JPH1075099A - Part-mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the mounting precision for improved mounting quality by, based on movement position correction amount decided according to movement speed or acceleration in horizontal direction of a nozzle unit, moving the nozzle unit. SOLUTION: An X-axis motor and a Y-axis motor of orthogonal robot method, wherein a nozzle unit is moved in the X-axis and Y-axis directions in the horizontal plane are a nozzle movement means. An operation speed is a parameter which decides movement acceleration of a nozzle part, and a value is selected and inputted from among 5 steps of lowest speed-highest speed, according to the part weight. As the first factor of correction value, looseness and play at a mechanism part are corrected, and as the second factor, deflection at the mechanism part is corrected, and as the third factor, overshoot of a servomotor is corrected. An X-coordinate D4 of NC program and an X-axis correction value D7 of correction data are added together by a microcomputer device C1, for obtaining the movement position of the X-axis motor, and the motors for X-axis and Y-axis are controlled so as to rotate them as far as the obtained movement position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting field for automatically mounting electronic components on a circuit board.

[0002]

2. Description of the Related Art General types of electronic component mounting apparatuses include an orthogonal robot type and a rotary head type.
Hereinafter, these structures will be briefly described.

FIG. 4 is a structural view of an orthogonal robot system. The parts to be mounted are carrier tape 1 for each type.
The carrier tape 11 is supplied in a form called taping supply housed in one row, and the carrier tape 11 wound on a reel 12 is mounted on a component supply device 13. The component supply device 13 has a mechanism that pulls out the carrier tape 11 from the reel 12 to the suction position 14 and allows components to be taken out from the suction position 14 one by one.

The orthogonal robot section includes a nut 21b which moves on a ball screw 20b rotated by a Y-axis motor 18.
The X-axis motor 17 is fixed to the nut 21a that moves on a ball screw 20a rotated by the X-axis motor 17.
The shaft motor 19 is fixed, and the nozzle unit 16 is fixed to a nut 21c that moves on a ball screw 20c rotated by the V-axis motor 19. Thus, the nozzle unit 16 can move along the V direction perpendicular to the X and Y directions orthogonal to the horizontal plane shown in the drawing. The nozzle unit 16 is provided with a nozzle 15 for adsorbing a component at its lower end, and the nozzle unit 16 controls the air pressure of the nozzle 15 to hold and release the component.

When the nozzle holds a part, the nozzle unit 1 is operated by operating the X-axis motor 17 and the Y-axis motor 18.
6 is moved above the suction position 14 of the component supply device 13, the V-axis motor 19 is operated, and the nozzle unit 16 is moved.
Is lowered, and air is sucked from the nozzle 15 in a state where the lower end of the nozzle 15 is in contact with the component, and the component is sucked to the lower end of the nozzle 15.

When the nozzle mounts a component, X
After operating the axis motor 17 and the Y-axis motor 18 to move the nozzle unit 16 above the circuit board 22, the V-axis motor 19 is operated to lower the nozzle unit 16,
The suction of the air from the nozzle 15 is released while the lower end of the component sucked by the nozzle 15 is in contact with the circuit board 22, and the component is mounted on the circuit board 22.

In the above structure, the X-axis motor 17, Y
The shaft motor 18 and the V-axis motor 19 are
3 are controlled to operate at appropriate timings.

Next, the structure of the rotary head system will be described with reference to FIG. FIG. 5A is a front perspective view of the structure of the rotary head system. FIG. 5B is a diagram for explaining a method of moving the nozzle up and down.

The rotary head has a structure in which nozzle units 33a to 33d for adsorbing electronic components are mounted around a rotating body 32 which rotates in a direction A in the drawing about a vertical axis. The nozzle units 33a to 33d are respectively provided with nozzles 34a to 34d for sucking the components at their lower ends, and can hold and release the components by controlling pneumatic pressure. Further, as shown in FIG. 5B, each nozzle unit is attached to a nut 37 that moves on a ball screw 36 that is rotated by a V-axis motor 35, and moves up and down with the rotation of the V-axis motor 35. It is possible. The components to be mounted are taped in the same manner as in the orthogonal robot system, and
Supplied from 1.

