JPH11145695A - Device of mounting component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device of mounting a component capable of speedily mounting a lot of various types of components delivered in connection with a plurality of component feeding cassettes and tray component feeding mechanisms. SOLUTION: A device comprises a tray component feeding section 8 having a plurality of tray component feeding mechanisms 7 serving a stocked component 2 by transferring a selected tray 4 from an enclosure position 5 to a component feeding position 6 as required, and a cassette component feeding section 13 having a plurality of component feeding cassettes 12 transferring and serving these components 2, one at a time, by loading a taping component, a bulk component, or the like. The component 2 stored in each tray 4 at the component feeding position 6 in each component feeding mechanism 7 of the tray component feeding section 8, and the component 2 sent to the component feeding position 11 in each component feeding cassette 12 of the cassette component feeding section 13, are mounted on the predetermined position on a mount substrate 1 by a mounting head 21 with various handling.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus, for example, by mounting various electronic components directly on a circuit board, or temporarily mounting them using cream solder and then performing reflow processing. It is used when manufacturing an electronic circuit board.

[0002]

2. Description of the Related Art For automatically mounting (including temporary mounting and mounting) such various electronic components on a circuit board, a component supply mechanism according to the type of component has been proposed and adopted. For example, fine so-called chip components are handled as taping components or bulk components by a component supply cassette, and each component is supplied to a predetermined position for use. Large or specially shaped irregular parts such as integrated circuits and connectors are stored in a plurality of trays, each of which is stored in a plural number, and a predetermined one is selected from the stored various trays. 2. Description of the Related Art It has been practiced to move a stored component to a predetermined component supply position and use the stored component.

Conventionally, by using these together in one component mounting device, various electronic components are stably supplied,
Even an electronic circuit board that requires various electronic components can be mounted using one or a small number of component mounting devices, thereby responding to further diversification of electronic components.

[0004]

By the way, recently,
With the progress of integrated circuits and the development of connectors, electronic components are becoming more diversified and larger. For this reason, it is necessary for the component mounting machine to handle electronic components of various types, forms, shapes, and sizes. The number of electronic components required to manufacture one electronic circuit board has been rapidly increasing due to the increase in functions and size of electric devices. In order to further improve productivity, further speeding up of component mounting is also required.

However, conventionally, various component supply cassettes and tray component supply mechanisms are simply used together to mount necessary types of components, and the various requirements described above cannot be satisfied. Absent.

For example, depending on the electronic circuit board to be manufactured, it is necessary to mount a large number of large electronic components suitable for a tray component supply mechanism. Has limitations.

If a large number of stored trays are sequentially supplied with drawn components in accordance with the selection of component type, a time lag occurs when the supply of different types of components from the tray component supply mechanism continues, resulting in a production delay. Is reduced.

A large-sized electronic component or a specially-shaped electronic component such as a connector that is not balanced around the center of gravity easily falls off when handled by a component mounting tool or a component transfer head, and is difficult to handle at high speed. For this reason, if various components are mounted sequentially using the component supply cassettes and tray component supply mechanisms that are installed side by side, it is necessary to mount other components while handling and mounting components with slow handling speed. There is a need to wait, which hinders further speeding up of component mounting.

An object of the present invention is to provide a plurality of tray component supply mechanisms together with a component supply cassette so that a single mounting machine can handle many types of components, and the mounting of components in a devised component supply form from them. An object of the present invention is to provide a component mounting apparatus capable of further increasing the speed.

[0010]

In order to achieve the above object, the present invention provides a method of selecting a tray containing predetermined components, moving the tray from a storage position to a component supply position as needed, and storing the tray. Tray component supply mechanism to use components
A plurality of tray component supply units, a cassette component supply unit in which a plurality of component supply cassettes are loaded and loaded with taping components and bulk components, and the components are sent one by one to a component supply position to be used; The components stored in each tray at the component supply position of each component supply mechanism of the supply unit and the components sent to the component supply position of each component supply cassette of the cassette component supply unit are picked up as necessary and placed on the mounting target. And a mounting head to be mounted at a predetermined position.

In such a configuration, the cassette component supply unit handles microcomponents that are frequently used, sequentially supplies various types of components from a large number of component supply cassettes, and uses the mounting head to match the high frequency of use. The tray component supply unit supplies individual components by alternately supplying different types of components by a plurality of tray component supply mechanisms that are provided in parallel while the tray components supply unit is mounted at a predetermined position on the handling / mounting object successively by a number. Even if the handling time is long, the time required to sequentially supply different kinds of parts is halved, the speed of supplying different kinds of parts from the tray is doubled, and the mounting head continuously handles and mounts the parts supplied from the cassette parts supply unit. While handling different types of parts from the tray in time to handle more types of parts as a whole.
In addition, the time lag for component supply can be reduced or eliminated, and the speed of component mounting can be increased.

According to the present invention, in addition to the above, the mounting head includes a plurality of component mounting tools for mounting components arranged in a predetermined direction, and stores a selected tray of a tray component supply mechanism provided adjacently in a storage position. The components are arranged in a direction and a pitch corresponding to the arrangement direction and the arrangement pitch of the component mounting tools on at least one of the shuttles which reciprocate so as to move the components to the component supply position and store the components in the storage position. A component transfer head provided with a component holding portion for holding, picking up a component stored in a tray that has been moved to a component supply position of a tray component supply mechanism, and transferring the component to the component holding portion to be held. The mounting head also picks up the component held by the component holding unit and mounts the component at a predetermined position on the mounting target.

