JPH11219930A - 洗浄装置 - Google Patents

洗浄装置

Info

Publication number
JPH11219930A
JPH11219930A JP10034347A JP3434798A JPH11219930A JP H11219930 A JPH11219930 A JP H11219930A JP 10034347 A JP10034347 A JP 10034347A JP 3434798 A JP3434798 A JP 3434798A JP H11219930 A JPH11219930 A JP H11219930A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
cleaning
polishing
wafer
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10034347A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11219930A5 (OSRAM
Inventor
Koji Ato
浩司 阿藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP10034347A priority Critical patent/JPH11219930A/ja
Priority to US09/238,612 priority patent/US6439962B1/en
Publication of JPH11219930A publication Critical patent/JPH11219930A/ja
Publication of JPH11219930A5 publication Critical patent/JPH11219930A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/36—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis orthogonal to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/0288—Ultra or megasonic jets

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP10034347A 1998-01-30 1998-01-30 洗浄装置 Pending JPH11219930A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP10034347A JPH11219930A (ja) 1998-01-30 1998-01-30 洗浄装置
US09/238,612 US6439962B1 (en) 1998-01-30 1999-01-28 Cleaning apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10034347A JPH11219930A (ja) 1998-01-30 1998-01-30 洗浄装置

Publications (2)

Publication Number Publication Date
JPH11219930A true JPH11219930A (ja) 1999-08-10
JPH11219930A5 JPH11219930A5 (OSRAM) 2005-07-21

Family

ID=12411618

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10034347A Pending JPH11219930A (ja) 1998-01-30 1998-01-30 洗浄装置

Country Status (2)

Country Link
US (1) US6439962B1 (OSRAM)
JP (1) JPH11219930A (OSRAM)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002353183A (ja) * 2001-05-28 2002-12-06 Nisso Engineering Co Ltd ウエハ洗浄装置
JP2003077881A (ja) * 2001-09-05 2003-03-14 Shibaura Mechatronics Corp 基板の処理装置及び処理方法
JP2003100698A (ja) * 2001-09-25 2003-04-04 Okamoto Machine Tool Works Ltd ウエハのスピン洗浄・乾燥方法および洗浄・乾燥装置
KR100733264B1 (ko) 2006-08-07 2007-06-28 동부일렉트로닉스 주식회사 반도체 소자의 제조 방법
KR100786627B1 (ko) 2006-07-24 2007-12-21 두산메카텍 주식회사 웨이퍼의 회전 감지장치
JP2008270753A (ja) * 2007-03-09 2008-11-06 Applied Materials Inc クリーニング時における基板の回転のモニタ方法及び装置
JP2016152382A (ja) * 2015-02-19 2016-08-22 株式会社荏原製作所 基板洗浄装置および方法
CN111389772A (zh) * 2020-03-24 2020-07-10 长江存储科技有限责任公司 清洗装置及清洗方法

