JPH11145161A - Die bonding apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to change collets easily with change of sizes of semiconductor chips, by providing a plurality of collets corresponding to the sizes of the semiconductor chips in a selectable way. SOLUTION: A mount arm section 21 has a linear holder guide 23 fitted to the lower end of an arm driving part 20 by the aid of an adjusting part 22, and a plurality of collet holders 24 slidably fitted to the holder guide 23. Collects 10 which are different in size respectively and hold semiconductor chips by vacuum adsorption are fitted to individual collet holders 24. The adjusting part 22 fitted to the lower end of the arm driving part 20 can adjust the fitted condition of the holder guide 23 to the arm driving part 20 by the operation of an adjusting screw 26 and so on. Adjustment of fitted conditions becomes unnecessary, if the holder guide 23 is fitted in an appropriate posture, and the fitted conditions of the collet holders 24 are properly adjusted once, when each collect holder 24 is selected and used. Consequently, it becomes possible to change collects easily.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonding apparatus, and more particularly to a die bonding apparatus capable of providing a plurality of collets in a selectable manner to easily cope with semiconductor chips having different sizes.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, an IC
2. Description of the Related Art A die bonding apparatus is used for bonding a semiconductor chip constituting a circuit onto a lead frame.
FIG. 4 shows a conventional die bonding apparatus. The die bonding apparatus 2 for mounting the semiconductor chip 1 on a lead frame (not shown) has a lead frame supply section 3 having a loading unit 3a and a lead frame storage section 4 having a magazine 4a. A lead frame transport section 5 serving as a transfer path for connecting the supply section 3 and the lead frame storage section 4 is provided. Along this lead frame transport section 5, a paste dispenser 6, a chip supply section 7, a mount arm section 8, and a bonding head section 9 are provided. The chip supply section 7 and the mount arm section 8 are arranged to face the bonding head section 9.

The lead frame supplied from the loading unit 3a of the lead frame supply unit 3 to the lead frame transport unit 5 is a bonding material for bonding the semiconductor chip 1 during transfer by the lead frame transport unit 5, for example. A silver paste is applied. This bonding material is supplied from a supply nozzle 6a of the paste dispenser 6, and is applied to a die pad which is a semiconductor chip bonding portion substantially at the center of the lead frame. For example, a mount arm 8 having a rotating arm
The semiconductor chip 1 is transferred from the chip supply unit 7 and supplied. The mount arm 8 is provided with a collet 10 for holding the semiconductor chip 1 by vacuum suction.

[0005] As shown in FIG. 5, the collet 10 is detachably mounted on a collet holder 12 attached to a lower end of a mount arm section 8 via an adjusting section 11.
This mount arm 8 is installed so as to be able to move up and down,
The mounting state of the collet holder 12 on which the collet 10 is mounted can be adjusted with respect to the mount arm section 8 by operating the adjusting screw 13 of the adjusting section 11 or the like. Also,
A vacuum pipe 14 for vacuum suction by the collet 10 is connected to the collet holder 12.

The collet 10 allows the chip supply unit 7
Semiconductor chip 1 set on a dicing tape (not shown) of wafer cassette ring 15 mounted on
And can be removed from the dicing tape. Semiconductor chip 1 sucked and held by collet 10
Is transferred onto the lead frame of the lead frame transport unit 5 with the movement of the mount arm unit 8, and is mounted on the die pad.

[0006] The semiconductor chip 1 mounted on the die pad of the lead frame is joined to the lead frame by a bonding head 9 via a joining material. When the semiconductor chip 1 is placed on the die pad, the bonding arm 16 of the bonding head 9 moves above the semiconductor chip 1 and then descends, pressing the semiconductor chip 1 against the die pad and joining the two. As a result, the semiconductor chip 1 is bonded to the lead frame. The lead frame for which bonding has been completed is sent by the lead frame transport section 5 to the lead frame storage section 4 and stored in the magazine 4a.

The die bonding apparatus 2 has a camera 17 disposed above the chip supply section 7 and a camera 17.
A monitor 18 for displaying an image taken by the camera is provided. The monitor 18 can display an image of the wafer W of the wafer cassette ring 15 mounted on the chip supply unit 7.

There are various sizes of the semiconductor chip 1 to be bonded, and the collet 10 for adsorbing the semiconductor chip 1 is replaced with a collet 10 adapted to the size each time the size of the semiconductor chip 1 changes. Then, it is necessary to mount it on the mount arm 8.

