JPH1086174A - Method and apparatus for resin-seal molding of electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To continue the molding operation of other units and implement the maintenance inspection work or the like of necessary units by setting each unit interstice in a plurality of molding units as movement areas for a loader unit, and allowing the loader unit or the like to be moved reciprocally in the areas. SOLUTION: When conducting maintenance inspection work only for a molding unit 5a, by ceasing operation of the molding unit 5a via a controller unit 13 and each operation of a loader unit 6 and so on relative to the loading unit 5a, maintenance inspection work can be done for the unit 5a while molding work is continued in other molding units 5b, 5c, 5d. The reciprocal movement areas of the loader unit 6 and so forth relative to the unit 5b, 5c, 5d are limited in areas 19, 20 not to run over the areas, so that a danger of collision with workers can be avoided beforehand, and its productivity can also be avoided from being lowered.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a resin sealing molding method and apparatus for sealing electronic components such as ICs, LSIs, diodes, and capacitors mounted on a lead frame with a resin material.

[0002]

2. Description of the Related Art Conventionally, an electronic component is resin-molded by a transfer molding method. This method generally includes a resin-sealing molding apparatus having the following basic structure. Is used.

That is, this type of resin encapsulation molding apparatus includes a pair of dies in which a fixed upper die and a movable lower die are arranged to face each other, a resin material supply pot disposed in the dies, A plunger for pressurizing the resin fitted in the pot, a cavity opposed to the mold surface of the mold, a resin passage and the like disposed between the pot and the cavity are provided. Then, the resin tablet is supplied into the pot, and the electronic component mounted on the lead frame is supplied and set at a predetermined position in the cavity to perform mold clamping, and further heat the resin tablet in the pot. By melting and injecting the molten resin material into the required number of cavities disposed at the side of the pot through the resin passage, respectively, the electronic components fitted in the respective cavities are respectively filled. Resin sealing molding is performed.

In recent years, for the purpose of simultaneously molding the same or different molded articles (resin-sealed molded articles), for example, FIG.
As shown in FIG. 1, there is proposed a resin encapsulation molding apparatus in which a plurality of molding units 50 for encapsulating and molding electronic components are arranged in a row (four molding units 50a, 50b. 50c ・ 50d). The molding apparatus shown in FIG. 4 uses the loader unit 51 disposed on one side of each of the molding units 50 to move the aligned lead frames 60 and the resin tablets 61 before the resin sealing to predetermined positions of the respective molding units 50. It is configured to supply to. In addition, the resin-encapsulated lead frame after resin-sealing molding was taken out using the unloader unit 52 disposed on the other side of each of the molding units 50, and was integrally mounted on the unloader unit 52. The cleaner unit 53 and the resin-sealed lead frame transfer unit 54 are used to clean the mold surface, and the resin-sealed lead frame is transferred to the next step. The above units 51, 52, 53
Each of the operations 54 is configured to be continuously and automatically controlled by the controller unit 58. Therefore, in the above-described molding apparatus, the loader unit
The moving area 55 of 51 is set as an elongated space on one side of each of the molding units 50,
The loader unit 51 moves within the moving area 55, and the moving area 56 of the unloader unit 52 (and the cleaner unit 53 and the resin-sealed lead frame transfer unit 54) corresponds to each of the moldings. On the other side of the unit 50, a similar elongated space is set, and the units 52, 53, and 54 move within the moving area 56.

[0005]

