KR101688455B1 - An ultrasonic transmitter having piezoelectric element capable of transverse prevention and ultrasonic cleaning device including the same - Google Patents

An ultrasonic transmitter having piezoelectric element capable of transverse prevention and ultrasonic cleaning device including the same Download PDF

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Publication number
KR101688455B1
KR101688455B1 KR1020150069457A KR20150069457A KR101688455B1 KR 101688455 B1 KR101688455 B1 KR 101688455B1 KR 1020150069457 A KR1020150069457 A KR 1020150069457A KR 20150069457 A KR20150069457 A KR 20150069457A KR 101688455 B1 KR101688455 B1 KR 101688455B1
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South Korea
Prior art keywords
piezoelectric element
ultrasonic
transverse wave
transducer
preventing
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KR1020150069457A
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Korean (ko)
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KR20160136493A (en
Inventor
이양래
임의수
김현세
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한국기계연구원
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/44—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
    • H01L21/449—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428 involving the application of mechanical vibrations, e.g. ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
    • B08B7/026—Using sound waves
    • B08B7/028—Using ultrasounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2209/00—Details of machines or methods for cleaning hollow articles
    • B08B2209/005—Use of ultrasonics or cavitation, e.g. as primary or secondary action
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/76—Apparatus for connecting with build-up interconnects
    • H01L2224/7625—Means for applying energy, e.g. heating means
    • H01L2224/763—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/76343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

The ultrasonic transducer according to the present invention includes a piezoelectric element having a piezoelectric element capable of preventing the transverse wave from being generated. The transducer is formed in a fan shape and the center of the sector is recessed to form a transverse wave prevention part.
The present invention also provides an ultrasonic cleaning apparatus including an ultrasonic vibrator having a piezoelectric element capable of preventing a transverse wave from occurring. The ultrasonic cleaning apparatus includes the piezoelectric element, a first transducer coupled to the piezoelectric transducer on an upper surface thereof, An ultrasonic transducer including a first transducer; And a housing which is provided so as to face the object to be cleaned and in which the piezoelectric element and the first carrier are housed.

Description

[0001] The present invention relates to an ultrasonic vibrator having a piezoelectric element capable of preventing a transverse wave from being generated, and an ultrasonic cleaning device including the piezoelectric element,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrasonic vibrator having a piezoelectric element capable of preventing the generation of transverse waves and an ultrasonic cleaning apparatus including the same.

Ultrasonic cleaning apparatuses are widely used for cleaning, sterilizing, and the like.

As a specific example, the process of manufacturing a semiconductor substrate includes unit processes such as deposition, lithography, etching, chemical polishing and mechanical polishing, cleaning, and drying.

Among these unit processes, the cleaning process is a process for removing foreign substances or unnecessary films adhering to the surface of the semiconductor substrate during each unit process.

At one time, as the pattern formed on the semiconductor substrate becomes finer and the aspect ratio of the pattern becomes larger, the importance of the cleaning process gradually increases.

In the early stage of the semiconductor cleaning process, a method of immersing and removing the semiconductor substrate into the cleaning liquid to clean the semiconductor substrate has been widely used. However, as the importance of the cleaning process has increased as described above, much progress has been made in the structure of the cleaning apparatus.

Recently, a substrate cleaning apparatus having a structure for increasing cleaning efficiency by applying ultrasonic vibration of several hundred kHz or more to a cleaning liquid while immersing a semiconductor substrate in a cleaning liquid is mainly used.

That is, the semiconductor substrate is cleaned using ultrasonic waves.

The ultrasonic transducer has a diaphragm or a rod, and the piezoelectric element is attached to one surface (plane) of the diaphragm or rod as described above.

Fig. 1 is a schematic view for explaining a transverse wave and a longitudinal wave generated through an ultrasonic vibrator (in this case, A is a schematic view showing a sound pressure distribution along a longitudinal wave of the piezoelectric element, and B is a schematic view showing a sound pressure distribution along a transverse wave of the piezoelectric element 2 is a schematic diagram for explaining an output state (a state in which a transverse wave and a longitudinal wave meet and a peak sound pressure is generated) output by a conventional ultrasonic vibrator.

