JPH1092768A - Semiconductor bar member peeling/supply equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the adhesion area of an adhesive tape and a semiconductor bar part member, and reduce adhesion by abutting a plurality of contact part members against the back of an adhesive sheet at isolation intervals, and forming a space part in the state of negative pressure which part is formed by the back of the adhesive tape and the facing contact part members. SOLUTION: The upper side part of a contact part member 1 is formed in a triangle mountain type. Planar part members 2 for setting isolation intervals P are arranged between contact part members 1. A plurality of the contact part members 1 and the interval setting part members 2 are alternately arranged in a lateral row layer type in an accommodating recessed part 4 formed in a square block material 3. Upper side top parts 1a of a plurality of the contact part members 1 are arranged in the same plane as the upper surface of the square block material 3. Upper surfaces 2a of the interval setting part members 2 are arranged at positions lower than the upper side top parts of the contact part members 1. A negative presser mechanism 5 connects a vacuum pump with each negative pressure hole 6, formed in each of the interval setting part members 2 and forms the state of negative pressure in a space part R 3 formed by the back of the adhesive sheet S and the facing contact part members 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for peeling and supplying a semiconductor bar member used in the process of manufacturing a square chip from a compound semiconductor wafer such as gallium arsenide or gallium aluminum.

[0002]

2. Description of the Related Art Conventionally, in a manufacturing process of a semiconductor square chip of this kind, as shown in FIGS. 7 to 9, a thin adhesive sheet S is put on an upper surface of an annular holding frame M made of aluminum or the like. The periphery of the sheet S is bent along the peripheral side surface of the holding frame M, and a fastening ring N made of rubber band is put on the surface of the bent portion, whereby the thin-film adhesive sheet S is put on the upper surface of the holding frame M in a tensioned state. On the adhesive sheet S, for example, a semiconductor bar member W having a square cross section having a thickness of about 80 μm, a width of about 1 mm, and a length of about 40 mm formed by scribing a wafer is adhered in a parallel state. Until the next step of cutting the semiconductor bar member W in the width direction to produce a substantially rectangular chip, the holding frame M is transferred while being in the adhesive state, and in the next step, the adhesive is adhered in a parallel state on the adhesive sheet S. Have been The semiconductor bar member W, for example, be supplied to an unillustrated cutting mechanism portion and one destined removed by suction effect from the negative pressure hole K ₁ which is formed on the negative pressure suction pads K.

[0003]

However, in the case of the above-mentioned conventional structure, when the holding frame M adhered in a side-by-side manner on the adhesive sheet S is transferred and the semiconductor bar members W on the adhesive sheet S are peeled one by one. In addition, due to the strength of the adhesive force between the adhesive sheet S and the semiconductor bar member W, at the stage of peeling the semiconductor bar member W from the adhesive sheet S, since the semiconductor bar member W is a very fragile and brittle material, The semiconductor bar member W may be broken, which may lower the yield and lower the workability.

[0004]

An object of the present invention is to solve such inconveniences. Among the present invention, the invention described in claim 1 is arranged in parallel on a thin film-like pressure-sensitive adhesive sheet. A plurality of semiconductor bar members are peeled off and supplied one by one, and a plurality of contact members contacting the back surface of the pressure-sensitive adhesive sheet at an interval, and the contact member and the adjacent contact member A semiconductor bar member comprising: an interval setting member for setting a separation interval; and a negative pressure mechanism capable of forming a space formed by a back surface of the pressure-sensitive adhesive sheet and an opposing contact member in a negative pressure state. It is in the peeling supply device.

According to a second aspect of the present invention, the space setting member has a negative pressure hole connected to a negative pressure generating source of the negative pressure mechanism. The invention described in Item 3 is characterized in that the interval setting member is configured to be replaceable.

[0006]

1 to 6 show an embodiment of the present invention, wherein 1 is a contact member and 2 is a spacing member. In this case, the contact member 1 has a plate-like shape and an upper side portion. Are formed in a triangular mountain shape, and a plate-shaped interval setting member 2 that sets a separation interval P between the contact member 1 and an adjacent contact member 1 is disposed,
In this case, a storage recess 4 is formed in the square block material 3, a gap setting member 2 having a different plate thickness T is prepared, and the space setting member 2 is replaceable. The members 1 and the interval setting members 2 are alternately arranged in a horizontal layer, and the tops 1a of the upper sides of the plurality of contact members 1 are arranged flush with the upper surface of the square block material 3 and the upper surface 2a of the interval setting member 2 is contacted with the contact members. 1 is arranged at a position lower than the top 1a of the upper side.

Reference numeral 5 denotes a negative pressure mechanism. In this case, a negative pressure hole 6 is formed in each interval setting member 1, and a negative pressure source such as a vacuum pump (not shown) is provided in each negative pressure hole 6 via a negative pressure pipe 7. To the back surface of the adhesive sheet S and the opposing contact members 1.1
Is formed in a negative pressure state.

In this case, the adhesive sheet S is stretched on the holding frame M in a tension state, and the semiconductor bar members W are adhered on the adhesive sheet S in a parallel state.

