the lower end surface 25b of the ultrasonic vibration plate 25, an appropriate amount of the cleaning liquid L is supplied between the ultrasonic vibration plate 25 and the surface to be cleaned Sa. .

As described above, when performing ultrasonic cleaning using the ultrasonic cleaning apparatus in the present embodiment,
Compared to conventional ultrasonic cleaning methods, damage to wiring and damage to the crystalline state of substances that make up the substrate can be reduced as much as possible, greatly improving the yield in the manufacturing process of semiconductor devices and liquid crystal display devices. It becomes possible to make it.

(Third embodiment)
FIG. 6 is a configuration diagram of the opening of the ultrasonic wave applying head 21 according to the third embodiment of the present invention. Although the basic configuration of the opening of the ultrasonic wave application head 21 is not changed in the first embodiment, in this embodiment, a baffle plate 60 integrally formed with the liquid guide tube 40 is provided at the tip of the outer wall 40a of the liquid guide tube 40. installed. The baffle plate 60 is installed horizontally toward the axis of the ultrasonic transmission plate 25.

With such a configuration, the cleaning liquid L receives a larger flow path resistance between the tip of the liquid introduction tube 40 and the surface to be cleaned Sa, and the space between the object to be cleaned S and the ultrasonic vibration plate 25. Will always be satisfied.

In addition, since it is possible to prevent the cleaning liquid L from flowing out and prevent it from being easily discharged to the outside, a small amount of the cleaning liquid L can be used to clean the surface to be cleaned Sa and the lower end surface of the ultrasonic vibration plate 25. 2
The cleaning liquid L between 5ab can be maintained, and cleaning can be performed efficiently.

As described above, when performing ultrasonic cleaning using the ultrasonic cleaning apparatus in the present embodiment,
Compared to conventional ultrasonic cleaning methods, damage to wiring and damage to the crystal state of the substances constituting the substrate can be reduced as much as possible, greatly increasing the yield in the manufacturing process of semiconductor devices and liquid crystal display devices. It becomes possible to improve.

Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.

DESCRIPTION OF SYMBOLS 20 ... Ultrasonic cleaning unit, 21 ... Ultrasonic application head, 21a ... Head main body, 23 ... Ultrasonic vibrator, 24 ... Cooling device, 25 ... Ultrasonic vibration plate (ultrasonic transmission means), 25a ... Upper end surface,
25b ... lower end surface, 30 ... cleaning liquid supply port, 40 ... liquid introduction pipe (liquid introduction means), 40a ... outer wall, 40
b: cleaning liquid flow path (flow path), 40c: inner wall, L: cleaning liquid, S: object to be cleaned, Sa: surface to be cleaned,
m ... Approaching point

Claims (8)

An ultrasonic transmission means arranged to face the surface to be cleaned with a gap;
An ultrasonic transducer that is provided in the ultrasonic transmission means and applies ultrasonic waves to the cleaning liquid on the surface to be cleaned through the ultrasonic transmission means;
A flow path through which the cleaning liquid flows is surrounded by an outer peripheral side surface of the ultrasonic transmission means, is disposed closer to the surface to be cleaned than the ultrasonic transmission means, and guides the cleaning liquid to the gap. Liquid means;
An ultrasonic cleaning unit comprising: An ultrasonic transmission means arranged to face the surface to be cleaned with a gap;
An ultrasonic transducer that is provided in the ultrasonic transmission means and applies ultrasonic waves to the cleaning liquid on the surface to be cleaned through the ultrasonic transmission means;
The flow path through which the cleaning liquid flows is surrounded by the outer peripheral side surface of the ultrasonic transmission means, and the distance from the surface to be cleaned is the same as the distance between the ultrasonic transmission means and the surface to be cleaned. Liquid introducing means for discharging the cleaning liquid into the gap;
An ultrasonic cleaning unit comprising: The liquid introduction means is concentric with the cylindrical ultrasonic transmission means, and is formed in a cylindrical shape in which an outer periphery of the ultrasonic transmission means is radially expanded. Item 3. The ultrasonic cleaning unit according to Item 2. 2. The liquid introduction unit includes a baffle plate installed horizontally toward the axis of the ultrasonic wave transmission unit, and the cleaning liquid is discharged from the baffle plate into the gap. The ultrasonic cleaning unit according to claim 3. The ultrasonic cleaning unit according to any one of claims 1 to 4, wherein the cleaning liquid is a liquid having a surface tension smaller than that of water. The ultrasonic transmission means includes a preventing means for preventing the ultrasonic wave oscillated by the ultrasonic vibrator from being reflected by the surface to be cleaned and entering the ultrasonic vibrator via the ultrasonic transmission means. The ultrasonic cleaning unit according to claim 1, wherein the ultrasonic cleaning unit is provided. The ultrasonic cleaning according to any one of claims 1 to 6, wherein the liquid introducing means includes an inner wall made of an ultrasonic absorbing member bonded to an outer peripheral side surface of the ultrasonic transmission means. unit. The ultrasonic cleaning unit according to any one of claims 1 to 7, wherein the ultrasonic cleaning unit is disposed so as to face a surface to be cleaned of the object to be cleaned.
Holding means for holding this ultrasonic cleaning unit, and reciprocating holding means;
A spin processing unit that is disposed opposite to the ultrasonic cleaning unit and holds and rotates the object to be cleaned;
An ultrasonic cleaning apparatus comprising:

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