JPH1117370A - Heat sink for electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat sink for electronic equipment with high cooling capability. SOLUTION: The upstream side of a second heat sink body 3 with a semi- closed structure, where the upstream side and a downstream side are opened, is provided at the downstream side end part of a first heat sink body 2 with a semi-closed structure where the upstream and downstream sides are opened, a first forced cooling means 5 for circulating a refrigerant in the first and second heat sink bodies 2 and 3 and cooling the first and second heat sink bodies 2 and 3 from the inside is provided at the upstream side opening part, and at the same time, a second forced cooling means 6 for cooling the outside of the second heat sink body 3 is provided near the second heat sink body 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiator for electronic equipment using an element (hereinafter, referred to as a heating element) that generates heat during use, such as an IC or an LSI.

[0002]

2. Description of the Related Art In recent years, in electronic devices such as an electronic exchange device using a heating element and a ground base station device, there is a demand for higher processing capability, more complicated control functions, higher accuracy, and the like. There is a demand for space saving so that it can be easily installed.

For this reason, the heat generation density in the electronic device, that is, the amount of heat generated per unit area or unit volume is increased, which may lower the performance. There has been a demand, and various radiators for electronic devices have been proposed and put into practical use (for example, Japanese Utility Model Application Laid-Open No. 58-78592).

FIG. 5 shows an example of a conventional radiator for electronic equipment, in which a plurality of heating elements b are mounted on the outer surface of a radiator body a with screws c and generated by these heating elements b. The heat is radiated by the radiator body a.

The radiator body a is formed in a box shape having a semi-hermetic structure with both ends opened, and a plurality of radiating fins d are arranged inside the radiator body at intervals in the vertical direction. Are arranged as follows.

In the opening on the upstream side of the radiator body a,
A forced cooling fan e is mounted, a radiating unit f is configured by the forced cooling fan e and the radiator body a, and the radiating unit f is fixed in a housing g of the electronic device.

In the conventional radiator for an electronic device configured as described above, the surface temperature of the radiator main body a rises from an initial value T due to heat generated from the heat generating element b when the electronic device is used. The heat quantity ΔQ1 is given to the entirety of “a”.

Further, when the cooling air sent from the forced cooling fan e passes through the radiator body a due to the operation of the forced cooling fan e, the heat quantity ΔQ2 is exchanged by the radiating fins d and the like, and is heated by the heat exchange. The discharged air is discharged out of the radiator body a through the opening on the downstream side.

The amount of heat ΔQ generated by the heating element b
When the heat quantity ΔQ2 radiated from the radiator body a is equal to 1, the rise in the surface temperature of the radiator body a stops, and the radiator body a and the heating element b become T + ΔTa, T + ΔTb.
Equilibrate at T + ΔTn.

[0010]

In the above-mentioned conventional radiator for electronic equipment, when the heat generation amount .DELTA.Q2 of the heating element b becomes larger than the heat release amount .DELTA.Q1 of the heat radiating unit f, the surface temperature of the heating element b becomes T + .DELTA.Tn more than T + .DELTA.Tn. T + ΔTb
1... T + ΔTn1, and as a result, the heating element b is heated, so that the performance is lowered and the life is shortened.
In the worst case, there is a defect such as being destroyed.

The relational expression of each temperature is shown in the following expression.

[0012]

## EQU1 ## In the conventional radiator body a, the cooling air is warmed toward the outlet side, and the cooling capacity is reduced.
Actually, it is as shown in the following Expression 2.

[0013]

## EQU2 ## As is apparent from the above equation (2), when the heat generation amounts of the respective heating elements b are equal, the heating element b attached to a location near the opening on the downstream side receives the greatest thermal stress.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and has as its object to provide a radiator for electronic equipment having a high cooling capacity.

[0015]

According to the present invention, a second radiator body is provided downstream of a first radiator body on which a heating element is mounted, and the first radiator body is provided with a second heat radiator body. Since the heat on the downstream side is propagated to the second radiator main body and radiated by the second radiator main body, the heat stress of the heating element mounted downstream of the first radiator main body increases, It is possible to prevent the performance and life of the heating element from being reduced or destroyed.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, the upstream side and the downstream side are opened at the downstream end of the first radiator body having a semi-hermetic structure having the upstream side and the downstream side opened. The first radiator main body having the semi-closed structure is provided such that the upstream side of the second radiator main body is positioned, and the first radiator main body is provided with the first,
A first forced cooling means is provided for cooling the first and second radiator bodies from the inside by circulating a refrigerant in the second radiator body, and a second radiator is provided near the second radiator body. A second forced cooling means for cooling the outside of the main body is provided.