[0013] In such a configuration, while the mounting head is continuously handling the components supplied from the cassette component supply unit in a number corresponding to the frequency of use, the mounting head may further include:
When different types of components are supplied by a plurality of adjacent tray component supply mechanisms, if there is enough time before the components of the tray are used, use the extra time to use the component supply position. A predetermined number of components are transferred to a plurality of component holding units provided on at least one of the shuttles for picking up components in the tray by the component transfer head and taking in and out the tray in the tray component supply mechanism, A predetermined number of the transferred components are picked up at a time by a component mounting tool of a mounting head having the same arrangement direction and arrangement pitch with the mounted components, so that they can be simultaneously handled and mounted. Including the case where a part of the parts are picked up directly from the tray at the parts supply position, the mounting efficiency of the parts Improved multiple of the number picked up, significant speed-up of the component mounting can be achieved. Therefore, it is preferable that the same number of component holding units as the component mounting tools of the mounting head are provided.

In addition to each of the above features,
The component transfer head preliminarily rotates the component picked up from the tray in a direction corresponding to the mounting direction of the mounting head to the mounting target based on the fact that the component is stored in the tray in a fixed direction, and holds the component. When the components are supplied by the tray, while the components supplied from the cassette component supply unit are being mounted by the mounting head, no special time is required in conjunction with the component supply operation in the tray component supply unit. By pre-rotating the parts, the time that the mounting head picks up the part, recognizes the image, and rotates it in a predetermined direction is omitted, so that it can be mounted immediately after pickup, The speed of component mounting can be further increased.

In each of the above features,
The mounting head, when the component to be handled is a mounting error or other problematic component, discharges the component on the problem component processing conveyor at a predetermined position. Is driven intermittently by a predetermined amount each time a sheet is received, and the receiving parts are conveyed in a certain direction at a certain pitch and provided for processing such as remounting and disposal,
When the received problem part is larger than the standard, the conveyance amount is increased by an integral multiple according to the size ratio.

In such a configuration, when the mounting head picks up various components to be supplied and sequentially mounts them on the mounting target, if there is a mounting error or other problematic component, it is placed in a predetermined position. The problem parts on the problem parts processing conveyor are manually re-used while leaving the space for receiving the next parts by transferring them at a fixed pitch on the problem parts processing conveyor. Processing is performed according to each component, such as disposal, but even if the size of the component handled by the mounting head varies, the problem will be the amount corresponding to the size of the component discharged on the problem component processing conveyor Since the parts handling conveyor is intermittently fed, the ejected parts can be prevented from overlapping and interfering with each other, scratching or sliding down, a small problem Since the transport amount of products is reduced, the problem parts conveyer is conveyed more than necessary, and the discharged parts are conveyed early and the opportunity for human processing is lost. That can be avoided.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, typical embodiments of the present invention will be described in detail with reference to the drawings together with the embodiments.

In this embodiment, as shown in FIG. 1, an electronic circuit board 3 is manufactured by mounting various electronic components 2 including a connector and the like as an example of components on a circuit board 1 as an example of a mounting object. The case of a component mounting apparatus is shown. However, the present invention is not limited to this, and may be applied to all cases where various components are mounted on various component mounting objects and various components are assembled, manufactured, or manufactured.

In the apparatus shown in FIG. 1, in order to handle various electronic components 2, a tray 4 storing predetermined components is selected and moved from its storage position 5 to a component supply position 6 as necessary, and stored. As shown in FIG. 2, a tray component supply mechanism 7 for using the electronic components 2 is provided. A plurality of tray component supply units 8 are provided adjacent to each other, and the electronic components 2 are loaded one by one by loading taping components and bulk components. Sent to the supply position 11,
A plurality of component supply cassettes 12 to be used are provided adjacent to each other, and a cassette component supply unit 13 is provided. The various electronic components 2 supplied from the tray component supply mechanism 7 and the cassette component supply unit 13 are, for example, viewed from a flat surface. The electronic circuit board 3 is manufactured by being picked up as needed by the mounting head 21 that can move in the XY2 directions that are orthogonal to each other as viewed, and mounted at a predetermined position on the circuit board 1.

As shown in FIG. 2, the tray component supply mechanism 7 has a lift 16 which is moved up and down by rotating the screw shaft 14 forward and reverse by a motor 15. The tray magazine 17 in which the trays 4 are stored is placed and positioned, and is locked by a lock member (not shown) so that the tray magazine 17 is not accidentally dropped. The tray magazine 17 stores a large number of trays 4 containing various electronic components 2 so as to be vertically separated by left and right rails (not shown) so that they can be individually taken in and out.

At the component supply position 6 set in front of the elevating section of the elevating table 16 of the tray magazine 17, an access table 18 for taking in and out the tray 4 is provided in common with each tray component supplying mechanism 7, A shuttle 26 is provided on the loading / unloading table 18 for reciprocatingly driving in the Y direction by a timing belt 19 provided so as to vertically pass through the center of the loading / unloading table 18 so as to take in and out the opposing trays 4 in the tray magazine 17. The tray magazine 17 is controlled so that the height of the tray 4 accommodating the electronic components 2 to be supplied is moved in and out of the loading / unloading table 18 by raising and lowering the lifting table 16. It is drawn out to the position 6 so that a predetermined electronic component 2 can be supplied. When supplying the electronic components 2 accommodated in another tray 4, the tray 4 pulled out to the component supply position 6 is pushed back to the original height position corresponding to the tray magazine 17, and then, the lifting table 16 is used. By controlling the height of the tray magazine 17, the tray 4 containing the electronic components 2 to be supplied next
Is set to the above-mentioned loading / unloading height so that it is pulled out to the component supply position 6 in the same manner as described above.

The shuttle 26 has a connecting member 22 for taking the tray 4 in and out, and the connecting member 22 is opened and closed by an actuator (not shown). The tray 4 is engaged with the tray 4 or is disengaged and disconnected.
Can be taken in and out of the tray magazine 17 and can be separated from the tray 4 in a disconnected state.
And does not hinder the movement of the tray 4 as it moves up and down.

The trays 4 are arranged in such a manner that the corresponding electronic components 2 are accommodated in a predetermined direction in the recesses 4a formed in the matrix of the tray 4 in a matrix according to the shape and size of the electronic components 2 to be accommodated. The tray 4 accommodates and handles the components 2 and is suitable for large flat electronic components 2 and flat large large irregular electronic components 2 such as connectors.
Of the electronic component 2 to be accommodated in the tray 4
It can be positioned and held in a certain direction above.

