JP3807812B2 - LED chip parts - Google Patents

LED chip parts Download PDF

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Publication number
JP3807812B2
JP3807812B2 JP10350897A JP10350897A JP3807812B2 JP 3807812 B2 JP3807812 B2 JP 3807812B2 JP 10350897 A JP10350897 A JP 10350897A JP 10350897 A JP10350897 A JP 10350897A JP 3807812 B2 JP3807812 B2 JP 3807812B2
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Japan
Prior art keywords
led chip
insulating substrate
chip component
led
led element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP10350897A
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Japanese (ja)
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JPH10294496A (en
Inventor
宏基 石長
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Rohm Co Ltd
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Rohm Co Ltd
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Publication of JPH10294496A publication Critical patent/JPH10294496A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)
  • Led Devices (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、ＬＥＤ（light emitting diode，発光ダイオード）チップ部品の改良に関するものである。
【０００２】
【従来の技術】
従来より使用されているＬＥＤチップ部品の一例を図１に示す。これは、小型サイズの面実装ＬＥＤチップ部品を斜め上方より見た斜視図であり、単色発光の場合を示している。同図において、１は耐熱性の材料でできた絶縁基板、２はＬＥＤ素子、３はワイヤボンディング用の金やアルミ等より成るワイヤ、４，４′は絶縁基板１の表面に施されたパターン、破線で示した５はＬＥＤ素子２等を保護する透明或いは拡散透明のモールド樹脂であり、さらに、絶縁基板１の左右の端部には、端子パターン６が設けられている。
【０００３】
同図に示すように、ＬＥＤ素子２は、絶縁基板１の表面中央付近に、ダイボンディングにより載置されている。そして、その一端はパターン４のランドに銀ペースト等で直接接続されて電極を形成し、他端はワイヤボンディングにより、ワイヤ３を介してパターン４′に接続されて電極を形成している。パターン４，４′は、それぞれ絶縁基板１の左右に延びて端子パターン６に接続されている。ＬＥＤ素子２及びワイヤ３は、モールド樹脂５により封入され、保護されている。以上の構成をＬＥＤチップ部品７と呼ぶ。
【０００４】
ＬＥＤ素子２からモールド樹脂５を通って発する光は、主に同図の矢印Ａで示す上面発光と、矢印Ｂで示す４方向の側面発光とに分けられる。そして、最近では例えば携帯電話において、コストダウンや小型化等のため、図２に示すように、４つの押しボタンスイッチ８の中央にＬＥＤチップ部品７を配置し、矢印Ｂで示す４方向の側面発光を利用して、その４つの押しボタンスイッチ８を同時に照明する事が行われている。尚、同図の押しボタンスイッチ８にそれぞれ描かれた数字は、例えば電話番号を指示するための数字を示している。
【０００５】
【発明が解決しようとする課題】
しかしながら、近年、携帯電話や携帯用の無線機等が普及するにつれて、それらの機器の薄型化の需要が高まってきており、それらの機器において表示用やディスプレイ照明用としてよく使われるＬＥＤにおいても、その薄型化に対応可能な製品が求められてきている。そのため、ＬＥＤチップ部品の厚さも益々薄くするように要求されてきている。
【０００６】
例えば、従来のＬＥＤチップ部品の厚さが０．８ｍｍであったのに対し、最近の市場要求では０．６ｍｍといった非常に厳しいものになってきている。ところが、薄型化に対応するため、図１に示すＬＥＤチップ部品７において、モールド樹脂５の厚さｈを薄くすると、矢印Ｂで示す側面発光の光量が大幅に減少してしまい、上記のような側面発光を利用した照明を行う事が困難となる。
【０００７】
また、ＬＥＤチップ部品７は、本来図１の矢印Ａで示す上面発光を利用する事が主流であるため、従来より絶縁基板１の材質として、耐熱性であって光を反射しやすいものが使われており、さらに、絶縁基板１の表面には、パターンのショート防止用レジストコーティング或いはシルクコーティングが施されていて、それにより光を反射するため、益々上面発光の光量が増加し、側面発光の光量が減少するという事態になっていた。
【０００８】
尚、薄型化に対応するため、モールド樹脂５のみではなく、絶縁基板１もできるだけ薄くなるように試みられている事は言うまでもない。本発明は、上記問題点を解消し、ＬＥＤチップ部品の薄型化のためにＬＥＤ素子保護用のモールド樹脂を薄く形成しても、或いはそのモールド樹脂がなかったとしても、側面発光の光量を確保する事ができるＬＥＤチップ部品を提供する事を目的とする。
【０００９】
【課題を解決するための手段】
上記目的を達成するために、本発明では、絶縁基体と、該絶縁基体の表面に載置されるとともに電極を有し、基体載置側の面とは反対側の上面と側面とが発光するＬＥＤ素子と、該ＬＥＤ素子の電極を外部接続するために前記絶縁基体上に形成された端子用パターンと、を備える、前記上面より上側が開放されているＬＥＤチップ部品において、前記絶縁基体を無色透明或いは拡散透明の材質により形成した構成とする。また、前記絶縁基体を耐熱性の高いガラス布基材エポキシ樹脂により形成した構成とする。さらに、前記絶縁基体の表面に前記パターンのショート防止用コーティングを施さない構成とする。
【００１０】
【発明の実施の形態】
以下、本発明の実施の形態について説明する。上記絶縁基板１の材質として、本実施形態では、無色透明或いは拡散透明（乳白色）で、マウント時のリフローソルダリングにおける耐熱性に優れたガラス布基材エポキシ樹脂を使用する。そして、パターンのショート防止用の上記レジストコーティングやシルクコーティングをその絶縁基板１の表面に施さずに使用する事により、図３の矢印Ｃで示すように、上記ＬＥＤ素子２からの光を絶縁基板１の表面でなるべく反射させずに内部に透過させる。
【００１１】
内部に透過した光は、屈折したり全反射を繰り返したりする事により絶縁基板１内を伝わり、同図の矢印Ｄで示すように、絶縁基板１の側面からも光が出るようになるので、矢印Ｂで示す上記モールド樹脂５の側面からの光と合わせて、側面発光の光量を確保する事ができる。尚、矢印Ｂ，Ｄのような側面発光は、同図の紙面に対して手前側と向こう側にも向かって行われている。
【００１２】
また、絶縁基板１の表面に施されるパターンは、ＩＣ等の場合と比較して電極数も少なく非常に単純であるので、上記絶縁コーティングを表面に施さなくても、ショートする恐れは殆どない。ところで、本実施形態では、ＬＥＤ素子保護用のモールド樹脂を設けた場合について説明したが、モールド樹脂がなかったとしても本発明による効果は同様である。
【００１３】
【発明の効果】
以上説明したように、本発明によれば、ＬＥＤチップ部品の薄型化のためにＬＥＤ素子保護用のモールド樹脂を薄く形成しても、或いはそのモールド樹脂がなかったとしても、側面発光の光量を確保する事ができるＬＥＤチップ部品を提供する事ができる。
【図面の簡単な説明】