According to the above configuration, since the heat on the downstream side of the first radiator main body propagates to the second radiator main body side and is cooled by the second radiator main body, it is mounted on the downstream side of the first radiator main body. It is possible to prevent the heat stress of the generated heating element from being increased, thereby lowering the performance and life, or preventing breakage.

Further, the first forced cooling means cools the inside of the first and second radiator bodies, and the second forced cooling means cools the outside of the second radiator body, so that the refrigerant flowing inside and outside is mixed with each other. Since they do not match, the cooling capacity is improved.

According to a second aspect of the present invention, the first aspect
The radiator main body and the second radiator main body are connected via a coupler.

According to the above configuration, the first radiator main body and the second radiator main body can be manufactured separately, and these can be connected and used as needed, so that versatility is improved.

[0021] The invention described in claim 3 of the present invention provides the following.
The second radiator main body is provided integrally on the downstream side of the radiator main body.

According to the above configuration, since the structure of the first and second radiator bodies is simplified, the manufacture is easy.

[0023] The invention described in claim 4 of the present invention is the first invention.
A heat pipe filled with a refrigerant is provided in both side walls of the radiator body and the second radiator body so as to pass therethrough.

With the above configuration, the heat on the first radiator main body side is efficiently transmitted to the second radiator main body via the heat pipe, so that the cooling performance is further improved.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings shown in FIGS.

(Embodiment 1) FIG. 1 shows Embodiment 1 of the present invention, in which 1 indicates a heat radiating unit.

The radiating unit 1 includes a first radiator body 2
And a second radiator main body 3, a coupler 4 for coupling the radiator main bodies 2 and 3, and a first forced cooling means 5 and a second forced cooling means 6 comprising a cooling fan.

The first radiator body 2 is formed in a box shape having a semi-hermetic structure with both ends opened as in the prior art, and a plurality of cooling fins 2a are provided therein with a space therebetween in the vertical direction. , And a plurality of heating elements 7 are attached to the outer surface with fixing members 8 such as screws.

The second radiator main body 3 is formed in a box shape having a semi-hermetic structure having substantially the same outer dimensions as the first radiator main body 2, and instead of having cooling fins inside, the outer radiator main body 3 has both outer surfaces. Are provided with a plurality of cooling fins 3a.

The cooling fin 3a is connected to the second radiator body 3
Each radiating fin 3 is provided so that heat can be efficiently radiated by the cooling air blown from the second forced cooling means 6 installed below the fins 3.
a is installed in the vertical direction.

The coupler 4 for coupling the first and second radiator bodies 2 and 3 is formed in a box shape having a semi-hermetic structure with both ends opened, and the coupling portions 4a provided at both ends. , 4b
Are fixed to the opening on the downstream side of the first radiator main body 2 and the opening on the upstream side of the second radiator main body 3 by fasteners 9 such as screws. The radiator body 3 can be connected in a straight line.

One or more first forced cooling means 5 are attached to the upstream opening of the first radiator body 2 by means of a fixing tool 10 such as a screw.

The heat radiating unit 1 configured as described above is
It is fixed in the housing 12 of the electronic device.

Next, the operation of the electronic device radiator constructed as described above will be described. The surface temperature of the first radiator body 2 rises from the initial value T due to heat generated from the heat generating element when the electronic device is used. And the amount of heat ΔQ11
give.

The operation of the first forced cooling means 5 causes the cooling air sent from the forced cooling means 5 to be supplied to the first radiator body 2.
When passing through the inside, the amount of heat ΔQ
The heat exchanged by the heat exchanger 12 causes the air warmed by the heat exchange to pass through the coupler 4 and reach the second radiator body 3.

A part ΔQ12 of the heat quantity ΔQ11 propagated from the first radiator body 2 to the second radiator body 3 via the coupler 4 is cooled by the radiating fins 3a cooled by the second forced cooling means 6. Heat is exchanged with air and heat is dissipated.

As a result, the surface temperatures of the heating elements 7 become T + ΔTa2, T + ΔTb2... T + ΔTn2, and are balanced at a temperature sufficiently lower than that of the conventional radiator for electronic equipment. Since the two radiator bodies 3 are coupled via the coupler 4, heat on the downstream side of the first radiator body 2 is transmitted to the second radiator body 3 via the coupler 4 and cooled. , Thereby the first
Since the surface temperature on the downstream side of the radiator body 2 does not increase as in the related art, the heating element 7 mounted on the downstream side of the first radiator body 2 does not receive the greatest thermal stress.