A circuit board 38 is horizontally supported by an XY table 39, and an X-axis motor 40 and a Y-axis motor 40 are provided.
The configuration is such that the shaft motor 41 can move in a horizontal plane along the X direction and the Y direction in the figure.

When the nozzle holds a part, the rotating body 3
The nozzle unit brought to the same position as the nozzle unit 33a by the rotation of 2 is lowered by the rotation of the V-axis motor 35, air is sucked from the nozzle 34a while the lower end of the nozzle 34a is in contact with the component, and the component is Adsorb to the lower end.

When the nozzle mounts a component, X
By driving the axis motor 40 and the Y-axis motor 41, the circuit board 38 is moved so that the mounting position on the circuit board 38 is directly below the nozzle 34d. Thereafter, the nozzle unit brought into the same position as the nozzle unit 33d by the rotation of the rotating body 32 is lowered by the rotation of the V-axis motor 35, and the nozzle 34d is held in a state where the lower end of the component adsorbed by the nozzle 34d is in contact with the circuit board 38. Is released, and the components are mounted on the circuit board 38.

In the above structure, the X-axis motor 40, Y
The shaft motor 41 and the V-axis motor 35 are
2 is controlled to operate at appropriate timing.

In the component mounting apparatus shown in the above two examples, the X-axis, Y-axis, and V-axis motors are usually pulse motors or servomotors, and can be positioned at desired positions. The positioning of these motors is generally performed based on an NC program in which the mounting position on a circuit board and the like are registered. However, the assembly error of each part of the device is registered as a correction value, and this correction value is stored in the NC program. In some cases, the operation is performed at the added position.

FIG. 6 shows an operation example of such correction values. FIG. 6A is an example of the origin correction of the X axis and the Y axis. When the X axis and the Y axis are positioned at the origin, how much the lower end of the nozzle 51 is displaced from the coordinate origin 53 of the circuit board 52. Are indicated by ΔX and ΔY. The origin correction value in this case is-△ X on the X axis,
On the Y axis,-△ Y.

FIG. 6B shows an example of the correction of the origin of the V-axis at the time of picking up the component. When the V-axis is positioned at the origin, how far the lower end of the nozzle 54 is away from the upper surface of the component 55 is shown. This is indicated by ΔVP. In this case, the origin correction value of the V axis is-△ VP.

FIG. 6C shows an example of the correction of the origin of the V axis at the time of component mounting. When the V axis is positioned at the origin, the lower surface of the component 57 sucked by the nozzle 56 is positioned on the upper surface of the circuit board 58.離 れ VM indicates how far away from it. In this case, the origin correction value of the V axis is-△ VM.

FIG. 6D shows an example of nozzle tip position correction accompanying the operation of the V-axis at the time of component mounting. When the V-axis 59 is inclined from the vertical direction, the nozzle 60 is lowered by ΔV. Thus, a value at which the X coordinate of the nozzle tip position changes is indicated by ΔXV. Although not shown, △ YV is also Y
It is defined as a similar quantity in the axial direction. In this case, the nozzle tip position correction value is −ΔXV in the X-axis direction and −ΔYV in the Y-axis direction.

[0019]

The correction values in the prior art are all for correcting the displacement measured in a static state, and the displacement amounts differ depending on the magnitude of the moving acceleration of each part of the device during operation. Is not taken into account. Considering the displacement of the nozzle portion that most affects the mounting quality, the following three factors can be considered as conditions for changing the displacement amount of the nozzle portion according to the moving acceleration.

The first is due to play and play of the mechanism for supporting the nozzle. Since the nozzle on which the component is mounted is supported by a plurality of mechanical mechanisms such as a nozzle unit, the tip of the nozzle is slightly displaced in that direction when a force is applied due to play and play of the movable portion. Therefore, when the movement acceleration applied to the nozzle portion increases, the force applied to the mechanism supporting the nozzle increases, and the tip of the nozzle is displaced in the direction of play.

The second is due to the deflection of the mechanism supporting the nozzle. When a heavy movable object is supported by a mechanical mechanism, the moment of inertia increases as the movement acceleration increases, and the deflection of the support member also increases.

Third, there is an overshoot of the servomotor for driving the nozzle portion. If the servo system is not sufficiently corrected for the load, the overshoot starts from a predetermined stop position when stopping as the moving acceleration increases. Tend.