[0009]

However, when replacing the collet 10, it is necessary to adjust the state of attachment of the collet holder 12 to the mount arm 8.
That is, each time replacement is performed, the position (X,
(Y, θ) coordinates and their inclinations must be adjusted. Since it is complicated and difficult to perform such mounting adjustment every time the size of the semiconductor chip 1 changes, the size of the semiconductor chip 1 to be bonded cannot be easily exchanged. For this reason, the number of semiconductor chips 1 that can be accommodated by one collet 10 is limited, and long-term production by continuous work cannot be performed, which causes a decrease in productivity.

SUMMARY OF THE INVENTION The present invention has been made in consideration of the above-described conventional technique, and has as its object to provide a die bonding apparatus capable of easily changing a collet according to a change in the size of a semiconductor chip.

[0011]

In order to achieve the above object, according to the present invention, in a die bonding apparatus having a collet for holding a semiconductor chip by suction, a plurality of collets corresponding to the size of the semiconductor chip can be selected. There is provided a die bonding apparatus characterized by being provided.

According to the above configuration, when the size of the semiconductor chip changes, a collet corresponding to the size can be selected from a plurality of collets provided in advance.
Thereby, the collet can be easily changed according to the size change of the semiconductor chip.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an overall configuration diagram schematically showing a die bonding apparatus according to an embodiment of the present invention. FIG.
FIG. 2 is a front view of a mount arm provided in the die bonding apparatus of FIG. 1. 3A and 3B show a collet mounted on the mount arm unit of FIG. 2, wherein FIG. 3A is a perspective view and FIG. 3B is an enlarged perspective view of a tip.

The present invention is obtained by improving the mount arm 8 of the die bonding apparatus shown in FIG. FIG.
As shown in FIG. 1, a die bonding apparatus 2 for mounting a semiconductor chip 1 on a lead frame (not shown) has a lead frame supply section 3 having a loading unit 3a and a lead frame storage section 4 having a magazine 4a. A lead frame transport unit 5 of, for example, a belt conveyor type, which connects the lead frame supply unit 3 and the lead frame storage unit 4 is provided. Along this lead frame transport section 5, a paste dispenser 6, a chip supply section 7, a mount arm section 21 mounted on an arm drive section 20,
A bonding head 9 is provided. The chip supply section 7 and the mount arm section 21 are arranged to face the bonding head section 9.

The paste dispenser 6 supplies, for example, a silver paste as a bonding material for bonding the semiconductor chip 1 to the lead frame being moved by the lead frame transport unit 5. The chip supply unit 7 is provided with wafers W set on a dicing tape (not shown) of the wafer cassette ring 15 and divided into individual semiconductor chips 1 mounted on a lead frame.

The arm driving section 20 is formed by using, for example, a vertical linear motor guide or the like, and moves the entire mounting arm section 21 up and down, and also connects the mounting arm section 21 to the chip supply section 7 and the lead frame transport section 5. Reciprocating or rotating by an arm (not shown).

As shown in FIG.
The adjusting unit 22 is provided at the lower end of the arm driving unit 20 (see FIG. 1).
And a plurality of collet holders 24 slidably mounted on the holder guide 23. Each collet holder 24 has
Collets 10 of different sizes for holding the semiconductor chip 1 by vacuum suction are mounted.

The adjusting section 22 has an attaching section 22a attached to the lower end of the arm driving section 20 by a fixing screw 25.
The attachment state of the holder guide 23 to the arm drive unit 20 can be adjusted by operating the adjustment screw 26 and the like. Thus, once the holder guide 23 is mounted in an appropriate posture, the mounting state of the plurality of collet holders 24 is properly adjusted, and the adjustment of the mounting state when selecting and using each collet holder 24 becomes unnecessary. .

Each collet holder 24 includes a holder guide 2
The holder guide 23 can move freely along the length 3, and the substantially entire length of the holder guide 23 is the movement range a. Each collet holder 24 can be moved up and down with respect to the holder guide 23, and a vertical hole 27 is formed in the front surface of each collet holder 24. The collet holder 24 is provided in the vertical hole 27 with the holder guide 2.
A fixing screw (fixing means) 28 for fixing the device 3 is mounted. By tightening the fixing screw 28,
The collet holder 24 is fixedly held by the holder guide 23 at an arbitrary position in the longitudinal direction of the holder guide 23, and at the same time,
The holder guide 23 is fixed and held at an arbitrary position of the vertical hole 27 in the vertical direction. Also, on the upper surface of the collet holder 24,
A piping coupler 29 connected to the vacuum piping 14 for vacuum suction by the collet 10 is provided. With this piping coupler 29, the collet holder 24 and the vacuum piping 14 can be easily attached and detached.