【図１】従来より使用されているＬＥＤチップ部品の一例を示す斜視図。
【図２】ＬＥＤチップ部品を携帯電話に応用した一例を示す斜視図。
【図３】本発明のＬＥＤチップ部品の発光状態を示す正面図。
【符号の説明】
１ 絶縁基板
２ ＬＥＤ素子
３ ワイヤ
４，４′ パターン
５ モールド樹脂
６ 端子パターン
７ ＬＥＤチップ部品
８ 押しボタンスイッチ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to improvements in LED (light emitting diode) chip components.
[0002]
[Prior art]
An example of LED chip components conventionally used is shown in FIG. This is a perspective view of a small-sized surface-mounted LED chip component viewed obliquely from above, and shows a case of monochromatic light emission. In the figure, 1 is an insulating substrate made of a heat-resistant material, 2 is an LED element, 3 is a wire made of gold or aluminum for wire bonding, and 4 and 4 ′ are patterns formed on the surface of the insulating substrate 1. , 5 indicated by a broken line is a transparent or diffusive transparent molding resin for protecting the LED element 2 and the like, and terminal patterns 6 are provided at the left and right ends of the insulating substrate 1.
[0003]
As shown in the figure, the LED element 2 is placed near the center of the surface of the insulating substrate 1 by die bonding. One end thereof is directly connected to the land of the pattern 4 with silver paste or the like to form an electrode, and the other end is connected to the pattern 4 'via the wire 3 by wire bonding to form an electrode. The patterns 4 and 4 ′ extend to the left and right of the insulating substrate 1 and are connected to the terminal pattern 6. The LED element 2 and the wire 3 are enclosed and protected by a mold resin 5. The above configuration is referred to as LED chip component 7.
[0004]
The light emitted from the LED element 2 through the mold resin 5 is mainly divided into upper surface light emission indicated by an arrow A and four side light emission indicated by an arrow B in FIG. In recent years, for example, in a mobile phone, for cost reduction and downsizing, as shown in FIG. Using the light emission, the four push button switches 8 are illuminated at the same time. Note that the numbers drawn on the push button switches 8 in the figure indicate numbers for instructing telephone numbers, for example.
[0005]
[Problems to be solved by the invention]
However, in recent years, as cellular phones and portable wireless devices have become widespread, the demand for thinning these devices has increased, and even in LEDs that are often used for display and display lighting in those devices, There is a demand for products that can cope with such thinning. For this reason, the thickness of the LED chip component has been required to be further reduced.
[0006]
For example, the thickness of a conventional LED chip component is 0.8 mm, but recent market demands have become extremely severe such as 0.6 mm. However, in order to cope with the reduction in thickness, in the LED chip component 7 shown in FIG. 1, when the thickness h of the mold resin 5 is reduced, the amount of side light emission indicated by the arrow B is significantly reduced. It becomes difficult to perform illumination using side light emission.
[0007]
In addition, since the LED chip component 7 mainly uses the top emission shown by the arrow A in FIG. 1, the material of the insulating substrate 1 is conventionally heat resistant and easily reflects light. Furthermore, the surface of the insulating substrate 1 is provided with a resist coating or a silk coating for preventing pattern short-circuiting, thereby reflecting the light. The amount of light was decreasing.
[0008]