If the displacements appear in the X-axis and Y-axis directions, the component mounting position on the circuit board will deviate from a predetermined position, leading to a deterioration in mounting accuracy. Also, if the displacement appears as an overshoot in the V-axis direction, the nozzle will hit the component at the time of component removal and mounting, causing component damage such as component cracking and causing board failure after mounting.

[0024]

In order to prevent the deterioration of the mounting quality due to these, the correction value is changed in accordance with the moving acceleration of the nozzle portion at that time, and the position of the nozzle is fixed even if the moving acceleration changes. It is necessary to take measures to prevent deviation from the position. If the moving acceleration depends on the moving speed, the same effect can be obtained by providing a correction value according to the moving speed.

A first aspect of the present invention is a component mounting apparatus for correcting displacement in the X-axis and Y-axis directions in the orthogonal robot system, and a mechanism for holding a component at the lower end of a nozzle and releasing the component from the lower end of the nozzle. And a nozzle moving means for moving the nozzle unit in the horizontal direction, and the moving speed of the nozzle unit in the horizontal direction in the component mounting operation in which the nozzle unit mounts the component at a predetermined position on the circuit board. Alternatively, a configuration having mounting control means for determining a horizontal movement position correction amount of the nozzle unit in accordance with the acceleration and controlling the nozzle movement means to move the nozzle unit based on the movement position correction amount is used.

According to a second aspect of the present invention, there is provided a component mounting apparatus for correcting displacement in the X-axis and Y-axis directions in a rotary head system, and a mechanism for holding a component at a lower end of a nozzle and releasing the component from the lower end of the nozzle. A nozzle unit having a nozzle unit, a nozzle moving unit for moving the nozzle unit in the horizontal direction, and a substrate moving unit for moving the circuit board in the horizontal direction, and the nozzle unit mounting the component at a predetermined position on the circuit board. In the mounting operation, the horizontal moving position correction amount of the circuit board is determined according to the horizontal moving speed or acceleration of the nozzle unit, and the board moving means moves the circuit board based on the moving position correction amount. A configuration having mounting control means for performing the above control is used.

According to a third aspect of the present invention, there is provided a component mounting apparatus for correcting a displacement in the V-axis direction of the orthogonal robot system and the rotary head system, wherein the component is held at the lower end of the nozzle and released from the lower end of the nozzle. A nozzle unit having a mechanism, and a nozzle moving means for moving the nozzle unit in a vertical direction, and a component taking-out operation in which the nozzle unit takes out a component from a predetermined component supply device, and the nozzle unit moves to a predetermined position on a circuit board. In the component mounting operation for mounting components, the vertical movement position correction amount of the nozzle unit is determined according to the vertical movement speed or acceleration of the nozzle unit, and the nozzle unit is moved based on this movement position correction amount. A configuration having mounting control means for controlling the nozzle moving means so as to perform the control is used.

[0028]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to FIGS.

First, as the nozzle moving means and the board moving means of the component mounting apparatus used in the present invention, those equivalent to the component mounting apparatus described in the conventional example can be used.

In the first aspect, the nozzle unit is connected to the X in a horizontal plane.
The present invention is applied to a component mounting apparatus that moves in the axis and Y-axis directions, and a typical example of this method is the orthogonal robot method shown in FIG. In FIG. 4, the X-axis motor 17 and the Y-axis motor 18 correspond to a nozzle moving unit.

A second aspect of the present invention is applied to a component mounting apparatus for moving a circuit board in the X-axis and Y-axis directions in a horizontal plane. A typical example of this system is a rotary head system shown in FIG. In FIG. 5A, the X-axis motor 40 and the Y-axis motor 41 correspond to a substrate moving unit, and the rotating body 32 corresponds to a nozzle moving unit.

In a third aspect, the nozzle unit is connected to a vertical V.
This method is applied to a component mounting apparatus that moves along an axis. A typical example of this method is the orthogonal robot method shown in FIG.
This is the rotary head system shown in FIG. In the orthogonal robot system shown in FIG. 4, the V-axis motor 19 corresponds to a nozzle moving unit. In the rotary head system shown in FIG.
The V-axis motor 35 shown in FIG. 5B corresponds to a nozzle moving unit.

