JPH11214741A - Optical space transmission sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently mount an optical space transmission sensor on a printed board by an automatic mounting machine along with other electronic components. SOLUTION: An light-emitting diode(LED) chip and a photodiode are sealed in a package 17 molded with a light-transmitting resin for cutting visible light into a rectangular parallelepiped shape, in a state such that the light-emitting direction of the chip and the light-receiving direction of the photodiode are respectively turned to the same direction, and a light-emitting side lens 18 and a light-receiving side lens 19 re provided on the surface of the package 17 in such a way that the lenses 18 and 19 respectively faces opposite to the chip and the photodiode. An attracting terminal 16, which is attracted by a nozzle and is formed into a flat plate shape, is provided on the side surface on one side of the side surfaces of the package 17 in a state such that the terminal 16 extends along the light-emitting and light-receiving directions of the chip and the photodiode. In the case where an optical space transmission sensor is mounted on a printed board by a side-view system, the terminal 16 is attracted by the nozzle of an automatic mounting machine.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a spatial light transmission sensor used for wireless data communication using infrared rays.

[0002]

2. Description of the Related Art In order to spread wireless data communication between personal computers and between a personal computer and peripheral devices, standardization of data communication using infrared rays has been carried out by IrDA (Infr.), A private standardization organization.
ared Data Assoiation). The standard IrDA1.0 specifies that the transmission speed of bidirectional infrared data communication up to a distance of 1 m is 2.4 kbps to 115.2 kbps. Transmission speed of infrared data communication is 9.6kbps to 115.2kbps, 1.152Mbps, 42Mbp
s. Due to such a standard, wireless data transmission from portable devices such as a notebook computer and a mobile phone is becoming widespread.

In bidirectional data communication using infrared rays of the IrDA standard, an optical space transmission sensor in which a light emitting element and a light receiving element are mounted on the same lead frame is usually used. FIG. 4 shows an example of the optical space transmission sensor. FIG.
4A is a front view showing an example of a conventional optical space transmission sensor, and FIG. 4B is a side view thereof. In this optical space transmission sensor 40, a light emitting element and a light receiving element are mounted on different lead terminals of the same lead frame with their light emitting directions and light receiving directions facing in the same direction. The package is molded in a rectangular parallelepiped package 46 by transfer molding a transparent resin that cuts visible light. A light-emitting lens 48 and a light-receiving lens 49 are provided on the surface of the package 46 so as to face the light-emitting surface of the light-emitting element and the light-receiving surface of the light-receiving element. A plurality of lead terminals 44 extend from one side surface of the package 46 along the longitudinal direction. Each lead terminal 44
Are bent at right angles so that the adjacent lead terminals 44 are opposite to each other.

[0004] Since such an optical space transmission sensor 40 is mounted on a small portable device such as a cellular phone, it is usually mounted on a printed circuit board with a large mounting density. The light emitting direction and the light receiving direction of the sensor 40 are respectively mounted on the printed circuit board 30 by a side view method in which the sensor 40 is mounted along the surface of the flat printed circuit board 30 (see FIG. 4B). I have. Some optical space transmission sensors are configured so that they can be surface-mounted by a top-view method such that the direction of light emission and the direction of light reception are each perpendicular to the surface of the printed circuit board.

[0005]

SUMMARY OF THE INVENTION Optical space transmission sensor 40
Package 46 is usually formed by transfer molding using a mold having an upper mold and a lower mold. The upper mold and the lower mold have a rectangular package 4
In order to mold 6, cuboid cavities are respectively formed, and the openings of the cavities are mutually butted and clamped. The inner side surfaces of the cavities in the upper mold and the lower mold are tapered surfaces that are sequentially inclined inward from the opening to the inner side in consideration of the mold releasability of the resin to be molded. . For this reason, each side surface of the package 46 to be molded is directed outward at an angle of about 3 to 6 ° with respect to the surface on which the light-emitting side lens 48 and the light-receiving side lens 49 are provided and the back side opposite thereto. The package 4 is formed by a pair of tapered surfaces inclined toward each other.
Each side surface of No. 6 is in a state where a middle portion in a thickness direction protrudes outward.