As shown in FIG. 1, in the conventional ultrasonic vibrator, the longitudinal wave of the piezoelectric element is fairly uniform, while the transverse wave of the piezoelectric element is superposed on the stading wave at the center, so that the sound pressure is very strong. At this time, the transverse waves of the piezoelectric element are generated when ultrasonic waves generated at one end in the horizontal direction of the piezoelectric element are transmitted to the other end, and then fed back to the other end in the horizontal direction.

As shown in FIG. 2, in the conventional ultrasonic vibrator, a peak sound pressure (1) having a very strong negative pressure due to a transverse wave of the piezoelectric element is generated at the center after the longitudinal wave and the transverse wave meet.

When the peak sound pressure reaches the pattern of the semiconductor substrate, there is a problem that the pattern of the semiconductor substrate is damaged by a very strong negative pressure of the peak sound pressure.

Therefore, it is necessary to develop various ultrasonic vibrators and ultrasonic cleaning apparatuses to solve the above-mentioned problems.

As a related art, the present applicant has proposed Korean Patent Publication No. 2011-0136345.

Korean Patent Publication No. 2011-0136345 (December 21, 2011)

It is an object of the present invention to provide an ultrasonic vibrator having a piezoelectric element capable of preventing a transverse wave from being generated in a piezoelectric element and an ultrasonic cleaning apparatus including the same, .

The ultrasonic transducer having the piezoelectric element capable of preventing the transverse wave according to the present invention is recessed such that the center of the sector shape has a flat cross section and the cross section between the flat cross section and the center line of the sector shape Shaped piezoelectric element including a transverse wave preventing portion formed at an obtuse angle or an acute angle with respect to the center of the fan shape, the plurality of piezoelectric elements being arranged in contact with each other along the circumferential direction with respect to the center of the fan shape, And a first transducer coupled to a bottom surface of the circularly arrayed fan-shaped piezoelectric element and having an upper circular surface is coupled.

delete

The transverse wave prevention part is characterized in that the transverse wave prevention part is formed in such a shape that two sides are recessed from the center of the sector shape to the inside of a sector.

delete

The ultrasonic cleaning apparatus including the ultrasonic vibrator having the piezoelectric element capable of preventing the transverse wave according to the present invention is characterized in that the ultrasonic cleaning apparatus includes a housing having a lower surface opposed to the object to be cleaned and accommodating the ultrasonic oscillator therein .

delete

The ultrasonic transducer may further include a second transducer coupled to a lower surface of the first transducer.

Further, the ultrasonic cleaning apparatus including the ultrasonic vibrator having the piezoelectric element capable of preventing the transverse wave from being generated, is formed in a shape in which the upper surface of the second transporter is recessed, the lower surface is formed in a protruding shape, And is coupled to the upper surface of the second carrier.

Accordingly, the ultrasonic transducer having the piezoelectric element capable of preventing the transverse wave according to the present invention has a fan shape, and the piezoelectric element includes the transverse wave prevention part formed by recessing the center of the sector shape, And the transverse wave prevention part are formed in a shape that is not symmetrical with respect to each other, and ultrasonic waves generated in a sectoral arc part of the piezoelectric element are transmitted to the transverse wave prevention part, So that it is possible to prevent the transverse wave of the piezoelectric element from being generated.