The component supply cassette 12 is suitable for handling electronic components 2 that are used much more frequently than the electronic components 2 handled on the tray 4, such as minute and various types of chip components.
A large number of electronic components 2 are arranged in the cassette component supply section 13 so as to be supplied.

The tray component supply unit 8 and the cassette component supply unit 13 may be basically arranged in any manner, and the electronic component 2 supplied by the relative movement with respect to the mounting head 21 may be arranged.
The electronic component 2 picked up by the mounting head 21 may be mounted at a predetermined position on the circuit board 1 by relative movement with respect to the circuit board 1.

For example, the cassette component supply section 13 handles minute and many types of electronic components 2 that are frequently used, sequentially supplies many types of electronic components 2 from a large number of component supply cassettes 12, and supplies them by the mounting head 21. The tray component supply unit 8 uses a plurality of tray component supply mechanisms 7 provided in parallel to sequentially handle the different types of electronic components 2 while sequentially mounting them at predetermined positions on the circuit board 1 in a number corresponding to the frequency of use.
Are alternately supplied, even if the handling time for supplying the individual electronic components 2 is long, the required time for sequentially supplying the heterogeneous electronic components 2 is reduced by half, and the plurality of types of electronic components 2 from the tray 4 The supply speed is doubled to make it easier to supply the plurality of types of electronic components 2 from the tray 4 while the mounting head 21 continuously handles and mounts the electronic components 2 supplied from the cassette component supply unit 13. Therefore, as a whole, more kinds of electronic components 2 can be handled, and the time lag for supplying the components can be reduced or eliminated, and the component mounting can be speeded up.

As shown in FIG. 1, the mounting head 21 is supported by an X-direction table
The motor 25 is reciprocated in the X direction by the forward / reverse rotation of 3a, and both ends of the X-direction table 24 are supported by Y-direction tables 29, 31. 26 screw shafts 25a, 2
It is reciprocated in the Y direction by the forward and reverse rotation of 6a. On the other hand, the circuit board 1 is transported in the X direction and is used for mounting components by the mounting head 21.
component mounting position 33 through the loading portion 32 having
The electronic circuit board 3 after the component mounting at the component mounting position 33 is carried out through an unloading section 34 having a pair of transport rails 34a. As a transport path 30 for the circuit board 1 and the electronic circuit board 3.

As shown in FIGS. 1 and 3, a pair of transport rails 35 for loading and unloading the circuit board 1 and a pair of transport rails 35 for loading the loaded circuit board 1 are provided at the component mounting position 33. The circuit board 1 is supported from below by the support pins 36 between the transport rails 35, for example, with respect to the double-sided circuit board 1.
A positioning support base 37 is provided on the downward supporting surface for supporting and positioning without interfering with the electronic component 2 mounted on the electronic component 2.

As shown in FIG. 1, the tray component supply section 8 and the cassette component supply section 13 are distributed so as to face one side and the other side of the transport path 30 of the circuit board 1 and the electronic circuit board 3. With this arrangement, the length in the X direction is reduced by half when the respective tray component supply mechanisms 7 and component supply cassettes 12 are arranged adjacent to each other in the X direction. However, such an arrangement is free. In the present embodiment, a cassette component supply unit 13 in which a small number of component supply cassettes 12 are arranged in the X direction is provided beside the tray component supply unit 8, and the component supply cassettes 12 are provided. While the number of arrangements is increased, the X-direction length of the component supply unit as a whole is substantially equal on both sides of the transport path 30, and the transport path 30 of the entire apparatus is an effective space that can contribute to component supply.

The number of adjacent tray component supply mechanisms 7 in the tray component supply unit 8, the number of tray component supply units 8 installed, the number of adjacent component supply cassettes 12 in the cassette component supply unit 13, and the number of cassette components The number of the supply units 13 and the arrangement thereof are free and can be variously designed.

In the present embodiment, the component supply units 8 and 13 are distributed on both sides of the transport path 30 so that
The mounting head 21 picks up the electronic components 2 supplied by the tray component supply unit 8 and the cassette component supply unit 13 on both sides thereof. Will be straddled. Attachment head 2 at this time
The movement amount of No. 1 is large as compared with the case where the transport path 30 is not straddled, and only in this case, the time required for picking up the electronic component 2 and mounting it on the circuit board 1 becomes long. Such non-uniform mounting time limits the determination of the mounting order of the various electronic components 2 from the viewpoint of the work efficiency of sequentially mounting the various electronic components 2.

Therefore, in the present embodiment, the component mounting position 33 can be moved in the Y direction. Specifically, a pair of transport rails 3 provided at the component mounting position 33
3 and the positioning support 37 are set on the Y-direction table 41 as shown in FIG. 3, and the Y-direction table 41 is moved along the Y-direction guide rail 49 by the forward / reverse rotation of the screw shaft 42a by the motor 42. To be able to reciprocate,
In order to pick up the electronic component 2 to the component supply unit 8 or 13 over the transport path 30 as in the case where the mounting head 21 moves from the top of the circuit board 1 indicated by a solid line in FIG. When the mounting head 21 moves, the mounting head 21 is moved to the side of the component supply unit 8 or 13 on the side to which the mounting head 21 moves, at the same time as the mounting head 21 moves, or at least
By the time the electronic component 1 starts to mount the next electronic component 2, the positioning support 37, and thus the component mounting position 33, is moved, for example, as shown by the imaginary line in FIG. The moving distance of the mounting head 21 for mounting the mounted electronic component 2 at a predetermined position on the circuit board 1 is shortened.