In the first embodiment, almost all of the cooling air passing through the first radiator body 2 is supplied to the second radiator body 3.
However, a part of the cooling air may be sent to the second radiator body 3.

(Embodiment 2) In the embodiment shown in FIG. 2, a fitting portion 2b is formed on the downstream side of the first radiator main body 2 so that the upstream opening of the second radiator main body 3 fits. By connecting the second radiator main body 3 directly to the first radiator main body 2, the coupler 4 is omitted, and the coupler 4 becomes unnecessary, so that the configuration is simplified.

(Embodiment 3) In the embodiment shown in FIG. 3, the first radiator body 2 and the second radiator body 3 are integrated, and the first radiator body 2 and the second radiator body Since it is not necessary to manufacture the 3 separately, manufacturing and assembling become easy.

(Embodiment 4) In the embodiment shown in FIG. 4, a plurality of heat pipes 13 penetrate through both side walls of the first radiator main body 2 and the second radiator main body 3, and 13, a refrigerant such as water or ammonia is sealed in a decompressed state, and the heat of the first radiator main body 2 is efficiently transmitted to the second radiator main body 3 through the heat pipe 13, so that cooling is performed. Ability is further improved.

It should be noted that any of Embodiments 2 to 4 above
Although the first forced cooling means 5 and the second forced cooling means 6 are provided similarly to the first embodiment, they are omitted in the drawing.

Since these operations are the same as those of the first embodiment, their description will be omitted.

Further, in any of the embodiments, the first,
Although a cooling fan is used for the second forced cooling means 5 and 6, a cooling medium such as cooling water or cooling oil may be circulated by a pump or the like for cooling.

[0045]

As described above in detail, the present invention provides a second radiator main body downstream of a first radiator main body to which a heating element is attached, and the first radiator is provided by first forced cooling means. A refrigerant such as air is circulated from the upstream side of the main body to the downstream side of the second radiator main body to cool the inside of the first and second radiator main bodies, and to force the outside of the second radiator main body to the second forced state. Since the cooling is performed by the cooling means, the heat on the downstream side of the first radiator body is transmitted to the second radiator body and cooled, so that the temperature on the downstream side of the first radiator body is significantly increased. Never do.

As a result, it is possible to solve the problem that the heat-generating element is mounted on the downstream side of the first radiator main body and overheats the heat-generating element, thereby deteriorating the performance, the life, or being destroyed. Means cools the insides of the first and second radiator bodies and the second forced cooling means cools the outside of the second radiator body, so that the refrigerants do not mix with each other, thereby providing cooling. Efficiency is also greatly improved.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a radiator for an electronic device according to a first embodiment of the present invention.

FIG. 2 is an exploded perspective view of a radiator for an electronic device according to a second embodiment of the present invention.

FIG. 3 is an exploded perspective view of a radiator for electronic equipment according to Embodiment 3 of the present invention.

FIG. 4 is an exploded perspective view of a radiator for an electronic device according to a fourth embodiment of the present invention.

FIG. 5 is an explanatory view of a conventional radiator for electronic equipment.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 radiator unit 2 first radiator body 2a radiating fin 3 second radiator body 3a radiating fin 4 coupler 4a, 4b coupling portion 5 first forced cooling means 6 second forced cooling means 7 heat generating element 8, 9, 10 fixed Fixture 13 Heat pipe Document describing chemical formula, etc.

(Equation 1)

(Equation 2)

Claims (4)

[Claims] 1. An upstream side of a semi-sealed second radiator main body having an upstream and a downstream side is located at a downstream end of a semi-sealed first radiator main body having an upstream and a downstream side opened. The first and second radiator main bodies are cooled by flowing a refrigerant through the first and second radiator main bodies through the upstream opening of the first radiator main body. A radiator for an electronic device, comprising: a forced cooling means; and a second forced cooling means for cooling the outside of the second radiator body near the second radiator body. 2. The radiator according to claim 1, wherein the first radiator main body and the second radiator main body are connected via a coupler. 3. The radiator for an electronic device according to claim 1, wherein a second radiator main body is integrally provided downstream of the first radiator main body. 4. The radiator for an electronic device according to claim 1, wherein heat pipes filled with a refrigerant are provided in both side walls of the first radiator body and the second radiator body so as to pass therethrough.