When such an optical space transmission sensor 40 is surface-mounted on the printed circuit board 30 by the side view method, the package 46 is placed so that the thickness direction of the package 46 is along the surface of the printed circuit board 30. It is necessary to arrange the printed circuit board 30 vertically. When an electronic component such as a semiconductor element is mounted on the printed circuit board 30, an automatic mounting machine that vacuum-adsorbs the electronic component by the nozzle 50 (see FIG. 4B) and mounts the electronic component on the surface of the printed circuit board 30 is usually used. Is done. The optical space transmission sensor 40 shown in FIG. 4 needs to be mounted on the printed circuit board 30 by the side view method,
It is necessary to vacuum-suction the side surface of the nozzle 6 by the nozzle 50. However, each side surface of the package 46 in the optical space transmission sensor 40 has a problem that it cannot be vacuum-sucked by the nozzle 50 because the middle part in the thickness direction protrudes outward.

As described above, the optical space transmission sensor 40 cannot be mounted on the printed circuit board 30 by the automatic mounting machine that sucks the electronic component by the nozzle 50. It cannot be mounted on the printed circuit board 30 together with the electronic components. For this purpose, for example, the optical space transmission sensor 40 must be chucked by a chucking device and mounted on the printed circuit board 30. However, in this case, it is necessary to provide a chucking device separately from the automatic mounting machine, and the economy is impaired. In addition, if the optical space transmission sensor 40 is manually mounted on the printed circuit board 30 without providing such a chucking device, the manufacturing efficiency of the printed circuit board will be further reduced.

When the spatial light transmission sensor 40 is mounted on the printed circuit board 30 by the top view method, the back surface of the package 46 where the light emitting lens 48 and the light receiving lens 49 are not provided is placed on the surface of the printed circuit board 30. It is necessary to arrange them facing each other. In order to arrange the back of the package 46 so as to face the surface of the printed circuit board 30 by the automatic mounting machine, the nozzle 5 of the automatic mounting machine is required.
0 indicates that it is necessary to adsorb the surface of the package 46 provided with the light-emitting lens 48 and the light-receiving lens 49 of the optical space transmission sensor 40. However, since the light-emitting side lens 48 and the light-receiving side lens 49 are provided close to each other on the surface of the package 46, an area where the nozzle 50 can be vacuum-sucked cannot be secured.

To this end, as shown in FIG. 4 (b), the tip surface of a nozzle 51 of the automatic mounting machine is depressed in an arc shape, and the surface of the light emitting side lens 48 or the light receiving side lens 49 is changed to the nozzle 51. And is mounted on the printed circuit board 30. However, also in this case, since the optical space transmission sensor 40 is mounted on the printed circuit board 30 and the nozzle 51 having a different configuration from the nozzle 50 used for mounting other electronic components is used, the optical space transmission sensor 40 is used. The sensor 40 cannot be mounted on a printed circuit board at the same time as other electronic components, and there is a problem that the working efficiency is reduced. In addition, the nozzle 51 whose tip surface is depressed in an arc shape attracts the spherical surface of the light-emitting lens 48 or the light-receiving lens 49.
There is a possibility that the optical space transmission sensor 40 cannot be vacuum-sucked in a predetermined posture and cannot be mounted on the printed board in a predetermined posture.

An object of the present invention is to solve such a problem, and an object of the present invention is to securely mount a printed board on a side view system and a top view system by a nozzle of an automatic mounting machine. It is an object of the present invention to provide an optical space transmission sensor capable of performing the following.

[0011]

According to a first aspect of the present invention, there is provided an optical space transmission sensor according to the present invention, wherein the light emitting element and the light receiving element have a light emitting direction and a light receiving direction oriented in the same direction, respectively. An optical space transmission sensor in which a light-emitting side lens and a light-receiving side lens are provided on a surface of the package, the light-emitting side lens and the light receiving side lens being opposed to the light emitting element and the light receiving element, respectively. Further, a flat plate-shaped suction terminal to be sucked by a nozzle is provided on a side surface of the package so as to extend along a light emitting direction and a light receiving direction of the light emitting element and the light receiving element.