Thus, when the mounting head 21 picks up various electronic components 2 without straddling the transport path 30 and sequentially mounts them, it picks up various electronic components 2 across the transport path 30. The electronic component 2 is picked up and then mounted on the circuit board 1
The difference in the time required for mounting at a predetermined position on the table is reduced. Accordingly, the mounting head 21 moves the electronic components 2 across the transport path 30 at each time or moves without crossing, and sequentially mounts the electronic components 2 at predetermined positions on the circuit board 1. However, even if the mounting order of the electronic components 2 is not particularly taken into consideration, the working efficiency is not particularly reduced, and it is easy to cope with the high-speed mounting of the components.

Moreover, as described above, the positioning support 37
Is performed using the time from when the mounting head 21 picks up the electronic component 2 and mounts the electronic component 2 on the circuit board 1 so that the mounting head 21 moves along the transport path 30. Since no special time is required for moving the support table 37, it does not hinder speeding up of component mounting.

The pair of transport rails 35 is a Y-direction table 4
1, one is fixed, and the other is a guide rail 4 in the Y direction.
The circuit board 1 is supported so as to be movable along the axis 6, and the distance between the motor boards 43 is adjusted by the simultaneous rotation of the screw shafts 44 a and 44 b via the belt and pulley in the forward and reverse directions. In the direction perpendicular to the conveying direction of the sheet. At the same time, the motor 4
With the forward / reverse rotation of the screw shaft 45 directly connected to 3, the positioning support 37 is reciprocated along the Y-direction guide rail 47 at half the speed of the movable transfer rail 35, and the positioning support 37 is It is always located at a predetermined position between the pair of transport rails 35, for example, at the center position, and is supported from below with the positioning support 37 being aligned with the center of the circuit board 1 received between the pair of transport rails 35. And position it.

The mounting head 21 is mounted on the component supply cassette 12.
Component mounting tools 51 to 54 for mounting components arranged in the X direction, which is also the arrangement direction in which the tray component supply mechanism 7 is arranged adjacently, and the electronic components 2 picked up by the component mounting tools 51 to 54 are mounted. And a recognition camera 55 for recognizing a position on the circuit board 1 to be maintained with an example of a positional relationship. Each of the component mounting tools 51 to 54 corresponds to the type of the electronic component 2 handled by the component mounting tool, and may be a suction nozzle that suctions and holds the electronic component 2 or a chuck that holds the electronic component 2 therebetween. In the present embodiment, each is a suction nozzle.

In conjunction with such a mounting head 21, the tray 4 of the adjacent tray component supply mechanism 7 is selected, moved from the storage position 5 to the component supply position 6, and stored in the storage position 5. In the present embodiment, at least one of the shuttles 26 that reciprocates, and on the other hand, the electronic component 2 in which the electronic component 2 is arranged in a direction and a pitch corresponding to the arrangement direction and the arrangement pitch of the component mounting tools 51 to 54.
Are provided. The electronic component 2 stored in the tray 4 moved to the component supply position 6 of each tray component supply mechanism 7 is picked up, and the component holding units 61 to 64 are provided. The mounting head 21 also picks up the electronic component 2 held by the component holding units 61 to 64 and mounts the electronic component 2 at a predetermined position on the circuit board 1. I am trying to do it.

The component holders 61 to 64 are determined according to the type of the electronic component 2 to be handled, and may be any components that can pick up the held electronic component 2 by the component mounting tools 51 to 54 of the mounting head 21. In the present embodiment, each of them is a suction nozzle, and corresponds to the flat electronic component 2 housed and handled in the tray 4. The component transfer head 65 is also provided with a component transfer tool 67 according to the type of the electronic component 2 handled by the component transfer head 65. In the present embodiment, a suction nozzle is employed, and the flat component that is accommodated in the tray 4 is handled. It corresponds to the electronic component 2.

The component transfer head 65 is located immediately below the portion of the cabinet 66 that covers the entire tray component supply mechanism 7 provided in the tray component supply section 8, at which the inlet / outlet 66 a of the tray 4 by the shuttle 26 is provided. The motor 6 is supported by an X table 68 fixed thereon.
8a by the forward and reverse rotation of the screw shaft 68b by the 8a
Is reciprocated along. This reciprocating movement range is a range that can traverse both of the component supply positions 6 of the adjacent tray component supply mechanism 7. The pick-up of the electronic components 2 from each tray 4 by the component transfer head 65 and the transfer of the picked-up electronic components 2 to the component holding units 61 to 64 are performed by moving the tray 4 in and out of the shuttle 26. Movement is also used. Thus, the electronic component 2 at any position on each tray 4 can be picked up, and the picked up electronic component 2 can be transferred to any of the component holding units 61 to 64. However, the transfer head 65 can be moved in the XY2 directions.

As described above, while the mounting head 21 continuously handles the electronic components 2 supplied from the cassette component supply unit 13 by the number corresponding to the high frequency of use, a plurality of adjacent tray component supply mechanisms are provided. When the electronic components 2 of different types are supplied in 7, if there is a time margin before the electronic components 2 on the tray 4 are used next, the part supply state is used by using the extra time. Electronic components 2 in tray 4
Is handled by the component transfer head 65, and a plurality of component holding portions 61 to 64 provided on one of the shuttles 26 for taking in and out the tray 4 in the adjacent tray component supply mechanism 7.
A predetermined number of electronic components 2 are transferred to the component mounting tool 51 of the mounting head 21 in which the transferred predetermined number of electronic components 2 have the same arrangement direction and arrangement pitch.
54 to 54 so that they can be picked up all at once and handled and mounted at the same time, so that a part of the component mounting tools 51 to 54 picks up the electronic components 2 directly from the tray 4 at the component supply position 6. In addition, the mounting efficiency of the electronic components 2 supplied by the tray component supply unit 8 is improved by a multiple of the number of electronic components 2 picked up at the same time, and the mounting speed of the components can be significantly increased. Therefore, the component holding unit 6
It is preferable that 1 to 64 are provided in the same number as the component mounting tools 51 to 54 of the mounting head 21 as in the present embodiment.

