JPH11177199A - Printed wiring board and its manufacture - Google Patents
Printed wiring board and its manufactureInfo
- Publication number
- JPH11177199A JPH11177199A JP33582397A JP33582397A JPH11177199A JP H11177199 A JPH11177199 A JP H11177199A JP 33582397 A JP33582397 A JP 33582397A JP 33582397 A JP33582397 A JP 33582397A JP H11177199 A JPH11177199 A JP H11177199A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- resin
- wiring board
- printed wiring
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ＣＰＵ、メモリー
等の半導体素子、その他の抵抗器、コンデンサー等の電
子部品、チップ部品等を搭載するために用いられるイン
ナービアホールを有するプリント配線板およびその製造
方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board having an inner via hole used for mounting a semiconductor element such as a CPU and a memory, other electronic parts such as a resistor and a capacitor, a chip part and the like, and its manufacture. About the method.
【０００２】[0002]
【従来の技術】最近、携帯用電子機器の一層の小型化と
薄型化のために、プリント配線基板は、半導体素子、抵
抗器、コンデンサー等のチップ部品等の集積度が非常に
高くなっており、そのためこれを実装するためのプリン
ト配線板も高密度化しなければならない。このような実
状に対処するために考え出されたのが多層プリント配線
板である。多層プリント配線板は、これを構成する複数
の基板（内層回路基板）に予め導体回路を形成してお
き、これらの基板を互いに接合することによって高集積
電子部品の実装を可能にするものである。2. Description of the Related Art In recent years, in order to further reduce the size and thickness of portable electronic devices, the degree of integration of chip components such as semiconductor elements, resistors, and capacitors has become extremely high in printed wiring boards. Therefore, the printed wiring board for mounting this must also be densified. A multilayer printed wiring board has been devised to cope with such a situation. The multi-layer printed wiring board has a conductor circuit formed in advance on a plurality of boards (inner circuit boards) constituting the multi-layer printed wiring board, and these boards are joined together to enable mounting of highly integrated electronic components. .
【０００３】このような多層プリント配線板では、各層
間の導体回路に電気的導通を行うことが必要となる。通
常は各層の電極間の電気的に導通させるためにスルーホ
ールを設けておりこの孔を通って電流が流れ、電気的な
接続が行われるようになっている。[0003] In such a multilayer printed wiring board, it is necessary to electrically connect the conductor circuits between the respective layers. Normally, a through hole is provided for electrical conduction between the electrodes of each layer, and a current flows through this hole to make an electrical connection.
【０００４】このスルーホールの設け方としてはめっき
による方法、導電性ペーストによる方法等様々な方法が
提案され、実施されている。各方法についての一般的な
製造方法としては最初にＮＣドリルマシーン、レーザ貫
通孔加工機等により貫通孔加工を行い、その後貫通孔の
中にめっきをしたり、導電性ペーストを入れる等により
層間の導通を図る。Various methods have been proposed and implemented for providing the through holes, such as a plating method and a conductive paste method. As a general manufacturing method for each method, first, through holes are formed by an NC drill machine, a laser through hole processing machine, and the like, and thereafter, plating is performed in the through holes, and a conductive paste is inserted between the layers, for example. Conduct continuity.
【０００５】例えば特開平７ー１１５２７９に示される
多層基板とその製造方法では具体的にこの種のプリント
配線板の製造方法が開示されている。この方法は、絶縁
材料層にビアホール用の貫通孔を加工する工程、この貫
通孔に導電性粒子、液状樹脂および粉体硬化剤よりなる
導電性ペーストを充填する工程、導電性ペーストが充填
されたビアを有する絶縁材料層の両面を銅箔で挟み、熱
圧着する工程、前記銅箔を加工して内層用回路パターン
を形成し、両面板構成とする工程、さらにこの両面板の
両側あるいは片側に前記ビアホールを有する絶縁材料層
と前記銅箔を交互に熱圧着しかつ前記銅箔を加工して回
路パターンを形成し、多層構成とする工程の一連の工程
により多層のプリント配線板を形成するものである。[0005] For example, Japanese Patent Application Laid-Open No. Hei 7-115279 specifically discloses a method of manufacturing a printed wiring board of this type in a multilayer substrate and a method of manufacturing the same. In this method, a step of processing a through hole for a via hole in an insulating material layer, a step of filling the through hole with a conductive paste made of conductive particles, a liquid resin, and a powder hardener, and a step of filling the conductive paste Sandwiching both sides of the insulating material layer having vias with copper foil, thermocompression bonding, processing the copper foil to form an inner layer circuit pattern, forming a double-sided board configuration, further on both sides or one side of this double-sided board Forming a multilayer printed wiring board by a series of steps of forming a circuit pattern by alternately thermocompressing the insulating material layer having the via hole and the copper foil and processing the copper foil to form a multilayer structure. It is.
【０００６】さらに、最近は、プリント配線板には、電
気的性質とともに、機械的強度、特に高温での強度の要
求から、繊維強化した合成樹脂樹脂板、特に、アラミド
繊維等の強靭な繊維の織布・不織布にエポキシ樹脂など
を含浸してシート状にしたコンポジットが使用され、配
線基板の耐熱性の向上に寄与している。このような多層
の配線基板として、図２に、複数の基板（内層回路基
板）２・・・に、導電性ペーストによる導体１０でビア
ホール１０を設けて電極４、４間を接続した多層プリン
ト配線板の例を示している。Furthermore, recently, printed wiring boards have been required to have a mechanical strength, particularly a high-temperature strength, in addition to an electrical property, so that a fiber-reinforced synthetic resin resin plate, particularly, a tough fiber such as an aramid fiber is required. A composite formed by impregnating a woven or nonwoven fabric with an epoxy resin or the like is used to contribute to improving the heat resistance of a wiring board. As such a multilayer wiring board, FIG. 2 shows a multilayer printed wiring in which a plurality of boards (inner circuit boards) 2... 2 shows an example of a plate.