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0987084A4 (en) * 1998-03-09 2006-11-15 Ebara Corp SANDERS
JP2002219645A (ja) * 2000-11-21 2002-08-06 Nikon Corp 研磨装置、この研磨装置を用いた半導体デバイス製造方法並びにこの製造方法によって製造された半導体デバイス
JP2003133274A (ja) * 2001-10-22 2003-05-09 Ebara Corp 研磨装置
US20060025046A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Abrasive article splicing system and methods
US20060025048A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Abrasive article detection system and method
US7090560B2 (en) * 2004-07-28 2006-08-15 3M Innovative Properties Company System and method for detecting abrasive article orientation
US20060025047A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Grading system and method for abrasive article
US20060247803A1 (en) * 2005-03-29 2006-11-02 Kazushi Mori Control system, control method, process system, and computer readable storage medium and computer program
DE102005027721A1 (de) * 2005-06-16 2007-01-04 Dürr Ecoclean GmbH Reinigungsvorrichtung und Verfahren zum Reinigen von Werkstücken
JP4522329B2 (ja) * 2005-06-24 2010-08-11 株式会社Sokudo 基板処理装置
JP5132108B2 (ja) * 2006-02-02 2013-01-30 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4730127B2 (ja) * 2006-02-22 2011-07-20 日産自動車株式会社 車両用ブレーキ装置
KR101004432B1 (ko) * 2008-06-10 2010-12-28 세메스 주식회사 매엽식 기판 처리 장치
KR101170760B1 (ko) * 2009-07-24 2012-08-03 세메스 주식회사 기판 연마 장치
US20110296634A1 (en) * 2010-06-02 2011-12-08 Jingdong Jia Wafer side edge cleaning apparatus
US9781994B2 (en) * 2012-12-07 2017-10-10 Taiwan Semiconductor Manufacturing Company Limited Wafer cleaning
KR20150075357A (ko) * 2013-12-25 2015-07-03 가부시키가이샤 에바라 세이사꾸쇼 기판 세정 장치 및 기판 처리 장치
US9700988B2 (en) 2014-08-26 2017-07-11 Ebara Corporation Substrate processing apparatus
CN105789075B (zh) * 2014-12-16 2019-02-19 北京北方华创微电子装备有限公司 基座旋转是否正常的监测方法及装卸载基片的方法
US10096460B2 (en) * 2016-08-02 2018-10-09 Semiconductor Components Industries, Llc Semiconductor wafer and method of wafer thinning using grinding phase and separation phase
US11600484B2 (en) * 2019-08-22 2023-03-07 Taiwan Semiconductor Manufacturing Company Ltd. Cleaning method, semiconductor manufacturing method and a system thereof
CN112388449A (zh) * 2020-11-16 2021-02-23 株洲华信精密工业股份有限公司 一种用于机械配件加工的打磨装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4197679A (en) * 1977-04-15 1980-04-15 Ito & Okamoto, Esq. Method for controlling the rotational speed of a rotary body
JPS6080241A (ja) 1983-10-07 1985-05-08 Hitachi Ltd 位置合せ装置
KR920001715Y1 (ko) * 1989-07-12 1992-03-13 박경 판유리 변형 면취기의 회전테이블의 회전속도 자동조절장치
US5518542A (en) * 1993-11-05 1996-05-21 Tokyo Electron Limited Double-sided substrate cleaning apparatus
US5468302A (en) * 1994-07-13 1995-11-21 Thietje; Jerry Semiconductor wafer cleaning system
US5655954A (en) * 1994-11-29 1997-08-12 Toshiba Kikai Kabushiki Kaisha Polishing apparatus
JPH08267347A (ja) * 1995-03-31 1996-10-15 Shin Etsu Handotai Co Ltd オリエンテーション・フラットを有するウエーハ面取り部の鏡面研磨方法とその装置
US5725414A (en) * 1996-12-30 1998-03-10 Intel Corporation Apparatus for cleaning the side-edge and top-edge of a semiconductor wafer

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002353183A (ja) * 2001-05-28 2002-12-06 Nisso Engineering Co Ltd ウエハ洗浄装置
JP2003077881A (ja) * 2001-09-05 2003-03-14 Shibaura Mechatronics Corp 基板の処理装置及び処理方法
JP2003100698A (ja) * 2001-09-25 2003-04-04 Okamoto Machine Tool Works Ltd ウエハのスピン洗浄・乾燥方法および洗浄・乾燥装置
KR100786627B1 (ko) 2006-07-24 2007-12-21 두산메카텍 주식회사 웨이퍼의 회전 감지장치
KR100733264B1 (ko) 2006-08-07 2007-06-28 동부일렉트로닉스 주식회사 반도체 소자의 제조 방법
JP2008270753A (ja) * 2007-03-09 2008-11-06 Applied Materials Inc クリーニング時における基板の回転のモニタ方法及び装置
JP2016152382A (ja) * 2015-02-19 2016-08-22 株式会社荏原製作所 基板洗浄装置および方法
CN111389772A (zh) * 2020-03-24 2020-07-10 长江存储科技有限责任公司 清洗装置及清洗方法

Also Published As

Publication number Publication date
US6439962B1 (en) 2002-08-27

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