In the case where the molding apparatus shown in FIG. 4 is used, when any one of the molding units 50 is stopped for some reason and the processing operation is performed, all the molding units 50 are removed.
Alternatively, there may be a problem that the entire molding apparatus must be stopped. That is, in each molding unit 50, when an abnormal condition such as molding failure occurs and the mold needs to be maintained and inspected, or when the production of the molded product is completed and the mold is replaced for the next production. Alternatively, when the resin burrs attached to the mold surface of the mold are periodically removed, it may be necessary to stop the entire molding apparatus and perform the processing operation.
For example, when an abnormality occurs in the molding unit 50b, only the molding unit 50b may be stopped to perform a required maintenance operation. However, when only the molding unit 50b is stopped and the required maintenance work is performed while continuing the molding work in the other molding units (50a, 50c, 50d), the above-described loader unit 51 and unloader unit 52 are required. Since the units 51 and 52 reciprocate in the moving areas 55 and 56, there is a danger of work such that these units 51 and 52 collide with the worker performing the maintenance work at the work positions J and K. Therefore, in order to avoid the operational danger as described above, the molding operation of other molding units (50a, 50c, 50d) which do not need to be stopped essentially must be interrupted. That is, even when any one of the molding units 50 is stopped for the purpose of maintenance and inspection, the entire apparatus must be stopped after all. For this reason, such an apparatus has the above-mentioned operational danger, and in order to avoid this, it is necessary to stop the entire molding apparatus. There is such an adverse effect.

Therefore, the present invention does not cause the above-mentioned operational danger even when, for example, a molding operation of any one molding unit is stopped and a maintenance operation or the like is performed. Further, an object of the present invention is to provide a method and an apparatus for resin-sealing and molding an electronic component that can perform maintenance work or the like of only the molding unit without interrupting or stopping the molding work by another molding unit. It is.

[0007]

According to the present invention, there is provided a resin molding method for an electronic component, comprising: a lead frame before resin molding; A resin material is separately supplied, and the electronic component mounted on the lead frame before resin sealing is sealed and molded with resin, and the resin-molded lead frame is separately taken out from each of the molding units. Resin sealing molding method of the electronic component,
The space between the molding units provided by arranging the plurality of molding units in parallel is provided with the above-described lead frame before resin sealing, the loader unit for supplying the resin material, and the resin sealed The moving area of the unloader unit for taking out the lead frame is set as a moving area, and the loader unit and the unloader unit are reciprocated within the moving area.

Further, a resin sealing and molding apparatus for an electronic component according to the present invention for solving the above-mentioned technical problems includes a supply unit for a plurality of pre-resin-sealed lead frames on which electronic components are mounted, and A lead frame alignment unit for aligning the pre-resin-sealed lead frame in a predetermined direction, a resin tablet supply unit, a resin tablet unloading unit for aligning and discharging the resin tablet, and A plurality of molding units for resin-sealing and molding electronic components; a loader unit for transferring the aligned lead frame before resin sealing and the resin tablet to each of the molding units described above; Loader unit and continuously and automatically control each operation of each unit A resin molding apparatus for electronic components, comprising: a plurality of molding units, wherein a plurality of the molding units are arranged in parallel to provide a space between the molding units at a predetermined interval, A space at a predetermined interval is set as a moving area of the above-described pre-resin-sealed lead frame and the loader unit for supplying the resin tablet, and the above-described unloader unit for taking out the resin-sealed lead frame, and The unit is configured to reciprocate within the range of the movement area.

[0009]

According to the present invention, a plurality of molding units are arranged in parallel to provide a space at a predetermined interval between the molding units, and the space at a predetermined interval is defined by a loader unit and an unloader unit. And the loader unit and the unloader unit are reciprocated within the range of the movement region, so that the loader unit and the unloader unit move the Is not projected out of the range of the moved region. Therefore, the danger of the work such that the loader unit and the unloader unit that reciprocate reciprocally collide with the worker during the usual resin sealing molding operation for resin sealing and molding the electronic component is reliably avoided. Also, for example, in a case where it is necessary to perform an operation such as maintenance and inspection or mold replacement only for a specific molding unit during a normal resin sealing molding operation, the molding unit is connected via a controller unit. And the operation of the loader unit and the unloader unit with respect to the molding unit are stopped, so that the normal resin sealing molding operation in other molding units is continued while the mold changing operation for a specific molding unit is performed. Can be performed.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. FIG. 1 schematically shows the overall configuration of a resin-sealing molding apparatus according to the present invention. FIG. 2 shows a main part of the resin sealing molding apparatus.