【０００７】[0007]
【発明が解決しようとする課題】然しながら、絶縁基板
が繊維の織布・不織布と含浸樹脂とのコンポジットのシ
ートであること、さらに、熱プレスの前においてはコン
ポジットシートが残留気孔を含む多孔質であることと関
連して、絶縁基板に、貫通孔を形成する際にその内壁に
欠陥を生じやすかった。上記コンポジットから成る絶縁
基材に貫通孔を加工する際に、加工方法が不適切である
と、プリント配線板のビアホールの貫通孔の内壁が粗く
なり、むしり、かじり等が発生するという問題があっ
た。これらの貫通孔の欠陥は、貫通孔に導電性ペースト
を充填した後に、熱プレスを行うと、ときには、流動的
になった導電性ペーストが、粗雑な貫通孔内壁に流れ込
んで、隣接するビアホールの導体と接触短絡したり、あ
るいはマイグレーションの原因となったり、埋め込むべ
き導電性ペーストが貫通孔から流出して少なくなり、硬
化後にはビアホール導体が層間電極と十分な電気的接続
がとれないといった課題が残されていた。However, the insulating substrate is a composite sheet of a woven or nonwoven fabric of fibers and an impregnated resin. Further, before hot pressing, the composite sheet is made of a porous material containing residual pores. In connection with the fact, when forming a through hole in an insulating substrate, it is easy to cause a defect on an inner wall thereof. When processing a through-hole in the insulating base material composed of the composite, if the processing method is inappropriate, there is a problem that the inner wall of the through-hole of the via hole of the printed wiring board becomes rough, and the cutting and galling occur. Was. Defects in these through-holes, when hot pressing is performed after filling the through-hole with the conductive paste, sometimes the flowing conductive paste flows into the rough inner wall of the through-hole, and the adjacent via hole has There are problems such as short-circuiting with the conductor, causing migration, and decreasing the amount of the conductive paste to be embedded flowing out of the through-hole and hardening the via-hole conductor with the interlayer electrode after curing. Was left.
【０００８】例えば、図３には、絶縁基板２に貫通孔３
をエキシマレーザで形成した後、導電性ペースト１を孔
３に充填し、次いで銅箔４で挟み込んで、熱プレスした
場合の状態を概念的に示しているが、エキシマレーザの
ような高エネルギの加工方法では、コンポジットの絶縁
基板２を構成する含浸樹脂が溶融する間もなく瞬時に分
解蒸発してしまうために加工された貫通孔の内壁が肌荒
く、むしれ、かじり等が内壁部に発生しその部分に導電
性のペーストが流れ込むために導電性ペーストの浸み込
み部１６が発生することになる。そのため、貫通孔内に
充填された導電性ペーストの充足が不十分で、接触不良
部１７が形成されるだけでなくビアホール間の耐マイグ
レーション性が著しく悪化するという課題があった。[0008] For example, in FIG.
Is formed by an excimer laser, the conductive paste 1 is filled in the holes 3, then sandwiched by the copper foil 4, and hot pressed. In the processing method, the impregnated resin constituting the insulating substrate 2 of the composite is instantaneously decomposed and evaporated shortly after being melted, so that the inner wall of the processed through hole is rough, and scorching, galling and the like occur on the inner wall portion. Since the conductive paste flows into the portion, the conductive paste seepage portion 16 is generated. Therefore, there is a problem that the conductive paste filled in the through hole is insufficiently filled, and not only the poor contact portion 17 is formed but also the migration resistance between the via holes is significantly deteriorated.
【０００９】また絶縁基材は、プリプレグとして多孔質
であるので、貫通孔の内壁に細孔が空隙としてむき出し
になるためそこに導電性ペーストが流れこみ、導電性ペ
ーストのしみこみ部１６が発生するという課題があっ
た。そして、多孔質の絶縁性基材としては、上述のよう
に、アラミド繊維やガラス繊維等の不織布にエポキシ樹
脂を含浸させたものが実用化されているが、その種の絶
縁基材は多孔性であるので、この導電性ペーストのしみ
こみ部の発生は、非常に避けがたい大きな解決課題とな
っていた。Further, since the insulating base material is porous as a prepreg, the pores are exposed as voids on the inner wall of the through-holes, so that the conductive paste flows into the insulating base material, and the conductive paste seepage portion 16 is generated. There was a problem that. As described above, as a porous insulating substrate, a non-woven fabric such as aramid fiber or glass fiber impregnated with an epoxy resin has been put to practical use. Therefore, the occurrence of the seepage portion of the conductive paste has been a very inevitable problem to be solved.
【００１０】また、ビアホールの導電性ペーストの導体
１と絶縁基材２とは、熱膨張係数に相違があるために、
リフロー半田付け等の加熱工程で、加熱冷却による伸縮
の繰返しにより、電気的な接続が低下して回路基板とし
ての信頼性が劣化するという課題があった。In addition, since the conductor 1 of the conductive paste of the via hole and the insulating base material 2 have different coefficients of thermal expansion,
In a heating process such as reflow soldering, there is a problem that electrical connection is reduced due to repetition of expansion and contraction due to heating and cooling, and reliability as a circuit board is deteriorated.
【００１１】本発明は、このような絶縁基板が、樹脂含
浸繊維シートよりなるシートであること、さらに、熱プ
レスの前においてはコンポジットシートが残留気孔を含
む多孔質であることと関連した従来の課題を解決し、成
形後のビアホール用の貫通孔内壁の状態を良好にせし
め、ビアホールによる接続信頼性を高め、ビアホール接
続不良、マイグレーションによる絶縁破壊等を起こさな
いプリント配線板およびその製造方法を提供するもので
ある。[0011] The present invention relates to a conventional method in which such an insulating substrate is a sheet made of a resin-impregnated fiber sheet, and furthermore, before the hot pressing, the composite sheet is porous including residual pores. A printed wiring board which solves the problem, improves the condition of the inner wall of a through hole for a via hole after molding, improves the connection reliability of the via hole, does not cause poor connection of the via hole, does not cause insulation breakdown due to migration, etc., and a method of manufacturing the same. Is what you do.
【００１２】[0012]
【課題を解決するための手段】本発明は、電極接続用の
ビアホールを備えたプリント配線板について、上記ビア
ホールは、樹脂含浸繊維シートよりなる絶縁用基材に形
成したビアホール用の貫通孔と、該貫通孔の内壁面に形
成した樹脂層と、該樹脂層を介して該貫通孔の内側に充
填した接続導体と、から成ることを特徴とする。According to the present invention, there is provided a printed wiring board having a via hole for connecting an electrode, wherein the via hole includes a through hole for a via hole formed in an insulating base material made of a resin-impregnated fiber sheet; It is characterized by comprising a resin layer formed on the inner wall surface of the through hole, and a connection conductor filled inside the through hole via the resin layer.
【００１３】このようなプリント配線板おいては、ビア
ホール導体は、貫通孔に樹脂層を介装して充填形成され
るので、貫通孔の内壁に粗雑な凹みや細孔があってもこ
れらを樹脂層により予め封鎖して、樹脂層が形成する平
滑な孔内面に導体が充填されるので、ビアホール接続不
良、マイグレーションによる絶縁破壊等が有効に防止さ
れる。In such a printed wiring board, the via-hole conductor is formed by filling the through-hole with a resin layer interposed therebetween. Since the conductor is filled into the smooth inner surface of the hole formed by the resin layer before sealing with the resin layer, poor connection of the via hole, insulation breakdown due to migration, and the like are effectively prevented.