The plurality of electronic components 2 can be collectively handled by the mounting head 21 using the component holding portions 61 to 64, by integrating the plurality of circuit boards 1 and mounting the electronic components 2 to form a predetermined electronic circuit board 3, and then individually. This is particularly effective in the case where the same electronic component 2 is simultaneously mounted on a plurality of integrated circuit boards 1 for manufacturing a so-called split board in which the electronic circuit board 3 is divided into cassettes. A plurality of the same electronic components 2 can be picked up at once from the component supply unit 13 and mounted collectively on each of the integrated circuit boards 1. However, in this case, in the cassette component supply unit 13, the arrangement pitch of the component supply cassettes 12 that can simultaneously supply the same electronic component 2 is the arrangement pitch of the plurality of component mounting tools 51 to 54 that simultaneously pick up the electronic components 2 of the mounting head 21. Must match.

Further, in this embodiment, as shown in FIG. 1, the right tray component supply mechanism 7 having the component holding portions 61 to 64 moves the tray 4 by the shuttle 26 to the storage position 5.
In the tray component supply mechanism 7 on the left side, the tray 4 is pulled out to the component supply position 6 by the shuttle 26 in the tray component supply mechanism 7 on the left side, and the electronic components stored in the tray 4 pulled out to the component supply position 6 on the left side 2 to the right tray 4
Holding part 6 on the shuttle 26 having the storage position
If the electronic components 2 are transferred to 1 to 64, the collective handling of the plurality of electronic components 2 by the mounting head 21 can be performed simply and efficiently. However, it is also possible to provide the component holders 61 to 64 on both the left and right shuttles 26 and selectively use them. In this case, on the contrary, the left shuttle 26 is set in a state where the tray 4 is stored in the storage position 5, and the electronic components 2 stored in the tray 4 pulled out to the right component supply position 6 are transferred to the left shuttle 26. The electronic components 2 can be transferred to the provided component holding units 61 to 64 and provided for collective handling by the mounting head 21, which is advantageous in a case where various electronic components 2 are sequentially handled collectively.

Regardless of whether or not the shuttle 26 of the tray component supply mechanism 7 has the component holding portions 61 to 64, as shown in FIG.
The mounting head 21 can continuously pick up the electronic components 2 by a predetermined number from both of the trays 4 pulled out from the tray 4 and mount them at a predetermined position on the circuit board 1 at a time. In this case, the electronic components 2 picked up from both or one of the left and right trays 4 and the component holding units 61 to 61
The electronic component 2 picked up from the H.64 can be combined and handled in a lump, and can be simultaneously mounted on a predetermined position of the circuit board 1.

Furthermore, in the present embodiment, the component transfer tools 51 to 54 use the mounting head 21 based on the fact that the electronic components 2 picked up from the tray 4 are stored in the tray 4 in a certain direction. Is preliminarily rotated in a direction corresponding to the mounting direction on the circuit board 1 so as to be held by the component holding section.

Thus, while the electronic component 2 supplied from the cassette component supply unit 8 by the mounting head 21 is mounted, a special time is required in conjunction with the component supply operation in the tray component supply unit 8. By preliminarily rotating the electronic component 2, the time during which the mounting head 21 picks up the electronic component 2, recognizes the image of the electronic component 2, and rotates the electronic component 2 in a predetermined direction is omitted. Since the components can be mounted, the speed of component mounting can be further increased.

As described above, the mounting head 21 is
When the electronic components 2 supplied from the component supply units 8 and 13 on both sides of the circuit board 1 are mounted on a predetermined position of the circuit board 1 positioned at a predetermined position on the transfer path 30, the transfer path 30 Recognition cameras 71 and 72 are provided at both sides of the range in which the positioning support 37 moves in the Y direction. These recognition cameras 71 and 72 pick up the electronic component 2 supplied with the mounting head 21 and A component located on the way of moving upward recognizes the position and orientation of the electronic component 2 held by the component mounting tools 51 to 54 of the mounting head 21 by image recognition. The amount of movement for mounting the electronic component 2 on the predetermined position is determined, and the amount of correction of the direction of the electronic component 2 picked up and held is determined. The electronic component 2 is rotated by the rotation of the component mounting tools 51 to 54 holding the electronic component 2 by the determined correction amount, and then mounted on a predetermined position on the circuit board 1.

As described above, since the mounting head 21 does not need to be folded back for image recognition of the electronic component 2 held by each of the component mounting tools 51 to 54 of the mounting head 21, it is possible to prevent a high-speed mounting of the component. do not become.

Each component mounting tool 51 to 51 of the mounting head 21
The electronic component 2 held in the position 54 and the orientation of which is
For mounting at a predetermined position on the circuit board, the recognition camera 55 mounted on the mounting head 21 performs image recognition on the entire position of the circuit board 1 and the component mounting position on the circuit board 1. Specifically, in the present embodiment, when picking up and mounting the electronic component 2 from the component supply unit 8 or 13 on the side of the mounting head 21 across the transport path 30, the component supply unit 8 or The positioning support 37 moves in the Y direction toward the side 13 to receive the mounting of the electronic component 2.

Therefore, immediately before mounting the electronic component 2, the positioning support base 37 is moved in a direction opposite to the previous moving direction and reaches a predetermined position. For example, the component mounting position may not reach the predetermined position accurately. If the position of the entire circuit board 1 or the component mounting position recognized by the recognition camera 55 of the mounting head 21 is used as a reference, the component mounting position may be shifted. Easy to occur.