Next, an operation program of the component mounting apparatus used in the present invention will be described with reference to FIG. The operation program of FIG. 2 is commonly used in claims 1, 2 and 3.

FIG. 2A shows an NC program, which specifies the order of mounting components, the mounting position, and the number of a component supply device from which components are to be taken out. The components are mounted in ascending order of the block numbers. For each block, the components are taken out from the component supply device of the specified component supply device number, and the components are placed at the positions specified by the X coordinate and the Y coordinate of the circuit board. Implement.

FIG. 2B shows an arrangement program for designating information depending on the components stored in each component supply device. Of these, V indicating the vertical position
The coordinate of the axis is an amount that depends on the component thickness, and in this example, the value of the component thickness is directly input. The operation speed is a parameter for determining the movement acceleration of the nozzle portion. In this example, the operation speed is selected from five levels from 1 (lowest speed) to 5 (highest speed) according to the weight of the component and input. I do. That is, since it is necessary to suppress the moment of inertia by lowering the acceleration of a component whose weight is likely to be largely deviated, the operation speed is also set low according to the weight of the component.

FIG. 2C shows correction data for designating the correction amounts of the X-axis, Y-axis and V-axis in accordance with the operation speed. Since the operation speed has five stages of 1 to 5, the correction value of each axis is registered in advance for each operation speed.

FIG. 3 shows a specific example of setting the correction values in FIG. FIG. 3A shows correction values for correcting backlash and play in the mechanism portion, which are shown as the first factor in the problem to be solved by the invention. In this case, since the moving position converges to one of the extremes of the movable range due to backlash or the like, the correction value also takes the extremes at the operating speed that is a threshold.

FIG. 3B shows a correction value for correcting the deflection of the mechanism shown as the second factor. In this case, the amount of deflection increases as the acceleration increases, so that the correction value also increases as the driving speed increases.

FIG. 3C shows a correction value for correcting the overshoot of the servomotor shown as the third factor. In this case, although depending on the characteristics of the servo system, the overshoot generally tends to increase as the acceleration increases, so that the correction value also increases as the operation speed increases.

Next, the operation of the mounting control means in the present invention will be described with reference to FIG. As the hardware of the mounting control means, a microcomputer device indicated by 23 in FIG. 4 and 42 in FIG. 5A is diverted. Also, the software is realized by a process of obtaining the movement position of each axis based on each operation program stored in the memory of the microcomputer device and instructing each axis motor serving as a nozzle moving means or a substrate moving means to move. FIG. 1 illustrates processing contents corresponding to the mounting control means of the microcomputer device.

First, if the block number at which the component is to be taken out next is 2 in the NC program, the component supply device number used in that block is obtained from the data D1 corresponding to the block number 2. Next, in the array program, from the data D2 corresponding to the corresponding component supply device number 3, the operation speed used by that component supply device number is determined. Further, in the correction data, a correction value for each axis is obtained from the data D3 of the corresponding operation speed 5.

Thereafter, in the case of claim 1 and claim 2, the microcomputer device C1 adds the X coordinate D4 of the NC program and the X axis correction value D7 of the correction data to determine the moving position of the X axis motor. Similarly, the Y coordinate D5 of the NC program and the Y axis correction value D8 of the correction data are stored in the microcomputer C2.
To obtain the moving position of the V-axis motor.

In the case of the third aspect, the microcomputer C3 adds the V coordinate D6 of the array program and the V axis correction value D9 of the correction data to determine the moving position of the V axis motor.

Finally, the X-axis motor M1, the Y-axis motor M2, and the V-axis motor M3 are rotated in accordance with the movement positions of the respective axes determined above. That is, in the case of the first aspect, the X-axis motor 17 and the Y-axis motor 18 of FIG. 4 which are the nozzle moving means are controlled to rotate each motor to the obtained moving position. In the case of claim 2, FIG.
(A) The X-axis motor 40 and the Y-axis motor 41 are controlled to rotate each motor to the determined moving position. In the case of claim 3, the V-axis motor 19 of FIG. 4 or the V-axis motor 35 of FIG.
Rotate the motor to the determined movement position.