【００１４】本発明のプリント配線板の製造方法は、樹
脂含浸繊維シートよりなる絶縁用基材に電極接続用のビ
アホールを備えたプリント配線板を製造する方法である
が、該絶縁用基材にビアホール用の貫通孔を形成し、該
貫通孔内面に樹脂層を被覆形成し、その後に該樹脂層を
介在したまま貫通孔内側に接続導体を形成することによ
り、上記ビアホールを形成することを特徴とするもので
ある。The method of manufacturing a printed wiring board of the present invention is a method of manufacturing a printed wiring board having via holes for connecting electrodes to an insulating base made of a resin-impregnated fiber sheet. Forming the via hole by forming a through hole for a via hole, coating and forming a resin layer on the inner surface of the through hole, and then forming a connection conductor inside the through hole with the resin layer interposed. It is assumed that.
【００１５】本発明の方法は、絶縁用基材にビアホール
用の貫通孔を形成し、その際に貫通孔の内壁に粗雑な凹
みや細孔があっても、次に形成する樹脂層によりこれら
を予め封鎖することができ、樹脂層の滑らかな内周面に
形成できるので、接続導体を充填形成させれば、緻密で
接続確実なビアホールが形成できる。According to the method of the present invention, a through hole for a via hole is formed in an insulating base material, and even if there are rough dents or pores on the inner wall of the through hole, these are formed by a resin layer formed next. Can be sealed in advance and can be formed on the smooth inner peripheral surface of the resin layer. Therefore, if the connection conductor is filled and formed, a dense and reliable via hole can be formed.
【００１６】[0016]
【発明の実施の形態】本発明のプリント配線板に具備す
るビアホール１０は、図１に示すように、絶縁用基材２
に形成された貫通孔３と接続導体１との間に樹脂層３０
が一体に介装されてなるものであ。本発明の第１の形態
は、絶縁用基材に貫通孔３を形成する過程で、樹脂含浸
繊維シートに含有の樹脂の加熱溶解成分を、樹脂層３０
に、利用するものである。即ち、樹脂含浸繊維シートに
含有される樹脂成分が加熱溶解した後に貫通孔内側に残
る樹脂皮膜の硬化体を樹脂層とするものである。DESCRIPTION OF THE PREFERRED EMBODIMENTS As shown in FIG. 1, a via hole 10 provided in a printed wiring board of the present invention
Resin layer 30 between through-hole 3 formed in
Are integrally interposed. In the first embodiment of the present invention, in the process of forming the through-holes 3 in the insulating base material, the heat-melting component of the resin contained in the resin-impregnated fiber sheet is added to the resin layer 30.
To use. That is, a cured resin film remaining inside the through hole after the resin component contained in the resin-impregnated fiber sheet is heated and dissolved is used as the resin layer.
【００１７】第２の形態は、上記樹脂層を、貫通孔形成
過程における樹脂含浸繊維シートの貫通孔３に樹脂液を
埋め込みその樹脂硬化体に貫通孔を穿孔して成る残部と
して形成するものである。In a second embodiment, the resin layer is formed as a remaining portion formed by embedding a resin liquid in the through-holes 3 of the resin-impregnated fiber sheet in the process of forming the through-holes and perforating the through-holes in the cured resin. is there.
【００１８】第３の形態は、上記樹脂層３０を、貫通孔
形成過程におけるプリント配線板のビアホール用の貫通
孔に塗布した樹脂液の乾燥硬化膜とするものである。In a third embodiment, the resin layer 30 is a dried and cured film of a resin liquid applied to a through hole for a via hole of a printed wiring board in a process of forming the through hole.
【００１９】第４の形態は、本発明のプリント配線板の
製造方法において、ビアホールは、貫通孔を該絶縁用基
材に加熱して形成し、この貫通孔形成の際に上記樹脂層
を絶縁用基材の加熱溶解成分により貫通孔内面に形成
し、その後に樹脂層内側に接続導体を形成することによ
りなされる。貫通孔とその後の樹脂層の加熱形成には、
レーザビーム照射が、小径に穿孔できるので利用され
る。特にレーザ照射は、ＣＯ2 ガスレーザ照射が好まし
い。According to a fourth aspect, in the method for manufacturing a printed wiring board of the present invention, a via hole is formed by heating a through-hole in the insulating base material, and the resin layer is insulated when the through-hole is formed. This is performed by forming the through-hole on the inner surface of the through-hole with the heat-melting component of the base material, and then forming the connection conductor inside the resin layer. For the heating formation of the through hole and the subsequent resin layer,
Laser beam irradiation is used because it can be perforated to a small diameter. Particularly, the laser irradiation is preferably a CO 2 gas laser irradiation.
【００２０】第５の形態は、本発明のプリント配線板の
製造方法が、絶縁用基板に貫通孔を形成した後に、該貫
通孔に別途、熱硬化性樹脂を充填し、その樹脂硬化体に
改めて小径の貫通孔を穿孔して上記樹脂層とするもので
ある。その後に樹脂層内側に接続導体を形成するのは上
記と同じである。According to a fifth aspect, in the method of manufacturing a printed wiring board of the present invention, after a through-hole is formed in an insulating substrate, a thermosetting resin is separately filled in the through-hole, and the cured resin is added to the resin. A small-diameter through hole is newly formed to form the resin layer. Thereafter, the connection conductor is formed inside the resin layer in the same manner as described above.
【００２１】第６の形態は、上記貫通孔の形成後に、該
貫通孔内面に樹脂液を付着させて後乾燥硬化させて貫通
孔内周面に樹脂層を形成し、その後貫通孔に接続導体を
充填形成することを特徴とする。この方法においては、
より詳しくは、樹脂液を揮発溶媒で薄めた希薄樹脂液を
使用し、貫通孔形成後の絶縁用基板に希薄樹脂液を塗布
し、次いで乾燥硬化させて、貫通孔内周面に樹脂皮膜を
形成し、これを樹脂層に利用する。In a sixth mode, after the formation of the through-hole, a resin liquid is applied to the inner surface of the through-hole, dried and hardened to form a resin layer on the inner surface of the through-hole. Is formed by filling. In this method,
More specifically, using a dilute resin liquid obtained by diluting the resin liquid with a volatile solvent, applying the dilute resin liquid to the insulating substrate after the formation of the through hole, and then drying and curing the resin film to form a resin film on the inner peripheral surface of the through hole. It is formed and used for the resin layer.