Fig. 1 is a schematic view for explaining a transverse wave and a longitudinal wave generated through an ultrasonic vibrator (in this case, A is a schematic view showing a sound pressure distribution along a longitudinal wave of the piezoelectric element, and B is a schematic view showing a sound pressure distribution along a transverse wave of the piezoelectric element )
2 is a schematic diagram for explaining the output state of ultrasonic waves output from a conventional ultrasonic vibrator (a state in which a transverse wave and a longitudinal wave meet and a peak sound pressure is generated)
3 is a plan view showing an ultrasonic vibrator having a piezoelectric element capable of preventing transverse waves according to the present invention
4 is a plan view showing an ultrasonic transducer according to a first embodiment of the present invention having a piezoelectric element capable of preventing transverse waves
5 is a plan view showing an ultrasonic vibrator according to a second embodiment of the present invention having a piezoelectric element capable of preventing the generation of a transverse wave
6 is a plan view showing an ultrasonic vibrator according to a third embodiment of the present invention having a piezoelectric element capable of preventing the occurrence of transverse waves
Fig. 7 is a plan view showing an ultrasonic vibrator according to a fourth embodiment of the present invention having a piezoelectric element capable of preventing the occurrence of transverse waves
8 is a cross-sectional view showing an ultrasonic cleaning apparatus including an ultrasonic vibrator having a piezoelectric element capable of preventing the transverse wave from occurring according to the present invention
9 is a cross-sectional view showing Embodiment 1 of an ultrasonic cleaning apparatus including an ultrasonic vibrator having a piezoelectric element capable of preventing a transverse wave from occurring according to the present invention

Hereinafter, the technical idea of the present invention will be described more specifically with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are included to provide a further understanding of the technical concept of the present invention, are incorporated in and constitute a part of the specification, and are not intended to limit the scope of the present invention.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrasonic vibrator having a piezoelectric element capable of preventing a transverse wave from being generated due to a transverse wave generated by a piezoelectric element, and an ultrasonic cleaning apparatus including the ultrasonic vibrator.

3 is a plan view showing an ultrasonic vibrator having a piezoelectric element capable of preventing transverse waves according to the present invention.

As shown in FIG. 3, the ultrasonic transducer having a piezoelectric element capable of preventing transverse waves according to the present invention includes a piezoelectric element 110 formed in a shape for preventing transverse waves from being generated.

The piezoelectric element 110 is formed in a fan shape having a predetermined central angle? C , and the center of the fan shape is recessed to form the transverse wave prevention part 111. [

The transverse wave prevention part 111 is formed by recessing the center of the sector shape, and the recessed cross section may be formed flat.

That is, the portion of the sector-shaped arc 112 and the transverse wave-preventing portion 111 are not symmetrical to each other.

When ultrasonic waves generated at one end in the horizontal direction of the piezoelectric element 110 are transmitted to the other end and then fed back to the other end in the horizontal direction, transverse waves are generated.

The ultrasonic transducer having a piezoelectric element capable of preventing the generation of a transverse wave according to the present invention includes a piezoelectric element 110 having a fan shape and a center of the fan shape being recessed to form a transverse wave prevention part 111 Shaped portion 112 of the piezoelectric element 110 and the transverse wave prevention portion 111 are formed in a non-symmetrical manner with respect to each other so that ultrasonic waves generated in the sectorial arc 112 of the piezoelectric element 110 After passing through the transverse wave prevention part 111, reflected toward another part of the sectorial arc 112 of the piezoelectric element 110 without being reflected, thereby generating a transverse wave of the piezoelectric element 110 There is an effect that it can be prevented.

The prevention of transverse waves of the piezoelectric element 110 at this time means that it is possible to prevent a peak sound pressure from being generated by the transverse waves of the piezoelectric element 110 in the ultrasonic vibrator 100 .

That is, the ultrasonic transducer having the piezoelectric element capable of preventing the transverse wave according to the present invention originally blocks the generation of the transverse wave in the piezoelectric transducing element 110 to prevent the generation of the peak sound pressure in the ultrasonic transducer 100 can do.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, various embodiments of an ultrasonic vibrator having a piezoelectric element capable of preventing transverse waves according to the present invention will be described.

≪ Ultrasonic vibrator - Example 1 &

4 is a plan view showing an ultrasonic vibrator according to a first embodiment of the present invention having a piezoelectric element capable of preventing a transverse wave from being generated.