Therefore, in this embodiment, the mounting head 2
Each time the positioning support 37 moves to and stops at the side of the component supply unit 8 or 13 that picks up the electronic component 2 due to the movement of the circuit board 1 across the transport path 30, the recognition camera 55 of the mounting head 21 Figure 4 shows the overall position
, And the mounting position 80 of the electronic component 2 on the circuit board 1 is image-recognized by the mounting position marks 83 and 84, and mounted based on these image recognitions. The electronic component 2 picked up from the component supply unit 8 or 13 by the movement of the head 21 across the transport path 30 is moved to a predetermined position on the component supply unit 8 or 13 picked up and stopped. It is to be mounted at a predetermined position on the circuit board 1 on 37. As a result, the positioning support 37
Immediately before the electronic component 2 is mounted, it is moved in the direction opposite to the previous moving direction, and even if there is a variation in the stop position due to the influence of the backlash of the drive mechanism or a control error, it is not affected. In addition, the electronic component 2 can be accurately mounted at a predetermined position on the circuit board 1.

Incidentally, each of the component mounting tools 51 to 54 of the mounting head 21 and the component transfer tool 67 of the component transfer head 65 are required in terms of component handling for mounting and transferring the electronic components 2. In order to ensure that the electronic component 2 is picked up, mounted, and transferred, it interferes with the circuit board 1 and the tray 4 as the work partner, FIG.
A descending stroke S as shown in FIG. 6 is given.
Therefore, when the component mounting tools 51 to 54 are in the lowered state, one or both of the mounting head 21 and the positioning support table 37 move in a direction approaching each other, or one or both of the component transfer head 65 and the tray 4 move. If they move closer to each other, they will interfere and be damaged.

An operation program of the control device may be set so as to avoid such an operation state.

However, in such a software correspondence,
It is undeniable that noise or malfunction for some reason may cause the problem of interference.

Therefore, in this embodiment, the mounting head 2
An area sensor 86 as shown in FIG. 5 is provided to prevent interference between the
An area sensor 87 as shown in FIG. 6 is provided in order to prevent interference with the tray 4 and the shuttle 26.

The area sensor 86 detects whether at least one of the component mounting tools 51 to 54 of the mounting head 21 is located in a position range facing the circuit board 1 on the positioning support 37. In one embodiment, a photo sensor is used. The area sensor 86 is attached to, for example, the mounting head 21, and a light-shielding plate 88 having a length corresponding to the dimension in the Y direction of the circuit board 1 having the largest size is provided on the positioning support 37 in correspondence with the area sensor 86. The positioning support 37 can be moved only while the area sensor 86 is detecting the light blocking plate 88.

Thus, the fact that the mounting head 21 is out of the component mounting range on the positioning support base 37 can be determined by the hardware means of the area sensor 86 including any case including a control error or a malfunction. Since the detection is reliably performed and the movement of the positioning support table 37 is prohibited, the component mounting tools 51 to 54 are in a lowered state at a position where the mounting head 21 is out of the component mounting range on the positioning support table 37, and the positioning support is performed. It is possible to reliably prevent the table 37 from being moved toward the mounting head 21 and causing mutual interference and damage. Moreover, since the light shielding plate 88 corresponds to the size of the circuit board 1 having the maximum size, no problem occurs even if the size of the circuit board 1 changes. However, the light shielding plate 8
The length 8 may be adjusted or adjusted in accordance with the interval adjustment of the transport rail 35 according to the size of the circuit board 1. In some cases, it can be replaced. However, as the area sensor 86, other than the combination of the photosensor and the light shielding plate, any hardware means having the same function can be adopted.

The component mounting tool 5 of the mounting head 21
1 to 54 are lowered to enable the component mounting operation,
In a range where the area sensor 86 does not detect the light shielding plate 88,
It is prohibited to lower the component mounting tools 51 to 54 of the mounting head 21 to perform the component mounting operation. At the same time, if the area sensor 86 has not detected the light blocking plate 88 and at least one of the component mounting tools 51 to 54 is at the lowered position, the positioning support 37 is prevented from being moved in the Y direction.

The area sensor 87 includes a component transfer head 65
Is detected at a position where it interferes with which tray 4 of the tray component supply mechanism 7, and a photosensor is used as one embodiment. Air piping 8 connected to a suction nozzle which is a component transfer tool 67 of the component transfer head 65
5 is interlocked with the movement of the component transfer head 65 at half speed, and the air pipe 85 is connected to the pipe guide 12.
The area sensor 87 is attached to a fixed portion such as the pipe guide 126 by utilizing the change in the length L crawling on the
The component transfer head 65 is detected on the side of which tray component supply mechanism 7 based on the length range in which the component 5 crawls on the pipe guide 126. Specifically, while the area sensor 87 detects the air pipe 85 as indicated by the phantom line in FIG. 6, it is determined that the component transfer head 65 is on the right side of the tray component supply mechanism 7 in FIG. The tray 4 on the right side of the tray component supply mechanism 7 is prohibited from being taken in and out, and the lowering of the component transfer tool 67 is permitted. Supply mechanism 7
Prohibit moving to the side of. At the same time, the removal and insertion of the tray 4 on the side of the tray component supply mechanism 7 on the left side is permitted. While the area sensor 87 does not detect the air pipe 85 as shown by the solid line in FIG. 6, it is determined that the component transfer head 65 is on the side of the tray component supply mechanism 7 on the left side in FIG. The loading / unloading of the tray 4 on the side of the supply mechanism 7 is prohibited, and the lowering of the component transfer tool 67 is permitted. When the component transfer tool 67 is lowered, the component transfer head 65 moves the tray component supply mechanism 7 on the right side. Prohibit being moved to the side. At the same time, the removal and insertion of the tray 4 on the right side of the tray component supply mechanism 7 is permitted. The area sensor 87 can be all other than the photo sensor as long as it is a hardware means having the same function. However, when the area sensor 87 is provided on the fixed portion, the electric wiring for detection can be fixed, and the device can be more easily installed than when it moves.

As described above, when the interference operation area between the mounting head 21 and the positioning support table 37 and the interference operation area between the component transfer head 21 and the tray 4 or the shuttle 26 are detected and corresponded by hardware means, Irrespective of the software control program or the actual control based on the software, the interference condition can be determined based on the actual positional relationship of the motion, and the interference problem can be reliably prevented. However, it is preferable to use both the hardware-based interference prevention and the software-based interference prevention described above.

