JPH1079491A - 半導体装置およびその製造方法 - Google Patents
半導体装置およびその製造方法Info
- Publication number
- JPH1079491A JPH1079491A JP9185264A JP18526497A JPH1079491A JP H1079491 A JPH1079491 A JP H1079491A JP 9185264 A JP9185264 A JP 9185264A JP 18526497 A JP18526497 A JP 18526497A JP H1079491 A JPH1079491 A JP H1079491A
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- film
- forming
- semiconductor device
- contact hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Semiconductor Memories (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9185264A JPH1079491A (ja) | 1996-07-10 | 1997-07-10 | 半導体装置およびその製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8-181057 | 1996-07-10 | ||
| JP18105796 | 1996-07-10 | ||
| JP9185264A JPH1079491A (ja) | 1996-07-10 | 1997-07-10 | 半導体装置およびその製造方法 |
Related Child Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005100898A Division JP4391438B2 (ja) | 1996-07-10 | 2005-03-31 | 半導体装置の製造方法 |
| JP2005100899A Division JP2005244251A (ja) | 1996-07-10 | 2005-03-31 | 半導体装置とその製造方法 |
| JP2005100900A Division JP2005252283A (ja) | 1996-07-10 | 2005-03-31 | 半導体装置とその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1079491A true JPH1079491A (ja) | 1998-03-24 |
| JPH1079491A5 JPH1079491A5 (enExample) | 2005-09-15 |
Family
ID=26500381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9185264A Pending JPH1079491A (ja) | 1996-07-10 | 1997-07-10 | 半導体装置およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1079491A (enExample) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0999585A1 (fr) * | 1998-11-05 | 2000-05-10 | STMicroelectronics SA | Fabrication de mémoire dram et de transistors mos |
| JP2000156483A (ja) * | 1998-11-18 | 2000-06-06 | Samsung Electronics Co Ltd | 接合スペ―サを備えたコンケ―ブキャパシタの製造方法 |
| JP2001036044A (ja) * | 1999-06-30 | 2001-02-09 | Hyundai Electronics Ind Co Ltd | 半導体素子のキャパシタ製造方法 |
| JP2002026295A (ja) * | 2000-06-19 | 2002-01-25 | Hynix Semiconductor Inc | 高誘電体キャパシタ及びその製造方法 |
| JP2002512450A (ja) * | 1998-04-16 | 2002-04-23 | アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド | ポリキャップの除去により容易なポリ1コンタクトが得られるnand型フラッシュメモリ装置の製造方法 |
| US6384441B1 (en) | 2000-03-31 | 2002-05-07 | Fujitsu Limited | Semiconductor device and method of manufacturing the same |
| KR100351897B1 (ko) * | 1999-12-31 | 2002-09-12 | 주식회사 하이닉스반도체 | 반도체 소자 제조방법 |
| JP2003152104A (ja) * | 2001-11-14 | 2003-05-23 | Fujitsu Ltd | 半導体装置及びその製造方法 |
| EP1061573A3 (en) * | 1999-06-17 | 2003-10-15 | Fujitsu Limited | Semiconductor device and method of manufacturing the same |
| JP2005260082A (ja) * | 2004-03-12 | 2005-09-22 | Toshiba Corp | 磁気ランダムアクセスメモリ |
| JP2007134699A (ja) * | 1999-07-22 | 2007-05-31 | Micron Technology Inc | キャパシタ・オーバー・ビットラインメモリセルの形成方法 |
| JP2007258747A (ja) * | 2002-08-30 | 2007-10-04 | Matsushita Electric Ind Co Ltd | 半導体装置 |
| JP2010056578A (ja) * | 2009-12-07 | 2010-03-11 | Fujitsu Microelectronics Ltd | 半導体装置の製造方法 |
| JP2012142599A (ja) * | 1999-10-13 | 2012-07-26 | Sony Corp | 半導体装置およびその製造方法 |
-
1997
- 1997-07-10 JP JP9185264A patent/JPH1079491A/ja active Pending
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002512450A (ja) * | 1998-04-16 | 2002-04-23 | アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド | ポリキャップの除去により容易なポリ1コンタクトが得られるnand型フラッシュメモリ装置の製造方法 |
| FR2785720A1 (fr) * | 1998-11-05 | 2000-05-12 | St Microelectronics Sa | Fabrication de memoire dram et de transistors mos |
| EP0999585A1 (fr) * | 1998-11-05 | 2000-05-10 | STMicroelectronics SA | Fabrication de mémoire dram et de transistors mos |
| US6432771B1 (en) | 1998-11-05 | 2002-08-13 | Stmicroelectronics Sa | DRAM and MOS transistor manufacturing |
| JP2000156483A (ja) * | 1998-11-18 | 2000-06-06 | Samsung Electronics Co Ltd | 接合スペ―サを備えたコンケ―ブキャパシタの製造方法 |
| EP1061573A3 (en) * | 1999-06-17 | 2003-10-15 | Fujitsu Limited | Semiconductor device and method of manufacturing the same |