4, in the ultrasonic transducer according to the first embodiment of the present invention having the piezoelectric element capable of preventing the generation of the transverse wave, the transverse wave prevention part 111 of the piezoelectric element 110 is formed at the center of the sector shape A line extending to the center point of the arc of the arc shape 112 is a seam line L110 and a side angle? S between the end face facing the arc 112 and the seam line L110 is formed at right angles .

At this time, two portions divided by the center point of the arc 112 are referred to as a first arc 112-1 and a second arc 112-2, respectively, in the sectorial arc 112 of the piezoelectric element 110. [ When you say,

The ultrasonic waves generated in the first call 112-1 are transmitted to the transverse wave prevention unit 111 and then transmitted to the first call 112-1 from the transverse wave prevention unit 111 without being reflected toward the first call 112-1, Is reflected toward the arc 112-2,

The ultrasonic waves generated in the second call 112-2 are transmitted to the transverse wave prevention part 111 and then transmitted to the second call 112-2 without being reflected from the transverse wave prevention part 111 toward the second call 112-2, Since the reflection is directed toward the arc 112-1, no refined wave is formed and a peak sound pressure is not generated in the center.

That is, the first embodiment of the ultrasonic transducer having the piezoelectric element capable of preventing the transverse wave according to the present invention has the effect of accurately grasping the movement path of the ultrasonic wave generated in the area of the arc 112 of the piezoelectric element 110.

≪ Ultrasonic vibrator - Example 2 >

5 is a plan view showing a second embodiment of an ultrasonic transducer having a piezoelectric element capable of preventing transverse waves according to the present invention.

5 is a plan view showing a second embodiment of an ultrasonic vibrator having a piezoelectric element capable of preventing transverse waves according to the present invention, as shown in FIG.

5, in the ultrasonic transducer according to the second embodiment of the present invention having the piezoelectric element capable of preventing the occurrence of the transverse wave, the transverse wave prevention part 111 of the piezoelectric element 110 is formed at the center of the sector shape When a line extending to the center point of the arc 112 of the sector shape is a seam line L110, a side angle? S between the end face facing the arc 112 and the seam line L110 is an obtuse angle or an acute angle .

At this time, two portions divided by the center point of the arc 112 are referred to as a first arc 112-1 and a second arc 112-2, respectively, in the sectorial arc 112 of the piezoelectric element 110. [ When you say,

The ultrasonic waves generated in the first call 112-1 are transmitted to the transverse wave prevention unit 111 and then transmitted to the first call 112-1 from the transverse wave prevention unit 111 without being reflected toward the first call 112-1, Is reflected toward the arc 112-2,

The ultrasonic waves generated in the second call 112-2 are transmitted to the transverse wave prevention part 111 and then transmitted to the second call 112-2 without being reflected from the transverse wave prevention part 111 toward the second call 112-2, And is reflected toward the arc 112-1.

However, in the ultrasonic transducer according to the second embodiment of the present invention having the piezoelectric element capable of preventing the transverse wave from being generated, the ultrasonic waves generated in the first call (112-1) and the second call (112-2) The ultrasonic transducer 111 of the ultrasonic transducer having the piezoelectric element capable of preventing the transverse wave is reflected with a wider or narrower reflection angle than the ultrasonic transducer 111 of the first embodiment.

≪ Ultrasonic vibrator - Example 3 >

6 is a plan view showing a third embodiment of an ultrasonic vibrator having a piezoelectric element capable of preventing the generation of a transverse wave according to the present invention.

6, in the ultrasonic transducer according to the third embodiment of the present invention having the piezoelectric element capable of preventing the transverse wave from occurring, the transverse wave prevention part 111 of the piezoelectric element 110 is connected to the piezoelectric element 110, The center of the fan shape is formed in a triangular or quadrangular shape.

At this time, the ultrasonic waves generated from the arc-shaped arcs 112 of the piezoelectric element 110 are transmitted to the transverse wave prevention part 111 and then reflected from the transverse wave prevention part 111 toward the arc 112 And is reflected toward the radii 113 of the sector shape.