【００２２】本発明に使用される絶縁性基板２には、樹
脂含浸繊維シートが使用されるが、繊維シートの繊維に
は電気的特性と機械的強度に優れた材料から及び含浸樹
脂も電気的特性と機械的強度に優れた熱可塑性樹脂から
適宜選ばれる。好ましくは繊維として、ガラス繊維又は
アラミド繊維の織布・不織布を使用し、含浸樹脂として
エポキシ樹脂又はビスマレイミドトリアジン樹脂を使用
して、織布・不織布に樹脂液を含浸してシート状に成形
した複合材料が使用される。これには、ガラス繊維エポ
キシ樹脂コンポジット、ガラス繊維ビスマレイミドトリ
アジン樹脂コンポジット、アラミド繊維エポキシ樹脂コ
ンポジット、アラミド繊維ビスマレイミドトリアジン樹
脂コンポジットが例示できる。A resin-impregnated fiber sheet is used for the insulating substrate 2 used in the present invention. The fibers of the fiber sheet are made of a material having excellent electrical properties and mechanical strength, and the impregnated resin is also electrically conductive. It is appropriately selected from thermoplastic resins having excellent properties and mechanical strength. Preferably, as a fiber, a woven or nonwoven fabric of glass fiber or aramid fiber is used, and an epoxy resin or a bismaleimide triazine resin is used as an impregnating resin. Composite materials are used. Examples thereof include a glass fiber epoxy resin composite, a glass fiber bismaleimide triazine resin composite, an aramid fiber epoxy resin composite, and an aramid fiber bismaleimide triazine resin composite.
【００２３】樹脂層３０は、電気的特性と機械的性質に
優れた熱硬化性樹脂が好ましく使用されるが、基板材料
と同様のエポキシ樹脂、ビスマレイミドトリアジン樹脂
が使用できる。上記樹脂層には、電気絶縁性のフィラー
が含有されているのが好ましい。このようなフィラーと
しては酸化アルミ（Ａｌ2 Ｏ3)、酸化マグネシウム（Ｍ
ｇＯ）、ＳｉＯ2 等の無機材料が好ましく利用され、フ
ィラーは電気絶縁体としてマイグレーションの防止等に
働くと同時に機械的強度に優れているのでペースト部の
補強材としても働く。また特に上記のフィラーは熱伝導
性も高いので半導体等で発生する熱量を速やかに逃がす
サーマルビアとしても働く。For the resin layer 30, a thermosetting resin having excellent electrical and mechanical properties is preferably used, but the same epoxy resin and bismaleimide triazine resin as the substrate material can be used. The resin layer preferably contains an electrically insulating filler. Aluminum oxide (Al 2 O 3 ), magnesium oxide (M
Inorganic materials such as gO) and SiO 2 are preferably used, and the filler functions as an electrical insulator to prevent migration and the like, and at the same time, has excellent mechanical strength, and thus also functions as a reinforcing material for the paste portion. In particular, since the filler has high thermal conductivity, it also functions as a thermal via for quickly releasing the amount of heat generated in a semiconductor or the like.
【００２４】接続導体１は、熱硬化型樹脂液と導体用粉
末（例えば、銅や銀などの金属粉末）との混合ペースト
の硬化体が使用され、このために、内周面に樹脂層を形
成した貫通孔内に、通常の方法によりペーストを充填し
て、加熱することにより硬化させて、導電性の接続導体
とされる。For the connection conductor 1, a cured body of a mixed paste of a thermosetting resin liquid and a conductor powder (for example, a metal powder such as copper or silver) is used. For this purpose, a resin layer is provided on the inner peripheral surface. The formed through-hole is filled with a paste by an ordinary method, and cured by heating to form a conductive connection conductor.
【００２５】最初に以下に例示するプリント配線板の作
成方法について説明する。第４の実施形態について、絶
縁性基材２への貫通孔３の加工方法の一つの例としてＣ
Ｏ2 ガスレーザ照射装置を用いてレーザビームを絶縁基
材のビアホール１０の対応部位に照射加熱して厚み方向
に貫通した孔を形成する。この際に、貫通孔３の内周に
樹脂層３０が形成されるように制御される。この貫通孔
内壁部の樹脂層３０は、レーザ照射により絶縁性基材内
に発生した熱により対応部位の含浸樹脂が一旦溶融し加
工後の内壁部に固着し、凝固後にそのまま形成される。First, a method of manufacturing a printed wiring board exemplified below will be described. Regarding the fourth embodiment, C is used as an example of a method of processing the through holes 3 in the insulating base material 2.
Using an O 2 gas laser irradiator, a laser beam is applied to a portion of the insulating substrate corresponding to the via hole 10 and heated to form a hole penetrating in the thickness direction. At this time, control is performed so that the resin layer 30 is formed on the inner periphery of the through hole 3. The resin layer 30 on the inner wall of the through-hole is formed as it is after solidification of the impregnated resin of the corresponding portion by the heat generated in the insulating base material by the laser irradiation and fixed to the processed inner wall, and then solidified.
【００２６】この溶融樹脂層を設けるためには加熱加工
時に樹脂の溶融に適度な熱が発生するに好適な加工法と
また適切な加工条件設定が必要となる。ＣＯ2 レーザ照
射加工機に代えて、ＮＣドリルマシーンでは、回転数、
送り速度等を適切に設定して、孔貫通とともに、溶融樹
脂液が形成され、且つ孔内周に残留するように制御され
る。In order to provide this molten resin layer, it is necessary to set a suitable processing method and appropriate processing conditions for generating an appropriate amount of heat for melting the resin during the heat processing. Instead of a CO 2 laser irradiation machine, the number of rotations,
By appropriately setting the feed speed and the like, control is performed so that the molten resin liquid is formed and remains on the inner periphery of the hole as well as through the hole.
【００２７】しかしながらエキシマレーザ等の高エネル
ギーレーザによる加工方法や適切な条件設定がなされて
いないＣＯ2 ガスレーザ加工方法、ドリル加工方法では
樹脂が溶融せず昇華、熱分解や微粒蒸散してしまい、貫
通孔内壁部に所望の樹脂層を形成することはできないこ
とがある。特に、含浸樹脂繊維質シートは、多孔質であ
ったり、或いは繊維と樹脂とは熱的機械的性質が相違す
るのが普通であって熱的にも機械的にも均質材料でな
く、貫通孔加工の際の切削やレーザ加熱により、貫通孔
内周の含浸樹脂繊維質シートの含浸樹脂の部分や繊維の
部分が貫通孔内壁部にむき出しになったり、凹凸やむし
り、かじり等が発生してしまう。However, in a processing method using a high-energy laser such as an excimer laser or a CO 2 gas laser processing method or a drill processing method in which appropriate conditions are not set, the resin does not melt, but sublimates, thermally decomposes, and fine particles evaporate. In some cases, a desired resin layer cannot be formed on the inner wall of the hole. In particular, the impregnated resin fibrous sheet is porous, or the fiber and the resin usually have different thermo-mechanical properties, and are not a homogeneous material both thermally and mechanically. Due to cutting or laser heating during processing, the impregnated resin part or fiber part of the impregnated resin fibrous sheet on the inner periphery of the through hole is exposed on the inner wall of the through hole, and unevenness, scuffing, galling etc. occur I will.