Needless to say, not only the mold resin 5 but also the insulating substrate 1 is tried to be as thin as possible in order to cope with the reduction in thickness. The present invention solves the above problems and secures the amount of light emitted from the side surface even if the mold resin for protecting the LED element is made thin in order to reduce the thickness of the LED chip component, or even if there is no mold resin. It aims at providing the LED chip component which can do.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, according to the present invention, an insulating substrate, an electrode mounted on the surface of the insulating substrate and having an electrode, the upper surface and the side opposite to the surface on which the substrate is mounted emit light. and LED element, in the provided with terminal patterns formed on an insulating substrate, a, LED chip components above the said upper surface is open to the external connecting electrodes of the LED element, colorless the insulating substrate The structure is made of a transparent or diffuse transparent material. Further, the insulating base is formed of a glass cloth base epoxy resin having high heat resistance. Further, the surface of the insulating substrate is not provided with a coating for preventing the pattern from being short-circuited.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below. As the material of the insulating substrate 1, in this embodiment, a glass cloth base epoxy resin that is colorless and transparent or milky white and has excellent heat resistance in reflow soldering during mounting is used. Then, by using the resist coating or silk coating for preventing pattern short-circuit without applying to the surface of the insulating substrate 1, the light from the LED element 2 is transmitted to the insulating substrate as shown by an arrow C in FIG. The light is transmitted through the surface of the surface 1 without being reflected as much as possible.
[0011]
The light transmitted to the inside travels through the insulating substrate 1 by being refracted and repeating total reflection, and light is emitted from the side surface of the insulating substrate 1 as indicated by the arrow D in FIG. Together with the light from the side surface of the mold resin 5 indicated by the arrow B, it is possible to secure the amount of side light emission. Side emission as indicated by arrows B and D is performed toward the front side and the other side with respect to the paper surface of FIG.
[0012]
Further, since the pattern applied to the surface of the insulating substrate 1 is very simple with fewer electrodes than in the case of an IC or the like, there is almost no risk of short-circuiting even if the insulating coating is not applied to the surface. . By the way, although this embodiment demonstrated the case where the mold resin for LED element protection was provided, even if there is no mold resin, the effect by this invention is the same.
[0013]
【The invention's effect】
As described above, according to the present invention, even if the mold resin for protecting the LED element is formed thinly for reducing the thickness of the LED chip component, or even if the mold resin is not present, the amount of side light emission can be reduced. An LED chip component that can be secured can be provided.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an example of an LED chip component that has been conventionally used.
FIG. 2 is a perspective view showing an example in which an LED chip component is applied to a mobile phone.
FIG. 3 is a front view showing a light emitting state of the LED chip component of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Insulation board | substrate 2 LED element 3 Wire 4, 4 'Pattern 5 Mold resin 6 Terminal pattern 7 LED chip component 8 Pushbutton switch