According to a second aspect of the present invention, the suction terminal is integrated with a lead terminal on which a light emitting element is mounted.

According to a third aspect of the present invention, there is provided an optical space transmission sensor, wherein the light emitting element and the light receiving element are formed into a rectangular parallelepiped shape by a light-transmitting resin in a state where the light emitting direction and the light receiving direction are respectively directed in the same direction. An optical space transmission sensor in which a light-emitting lens and a light-receiving lens are provided on the surface of the package so as to face the light-emitting element and the light-receiving element, respectively. A part of each of the light-emitting side lens and the light-receiving side lens is notched so that a flat region that can be sucked by the nozzle is formed on the surface of the package between the side lens and the side lens.

[0014]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1A is a front view showing an embodiment of the optical space transmission sensor according to the present invention, and FIG. 1B is a side view thereof. The spatial light transmission sensor 10 is surface-mounted by a side-view method with the light emitting direction and the light receiving direction respectively along the surface of the printed circuit board 30 (see FIG. 1B). An LED chip having an LED (light emitting diode) as a light emitting element;
An integrated circuit for amplifying the waveform of the photodiode as a light receiving element and the output of the photodiode,
It is sealed in a package 17 which is transfer molded in a rectangular parallelepiped shape by a translucent resin that cuts visible light. On the flattened surface of the package 17, facing the light emitting surface of the LED in the LED chip,
A light emitting side lens 18 protruding in a hemispherical shape is provided,
On the surface of the package 17 on which the light emitting side lens 18 is provided, a light receiving side lens 19 protruding in a hemispherical shape is provided alongside the light emitting side lens 18.

The package 17 is formed by transfer molding using a mold having an upper mold and a lower mold. A rectangular cavity is formed in each of the upper mold and the lower mold for transfer molding the package 17 in order to form the rectangular package 17, and the openings of the respective cavities are mutually connected. It is butted and clamped. The inner side surfaces of the cavities in the upper die and the lower die are tapered surfaces that are sequentially inclined inward from the opening to the inner side in consideration of the mold releasability of the molded resin. Therefore, each side surface of the molded package 17 is formed in the thickness direction by the respective tapered surfaces which are sequentially inclined outward from the front surface and the rear surface on which the light emitting side lens 18 and the light receiving side lens 19 are provided. It is in a state of protruding outward over the entire circumference.

On one side surface of the package 17 along the longitudinal direction, a pair of lead portions 15b provided continuously with the leads on which the LED chips are mounted extend outward, respectively. At the portion 15b, a rectangular flat plate-shaped suction terminal 16 is provided in a state perpendicular to each lead portion 15b. The attraction terminal 16 is connected to each of the lead portions 1 so as to be in a light emitting direction by the light emitting side lens 18 and a light receiving direction by the light receiving side lens 19.
5b, the light emitting side lens 1 in the package 17
8 and the light-receiving side lens 19 are bent at right angles in a direction away from the surface on which they are provided.

On the other side surface of the package 17 along the longitudinal direction, eight lead terminals 14a to 14h are provided.
Each is extending. Each lead terminal 14a to 14h
Are bent at right angles, but adjacent lead terminals are bent in opposite directions.

FIG. 2 is a layout diagram of a lead frame used for manufacturing the optical space transmission sensor 10. As shown in FIG. The lead frame 20 is provided with eight lead terminals 14 a to 14 h in a direction orthogonal to the tie bar 21 and continuously with the tie bar 21, and the lead 14 a located on one side is provided with an LED chip 11. Are die-bonded with an Ag (silver) paste. LED chip 11
, An LED and an LED driving driver are provided integrally.

The lead terminal 14a to which the LED chip 11 is die-bonded has a lead portion 15a extending linearly in parallel with the tie bar 21 on the side opposite to the tie bar 21, and the tie bar 21 in a state orthogonal to the lead portion 15a. Is provided with a pair of lead portions 15b extending to the opposite side. Each of the lead portions 15b is integrally provided with a suction terminal 16 having a rectangular flat plate shape.