[0045]

According to the first and second aspects of the present invention, when the horizontal position of the nozzle tip is displaced in accordance with the movement acceleration of the nozzle, an appropriate position correction amount in accordance with the movement acceleration is determined. By giving it to the nozzle moving means or the substrate moving means, it is possible to prevent the nozzle tip from being displaced relative to the circuit board.

According to the third aspect of the present invention, when the vertical position of the tip of the nozzle is displaced in accordance with the moving acceleration of the nozzle, an appropriate position correction amount corresponding to the moving acceleration is provided to the nozzle moving means. By giving, it is possible to prevent the height of the nozzle tip from deviating from the predetermined position.

Therefore, if there is play or play in the mechanism supporting the nozzle, or if the mechanism supporting the nozzle is bent, an overshoot occurs in the servomotor driving the nozzle. In the case where the displacement amount of the nozzle portion depends on the movement acceleration, for example, the displacement of the nozzle position can be prevented.

As a result, it is possible to prevent a component mounting position shift on a circuit board due to a horizontal displacement, and to prevent component damage such as a component crack due to a vertical overshoot, thereby improving the mounting accuracy and the board quality after mounting. Can be improved.

[Brief description of the drawings]

FIG. 1 is a diagram showing the operation of a mounting control unit according to the present invention.

FIG. 2 is a diagram showing an example of an operation program of a component mounting apparatus used in the present invention.

FIG. 3 is a diagram illustrating an example of a method of setting a correction value according to the present invention.

FIG. 4 is a view showing an orthogonal robot type component mounting apparatus as an example of a nozzle moving means according to claims 1 and 3 of the present invention.

FIG. 5 is a diagram showing a rotary head type component mounting apparatus as an example of the nozzle moving means and the substrate moving means according to claims 2 and 3 of the present invention.

FIG. 6 is a diagram illustrating an example of a method of operating a correction value according to the related art.

[Explanation of symbols]

15, 34 Nozzle 16, 33 Nozzle unit 17, 18 Nozzle moving means 32 according to claim 1 of the present invention Nozzle moving means 40, 41 according to claim 2 of the present invention 19, 35 substrate moving means according to claim 2 of the present invention Nozzle moving means D1 to D9, C1 to C3 according to claim 3 of the present invention Components of mounting control means according to each claim of the present invention

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Susumu Takaichi 1006 Kazuma Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (3)

[Claims] A nozzle unit having a mechanism for holding a part at the lower end of the nozzle and releasing the part from the lower end of the nozzle, and a nozzle moving means for moving the nozzle unit in a horizontal direction, wherein the nozzle unit is mounted on a circuit board at a predetermined position. In the component mounting operation of mounting the component at the position, according to the moving speed or acceleration of the nozzle unit in the horizontal direction,
Determine the horizontal movement position correction amount of the nozzle unit,
A component mounting apparatus having mounting control means for controlling a nozzle moving means to move a nozzle unit based on the moving position correction amount. 2. A nozzle unit having a mechanism for holding a component at a lower end of a nozzle and releasing the component from the lower end of the nozzle, a nozzle moving unit for moving the nozzle unit in a horizontal direction, and a substrate moving unit for moving a circuit board in a horizontal direction. In the component mounting operation in which the nozzle unit mounts the component at a predetermined position on the circuit board, the horizontal moving position correction amount of the circuit board is adjusted according to the horizontal moving speed or acceleration of the nozzle unit. A component mounting apparatus configured to include mounting control means for determining and controlling a board moving means to move a circuit board based on the moving position correction amount. 3. A nozzle unit having a mechanism for holding a component at a lower end of a nozzle and releasing the component from the lower end of the nozzle, and a nozzle moving unit for moving the nozzle unit in a vertical direction, wherein the nozzle unit is provided with a predetermined component supply device. The vertical movement of the nozzle unit according to the vertical moving speed or acceleration of the nozzle unit in the component picking operation of picking up the component from the nozzle unit and the component mounting operation of mounting the component at a predetermined position on the circuit board by the nozzle unit A component mounting apparatus configured to include a mounting control unit that determines a position correction amount and controls a nozzle moving unit to move a nozzle unit based on the movement correction amount.