The above-mentioned resin encapsulation and molding apparatus includes a supply unit 1 for a pre-resin encapsulation lead frame (lead frame before resin encapsulation) on which electronic components are mounted, and the pre-resin encapsulation lead frame 14. Lead frame alignment unit 2 for aligning in a predetermined direction, resin tablet (resin material) 15
Supply unit 3, a resin tablet carry-out unit 4 for aligning and carrying out the resin tablet 15, and a plurality of molding units 5 (5a · 5) for resin-sealing and molding electronic components.
b, 5c, 5d), a loader unit 6 for individually transferring the aligned lead frame 14 and resin tablet 15 to each of the molding units 5, and a resin-sealed lead frame (lead frame after resin sealing molding). The unloader unit 7 to be taken out, the mold cleaner unit 8 integrally mounted on the unloader unit 7, the transfer unit 9 for transferring the resin-sealed lead frame, and the gate of the resin-sealed lead frame are removed. And a pickup unit 11 for individually engaging the resin-sealed lead frame from which the gate has been removed,
A lead frame accommodating unit 12 for accommodating each of the individually resin-sealed lead frames in each magazine,
A controller unit 13 and the like for continuously and automatically controlling each operation of each unit are provided.

As shown in FIGS. 1 and 2, each of the molding units 5 is disposed opposite to the fixed upper die 16 and the lower portion of the fixed upper die 16 and is vertically driven by a required die opening / closing mechanism. A pair of resin molding dies including a movable lower mold 17 is provided, and a plurality of pots 18 are provided on the movable lower mold 17 side. Further, a plunger for pressurizing the resin tablet is fitted in each pot 18, and heating means such as a heater is provided in the upper and lower molds 16 and 17, and the mold surfaces of the upper and lower molds are also provided. Is provided with a required number of resin molding cavities, and a resin passage (not shown) is provided between each of the pots and each of the cavities. Therefore, with both upper and lower dies 16 and 17 clamped,
The resin tablet 15 in each pot is heated and melted, and the molten resin material can be injected and filled into each cavity through the resin passage.

The loader unit 6 includes a pre-resin-sealed lead frame 14 (two sheets in the illustrated example) aligned by the lead frame alignment unit 2, the resin tablet supply unit 3 and the resin tablet unloading. A loader 21 (see FIG. 2) for simultaneously transferring a plurality of (three in the example shown) resin tablets 15 aligned and carried out by the unit 4 to each of the molding units 5 is provided. The loader 21 is provided so as to reciprocate between the position of the lead frame alignment unit 2 and each position of each of the molding units 5, and the loader 21 controls the movable lower mold 17 of each of the molding units 5. Move the lead frame 14 before resin sealing to a predetermined position of the cavity portion of the movable lower die 17 and move each resin tablet 15 to each pot of the movable lower die 17
18 are provided so that they can be respectively supplied. In the loader (21) described above, both of these transfer mechanisms may be configured separately, and a configuration may be employed in which each of the transfer mechanisms is operated individually.

The unloader unit 7 includes:
An unloader 22 for taking out the resin-sealed lead frame molded by the molding unit 5 to the outside of the upper and lower dies 16 and 17 is provided (see FIG. 2). The unloader 22 is provided so as to reciprocate with respect to the position of each of the molding units 5. The above-mentioned cleaner unit 8 includes both upper and lower dies 16 and 17 in each of the molding units 5.
An air blow mechanism for blowing air to the mold surface and a vacuum mechanism (not shown) for sucking and removing dust on the mold surface are provided. Further, the cleaner unit 8 is integrated with the unloader 22 of the unloader unit 7, so that the cleaner unit 8 moves with respect to the position of each molding unit 5 as the unloader unit 7 reciprocates. It is provided to reciprocate at the same time. Note that a configuration in which the unloader unit 7 and the cleaner unit 8 described above are separately formed and individually operated may be employed.

The plurality of molding units are arranged in a parallel state, and a space is provided between the molding units at a predetermined interval. It is set as a moving area of a pre-sealed lead frame, a loader unit for supplying a resin tablet, and an unloader unit for taking out a resin-sealed lead frame, and the loader unit and the unloader unit move within the range of the moving area. It is configured to reciprocate. That is, as shown in FIG. 1, the above-mentioned resin encapsulation / molding apparatus includes four molding units 5 arranged in parallel in two rows and two columns in the XY directions.
A space portion having a predetermined space in the XY direction is provided between the space portions, and the space portion having the predetermined space is provided with the above-described lead frame before resin sealing, the loader unit 6 for supplying the resin tablet, and the space for taking out the resin sealed lead frame. Are set as moving regions 19 and 20 of the unloader unit 7, and the loader unit 6 and the unloader unit 7 are configured to reciprocate within the range of the moving regions 19 and 20.