≪ Ultrasonic vibrator - Example 4 >

7 is a plan view showing a fourth embodiment of an ultrasonic vibrator having a piezoelectric element capable of preventing the generation of a transverse wave according to the present invention.

As shown in FIG. 7, in the ultrasonic transducer according to the fourth embodiment of the present invention having the piezoelectric element capable of preventing the transverse wave from occurring, a plurality of the piezoelectric elements 110 are arranged along the central circumferential direction of the sector.

Accordingly, in the ultrasonic transducer according to the fourth embodiment of the present invention having the piezoelectric element capable of preventing the generation of the transverse wave according to the present invention, the transverse waves are generated in the piezoelectric elements 110, Respectively.

8 is a cross-sectional view showing an ultrasonic cleaning apparatus including an ultrasonic vibrator having a piezoelectric element capable of preventing a transverse wave from occurring according to the present invention.

8, an ultrasonic cleaning apparatus 1000 including an ultrasonic vibrator having a piezoelectric element capable of preventing transverse waves according to the present invention may include an ultrasonic vibrator 100 and a housing 200 .

The ultrasonic transducer 100 may include the piezoelectric transducer 110, the first transducer 120, and the second transducer 130 in order to transmit ultrasound to a semiconductor substrate, which is an object to be cleaned.

The piezoelectric element 110 is composed of the piezoelectric element 110 having a shape for preventing the transverse wave according to the present invention.

The first transducer 120 may be made of aluminum or copper, which is made of a material having a high heat transfer efficiency, through which the ultrasonic waves generated in the piezoelectric transducer 110 are transferred and the piezoelectric transducer 110 is installed on the upper surface.

The second transporter 130 is coupled to a lower surface of the first transporter 120 to transmit the ultrasonic waves transferred from the first transporter 120 to a semiconductor substrate to be cleaned.

The housing 200 is provided so that the lower surface thereof is opposed to the object to be cleaned and the piezoelectric element 110 and the first delivering body 120 are housed therein and the cooling fluid inlet 210 and the cooling fluid outlet 220, .

The cooling fluid inlet 210 may be formed on the upper surface of the housing 200 and communicate with a cooling fluid storage tank (not shown), one end of which communicates with the interior of the housing 200 and the other end with a cooling fluid And serves to introduce the cooling fluid into the housing 200.

In addition, although the cooling fluid inlet 210 is shown in the form of a pipe in the drawing, the present invention is not limited thereto, and a plurality of the cooling fluid inlets 210 may be formed.

In addition, the cooling fluid inlet 210 may have a plurality of through holes (not shown) on its surface to spray the cooling fluid.

The cooling fluid outlet 220 may be formed on the upper surface of the housing 200 so that one end thereof communicates with the inside of the housing 200 and the other end communicates with the outside of the housing 200, And discharging the cooling fluid introduced into the interior of the casing.

The cooling fluid flowing into the housing 200 through the cooling fluid inlet 210 cools the heat generated by the ultrasonic vibrator 100.

Hereinafter, embodiments of an ultrasonic cleaning apparatus 1000 including an ultrasonic vibrator having a piezoelectric element capable of preventing transverse waves according to the present invention will be described.

≪ Ultrasonic Cleaning Device - Example 1 >

9 is a cross-sectional view showing Embodiment 1 of an ultrasonic cleaning apparatus including an ultrasonic vibrator having a piezoelectric element capable of preventing transverse waves according to the present invention.

As shown in FIG. 9, the ultrasonic cleaning apparatus 1000 according to the first embodiment of the present invention includes the ultrasonic vibrator having the piezoelectric element capable of preventing the transverse wave from being generated, The housing 200 is formed in a cap shape and is coupled to the upper surface of the second carrier 130.