The number of collet holders 24 mounted on the holder guide 23 can be arbitrarily set as required. For example, in FIG. 2, five collet holders 24 are mounted. The collet holder 24 is attached to and detached from the holder guide 23 by, for example, the holder stopper 23.
This can be easily performed from the end 23b opposite to the end a.

From the plurality of collet holders 24 previously mounted on the holder guide 23, the collet 10 that matches the size of the semiconductor chip 1 to be bonded is selected and used. In this case, the selected collet holder 24 is lowered lower than the others and fixed to the holder guide 23 with the fixing screw 28. The fixed position of the selected collet 10 may be determined at a substantially central portion of the holder guide 23 as shown in FIG. 2, or the collet holder 24 at an arbitrary position is selected if the rigidity of the holder guide 23 is sufficiently high. May be lowered. If the selected collet 10 is set at a fixed position, the arm drive for transferring it to the lead frame may be a fixed reciprocating operation, and if a collet 10 at an arbitrary position is selected and set at that position, Positioning with respect to the lead frame can be performed by position control during transfer by arm drive control.

When selecting and moving the collet holder 24, the fixing screw 28 can be loosened. By loosening the fixing screw 28, the collet holder 24 can slide freely on the holder guide 23. By tightening the fixing screw 28, the collet holder 24 can be arbitrarily positioned on the holder guide 23 during sliding, and 23 can be positioned and fixed at an arbitrary height.

As described above, by mounting a plurality of collet holders 24 of different sizes to the holder guide 23, a necessary collet holder 24 can be selected and arranged at a semiconductor chip transfer position as needed. This allows
Each time the size of the semiconductor chip 1 to be bonded changes, the collet holder 24 on which the collet 10 corresponding to the size is mounted is moved on the holder guide 23 and lowered at a predetermined position to be fixed, or simply selected. It can be set easily simply by lowering it at that position.

As shown in FIG. 3, the collet 10 has a rod-shaped base 30 inserted into and fixed to the collet holder 24, and a suction portion 31 formed at the tip of the base (see (A)). The suction portion 31 is formed of a substantially rectangular contoured projection 32 and a suction hole 33 located substantially at the center of the concave surface surrounded by the contoured projection 32 and communicating with the vacuum pipe 14 (see (B)). The semiconductor chip 1
The semiconductor chip 1 can be sucked and held on the collet 10 by making a vacuum suction through the suction hole 33 while being in contact with the semiconductor chip 1.

The die bonding apparatus 2 has a camera 17 disposed above the chip supply unit 7 and a camera 17.
A monitor 18 for displaying an image taken by the camera is provided. The monitor 18 can display an image of the wafer W of the wafer cassette ring 15 mounted on the chip supply unit 7, and can constantly check the slice state of the wafer W divided into individual semiconductor chips 1. At the same time, it is possible to display the semiconductor chip 1 to be sucked and control the alignment of the collet 10.

In the die bonding apparatus having the above configuration, the loading unit 3 of the lead frame supply unit 3
a, the bonding material for bonding the semiconductor chip 1 from the supply nozzle 6a of the paste dispenser 6 is supplied to the lead frame supplied to the lead frame transport unit 5 from the supply nozzle 6a during the transfer by the lead frame transport unit 5. Is applied to a die pad, which is a semiconductor chip bonding portion substantially at the center. The semiconductor chip 1 is transferred and supplied from the chip supply unit 7 to the lead frame to which the bonding material has been applied by the mount arm unit 21 as described below.

The collet 10 that has moved onto the chip supply unit 7 together with the mount arm unit 21 vacuum-adsorbs the semiconductor chip 1 set on a dicing tape (not shown) of the wafer cassette ring 15 mounted on the chip supply unit 7. Hold by and remove from the dicing tape. The semiconductor chip 1 sucked and held by the collet 10
As the mount arm 21 moves, it is transported onto the lead frame of the lead frame transport section 5 and placed on the die pad.

The semiconductor chip 1 mounted on the die pad of the lead frame is bonded to the lead frame by a bonding head 9 via a bonding material. When the semiconductor chip 1 is placed on the die pad, the bonding arm 16 of the bonding head 9 moves above the semiconductor chip 1 and then descends, pressing the semiconductor chip 1 against the die pad and joining the two. As a result, the semiconductor chip 1 is bonded to the lead frame. The lead frame for which bonding has been completed is sent by the lead frame transport section 5 to the lead frame storage section 4 and stored in the magazine 4a.