【００２８】そこで、第５の形態のようにこのような溶
融樹脂液による樹脂層の形成が困難な加工法による場合
には、この加工法で一度所望の直径より大き目の直径の
貫通孔を形成し、仮に貫通孔内周面にむしり、かじりな
どが発生したとしても、貫通孔に別途、熱硬化性樹脂液
を充填して内壁内に埋め込み、その硬化後に再度、所望
の直径の貫通孔を開けることにより、貫通孔内壁に樹脂
層を形成することができる。このように充填硬化した樹
脂は比較的均質であり、内壁面を円滑に形成することが
できる。このため、この樹脂層用の樹脂には、レーザに
よる加工やドリル加工で孔成形性の良い樹脂が使用され
る。Therefore, in the case of using a processing method in which it is difficult to form a resin layer using a molten resin liquid as in the fifth embodiment, a through hole having a diameter larger than a desired diameter is once formed by this processing method. However, even if the inner peripheral surface of the through-hole is peeled, galling, etc., the through-hole is separately filled with a thermosetting resin liquid and embedded in the inner wall, and after the curing, the through-hole having a desired diameter is formed again. By opening, a resin layer can be formed on the inner wall of the through hole. The resin filled and cured as described above is relatively homogeneous, and the inner wall surface can be formed smoothly. For this reason, as the resin for the resin layer, a resin having good hole forming properties by laser processing or drilling is used.
【００２９】このような２回貫通孔加工する方法は、ド
リル加工法やその他、レーザ加工方法以外の加工方法も
同様に適用することができ、適切な材料、条件で加工を
行えば１回で内壁に樹脂層を設けるよりも信頼性の高い
ビアを形成することが可能となる。Such a method of forming the through-hole twice can be applied to a drilling method and other processing methods other than the laser processing method in a similar manner. It is possible to form a via with higher reliability than providing a resin layer on the inner wall.
【００３０】本発明の方法は、第６の形態の如く貫通孔
の成形後に、貫通孔内壁に樹脂を塗布することにより樹
脂層を設けることもできる。この際に樹脂を塗布する方
法は様々な方法があるが、例えば貫通孔を成形した絶縁
基材を溶剤等で溶解させ樹脂液中に浸漬する方法、また
スプレーコーター等で樹脂溶液を吹き付け塗布し、その
後に乾燥硬化させて、皮膜化する方法等により貫通孔内
壁に樹脂層を形成することができる。In the method of the present invention, a resin layer can be provided by applying a resin to the inner wall of the through hole after the formation of the through hole as in the sixth embodiment. There are various methods of applying the resin at this time, for example, a method of dissolving an insulating base material having a through hole formed with a solvent or the like and immersing it in a resin solution, or spraying and applying a resin solution with a spray coater or the like. Thereafter, a resin layer can be formed on the inner wall of the through hole by a method of drying and curing to form a film.
【００３１】この塗布の際に、貫通孔内壁が詰まらない
ように樹脂溶液を希釈な濃度ないし低い粘度のコントロ
ールするのがよく、また塗布直後の樹脂溶液が未硬化状
態の間に圧縮空気等で貫通孔に詰まっている樹脂をある
程度吹き飛ばすのも効果的である。At the time of this coating, it is preferable to control the resin solution to a diluted concentration or a low viscosity so that the inner wall of the through-hole is not clogged. It is also effective to blow off the resin clogging the through holes to some extent.
【００３２】（実施例１）絶縁基材としてアラミド不織
布にエポキシ樹脂を含浸させて作ったコンポジットシー
トの絶縁性基材（厚み１００μｍ、５００×６００ｍ
ｍ）を用い、それに貫通孔内壁部に樹脂層を形成できる
ように適切な条件を設定して（穴開け条件；１００〜３
００穴／sec ）、ＣＯ2 レーザ加工機で直径１５０μｍ
の貫通孔を成形し、同時に樹脂層を形成することができ
た。次いで、導電材料に銅微粉末と樹脂主成分エポキシ
樹脂とを混練した導電性ペーストを充填しビアホールを
形成後、銅箔で両側を挟み真空熱プレスにより加熱加圧
成形し、銅箔に内層用パターンをエッチングで形成して
内層用プリント配線板を得た。(Example 1) An insulating substrate of a composite sheet made by impregnating an aramid nonwoven fabric with an epoxy resin as an insulating substrate (thickness: 100 μm, 500 × 600 m)
m), and appropriate conditions are set so that a resin layer can be formed on the inner wall of the through hole (drilling conditions; 100 to 3).
00 hole / sec), diameter 150μm with CO 2 laser beam machine
And a resin layer could be formed at the same time. Next, after filling conductive paste obtained by kneading copper fine powder and resin-based epoxy resin into conductive material, forming via holes, sandwiching both sides with copper foil, heat-press molding by vacuum hot press, and forming inner layer on copper foil The pattern was formed by etching to obtain a printed wiring board for an inner layer.
【００３３】外層用配線板として、上記の内層用プリン
ト配線板と同様にして、直径１５０μm の貫通孔をあけ
導電性を有したペーストを充填した絶縁基材を形成し、
これら外層用プリント配線板を上記の内層用基材の両側
に面接積層し、その外面を銅箔で挟んで、真空熱プレス
により加熱加圧成形を行い、外層用パターンをエッチン
グで形成して３層の試験用の多層プリント配線基板を得
た。As an outer layer wiring board, a through hole having a diameter of 150 μm was formed in the same manner as the inner layer printed wiring board, and an insulating base material filled with a conductive paste was formed.
These printed wiring boards for the outer layer are laminated on the both sides of the above-mentioned base material for the inner layer, the outer surfaces thereof are sandwiched between copper foils, heated and pressed by a vacuum hot press, and the outer layer pattern is formed by etching. A multilayer printed wiring board for testing the layers was obtained.
【００３４】（実施例２）絶縁基材としてアラミド不織
布にエポキシ樹脂を含浸させて作った多孔質基材である
アラミドエポキシコンポジットを用い、それにＮＣドリ
ル貫通孔加工機で直径１５０μm の貫通孔をあけ導電性
ペーストを充填しビアホールを形成後、銅箔で両側を挟
み真空熱プレスにより加熱加圧成形し、内層用パターン
をエッチングで形成し内層用配線板を得る。Example 2 An aramid nonwoven fabric was impregnated with an epoxy resin as an insulating base material, and an aramid epoxy composite was used as a porous base material. A 150 μm diameter through hole was formed in the aramid epoxy composite using an NC drill through hole processing machine. After filling the conductive paste to form a via hole, both sides are sandwiched between copper foils, heated and pressed by a vacuum hot press, and an inner layer pattern is formed by etching to obtain an inner layer wiring board.
【００３５】同様に、ＮＣドリル貫通孔加工機で直径１
５０μmの貫通孔をあけ導電性を有したペーストを充填
して外層用の絶縁基材を２枚形成し、これら外層用の配
線板を上記の内層用配線板の両側に面接して積層し、表
面を銅箔で挟みこみ真空熱プレスにより加熱加圧成形を
行い、外層用パターンをエッチングで形成し試験用の基
板を得た。Similarly, an NC drill through-hole drilling machine is used to cut a diameter of 1
A through hole of 50 μm is opened, filled with a paste having conductivity, two insulating base materials for the outer layer are formed, and these wiring boards for the outer layer are laminated in contact with both sides of the wiring board for the inner layer, The surface was sandwiched between copper foils, heated and pressed by a vacuum hot press, and an outer layer pattern was formed by etching to obtain a test substrate.