Since this embodiment has the above configuration,
A thin pressure-sensitive adhesive sheet S is placed on the upper surface of an annular holding frame M made of aluminum or the like, and the periphery of the pressure-sensitive adhesive sheet S is bent along the peripheral side surface of the holding frame M, and the surface of the bent portion is made of rubber band. A fixing ring N is put on the thin film-shaped adhesive sheet S on the upper surface of the holding frame M in a stretched state, and the semiconductor bar members W are adhered in a side-by-side state on the adhesive sheet S. As shown in FIGS. 2 and 3, the holding frame M which is automatically transferred is put on the square block material 3, and
As a result, as shown in FIG. 4, the pressure-sensitive adhesive sheet S is placed in contact with the tops 1a of the upper sides of the plurality of contact members 1 in the storage recess 4, and in this state, the negative pressure mechanism 5 applies a negative pressure to the space R. Then, as shown in FIG. 5, the adhesive tape S is pulled inward and bent, whereby the adhesive area between the adhesive tape S and the semiconductor bar member W is reduced, and the adhesive force is reduced accordingly. 6 as, the one destined for stripping to a suction effect from the pressure-sensitive adhesive sheet semiconductor bar member W negative pressure hole K ₁ which is formed on the negative pressure suction pads K being adhesive in juxtaposition on S is transported to the next step Can be.

At this time, the adhesive sheet S is placed in contact with the top side 1a of the upper side of the plurality of contact members 1 in the storage recess 4,
In this state, the adhesive tape S is pulled inward by bending the space portion R by the negative pressure mechanism 5 to be bent, thereby reducing the adhesive area between the adhesive tape S and the semiconductor bar member W. The adhesive strength can be reduced, and the semiconductor bar members W adhered in a parallel state on the adhesive sheet S can be prevented from being broken and can be separated and supplied to the next step, thereby improving workability. it can.

Further, in this case, since the negative pressure hole 6 connected to the negative pressure generating source of the negative pressure mechanism 5 is formed in the space setting member 2, the back surface of the adhesive sheet S and the contact members 1.
1, a good negative pressure action can be given to the space portion R formed by the space setting member 1. In this case, since the space setting member 2 is configured to be replaceable, the space setting member 2 having a different plate thickness T can be provided.
By replacing the contact member 1 with the adjacent contact member 1
Can be varied, whereby the adhesive area between the adhesive tape S and the semiconductor bar member W can be arbitrarily reduced and reduced to an arbitrary adhesive strength. Can be prevented, and one by one can be separated and supplied to the next step reliably.

It should be noted that the present invention is not limited to the above-mentioned embodiment, and the shapes of the contact member 1 and the interval setting member 2, the structure of the negative pressure mechanism 5, and the like are appropriately changed and designed.

[0013]

As described above, according to the first aspect of the present invention, the pressure-sensitive adhesive sheet is placed in contact with the plurality of contact members, and the space portion is brought into a negative pressure state by the negative pressure mechanism. By doing so, the pressure-sensitive adhesive tape is pulled inward and bent, thereby reducing the pressure-sensitive adhesive area between the pressure-sensitive adhesive tape and the semiconductor bar member, thereby reducing the pressure-sensitive adhesive strength, and thus, the pressure-sensitive adhesive sheet is adhered in parallel on the pressure-sensitive adhesive sheet. The semiconductor bar member can be prevented from being broken and peeled one by one and supplied to the next step, so that workability can be improved.

According to the second aspect of the present invention, since the space setting member is provided with a negative pressure hole connected to a negative pressure generating source of the negative pressure mechanism, the back surface of the adhesive sheet and the opposing contact are formed. A good negative pressure action can be imparted to the space formed by the member. In the invention according to the third aspect, since the interval setting member is configured to be replaceable, the thickness of the plate is reduced. By replacing with a different interval setting member, it is possible to change the separation interval between the contact member and the adjacent contact member, thereby arbitrarily reducing the adhesive area between the adhesive tape and the semiconductor bar member and allowing any adhesive Therefore, the semiconductor bar member can be prevented from being broken, and can be peeled off one by one and reliably supplied to the next step.

As described above, the intended purpose can be sufficiently achieved.

[Brief description of the drawings]

FIG. 1 is an overall perspective view of an embodiment of the present invention.

FIG. 2 is an overall sectional view of an embodiment of the present invention.

FIG. 3 is an overall plan view of an embodiment of the present invention.

FIG. 4 is a partially enlarged cross-sectional view of the embodiment of the present invention.

FIG. 5 is a partially enlarged sectional view of the embodiment of the present invention.

FIG. 6 is a side view of the embodiment of the present invention.

FIG. 7 is a perspective view of a semiconductor bar member.

FIG. 8 is a plan view of a holding frame.

FIG. 9 is a side view of the holding frame.

[Explanation of symbols]

 W Semiconductor bar member S Adhesive sheet P Separation interval R Space portion 1 Contact member 2 Interval setting member 5 Negative pressure mechanism 6 Negative pressure hole

Claims (3)

[Claims] 1. A method for supplying a plurality of semiconductor bar members arranged in parallel on a thin film-like adhesive sheet by peeling them one by one, wherein a plurality of contact members abut on a back surface of the adhesive sheet at a distance. A member, an interval setting member for setting the separation interval between the contact member and an adjacent contact member, and a negative pressure capable of forming a space formed by the back surface of the adhesive sheet and the opposing contact member in a negative pressure state. And a mechanism for peeling and supplying a semiconductor bar member. 2. The apparatus according to claim 1, wherein a negative pressure hole connected to a negative pressure source of the negative pressure mechanism is formed in the interval setting member. 3. The apparatus according to claim 1, wherein said interval setting member is replaceable.