More specifically, the molding unit 5a and the molding unit 5b, and the molding unit 5c and the molding unit 5d are separated from each other at a predetermined interval in the X direction (lateral direction) in FIG. They are arranged in a parallel state. The predetermined interval provided between the horizontal rows of the molding units (5a and 5b) and the horizontal rows of the molding units (5c and 5d) is such that the loader unit 6 is moved in the X direction (horizontal direction). The loader unit 6 is configured to reciprocate in the X direction (lateral direction) within the range of the moving area 19.

The molding unit 5 described above
a and the molding unit 5c, and the molding unit 5b and the molding unit 5d described above.
Are arranged in parallel with each other at a predetermined interval in the Y direction (vertical direction) in FIG. The predetermined interval provided between the vertical rows of the molding units (5a, 5c) and the vertical rows of the molding units (5b, 5d) is the same as that of the unloader unit 7 (and the cleaner unit 8). Is set as a moving area 20 for reciprocating the resin-sealed lead frame transfer unit 9) in the Y direction (vertical direction). Therefore, the unloader unit 7 moves within the range of the moving area 20. It is configured to reciprocate in the Y direction (vertical direction).

As will be described later, the loader unit 6 reciprocates in the moving area 19 in the X direction and moves up and down to the work area 23 shown in FIG. A mechanism 24 is provided. Also,
Similarly, the unloader unit 7 (the cleaner unit 8 and the resin-sealed lead frame transfer unit 9) reciprocates in the movement area 20 in the Y direction,
An appropriate reciprocating and up-and-down movement mechanism 25 for vertically moving to the position of the work area 23 shown in FIG. 2 is provided.

As shown in FIG. 2, when the fixed upper mold 16 and the movable lower mold 17 are in the mold open state, the two molds 16 are movable.
Since a work area 23 for performing the resin molding operation is set between 17 and 17, an area for moving the loader unit 6 and the unloader unit 7 (19.
0) may be provided separately in the upper and lower spaces of the work area 23 described above. For example, as shown in the figure, a moving area 19 for the loader unit 6 is provided in the upper space of the work area 23, and the unloader unit 7 (the cleaner unit 8 and the resin) is provided in the lower space of the work area 23. A moving area 20 for the sealed lead frame transfer unit 9) may be provided. Accordingly, in this case, the loader unit 6 that has moved in the moving area 19 stops at the position of the predetermined molding unit and descends to the position of the work area 23, and the molding unit The operation of supplying and setting the pre-resin-sealed lead frame 14 and the resin tablet 15 at predetermined positions of the mold (lower mold 17) can be performed. Similarly, the unloader unit 7 that has moved in the moving area 20 stops at a predetermined molding unit position, and
23, and in the working area 23, the molded resin-sealed lead frame is taken out from a predetermined position of the mold in the molding unit, and at the same time, the mold surface is cleaned. Work can be performed in parallel. That is, the two moving areas 19 described above
20 are independent of each other, and therefore do not share the region, and are configured in a so-called three-dimensional intersection (position A in FIG. 1).

The controller unit 13 includes:
The operation of each unit is controlled continuously and automatically, and the resin molding of the electronic component by the controller unit 13 is performed, for example, as follows. In addition, since the resin sealing molding operation in each molding unit 5 is performed in substantially the same manner, only the resin sealing molding operation in the molding unit 5a will be described below.