【００３６】（実施例３）絶縁基材としてアラミド不織
布にエポキシ樹脂を含浸させて作った多孔質基材を用
い、それにエキシマレーザ加工機で直径２００μm の貫
通孔をあけた後、エポキシ樹脂ペーストを貫通孔に充填
した。エポキシ樹脂の充填は半ねり状のエポキシ樹脂ペ
ーストをスキージで貫通孔に詰め込む等の方法により行
い、その後再度同じ位置に直径１５０μm の貫通孔をエ
キシマレーザで穿孔することにより貫通孔内壁に樹脂層
を有した所望の直径の貫通孔を得る。次に、導電性ペー
ストを充填しビアホールを形成後、銅箔で両側を挟み真
空熱プレスにより加熱加圧成形し、内層用パターンをエ
ッチングで形成し内層用配線板を得る。Example 3 A porous substrate made by impregnating an aramid nonwoven fabric with an epoxy resin was used as an insulating substrate, and a through hole having a diameter of 200 μm was formed in the porous substrate with an excimer laser processing machine. Filled through holes. The filling of the epoxy resin is performed by filling the through-hole with a squeegee using a semi-twist-like epoxy resin paste, and thereafter, a through-hole having a diameter of 150 μm is formed again at the same position with an excimer laser to form a resin layer on the inner wall of the through-hole. Thus, a through hole having a desired diameter is obtained. Next, after filling a conductive paste to form a via hole, both sides are sandwiched by a copper foil and heated and pressed by a vacuum hot press, and an inner layer pattern is formed by etching to obtain an inner layer wiring board.
【００３７】外層用として、上記の内層用配線板と同様
にして、エポキシ樹脂ペーストを貫通孔に充填し、再度
同じ位置に直径１５０μm の貫通孔をエキシマレーザで
穿孔することにより貫通孔壁に樹脂層を有した貫通孔を
設けた後、導電性ペーストを貫通孔に充填した外層用の
配線板を形成した。外層用の配線板２枚を内層用配線板
の両側に配し銅箔で挟みこみ真空熱プレスにより加熱加
圧成形を行い、外層用パターンをエッチングで形成し試
験用基板を得た。For the outer layer, an epoxy resin paste is filled in the through-hole in the same manner as in the wiring board for the inner layer, and a through-hole having a diameter of 150 μm is formed again at the same position with an excimer laser, thereby forming a resin layer on the wall of the through-hole. After providing a through hole having a layer, a wiring board for an outer layer in which a conductive paste was filled in the through hole was formed. Two wiring boards for the outer layer were arranged on both sides of the wiring board for the inner layer, sandwiched between copper foils, heated and pressed by a vacuum hot press, and a pattern for the outer layer was formed by etching to obtain a test substrate.
【００３８】（実施例４）絶縁基材としてアラミド不織
布にエポキシ樹脂を含浸させて作った多孔質基材である
アラミドエポキシコンポジットを用い、それにエキシマ
レーザ加工機等で直径１８０μm の貫通孔をあけ、樹脂
溶液を貫通孔内壁部に塗布し樹脂層を形成し貫通孔を所
望の直径にした後、導電性ペーストを充填しビアを形成
後、銅箔で両側を挟み真空熱プレスにより加熱加圧成形
し、内層用パターンをエッチングで形成し内層用の配線
板を得る。Example 4 An aramid nonwoven fabric was impregnated with an epoxy resin as an insulating base material, and an aramid epoxy composite was used as a porous base material. A 180 μm diameter through-hole was formed in the aramid epoxy composite using an excimer laser processing machine or the like. A resin solution is applied to the inner wall of the through-hole to form a resin layer, the through-hole is formed to a desired diameter, and then filled with conductive paste to form a via. Then, an inner layer pattern is formed by etching to obtain an inner layer wiring board.
【００３９】同様にして、外層用の配線板を得るため
に、エキシマレーザ加工機等で直径１８０μm の貫通孔
をあけ、樹脂溶液を塗布することにより貫通孔内壁部に
樹脂層を形成し貫通孔を所望の直径にした後、貫通孔に
導電性ペーストを充填した絶縁基材を形成し、両側に配
し銅箔で挟みこみ真空熱プレスにより加熱加圧成形を行
い、外層用パターンをエッチングで形成し試験用の多層
配線基板を得た。Similarly, in order to obtain a wiring board for an outer layer, a through-hole having a diameter of 180 μm is made by an excimer laser machine or the like, and a resin solution is applied to form a resin layer on the inner wall of the through-hole. After having a desired diameter, form an insulating base material filled with conductive paste in the through holes, arrange it on both sides, sandwich it with copper foil, perform heat and pressure molding by vacuum hot press, and etch the outer layer pattern by etching. A multilayer wiring board for testing was obtained.
【００４０】（実施例５）貫通孔内壁部に樹脂層を形成
するために埋め込む樹脂としてフィラー入りのものを用
いた他は実施例３と全く同様に試験用基板を作成した。
フィラー材料としては無機物系の絶縁材料を樹脂材料に
混合して使用した。また、フィラー材料を適切に選定し
含有量を調整することにより、熱膨張係数を導電性ペー
ストとほぼ同じ値にしてある。Example 5 A test substrate was prepared in exactly the same manner as in Example 3 except that a resin containing a filler was used as a resin to be embedded in the inner wall portion of the through hole to form a resin layer.
As a filler material, an inorganic insulating material was mixed with a resin material and used. In addition, by appropriately selecting the filler material and adjusting the content, the thermal expansion coefficient is set to substantially the same value as that of the conductive paste.
【００４１】（実施例６）貫通孔内壁部に樹脂層を形成
するために埋め込む樹脂としてフィラー入りのものを用
いた他は実施例４と全く同様に評価用基板を作成した。
フィラー材料としては無機物系の絶縁材料を樹脂材料に
混合して使用した。また、フィラー材料を適切に選定し
含有量を調整することにより、熱膨張係数を導電性ペー
ストとほぼ同じ値にしてある。Example 6 A substrate for evaluation was prepared in exactly the same manner as in Example 4 except that a resin containing a filler was used as a resin to be embedded in the inner wall portion of the through hole to form a resin layer.
As a filler material, an inorganic insulating material was mixed with a resin material and used. In addition, by appropriately selecting the filler material and adjusting the content, the thermal expansion coefficient is set to substantially the same value as that of the conductive paste.