Accordingly, in the ultrasonic cleaning apparatus 1000 including the ultrasonic vibrator having the piezoelectric element capable of preventing the transverse wave from occurring according to the present invention, the ultrasonic cleaning apparatus 1000 according to the first embodiment of the present invention includes the housing 200 and the second carrier 130, The cleaning liquid applied to the semiconductor substrate can be prevented from entering between the housing 200 and the second carrier 130 by being disposed farther away from the semiconductor substrate as the object to be cleaned.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

1000: an ultrasonic cleaning device including an ultrasonic vibrator having a piezoelectric element capable of preventing the transverse wave from occurring according to the present invention
100: ultrasonic vibrator
110: piezoelectric element L110: seam
111: transverse wave prevention part 112: arc
112-1: No. 1 112-2: No. 2
113: Radius θ s : Angle between sides
θ c : central angle
120: first carrier 130: carrier
200: Housing
210: cooling fluid inlet 220: cooling fluid outlet

Claims (8)

And a transverse wave preventing portion which is recessed so as to have a flat cross-section at the center of the sector shape and in which the angle formed by the flat cross section and the seam line extending from the center of the sector shape to the center point of the arc of the sector shape is formed at an obtuse angle or acute angle And a piezoelectric element,
The fan-shaped piezoelectric elements are arranged in contact with each other along the circumferential direction with respect to the center of the fan shape, and are formed so as to have a circular perimeter,
Wherein the first transducer is coupled to a lower surface of the circularly arrayed fan-shaped piezoelectric element, and the upper surface of the first transducer is formed into a flat circular surface.
delete delete The method according to claim 1,
Wherein the transverse wave prevention part is formed in a shape in which two sides are recessed from the center of the sector shape to the inside of a sector.
delete And a housing which is provided so as to face the object to be cleaned and in which the ultrasonic vibrator of the first or fourth aspect is housed.
The ultrasonic diagnostic apparatus according to claim 6, wherein the ultrasonic transducer
And a second transducer coupled to a lower surface of the first transducer.
delete
KR1020150069457A 2015-05-19 2015-05-19 An ultrasonic transmitter having piezoelectric element capable of transverse prevention and ultrasonic cleaning device including the same KR101688455B1 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190027547A (en) 2017-09-07 2019-03-15 한국기계연구원 Ultrasonic dry cleaning module and cleaning method using gas for large substrate
KR20190027517A (en) 2017-09-07 2019-03-15 한국기계연구원 Ultrasonic cleaning module and cleaning system using uniform liquid droplet for plate
KR20190027534A (en) 2017-09-07 2019-03-15 한국기계연구원 Ultrasonic cleaning module and cleaning system using air fir substrate
KR20190027531A (en) 2017-09-07 2019-03-15 한국기계연구원 Droplet ultrasonic cleaning apparatus of large surface and that method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101031374B1 (en) * 2010-03-12 2011-05-06 (주) 경일메가소닉 Ultrasonic cleaning apparatus preventing spike pulse

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0244890U (en) * 1988-09-20 1990-03-28
KR20110136345A (en) 2010-06-15 2011-12-21 한국기계연구원 Vibrator device for ultrasonics wave and ultrasonics wave apparatus having the same
KR101511018B1 (en) * 2013-08-01 2015-04-10 한국기계연구원 An ultrasonic cleaning apparatus and ultrasonic cleaning system using the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101031374B1 (en) * 2010-03-12 2011-05-06 (주) 경일메가소닉 Ultrasonic cleaning apparatus preventing spike pulse

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190027547A (en) 2017-09-07 2019-03-15 한국기계연구원 Ultrasonic dry cleaning module and cleaning method using gas for large substrate
KR20190027517A (en) 2017-09-07 2019-03-15 한국기계연구원 Ultrasonic cleaning module and cleaning system using uniform liquid droplet for plate
KR20190027534A (en) 2017-09-07 2019-03-15 한국기계연구원 Ultrasonic cleaning module and cleaning system using air fir substrate
KR20190027531A (en) 2017-09-07 2019-03-15 한국기계연구원 Droplet ultrasonic cleaning apparatus of large surface and that method

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