At the tip of a lead terminal 14b located on the side opposite to the lead terminal 14a to which the LED chip 11 is die-bonded, a photodiode 12 is mounted.
It is die bonded with g paste. Lead 14 to which photodiode 12 is die-bonded
b denotes an integrated circuit 13 for amplifying the output of the photodiode 12 and shaping the waveform at the tip of a lead terminal 14e disposed with one lead terminal 14d interposed therebetween.
Die-bonded with paste. The photodiode 12 and the integrated circuit 13 are wire-bonded to each other. The lead terminal 14d to which the integrated circuit 13 is die-bonded and the integrated circuit 13
Wire bonded.

The lead terminal 14b between the lead terminal 14b to which the photodiode 12 is die-bonded and the lead terminal 14d to which the integrated circuit 13 is die-bonded.
“c” is wire-bonded to the integrated circuit 13. Furthermore, three lead terminals 14e, 14f, and 14g arranged adjacent to the lead terminal 14d to which the integrated circuit 13 is die-bonded are wire-bonded to the integrated circuit 13, respectively. The lead terminal 14h adjacent to the lead terminal 14a to which the LED chip 11 is die-bonded is wire-bonded to the LED chip 11 and also to the integrated circuit 13.

LED chip 11, photodiode 1
2. The integrated circuit 13 includes a part of each of the lead terminals 14a to 14h, a lead part 15a and each of the lead parts 1a to 14h.
5b together with a part indicated by a broken line in FIG. 2 is formed by a transparent resin package 17 for cutting visible light.
Transfer molded. Then, as described above, the transfer-molded translucent resin 17 is
The side surfaces orthogonal to the suction terminals 16 are tapered surfaces protruding so that the center in the width direction is located outside.

When the package 17 is transfer-molded with the translucent resin, the tie bar is cut, and each of the lead terminals 14a to 14h is bent into a predetermined shape, and each of the lead portions 15b is bent at a right angle. The suction terminal 16 is in a state along the same direction as the light emitting direction and the light receiving direction of the LED chip 11 and the photodiode 12.

Thereafter, a light emitting side lens 18 is provided at a portion of the package 17 opposite to the light emitting portion of the LED of the LED chip 11, and
The light receiving side lens 19 is provided in a portion facing the light receiving surface of the photodiode 12 in FIG. Thereby, the optical space transmission sensor 10 shown in FIG. 1 is obtained.

The optical space transmission sensor 10 having such a configuration
When the surface mounting is performed on the printed circuit board 30 by the side view method, an automatic mounting device that mounts the electronic component on a predetermined position of the printed circuit board 30 by suctioning the electronic component by a nozzle for vacuum suction is used. The automatic mounting device sucks the suction terminals 16 of the optical space transmission sensor 10 by the nozzles, transports the suction terminals 16 to a predetermined position on the printed circuit board 30, and extends the lead terminals 14a to 14a extending from the package 17.
14 h are located on predetermined wirings on the printed circuit board 30 and are electrically connected to the respective wirings.

As described above, the optical transmission space sensor 10 is provided with the suction terminal 16 having a flat plate shape, and the suction terminal 16 is sucked by the nozzle of the automatic mounting device.
Since it is designed to be mounted on the printed circuit board 30, it is mounted on the printed circuit board 30 by an automatic mounting machine together with other electronic components. Therefore, the optical transmission space sensor 1
Printed circuit board 3 efficiently by side view method
0 can be surface-mounted.

In the optical space transmission sensor 10 surface-mounted on the printed circuit board 30, since the suction terminal 16 is continuous with the die portion of the lead terminal 14a on which the LED chip 11 is mounted, the light is emitted from the LED chip 11. Heat is radiated by the suction terminals 16. As a result, LED
Heating of the chip 11 is suppressed.