In this embodiment, the mounting head 2
When the electronic component 2 to be handled is a mounting component or other problem component that has caused a problem, the problem component processing conveyor is located at a predetermined position, for example, on both sides of the cabinet 66 of the tray component supply unit 8 shown in FIG. The problem component processing conveyor 91 is intermittently driven by a predetermined amount by a motor 92 each time a problem component to be discharged is received, and the received component is conveyed at a constant pitch P in a predetermined direction. When the received problem part is larger than the standard, the conveyance amount is increased to an integral multiple (P × n) according to the ratio of the size. I do.

Thus, when the mounting head 21 picks up the various electronic components 2 to be supplied and sequentially mounts them on the circuit board 1, if there is a mounting error or any other problematic component, it is placed in a predetermined position. Problem handling conveyor 9
1, the problem parts on the problem parts processing conveyor 91 are manually reused while leaving a space for receiving the next electronic component 2 by being conveyed at a constant pitch P on the problem parts processing conveyor 91. Electronic components 2 such as disposal
Is processed according to the state of the mounting head 2
Even if the size of the electronic component 2 handled by the electronic component 1 varies, the problem component processing conveyor 91 is moved by the motor 92 in an amount (P × n) corresponding to the size of the electronic component 2 discharged onto the problem component processing conveyor 91. , The discharged electronic components 2 can be prevented from overlapping and interfering with each other to cause damage or sliding down. For a small problem component, the transport amount is reduced to the minimum P, so that As a result, it is possible to avoid a situation in which the electronic component 2 that has been conveyed unnecessarily by transporting the problem component processing conveyor 91 more than necessary is conveyed at an early stage, and the opportunity for humans to process the electronic component 2 is missed.

In this embodiment, the mounting head 21
A tool stocker 128 for stocking various component mounting tools for replacing the component mounting tools 51 to 54 with various ones is provided in a part of the moving range of the electronic component 2 so that various electronic components 2 can be properly handled. I have to. If necessary, the component transfer tool 61 may be configured so that such a tool can be replaced.

The above-described operation control is performed by the control device 102 provided in the apparatus main body 101 of FIG. The control device 102 preferably uses a microcomputer, but is not limited to this. The control device 102 performs the above-described operation control by using FIG.
The operation panel 103 provided in the apparatus 101 is connected to the input / output port as shown in FIG.
83, and recognition circuits 104 to which input processing from each of the recognition cameras 55, 71, 72 is processed to obtain necessary position information.
106 is connected to the input port, and the driver 107 of the cassette component supply unit 13 whose operation is to be controlled is connected to the output port.
The driver 108 of the tray component supply unit 8, the driver 109 of the component transfer head 65, the driver 110 of the component mounting head 21, the driver 111 of the Y-direction table 41, and the driver 112 of the problem component processing conveyor 91 are connected to output ports. The main configuration is that a signal indicating the operation state of each operation target is input in real time.

The operation control of the problem component processing conveyor 91 as described above is performed by the sixth control means 127 as an internal function of the control device 102. The operation of the tray 4 by the area sensor 86 is restricted by the first control means 121 as an internal function of the control device 102.
Component mounting tools 51 to 51 input to the control device 102
Tray 4 and component mounting head 2 according to the operation state of 54
The first operation restriction is performed by the second control means 122 as an internal function of the control device 102, and the operation restriction of the tray 4 by the area sensor 87 is performed by the third control means 123 as an internal function of the control device 102. Area sensor 8
7 and the operation limitation of the tray 4 and the component transfer head 65 according to the operation state input to the control device 102.
02 is performed by the fourth control means 124 as an internal function of the second function. Further, in each tray component supply mechanism 7 as described above,
A first component supply mode in which each of the selected trays 4 is simultaneously moved to the component supply position 6 as shown in FIG. 2 to use the electronic components 2 stored in each tray 4;
The electronic components 2 stored in the tray 4 moving to the component supply position 5 of the tray component supply mechanism 7 are transferred to the component transfer head 6.
The second component supply mode in which the cassette 5 is transferred to the component holding units 61 to 64 of the same shuttle 26 for use by the control unit 5 in accordance with the supply of the electronic components 2 by the cassette component supply unit 13 and controlled according to the component mounting program The fifth control means 125 as an internal function of the device 102 may perform only one of them or perform a combination of both at various timings as necessary. Further, the second component supply mode is based on information that the electronic component 2 has been transferred to each of the component holding units 61 to 64 or to a necessary component, based on the component mounting head of the transferred electronic component 2. 21 and the subsequent mounting is performed.
It is also possible to control so that the supply of the electronic component 2 by the cassette component supply unit 13 is continued until there is a signal indicating that the transfer has been completed.

In the first component supply mode, the maximum number of electronic components 2 of the number corresponding to the number of the tray component supply mechanisms 7 can be supplied simultaneously or sequentially and used. The efficiency of supplying a plurality of types of electronic components 2 by the tray component supply mechanism 7 is improved. In the second component supply mode, the plurality of electronic components 2 held in the component holding portions 61 to 64 of the shuttle 26 are replaced with the components of the component mounting head 21 having the same arrangement direction and pitch. Handling tools 51-54
For example, since the electronic component 2 is picked up and used collectively, the number of times and the required time of the work in which the electronic component 2 is picked up and used can be reduced.
The electronic component 2 and the like are supplied in parallel with the supply of components at another component supply unit including another component supply mechanism such as another tray component supply mechanism 7 provided at the side and a cassette component supply unit 13 having a component supply cassette 12. If the transfer can be performed, the efficiency of the operation of handling a predetermined number of electronic components 2 and the like in the same manner, for example, the operation of mounting the same components on the split board described above can be improved.