【００４２】（比較例）比較例用として、アラミド不織
布にエポキシ樹脂を含浸させて作った多孔質基材エキシ
マレーザ加工機で直径１５０μm の貫通孔をあけ導電性
ペーストを充填しビアを形成後、銅箔で両側を挟み真空
熱プレスにより加熱加圧成形し、内層用パターンをエッ
チングで形成し内層用板を得、さらに同様に外層用板と
を得た。Comparative Example For a comparative example, a through hole having a diameter of 150 μm was made with a porous substrate excimer laser processing machine made by impregnating an aramid nonwoven fabric with an epoxy resin, and a conductive paste was filled with a conductive paste. Both sides were sandwiched between copper foils, pressed under heat and pressure by a vacuum hot press, and an inner layer pattern was formed by etching to obtain an inner layer plate, and similarly, an outer layer plate.
【００４３】内層用板と外層用板との間で、プレスによ
り加熱加圧成形を行い、外層用パターンをエッチングで
形成し比較例の試験基板を得た。Heat and pressure molding was performed by pressing between the inner layer plate and the outer layer plate, and the outer layer pattern was formed by etching to obtain a test substrate of a comparative example.
【００４４】本実施例および比較例にて作成した試験用
基板を用いてビアホールと電気的な接続の信頼性および
ビア間の耐マイグレーション性（絶縁性）を評価した。
本発明のプリント配線板によって作成されるビアの電気
的な接続信頼性の評価方法は次のように行う。Using the test substrates prepared in this example and the comparative example, the reliability of the electrical connection with the via hole and the migration resistance (insulation) between the vias were evaluated.
The method for evaluating the electrical connection reliability of the via formed by the printed wiring board of the present invention is performed as follows.
【００４５】（１）ビアホール接続抵抗 ビアの接続抵抗の評価方法はビア接続が直列に５００個
のチェーン配線を接続した抵抗測定により行う。ビア５
００個分の接続抵抗と配線抵抗の総和分を４端子測定法
で求め、試験前後のビア抵抗値の変化量を求めるもので
ある。信頼性試験として温度サイクル試験および半田デ
ィップ（はんだ浸漬）試験、オイルディップ（油浸）試
験を行った。(1) Via-hole connection resistance Via connection resistance is evaluated by measuring resistance in which 500 chain wirings are connected in series via connection. Via 5
The sum of 00 connection resistances and wiring resistances is determined by a four-terminal measurement method, and the amount of change in via resistance before and after the test is determined. As a reliability test, a temperature cycle test, a solder dip (solder immersion) test, and an oil dip (oil immersion) test were performed.
【００４６】温度サイクル試験は気相中にてー５５℃で
３０分放置し、後＋１２５℃で３０分放置を繰り返し１
０００回実施したとき、ビア接続抵抗の変化量で比較す
る。はんだディップ試験は、２３０℃に溶解したはんだ
槽に１０秒間漬けた後同様にビア接続抵抗の変化量を測
定、比較する。In the temperature cycle test, the sample was left standing at −55 ° C. for 30 minutes in the gas phase, and then left at + 125 ° C. for 30 minutes.
When the test is performed 000 times, a comparison is made based on the amount of change in via connection resistance. In the solder dip test, after immersing in a solder bath melted at 230 ° C. for 10 seconds, the amount of change in via connection resistance is measured and compared in the same manner.
【００４７】オイルディップ試験はオイルによる液相中
の温度サイクル試験である。試験基板を高温２６０℃に
加熱したオイル中に１０秒間漬け、室温で１０秒間保持
し、さらに２０℃のオイル中に１０秒間漬ける。評価は
この温度サイクルを２００回繰り返した後に行う。その
時、高温側、低温側それぞれの漬けている時の抵抗を測
定し２００回の間断線がないことを確認し、２００回後
の抵抗値変化量を測定し比較する。The oil dip test is a temperature cycle test in a liquid phase using oil. The test substrate is immersed in oil heated to 260 ° C. for 10 seconds, kept at room temperature for 10 seconds, and further immersed in oil at 20 ° C. for 10 seconds. The evaluation is performed after repeating this temperature cycle 200 times. At this time, the resistance of each of the high-temperature side and the low-temperature side is measured, and it is confirmed that there is no disconnection for 200 times. Then, the resistance change after 200 times is measured and compared.
【００４８】（２）耐マイグレーション性試験 電気的に接続されている５００ビアのチェーン配線を設
け、そのすぐ隣に一定の間隔をおいて、電気的に接続さ
れている５００ビアのチェーン配線を設ける。それぞれ
のチェーン配線は接続されていない。これらのそれぞれ
の配線チェーンに＋３５Ｖの電位差を与え６０℃９５％
の湿熱中に１０００時間放置した後のそれぞれのチェー
ン配線間の抵抗値を比較測定した。これらの電気的な接
続信頼性および耐マイグレーション性の評価結果を表１
に示す。(2) Migration resistance test A chain wiring of 500 vias which are electrically connected is provided, and a chain wiring of 500 vias which are electrically connected is provided immediately next to the chain wiring at a predetermined interval. . Each chain wiring is not connected. A potential difference of +35 V is applied to each of these wiring chains, and 60 ° C. and 95%
After 1000 hours of standing in the wet heat of each sample, the resistance value between the chain wires was compared and measured. Table 1 shows the evaluation results of the electrical connection reliability and migration resistance.
Shown in
【００４９】[0049]
【表１】 [Table 1]
【００５０】表１に示すように本実施例のプリント配線
板は比較例のプリント配線板に比べて接続抵抗値の変化
量が小さいのが分かる。また耐マイグレーション性も良
好なことが分かる。特に貫通孔内壁の樹脂層にフィラー
を混合したものは電気的な接続信頼性が向上し絶縁抵抗
値が高く耐マイグレーション性が向上しているのが分か
る。本発明のプリント配線板では、貫通孔の内壁に樹脂
層を形成することによりビアホール貫通孔内壁の状態を
良好円滑にせしめ、ビアホールによる接続信頼性を高
め、ビアホール接続不良、マイグレーションによる絶縁
破壊等を起こさないようにすることができる。As shown in Table 1, it can be seen that the printed wiring board of this embodiment has a smaller change in the connection resistance value than the printed wiring board of the comparative example. It can also be seen that the migration resistance is good. In particular, it can be seen that the one in which the filler is mixed into the resin layer on the inner wall of the through hole has improved electrical connection reliability, high insulation resistance value, and improved migration resistance. In the printed wiring board of the present invention, by forming a resin layer on the inner wall of the through hole, the state of the inner wall of the via hole through hole can be made smooth smoothly, the connection reliability by the via hole can be increased, the via hole connection failure, insulation breakdown due to migration, and the like can be prevented. Can be prevented from waking up.