Claims (3)

絶縁基体と、
該絶縁基体の表面に載置されるとともに電極を有し、基体載置側の面とは反対側の上面と側面とが発光するＬＥＤ素子と、
該ＬＥＤ素子の電極を外部接続するために前記絶縁基体上に形成された端子用パターンと、を備える、前記上面より上側が開放されているＬＥＤチップ部品において、
前記絶縁基体を無色透明或いは拡散透明の材質により形成した事を特徴とするＬＥＤチップ部品。An insulating substrate;
An LED element mounted on the surface of the insulating substrate and having an electrode, and an upper surface and a side surface opposite to the surface on which the substrate is mounted;
In the LED chip component that is open on the upper side from the upper surface , comprising a terminal pattern formed on the insulating base for external connection of the electrode of the LED element,
An LED chip component, wherein the insulating base is formed of a colorless transparent or diffusive transparent material. 前記絶縁基体を耐熱性の高いガラス布基材エポキシ樹脂により形成した事を特徴とする請求項１に記載のＬＥＤチップ部品。  The LED chip component according to claim 1, wherein the insulating base is formed of a glass cloth base epoxy resin having high heat resistance. 前記絶縁基体の表面に前記パターンのショート防止用コーティングを施さない事を特徴とする請求項１又は請求項２に記載のＬＥＤチップ部品。  The LED chip component according to claim 1 or 2, wherein a coating for preventing a short circuit of the pattern is not applied to a surface of the insulating substrate.
JP10350897A 1997-04-21 1997-04-21 LED chip parts Expired - Fee Related JP3807812B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10350897A JP3807812B2 (en) 1997-04-21 1997-04-21 LED chip parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10350897A JP3807812B2 (en) 1997-04-21 1997-04-21 LED chip parts

Publications (2)

Publication Number Publication Date
JPH10294496A JPH10294496A (en) 1998-11-04
JP3807812B2 true JP3807812B2 (en) 2006-08-09

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011142097A1 (en) 2010-05-13 2011-11-17 パナソニック株式会社 Mounting board, method for manufacturing same, light emitting module, and illuminating apparatus

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JP2006310004A (en) * 2005-04-27 2006-11-09 Citizen Electronics Co Ltd Illuminated tactile switch
JP5126944B2 (en) * 2007-02-28 2013-01-23 株式会社大一商会 Pachinko machine
JP5840411B2 (en) 2011-08-05 2016-01-06 日本メクトロン株式会社 Opto-electric mixed flexible printed wiring board and method for mounting light receiving and emitting element thereof

Cited By (2)

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Publication number Priority date Publication date Assignee Title
WO2011142097A1 (en) 2010-05-13 2011-11-17 パナソニック株式会社 Mounting board, method for manufacturing same, light emitting module, and illuminating apparatus
EP2804227A1 (en) 2010-05-13 2014-11-19 Panasonic Corporation Mounting substrate and manufacturing method thereof, light-emitting module and illumination device

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