[0066]

According to one aspect of the present invention, the cassette component supply unit handles frequently used minute components, sequentially supplies many types of components from a large number of component supply cassettes,
In the tray component supply unit, a plurality of different tray component supply mechanisms alternately use different types of components, while successively handling them by the mounting head in a number corresponding to the frequency of use and mounting them at predetermined positions on the mounting object. By supplying to
Even if the handling time for supplying individual components is long, the time required to supply different components sequentially is halved, the speed of supplying different components from the tray is doubled, and the mounting head is supplied from the cassette component supply unit. Since the supply of different parts from the tray can be made in time during continuous handling and mounting of parts, as a whole, more kinds of parts can be handled, and the time lag for parts supply is reduced, or Therefore, the speed of component mounting can be increased.

In a further feature of the present invention, a plurality of adjacent tray component supply mechanisms are provided while the mounting head continuously handles components supplied from the cassette component supply unit in a number commensurate with the frequency of use. When supplying different types of components, a predetermined number of components in the tray in the component supply state are transferred to a plurality of component holding units provided on at least one of the shuttles for taking in and out the tray in the adjacent tray component supply mechanism. In addition, since it is picked up at a time by the component mounting tool of the mounting head at a time and handled and mounted at the same time, the mounting efficiency of the component supplied by the tray component supply unit is Improves by a factor of multiple, and can significantly speed up component mounting. Therefore, it is preferable that the same number of component holding units as the component mounting tools of the mounting head are provided.

According to a further feature of the present invention, a special time is set during the mounting of the components supplied from the cassette component supply unit by the mounting head in conjunction with the component supply operation in the tray component supply unit. Preliminary rotation of the component eliminates the time required for the mounting head to pick up the component, recognize the image, and rotate it in a predetermined direction. Can be achieved.

According to still another feature of the present invention, when a mounting head picks up various components to be supplied and sequentially mounts them on a mounting target, a mounting error or other problematic component can be replaced by a problem component. Discharge the parts on the processing conveyor, transport them at a fixed pitch, and leave the space for receiving the next parts, so that the received problem parts can be manually processed according to each part such as reuse or disposal. However, even if the size of the parts handled by the mounting head varies,
Discharged parts can be prevented from overlapping and interfering with each other to damage or slip off.For small problem parts, the problem parts handling conveyor is conveyed more than necessary and the discharged parts are conveyed early. It can be avoided that the user cuts it and misses the opportunity to process it.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating a schematic configuration of a component mounting apparatus according to a typical embodiment of the present invention.

FIG. 2 is a perspective view illustrating a schematic configuration of a tray component supply unit of the apparatus of FIG.

FIG. 3 is a perspective view showing an overall configuration including a Y-direction moving mechanism of a positioning support base of the apparatus of FIG. 1;

FIG. 4 is a plan view showing an example of a circuit board on which electronic components are mounted.

FIG. 5 is an explanatory diagram showing a positional relationship among the positioning support table of FIG. 3, cassette component supply units and tray component supply units on both sides thereof, and a mounting head.

FIG. 6 is an explanatory diagram showing a positional relationship between a tray at each component supply position of a tray component supply mechanism provided adjacently and a component transfer head.

FIG. 7 is a block diagram of a control device of the component mounting apparatus of FIG. 1;

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 circuit board 2 electronic component 3 electronic circuit board 4 tray 4 a recess 5 storage position 6, 11 component supply position 7 tray component supply mechanism 8 tray component supply unit 12 component supply cassette 13 cassette component supply unit 18 loading / unloading stand 19 timing belt 21 mounting Head 26 Shuttle 30 Transport path 32 Loading section 33 Component mounting position 34 Unloading section 37 Positioning support base 41 Y-direction table 42 Motor 91 Problem component processing conveyor 102 Controller 107 Cassette component supply driver 108 Tray component supply driver 109 Component transfer Mounting head driver 110 Mounting head driver 111 Y-direction table driver 112 Problem parts processing conveyor driver

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Akira Kashimo 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (5)

[Claims] 1. A tray component supply mechanism in which a plurality of tray component supply mechanisms for selecting a tray accommodating a predetermined component, moving the tray from a storage position to a component supply position as needed, and using the accommodated component for use are provided. Parts, taping parts and bulk parts are loaded, and these parts are sent out one by one to a parts supply position, and a plurality of parts supply cassettes to be used are arranged in a cassette parts supply part, and each part supply of these tray parts supply parts The components stored in each tray at the component supply position of the mechanism and the components sent to the component supply position of each component supply cassette of the cassette component supply unit are picked up as necessary and mounted at predetermined positions on the mounting target. A component mounting apparatus comprising a mounting head. 2. The mounting head includes a plurality of component mounting tools for mounting components arranged in a predetermined direction, and moves a selected tray of a tray component supply mechanism provided adjacently from a storage position to a component supply position. A component holding a component, the component being arranged in a direction and a pitch corresponding to an arrangement direction and an arrangement pitch of a component mounting tool on at least one of a shuttle that moves and reciprocates to store the component in a storage position. A component transfer head that is provided with a holding unit, picks up a component stored in a tray that has been moved to a component supply position of a tray component supply mechanism, transfers the component to the component holding unit, and holds the component; 2. The component mounting apparatus according to claim 1, wherein the mounting head also picks up the component held by the component holding unit and mounts the component at a predetermined position on the mounting target. 3. The component mounting apparatus according to claim 2, wherein the same number of component holding units as the component mounting tools of the mounting head are provided. 4. The component transfer head pre-rotates a component picked up from a tray in a direction corresponding to a direction in which the component is mounted on a mounting target by a mounting head, and is held by a component holding unit. 4. The component mounting device according to any one of 3. 5. The mounting head, when a component to be handled is a mounting component or a problem component that has caused another problem, discharges the component on a problem component processing conveyor at a predetermined position. Each time a problem component to be ejected is received, it is driven intermittently by a predetermined amount to convey the receiving component in a certain direction at a constant pitch, and to perform processing such as re-attachment and disposal. The component mounting apparatus according to any one of claims 1 to 4, wherein when the size is larger, the transport amount is increased by an integral multiple according to the ratio of the size.