【００５１】[0051]
【発明の効果】以上のように本発明のプリント配線板お
よび製造方法は貫通孔の内壁に樹脂層を形成することに
より多孔質基材を用いた場合でも、ビアホール貫通孔内
壁の状態を良好にせしめ、導電性ペーストを貫通孔内部
に確実に充填でき、ビアホールによる接続信頼性を高
め、ビアホール接続不良、マイグレーションによる絶縁
破壊等を起こさないようにすることができ、品質を大幅
に向上させることができる。As described above, the printed wiring board and the manufacturing method of the present invention can improve the state of the inner wall of the via hole through hole even when a porous substrate is used by forming a resin layer on the inner wall of the through hole. At the very least, the conductive paste can be reliably filled into the through-hole, the connection reliability by the via hole can be increased, the via-hole connection failure, insulation breakdown due to migration, etc. do not occur, and the quality can be greatly improved. it can.
【図１】本発明の実施例のプリント配線板を説明するた
めの部分縦断面図である。FIG. 1 is a partial longitudinal sectional view illustrating a printed wiring board according to an embodiment of the present invention.
【図２】多層ブリント配線基板の部分縦断面図である。FIG. 2 is a partial vertical sectional view of a multilayer printed wiring board.
【図３】従来のプリント配線板を説明するための部分縦
断面図である。FIG. 3 is a partial longitudinal sectional view for explaining a conventional printed wiring board.
１ ビアホール １０ 貫通孔 ２ 絶縁基材 ３ 樹脂層 ４ 銅箔 ５ 導電ペースト ６ 導電ペーストしみこみ部 REFERENCE SIGNS LIST 1 via hole 10 through hole 2 insulating base material 3 resin layer 4 copper foil 5 conductive paste 6 conductive paste soaked part
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｈ０５Ｋ 3/46 Ｈ０５Ｋ 3/46 Ｘ ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 6 Identification code FI H05K 3/46 H05K 3/46 X
Claims (11)
ト配線板において、 上記ビアホールが、樹脂含浸繊維シートよりなる絶縁用
基材に形成したビアホール用の貫通孔と、該孔内面に被
覆形成した樹脂層と、該樹脂層を介して該孔内側に充填
硬化された導体と、から成ることを特徴とするプリント
配線板。1. A printed wiring board having a via hole for connecting an electrode, wherein the via hole has a through hole for a via hole formed in an insulating base material made of a resin-impregnated fiber sheet, and a resin formed on the inner surface of the hole. A printed wiring board comprising: a layer; and a conductor which is filled and cured inside the hole via the resin layer.
る樹脂含浸繊維シートに含有の樹脂の加熱溶解成分であ
る請求項１のプリント配線板。2. The printed wiring board according to claim 1, wherein the resin layer is a heat-dissolving component of a resin contained in the resin-impregnated fiber sheet in the process of forming the through holes.
樹脂含浸繊維シートの貫通孔に樹脂液を埋め込みその樹
脂硬化体に貫通孔を穿孔して成る残部であることを特徴
とする請求項１のプリント配線板。3. The resin layer according to claim 1, wherein a resin liquid is embedded in the through-holes of the resin-impregnated fiber sheet in the process of forming the through-holes, and the remaining portion is formed by perforating the through-holes in the cured resin. Printed wiring board.
プリント配線板のビアホール用の貫通孔に付着した樹脂
液の乾燥硬化膜であることを特徴とするプリント配線
板。4. A printed wiring board, wherein the resin layer is a dried and cured film of a resin liquid adhered to a through hole for a via hole of the printed wiring board in a process of forming the through hole.
が含有されていることを特徴とする請求項１、３又は４
記載のプリント配線板。5. The resin layer according to claim 1, wherein the resin layer contains an electrically insulating filler.
The printed wiring board as described.
に電極接続用のビアホールを備えたプリント配線板の製
造方法において、 該絶縁用基材にビアホール用の貫通孔を形成し、該貫通
孔内面に樹脂層を被覆形成し、その後に該樹脂層を介在
したまま貫通孔内側に接続導体を形成することにより、
上記ビアホールを形成することを特徴とするプリント配
線板の製造方法。6. A method for manufacturing a printed wiring board having a via hole for connecting an electrode to an insulating substrate made of a resin-impregnated fiber sheet, wherein a through hole for a via hole is formed in the insulating substrate. By forming a resin layer on the inner surface and then forming a connection conductor inside the through hole with the resin layer interposed,
A method for manufacturing a printed wiring board, wherein the via hole is formed.
加熱して形成し、この貫通孔形成の際に上記樹脂層を絶
縁用基材の加熱溶解成分により貫通孔内面に形成するこ
とを特徴とする請求項６記載のプリント配線板の製造方
法。7. The through-hole is formed by irradiating the insulating base material with laser irradiation, and the resin layer is formed on the inner surface of the through-hole by the heat-melting component of the insulating base material when forming the through-hole. The method for manufacturing a printed wiring board according to claim 6, wherein:
を充填し、その樹脂硬化体に改めて小径の貫通孔を穿孔
して上記樹脂層となし、その後に樹脂層内側に接続導体
を形成することを特徴とする請求項６記載のプリント配
線板の製造方法。8. After the formation of the through-hole, the through-hole is filled with a resin, a small-diameter through-hole is newly formed in the cured resin to form the resin layer, and then a connection conductor is formed inside the resin layer. The method for manufacturing a printed wiring board according to claim 6, wherein the printed wiring board is formed.
樹脂液を付着させて後乾燥硬化させて樹脂層を形成し、
その後貫通孔に接続導体を充填形成することを特徴とす
るプリント配線板の製造方法。9. After the formation of the through hole, a resin liquid is adhered to the inner surface of the through hole, followed by drying and curing to form a resin layer,
A method for manufacturing a printed wiring board, characterized in that a through-hole is filled with a connection conductor thereafter.
程が、ＣＯ2 レーザ加熱加工法を用いることを特徴とす
る請求項６記載のプリント配線板の製造方法。10. The method for manufacturing a printed wiring board according to claim 6, wherein said step of forming said through hole in said insulating base material uses a CO 2 laser heating method.
維又はアラミド線維と、エポキシ樹脂又はビスマレイミ
ドトリアジン樹脂と、のコンポジットであることを特徴
とする請求項１ないし８何れかに記載のプリント配線
板。11. The printed wiring board according to claim 1, wherein the resin-impregnated fiber sheet is a composite of glass fiber or aramid fiber and epoxy resin or bismaleimide triazine resin. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33582397A JP3441945B2 (en) | 1997-12-05 | 1997-12-05 | Printed wiring board and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33582397A JP3441945B2 (en) | 1997-12-05 | 1997-12-05 | Printed wiring board and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11177199A true JPH11177199A (en) | 1999-07-02 |
| JP3441945B2 JP3441945B2 (en) | 2003-09-02 |
Family
ID=18292812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33582397A Expired - Fee Related JP3441945B2 (en) | 1997-12-05 | 1997-12-05 | Printed wiring board and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3441945B2 (en) |
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| JP2002299784A (en) * | 2001-03-29 | 2002-10-11 | Matsushita Electric Ind Co Ltd | Connection structure of substrate, and manufacturing method thereof |
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