First, in the lead frame supply unit 1, the lead frames 14 before resin sealing are individually transferred to the lead frame alignment unit 2 side. Next, in the lead frame alignment unit 2, the lead frames 14 before resin sealing are aligned in a predetermined direction. Subsequent to or in parallel with the transfer and alignment steps of the lead frames 14 before resin sealing, the resin tablets 15 are aligned by the resin tablet supply unit 3 and the resin tablet unloading unit 4. Let them be carried out. Next, the loader 21 of the loader unit 6 causes each lead frame 14 before resin sealing in the lead frame alignment unit 2 and each resin tablet in the resin tablet supply unit 3 to move.
15 and engage. Next, the loader unit 6 is moved to a predetermined position between the molding units 5a and 5c (a predetermined position in a moving area 19 indicated by reference numeral B in FIG. 1), and the loader unit 6 is moved at this position to the above-described operation. It is lowered to the position of the region 23, and is further moved between the upper and lower dies 16 and 17 of the molding unit 5a, and the lead frame 14 before resin sealing and The resin tablet 15 is disengaged and held and supplied and set at a predetermined position of the cavity portion of the movable lower die 17 and each pot 18 (note that the lead frame 14 and the resin tablet before resin sealing with respect to other molding units). The 15 supply sets can be done in a similar manner). Next, the upper and lower dies 16 and 17 are clamped via the mold opening and closing mechanism in the molding unit 5a, and each pot is closed.
By heating and melting the resin tablet 15 in 18 and injecting and filling the molten resin material into the respective cavities through the resin passages, the electronic components fitted in the respective cavities are individually resin-molded.

Next, the unloader unit 7 is moved to a predetermined position between the molding units 5a and 5b (a predetermined position in the movement area 20 indicated by reference numeral C in FIG. 1), and the unloader unit 7 is moved to this position. 7 is raised to the position of the work area 23, and the upper and lower dies 16 ・ 1 in the molding unit 5a are further moved.
7, the resin-encapsulated lead frame 14 is retracted through the unloader 22 while the resin-encapsulated lead frame 14 is engaged and held. Can be taken out. In addition,
During the retreating movement of the unloader 22, the dust on the mold surface of the upper and lower molds 16 and 17 in the molding unit 5a is removed by air blowing and vacuuming via the air blow mechanism and the vacuum mechanism of the cleaner unit 8. By performing suction removal, the mold surface can be cleaned. Next, the resin-sealed lead frame 14 taken out via the transfer unit 9 of the unloader unit 7 is transferred to the degating unit 10.
And the gate portion is cut and removed. Next, through the pickup unit 11, each of the resin-sealed lead frames from which gates have been removed is separately engaged and transferred to the position of the lead frame accommodating unit 12, and this is transferred to each of the accommodating units 12. Each is housed separately in the stock magazine.

Therefore, for example, in the case of performing the maintenance and inspection of only the molding unit 5a and the operation of exchanging the mold during the normal resin sealing molding operation, the molding unit 5 is controlled via the controller unit 13. By stopping the operation of the molding unit 5a and the operations of the loader unit 6 and the unloader unit 7 with respect to the molding unit 5a, the maintenance of the molding unit 5a is continued while the normal resin sealing molding operation in other molding units is continued. Inspection and mold replacement work can be performed. That is, at this time, the operation of the molding unit 5a, the operations of the loader unit 6 and the unloader unit 7 for the molding unit 5a are stopped, and the other molding units (5b, 5c, 5d) , The reciprocating movement range of the loader unit 6 and the unloader unit 7 is limited to the range of the movement areas 19 and 20 described above. The loader unit 6 and the unloader unit that reciprocate even if the normal molding operation is continuously performed on the other molding units (5b, 5c, 5d) because they are not protruded out of the range. 7, for example, at the working position indicated by the reference symbol D in FIG. The risk of the work that went to collide with the workers doing the work of maintenance and molds such as replacement of a can and reliably avoided in advance. Furthermore, in this case, other molding units (5b, 5c, 5
Since the normal resin sealing molding operation can be performed continuously in d), it is possible to avoid a decrease in productivity that occurs when these molding units are stopped.

Note that the above description also applies to the case where maintenance and inspection of other molding units (5b, 5c, 5d) and mold replacement are performed at the respective working positions indicated by reference numerals E, F, and G in FIG. According to the same procedure, each operation can be performed independently irrespective of the resin sealing molding operation of other molding units. Also in this case, similarly to the above, the danger of work such as collision of another molding unit with the worker can be avoided beforehand and surely, and the above-described decrease in productivity can be avoided. can do.

