JPH11150133A - 半導体素子の搭載方法及びそのシステム、半導体素子分離装置並びにｉｃカードの製造方法 - Google Patents

半導体素子の搭載方法及びそのシステム、半導体素子分離装置並びにｉｃカードの製造方法

Info

Publication number
JPH11150133A
JPH11150133A JP10227052A JP22705298A JPH11150133A JP H11150133 A JPH11150133 A JP H11150133A JP 10227052 A JP10227052 A JP 10227052A JP 22705298 A JP22705298 A JP 22705298A JP H11150133 A JPH11150133 A JP H11150133A
Authority
JP
Japan
Prior art keywords
adhesive sheet
semiconductor element
mounting
semiconductor
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10227052A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11150133A5 (enExample
Inventor
Hitoshi Odajima
均 小田島
Kazuyuki Futaki
和行 二木
Masato Matsuoka
真人 松岡
Tomochika Nakagawa
智愼 中川
Shoji Nakakuki
昌二 中久喜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10227052A priority Critical patent/JPH11150133A/ja
Publication of JPH11150133A publication Critical patent/JPH11150133A/ja
Publication of JPH11150133A5 publication Critical patent/JPH11150133A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H01L2221/6839—Separation by peeling using peeling wedge or knife or bar

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP10227052A 1997-09-04 1998-08-11 半導体素子の搭載方法及びそのシステム、半導体素子分離装置並びにｉｃカードの製造方法 Pending JPH11150133A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10227052A JPH11150133A (ja) 1997-09-04 1998-08-11 半導体素子の搭載方法及びそのシステム、半導体素子分離装置並びにｉｃカードの製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP23992497 1997-09-04
JP9-239924 1997-09-04
JP10227052A JPH11150133A (ja) 1997-09-04 1998-08-11 半導体素子の搭載方法及びそのシステム、半導体素子分離装置並びにｉｃカードの製造方法

Publications (2)

Publication Number Publication Date
JPH11150133A true JPH11150133A (ja) 1999-06-02
JPH11150133A5 JPH11150133A5 (enExample) 2005-01-20

Family

ID=26527481

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10227052A Pending JPH11150133A (ja) 1997-09-04 1998-08-11 半導体素子の搭載方法及びそのシステム、半導体素子分離装置並びにｉｃカードの製造方法

Country Status (1)

Country Link
JP (1) JPH11150133A (enExample)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002124494A (ja) * 2000-08-07 2002-04-26 Nitto Denko Corp 半導体ウエハの不要物除去方法およびその装置
US7185823B2 (en) 2004-02-05 2007-03-06 Hitachi, Ltd. Paper tag identified by using radiofrequency and method of manufacturing the same
JP2007123846A (ja) * 2005-09-29 2007-05-17 Semiconductor Energy Lab Co Ltd ピックアップ装置及びピックアップ方法
WO2008002083A1 (en) * 2006-06-30 2008-01-03 Kbctech Co., Ltd Rfid card using korea paper and the manufacturing method thereof
WO2008143004A1 (ja) * 2007-05-14 2008-11-27 Ulvac, Inc. ドライエッチング方法
JP2011093629A (ja) * 2009-10-27 2011-05-12 Sharp Corp 電子部品搬送装置
JP2011093628A (ja) * 2009-10-27 2011-05-12 Sharp Corp 電子部品搬送装置
JP2014053517A (ja) * 2012-09-10 2014-03-20 Hitachi High-Tech Instruments Co Ltd 受渡用ステージ及びダイピックアップ装置並びにダイボンディング装置
JP2014165379A (ja) * 2013-02-26 2014-09-08 Lintec Corp シート剥離装置および剥離方法
JP2014181119A (ja) * 2013-03-21 2014-09-29 Fuji Xerox Co Ltd フィルム分離装置
WO2017168498A1 (ja) * 2016-03-28 2017-10-05 富士機械製造株式会社 部品供給装置、実装装置及び部品供給方法
JP2018177399A (ja) * 2017-04-05 2018-11-15 アルプス電気株式会社 剥離方法及びプログラム
JP2019102401A (ja) * 2017-12-08 2019-06-24 株式会社村田製作所 積層電極体の製造装置
JP2019175927A (ja) * 2018-03-27 2019-10-10 株式会社東京精密 ウェーハ分割装置及び方法
CN112766446A (zh) * 2021-01-12 2021-05-07 深圳市金冠威科技有限公司 智能卡rfid全自动化生产线

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002124494A (ja) * 2000-08-07 2002-04-26 Nitto Denko Corp 半導体ウエハの不要物除去方法およびその装置
US7185823B2 (en) 2004-02-05 2007-03-06 Hitachi, Ltd. Paper tag identified by using radiofrequency and method of manufacturing the same
US7413130B2 (en) 2004-02-05 2008-08-19 Hitachi, Ltd. Paper tag identified by using radiofrequency and method of manufacturing the same
JP2007123846A (ja) * 2005-09-29 2007-05-17 Semiconductor Energy Lab Co Ltd ピックアップ装置及びピックアップ方法
WO2008002083A1 (en) * 2006-06-30 2008-01-03 Kbctech Co., Ltd Rfid card using korea paper and the manufacturing method thereof
US7909258B2 (en) 2006-06-30 2011-03-22 Kbctech Co., Ltd. RFID card using Korea paper and the manufacturing method thereof
WO2008143004A1 (ja) * 2007-05-14 2008-11-27 Ulvac, Inc. ドライエッチング方法
JP5090443B2 (ja) * 2007-05-14 2012-12-05 株式会社アルバック ドライエッチング方法
JP2011093628A (ja) * 2009-10-27 2011-05-12 Sharp Corp 電子部品搬送装置
JP2011093629A (ja) * 2009-10-27 2011-05-12 Sharp Corp 電子部品搬送装置
JP2014053517A (ja) * 2012-09-10 2014-03-20 Hitachi High-Tech Instruments Co Ltd 受渡用ステージ及びダイピックアップ装置並びにダイボンディング装置
JP2014165379A (ja) * 2013-02-26 2014-09-08 Lintec Corp シート剥離装置および剥離方法
JP2014181119A (ja) * 2013-03-21 2014-09-29 Fuji Xerox Co Ltd フィルム分離装置
WO2017168498A1 (ja) * 2016-03-28 2017-10-05 富士機械製造株式会社 部品供給装置、実装装置及び部品供給方法
JPWO2017168498A1 (ja) * 2016-03-28 2019-01-31 株式会社Ｆｕｊｉ 部品供給装置、実装装置及び部品供給方法
JP2018177399A (ja) * 2017-04-05 2018-11-15 アルプス電気株式会社 剥離方法及びプログラム
JP2019102401A (ja) * 2017-12-08 2019-06-24 株式会社村田製作所 積層電極体の製造装置
JP2019175927A (ja) * 2018-03-27 2019-10-10 株式会社東京精密 ウェーハ分割装置及び方法
CN112766446A (zh) * 2021-01-12 2021-05-07 深圳市金冠威科技有限公司 智能卡rfid全自动化生产线

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