| US7074625B2 (en) | 1999-06-17 | 2006-07-11 | Fujitsu Limited | Semiconductor device and method of manufacturing the same |
| US6911686B1 (en) | 1999-06-17 | 2005-06-28 | Fujitsu Limited | Semiconductor memory device having planarized upper surface and a SiON moisture barrier |
| JP2001036044A (ja) * | 1999-06-30 | 2001-02-09 | Hyundai Electronics Ind Co Ltd | 半導体素子のキャパシタ製造方法 |
| JP2007134699A (ja) * | 1999-07-22 | 2007-05-31 | Micron Technology Inc | キャパシタ・オーバー・ビットラインメモリセルの形成方法 |
| JP2015149504A (ja) * | 1999-10-13 | 2015-08-20 | ソニー株式会社 | 半導体装置およびその製造方法 |
| JP2017017359A (ja) * | 1999-10-13 | 2017-01-19 | ソニー株式会社 | 半導体装置およびその製造方法 |
| JP2015165601A (ja) * | 1999-10-13 | 2015-09-17 | ソニー株式会社 | 半導体装置 |
| JP2012142599A (ja) * | 1999-10-13 | 2012-07-26 | Sony Corp | 半導体装置およびその製造方法 |
| JP2014140081A (ja) * | 1999-10-13 | 2014-07-31 | Sony Corp | 半導体装置およびその製造方法 |
| KR100351897B1 (ko) * | 1999-12-31 | 2002-09-12 | 주식회사 하이닉스반도체 | 반도체 소자 제조방법 |
| US6475858B2 (en) | 2000-03-31 | 2002-11-05 | Fujitsu Limited | Method of manufacturing semiconductor device |
| US6384441B1 (en) | 2000-03-31 | 2002-05-07 | Fujitsu Limited | Semiconductor device and method of manufacturing the same |
| JP2002026295A (ja) * | 2000-06-19 | 2002-01-25 | Hynix Semiconductor Inc | 高誘電体キャパシタ及びその製造方法 |
| JP2003152104A (ja) * | 2001-11-14 | 2003-05-23 | Fujitsu Ltd | 半導体装置及びその製造方法 |
| JP2007258747A (ja) * | 2002-08-30 | 2007-10-04 | Matsushita Electric Ind Co Ltd | 半導体装置 |
| JP2005260082A (ja) * | 2004-03-12 | 2005-09-22 | Toshiba Corp | 磁気ランダムアクセスメモリ |
| JP2010056578A (ja) * | 2009-12-07 | 2010-03-11 | Fujitsu Microelectronics Ltd | 半導体装置の製造方法 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6285045B1 (en) | Semiconductor device with self-aligned contact and its manufacture | |
| KR100375428B1 (ko) | 반도체기억장치 및 그 제조방법 | |
| US8124491B2 (en) | Container capacitor structure and method of formation thereof | |
| US5858829A (en) | Method for fabricating dynamic random access memory (DRAM) cells with minimum active cell areas using sidewall-spacer bit lines | |
| US7642590B2 (en) | Semiconductor device and method for making the same | |
| US7052983B2 (en) | Method of manufacturing a semiconductor device having selective epitaxial silicon layer on contact pads | |
| KR100475257B1 (ko) | 반도체집적회로장치및그제조방법 | |
| KR100299085B1 (ko) | 반도체장치 및 그 제조방법 | |
| US20060261392A1 (en) | Semiconductor device and method of manufacturing the same | |
| JPWO1997019468A1 (ja) | 半導体記憶装置およびその製造方法 | |
| US6010933A (en) | Method for making a planarized capacitor-over-bit-line structure for dynamic random access memory (DRAM) devices | |
| US6458692B1 (en) | Method of forming contact plug of semiconductor device | |
| JPH0917978A (ja) | 高集積dram素子及びその製造方法 | |
| US6037211A (en) | Method of fabricating contact holes in high density integrated circuits using polysilicon landing plug and self-aligned etching processes | |
| JPH1079491A (ja) | 半導体装置およびその製造方法 | |
| KR100273987B1 (ko) | 디램 장치 및 제조 방법 | |
| US6844229B2 (en) | Method of manufacturing semiconductor device having storage electrode of capacitor | |
| JP2005252283A (ja) | 半導体装置とその製造方法 | |
| US20080067692A1 (en) | Semiconductor devices having contact pad protection for reduced electrical failures and methods of fabricating the same | |
| US6037217A (en) | Method of fabricating a capacitor electrode structure in a dynamic random-access memory device | |
| JP4391438B2 (ja) | 半導体装置の製造方法 | |
| JP2005244251A (ja) | 半導体装置とその製造方法 | |
| JP2003031690A (ja) | 半導体装置の製造方法およびその方法を用いて製造される半導体装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050331 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20051130 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20051220 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060220 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070327 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20070724 |