FIG. 3A is a front view showing another example of the embodiment of the optical space transmission sensor 10 of the present invention, which is surface-mounted on the printed circuit board 30 by the top view method.
(B) is a side view thereof. This optical space transmission sensor 1
0 is the suction terminal 1 extending from the side opposite to the side from which the lead terminals 14a to 14h extend, as described above.
6 are not provided, and the mutually facing portions of the light emitting side lens 18 and the light receiving side lens 19 provided on the surface of the package 17 are cut out, and are attracted to the surface of the package 17 by the nozzle of the automatic mounting machine. A flat suction area 17a is provided. The light-emitting side lens 18 and the light-receiving side lens 19 are notched by cutting lines 18a and 19a, respectively, which are inclined in opposite directions, so that a trapezoidal suction area 17a is formed on the surface of the package 17. Have been.

When such an optical space transmission sensor 10 is mounted on a printed circuit board 30 by the top view method, the nozzle of the automatic mounting apparatus is mounted on the optical space transmission sensor 1.
In this case, the suction area 17a in the package 17 is sucked. Then, the optical space transmission sensor 10 sucked by the nozzle is transported to a predetermined position on the printed circuit board 30, and the back of the package 17 is brought into contact with the surface of the printed circuit board 30, and each lead extending from the package 17. The terminals 14a to 14h are electrically connected to predetermined wirings on the printed circuit board 30, respectively.

As described above, the optical transmission space sensor 10 shown in FIG.
It is efficiently mounted on the printed circuit board 30 by the top view method.

[0032]

According to the optical space transmission sensor of the present invention as described in the first aspect, since the flat suction terminal is sucked by the nozzle, like the other electronic components,
The automatic mounting machine can be mounted on a printed circuit board by a side view method, and mounting efficiency is significantly improved.

Further, in the optical space transmission sensor according to the present invention, a part of the light emitting side lens and the light receiving side lens is cut out, respectively, so that the light emitting side lens and the light receiving side lens are provided on the surface of the package. Since a region that can be vacuum-sucked is formed by the nozzle, the electronic component can be mounted on a printed circuit board by a top-view method together with other electronic components, and mounting work efficiency is significantly improved.

[Brief description of the drawings]

FIG. 1A is a front view showing an example of an embodiment of an optical space transmission sensor of the present invention which is surface-mounted on a printed circuit board by a side view method, and FIG. 1B is a side view thereof.

FIG. 2 is a layout diagram of a lead frame used for manufacturing the optical space transmission sensor.

FIG. 3A is a front view showing an example of an embodiment of the optical space transmission sensor of the present invention which is surface-mounted on a printed board by a top view method, and FIG. 3B is a side view thereof.

FIG. 4A is a front view showing an example of a conventional optical space transmission sensor surface-mounted on a printed circuit board by a side view method, and FIG. 4B is a side view thereof.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Optical space transmission sensor 11 LED chip 12 Photodiode 13 Integrated circuit 14a-14h Lead terminal 16 Suction terminal 17 Package 17a Suction area 18 Light emitting side lens 19 Light receiving side lens 30 Printed circuit board

Claims (3)

[Claims] 1. A light-emitting element and a light-receiving element are sealed in a rectangular parallelepiped package with a light-transmitting resin, with the light-emitting direction and the light-receiving direction oriented in the same direction. An optical space transmission sensor having a light-emitting lens and a light-receiving lens opposed to a light-emitting element and a light-receiving element, respectively, on a surface of the optical space transmission sensor. Is provided along the light emitting direction and the light receiving direction of the light emitting element and the light receiving element. 2. The optical space transmission sensor according to claim 1, wherein the suction terminal is integrated with a lead terminal on which a light emitting element is mounted. 3. A light-emitting element and a light-receiving element are sealed in a rectangular parallelepiped package with a light-transmitting resin in a state where the light-emitting direction and the light-receiving direction are respectively oriented in the same direction. An optical spatial transmission sensor having a light emitting element and a light receiving element opposed to a light emitting element and a light receiving element, respectively, on a surface thereof. An optical space transmission sensor, wherein a part of each of a light-emitting side lens and a light-receiving side lens is cut out so as to form a flat area that can be attracted.