The present invention is not limited to the above-described embodiment, but may be arbitrarily and appropriately changed and selected as necessary within a range not departing from the gist of the present invention. It is. For example, it is apparent that the number of the molding units 5 described above can appropriately adopt an appropriate configuration according to the type of the molded product, the production amount, and other requirements.

[0026]

According to the present invention, when a resin is molded by a plurality of molding units, for example, when it is necessary to stop one of the molding units, the molded product is formed by other molding units. Maintenance work on the necessary molding unit can be performed without stopping production of the product, thereby ensuring the above-mentioned danger of work for maintenance workers and the adverse effect of reducing productivity. This provides an excellent practical effect that a resin sealing molding apparatus for an electronic component can be provided. Furthermore, in the case where it is necessary to perform a work such as a maintenance check and a mold replacement only for a specific molding unit during a normal resin sealing molding operation, the normal resin sealing for other molding units may be performed. Maintenance and inspection of a specific molding unit, mold replacement work, etc. can be performed while continuing the molding operation, so that there is no need to stop all the molding units as in the past, and therefore, the production This has an excellent practical effect that it is possible to reliably prevent the deterioration of the performance.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing the overall configuration of a resin sealing molding apparatus according to the present invention.

FIG. 2 is an enlarged schematic side view showing a main part of the resin encapsulation molding apparatus corresponding to FIG. 1; Fig. 3 schematically shows a state in which they are separately provided.

FIG. 3 is a schematic plan view showing a configuration example of a conventional resin sealing molding apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead frame supply unit before resin sealing 2 Lead frame alignment unit 3 Resin tablet supply unit 4 Resin tablet unloading unit 5 (5a / 5b / 5c / 5d) Molding unit 6 Loader unit 7 Unloader unit 8 Cleaner unit 9 Resin sealing Completed lead frame transfer unit 10 Degating unit 11 Pickup unit 12 Lead frame housing unit 13 Controller unit 14 Lead frame before resin sealing 15 Resin tablet 16 Fixed upper die 17 Movable lower die 18 Pot 19 Moving area 20 Moving area 21 Loader 22 Unloader 23 Work area 24 Reciprocating and up / down moving mechanism 25 Reciprocating and up / down moving mechanism

Claims (2)

[Claims] 1. A lead frame and a resin material before resin molding are separately supplied to each of a plurality of molding units, and an electronic component mounted on the lead frame before resin molding is molded with resin. A resin sealing molding method for an electronic component, in which the resin-encapsulated molded lead frame is separately taken out from each of the molding units, wherein the plurality of molding units are arranged in parallel. The space between the provided molding units is set as a movement area of the unloader unit for taking out the above-described pre-resin-sealed lead frame and the resin material-supplying loader unit and the resin-sealed lead frame, The loader unit and the unloader unit are reciprocated within the range of the movement area. Method of resin-seal-molding an electronic component, characterized in that there was Unishi. 2. A supply unit for a plurality of pre-resin-sealed lead frames on which electronic components are mounted, a lead-frame alignment unit for aligning each of the pre-resin-sealed lead frames in a predetermined direction, and a supply unit for a resin tablet. A resin tablet unloading unit for aligning and unloading the resin tablet, a plurality of molding units for resin sealing and molding the electronic components on the lead frame before resin sealing, and the aligned lead before resin sealing. A loader unit for transferring the frame and the resin tablet to each of the molding units described above, an unloader unit for taking out the resin-sealed lead frame, and a controller unit for continuously and automatically controlling each operation of each of the units. A resin sealing molding apparatus for electronic parts, comprising: A plurality of molding units are arranged in parallel to provide a space at a predetermined interval between the molding units, and the space at the predetermined space is provided with the above-described lead frame before resin sealing and a loader unit for supplying a resin tablet, and An electronic component, wherein the electronic component is set as a moving area of the unloader unit for taking out the resin-sealed lead frame, and the loader unit and the unloader unit are reciprocated within the range of the moving area. Resin molding equipment.