In the above die bonding step, when the size of the semiconductor chip 1 to be bonded changes.
A collet 10 that adsorbs the semiconductor chip 1 is selected and used according to its size. In this case, for example, the collet holder 24 on which the collet 10 corresponding to the size is mounted is moved on the holder guide 23. The collet holder 24 is moved to the holder stopper 23a side by loosening the fixing screw 28 of the previously used collet holder 24, and then moving to the desired collet holder 24.
Is moved to a predetermined position corresponding to the die bonding position, and the fixing screw 28 is tightened for positioning.
That is, the collet holder 24 on which the selected collet 10 is mounted is fixedly held at the semiconductor chip suction position on the holder guide 23 by the fixing screw 28.

Therefore, unlike the conventional bonding apparatus, there is no need to replace the collet 10 by attaching and detaching the collet 10 to and from the collet holder 12 each time the size of the semiconductor chip 1 to be bonded changes. At this time, the selected collet holder 24 is
3 and is positioned at the same position as the previous collet holder 24, so that it is not necessary to adjust the (X, Y, θ) coordinates or the inclination thereof in accordance with the die bonding position each time the selection is made.

Therefore, it is not necessary to adjust the state of attachment of the collet holder 24 to the mount arm portion 8 every time the collet 10 is changed, and the collet 10 can be easily and easily adjusted according to the size change of the semiconductor chip 1 to be bonded. Can be changed. For this reason, if a plurality of collet holders 24 having different sizes are mounted in advance, the die bonding operation can be performed continuously even if the size is different, as long as the semiconductor chip 1 can cope with the collet 10. Therefore, the size of the semiconductor chip 1 can be easily exchanged, and long-term production by continuous operation can be performed, so that productivity can be improved.

The above-mentioned collet holder 24 reciprocates linearly on the holder guide 23, but it is also possible to arrange the collet selected by a rotary motion in the turret type at a predetermined use position. Good.

[0033]

As described above, according to the die bonding apparatus of the present invention, when the size of a semiconductor chip changes, a collet adapted to the size is selected from a plurality of collet holders set in advance. Since the collet can be selected, the collet can be easily changed according to the change in the size of the semiconductor chip without replacing the collet of the collet holder. Therefore, it is not necessary to adjust the mounting state each time the collet is changed, and the collet can be easily and easily changed according to the size change of the semiconductor chip to be bonded. Can work,
Long-term production by continuous work becomes possible, and productivity can be improved.

[Brief description of the drawings]

FIG. 1 is an overall configuration diagram schematically showing a die bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a front view of a mount arm provided in the die bonding apparatus of FIG. 1;

3A and 3B show a collet mounted on the mount arm unit of FIG. 2, wherein FIG. 3A is a perspective view and FIG. 3B is an enlarged perspective view of a tip.

FIG. 4 is an overall configuration diagram schematically showing a conventional die bonding apparatus.

FIG. 5 is a front view of a mount arm unit provided in the die bonding apparatus of FIG. 4;

[Explanation of symbols]

1: semiconductor chip, 2: die bonding apparatus, 3: lead frame supply section, 3a: loading unit, 4: lead frame storage section, 4a: magazine, 5: lead frame transport section, 6: paste dispenser, 7: chip supply section , 9: bonding head, 10: collet, 1
4: Vacuum piping, 15: Wafer cassette ring, 16: Bonding arm, 17: Camera, 18:
Monitor, 20: arm drive unit, 21: mount arm unit, 22: adjusting unit, 22a: mounting unit, 23: holder guide, 23a: holder stopper, 23b: opposite end,
24: Collet holder, 25: Fixing screw, 26: Adjusting screw, 27: Vertical hole, 28: Fixing screw, 29: Piping coupler, 30: Base, 31: Suction part, 32: Contour projection, 3
3: suction hole, a: moving range, W: wafer.

Claims (2)

[Claims] 1. A die bonding apparatus having a collet for sucking and holding a semiconductor chip, wherein a plurality of collets corresponding to the size of the semiconductor chip are provided in a selectable manner. 2. The method according to claim 1, wherein each of the collets is mounted on a holder movable on a guide, and the holder on which the selected collet is mounted is fixedly held at a semiconductor chip suction position on the guide by a fixing means. The die bonding apparatus according to claim 1, wherein: