JP2000077897A - Part mounter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inhibit inertial force and impact force applied to a part sucked to a suction nozzle minimally because the acceleration of the rotation of a nozzle-rotation correction section is set at the irreducible minimal value of a demand in response to rotation-correction angles, to prevent a mounting mistake to an article to be mounted in the part and to improve yield. SOLUTION: Inertial force and impact force applied to electronic parts 1 sucked to suction nozzles 5 are suppressed minimally by minimally setting the acceleration of a nozzle-rotation correction section 13 calculated by a recognition result in a part recognition section 10 so that rotation is corrected within the time, when correction is enabled, of the suction nozzles 5 during temporary stoppage when the nozzle-rotation correction section 13 is turned and a rotation correction angle is obtained, the mounting mistake of the electronic parts 1 to a printed board 3 is prevented, and yield can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for automatically mounting various components at a predetermined position on a mounting object by suction-holding various components using a suction nozzle. For example, an electronic component is mounted on a printed circuit board. To manufacture electronic circuit boards.

[0002]

2. Description of the Related Art Generally, in an electronic component mounting apparatus for manufacturing an electronic circuit board, an electronic component is mounted on an angle (an angle along a mounting surface of the electronic circuit board) and an electronic component is supplied from a component supply unit by a suction nozzle. In order to correct the shift amount when the electronic component is sucked, the suction nozzle that has sucked the electronic component is rotated to mount the electronic component in a predetermined direction.

Conventionally, in order to obtain an electronic component mounting angle (hereinafter, simply referred to as a “mounting angle”) θ, θ = α + β, and a suction nozzle is rotated by an angle α in a nozzle rotation unit and an angle β in a nozzle rotation correction unit. I am trying to attach it.

The angle α is set at intervals of 90 ° such as 0 °, 90 °, 180 °, and 270 ° so as to facilitate component recognition, and the angle β is 45 ° at the maximum.
The angle is set.

A component recognition unit recognizes a shift generated when an electronic component is sucked by a suction nozzle in a component supply unit and a shift generated when the electronic component is rotated by an angle α in a nozzle rotating unit. In actuality, the suction nozzle is rotated by the rotation correction angle (β + Δθ) in accordance with Δθ and the angle β in the nozzle rotation correction section, and the electronic component is mounted.

[0006] At this time, the rotation acceleration of the nozzle rotation correction unit is rotated within the time that the suction nozzle is rotatable when the suction nozzle reaches the nozzle rotation correction unit and temporarily stops at the maximum angle that the rotation correction angle (β + Δθ) can take. Correction angle (β + Δθ)
It is always set constant so that the rotation of the minute ends.

[0007]

However, in the above-mentioned conventional electronic component mounting apparatus, the rotation acceleration of the nozzle rotation correction unit is unnecessarily large with respect to the actually required rotation correction angle (β + Δθ). In this case, when the nozzle rotation correction unit accelerates or decelerates, the electronic component sucked by the suction nozzle is displaced from the angle at which the suction nozzle is rotated by the inertial force or impact force of the nozzle rotation correction unit. As a result, mounting errors such as mounting displacement of electronic components have occurred, and the yield has deteriorated.

Therefore, the present invention sets the acceleration of rotation of the nozzle rotation correction unit to a necessary minimum value according to the rotation correction angle, thereby providing an inertial force applied to a component (electronic component) sucked by the suction nozzle. The object of the present invention is to provide a component mounting apparatus capable of minimizing impact force, preventing component mounting errors, and improving yield.

[0009]

The object of the present invention is to provide a component supply unit for supplying a component, a component mounting unit for providing a component to which a component to be mounted is mounted, and a component supply unit. A plurality of suction nozzles for picking up components are vertically movable, and these suction nozzles are intermittently rotatable so as to move between a component suction position on the component supply unit side and a component mounting position on the mounting object side. A mounting head,
At a position where the suction nozzle is temporarily stopped in the middle of the component suction position and the component mounting position, a nozzle rotating unit for rotating the predetermined suction nozzle to the component mounting angle to the component mounting object, and suction to the predetermined suction nozzle A component recognition unit for recognizing a component that has been picked up, and a position where the suction nozzle is temporarily stopped halfway between the component recognition unit and the component mounting position. A nozzle rotation correction unit for rotating the rotation correction angle and correcting the component mounting angle, based on the rotation angle of the nozzle rotation correction unit calculated based on the recognition result by the component recognition unit,
The acceleration for rotating the suction nozzle is set to be minimum.

Also, among the component mounting angles set for each component, the rotation angle rotated by the nozzle rotation correction unit and the maximum allowable angle of suction deviation during suction with the suction nozzle allowable by the component recognition unit. The maximum rotation correction angle is determined based on the sum, and based on the rotation correction angle, the acceleration when the suction nozzle is rotated is set to be the minimum.

According to the above configuration, the rotation acceleration of the nozzle rotation correction unit is set to a necessary minimum value in accordance with the rotation correction angle, so that the inertial force and impact force applied to the component sucked by the suction nozzle are minimized. In this way, it is possible to prevent the mounting error of the component from being mounted on the mounting target, and to improve the yield.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. As shown in FIG. 1, an electronic component mounting apparatus according to an embodiment of the present invention mounts an electronic component 1 at a predetermined position on a printed circuit board 3 to manufacture an electronic circuit board.

As shown in FIG. 1, a component supply unit 2 for supplying the electronic component 1, a component mounting unit 4 for mounting the printed board 3 on which the electronic component 1 is to be mounted for mounting the electronic component 1, The suction nozzle 5 for sucking the electronic component 1 supplied to the component supply unit 2 is equipped so as to be able to move up and down, intermittently rotated, and repeatedly moves circumferentially between the component supply unit 2 and the component mounting unit 4. While controlling the suction nozzle 5 to a required height in accordance with the moving position thereof, and
The mounting head 6 is held so as to be able to move up and down in order to suck the electronic component 1 in the electronic component 1 and mount the electronic component 1 in the component mounting section 4.

Various electronic components 1 are provided in the component supply unit 2.
A plurality of component supply cassettes 7 are arranged in accordance with the type and number of the required electronic components 1, and a plurality of component supply cassettes 7 for storing the stored electronic components 1 as necessary. Is moved to, for example, the component supply position A corresponding to P1 among the stop positions P1 to P16 of the suction nozzle 5 as shown in FIG. 3, and the necessary electronic component 1 is supplied each time. It is configured to be.

The electronic component 1 is mounted on the component mounting section 4 at a predetermined position of the printed circuit board 3 held therein, as shown in FIG.
For example, an XY table 8 that moves in two directions XY orthogonal to each other in a plan view is provided so that a predetermined position faces the suction nozzle 5 at the component mounting position B set at P9 shown in FIG.

As shown in FIGS. 1 and 2, the mounting head 6 has a cam follower 2 of a nozzle unit 20 having the suction nozzle 5 around a rotating body 6a which is intermittently rotated.
By engaging 0a with the cam groove 6c of the cam 6b provided around the rotating body 6a, each of the nozzle units 20 has a required height at each rotating position due to the intermittent rotation of the rotating body 6a. In addition to this control, the suction nozzle 5 moves the vertical moving member 20 c on each nozzle unit 20 for suction of the electronic component 1 in the component supply unit 2 and mounting of the electronic component 1 in the component mounting unit 4. The suction nozzle 5 is moved downward by the nozzle rotating unit 12 and the nozzle rotation correcting unit 13 to correct the rotational position of the electronic component 1 on each nozzle unit 20 via the vertical moving member 20c.
It is configured to be moved up against the

In the present embodiment, the suction nozzle 5
For example, the stop position P in which the suction nozzles 5 temporarily stop during a range in which the suction nozzle 5 moves from the component supply unit 2 to the component mounting unit 4.
4 The nozzle rotation unit 12 is provided at a corresponding position C, and the nozzle rotation correction unit 13 is provided at a position D corresponding to P7. The electronic component 1 sucked to the suction nozzle 5 by the nozzle rotation unit 12 and the nozzle rotation correction unit 13 It is configured to perform rotational position correction.

Further, a circumferential movement locus of the lower end of the suction nozzle 5 is located at, for example, a stop position P5 where the suction nozzle 5 is temporarily stopped sequentially within a range in which the suction nozzle 5 moves from the nozzle rotating unit 12 to the nozzle rotation correcting unit 13. A component recognizing unit 10 for recognizing the suction angle of the electronic component 1 sucked by the suction nozzle 5 based on an image picked up by a component recognition camera 9 provided below the component recognizing unit 9 is provided. It is configured to measure the amount to be corrected.

As shown in FIG. 2, the nozzle rotating unit 12 and the nozzle rotation correcting unit 13 are provided with a roller bearing 2 which is rotated by a plate cam 21 and urged by a spring 23.
2 operates along the plate cam 21 and the lever 24 swings. The swinging operation of the lever 24 is transmitted to the vertically moving member 20c of the nozzle unit 20 via the roller bearing 22a provided on the other side of the plate cam 21 of the lever 24, and the suction nozzle 5 moves up and down. When the suction nozzle 5 moves upward, the groove 20b provided above the nozzle unit 20 and the rotary shaft 2
The V-notch 25a provided at the lower end of 5 is configured to mesh with the V-notch 25a.

When the V notch 25a and the groove 20b of the nozzle unit 20 are engaged with each other, the rotation of the motor 27 is transmitted to the rotating shaft 25 via the belt 26. The rotation of the suction nozzle 5 allows the mounting angle of the sucked electronic component 1 to be corrected. Accordingly, the time during which the rotary shaft 25 rotates in a state where the V notch 25a and the groove 20b are engaged with each other is the rotatable time (correctable time) of the suction nozzle 5.

Therefore, when performing rotation correction using all of the correction possible times, the acceleration of the nozzle rotation correction unit 13 calculated based on the recognition result of the component recognition unit 10 is set to be minimum.

For example, if the angle to be rotated by the nozzle rotation correction unit 13 is 75 °, the suction nozzle 5 is rotated with an acceleration curve as shown in FIG. By setting the rotation acceleration of the unit 13 to a necessary minimum value in accordance with the rotation correction angle, the inertial force / impact force applied to the electronic component 1 sucked by the suction nozzle 5 can be minimized. Therefore, mounting errors of the electronic component 1 on the printed circuit board 3 can be prevented, and the yield can be improved. In FIG. 4, the vertical axis represents the rotation speed of the nozzle rotation correction unit 13 and the horizontal axis represents time. The acceleration curve a1 coincides with the end of the rotatable time of the suction nozzle 5 (nozzle rotatable time). 0
It has become.

If the angle to be rotated by the nozzle rotation correction unit 13 is 15 °, the electronic component 1 sucked by the suction nozzle 5 can be rotated by the acceleration curve a2 as shown in FIG. In addition, the inertial force and the impact force applied to the electronic component 1 can be minimized, the mounting error of the electronic component 1 on the printed circuit board 3 can be prevented, and the yield can be improved. In addition,
Also in this case, the acceleration curve a2 becomes 0 at the end of the rotatable time of the suction nozzle 5.

Further, the rotation acceleration in the nozzle rotation correction unit 13 is determined based on the component mounting angle set for each electronic component (for example, for each type). The allowable value (allowable maximum angle) of the component suction misalignment is set to 30 °, and the nozzle rotation corrector 13
In the case where the angle that must be rotation-corrected in step S15 is 15 °, the rotation in the nozzle rotation correction unit 13 is determined by the sum of the angle to be rotation-corrected in the nozzle rotation correction unit 13 and the allowable value in the component recognition unit 10. The maximum value of the angle is determined, and based on this maximum value, if the suction nozzle 5 is rotated with an acceleration curve a3 as shown in FIG. 6, the inertia applied to the electronic component 1 within the rotatable time of the suction nozzle 5 By minimizing the force and impact force, it is possible to prevent mounting errors of the electronic component 1 on the printed circuit board 3 and improve the yield.

The broken line in FIG.
3 is an acceleration curve a4 when the angle to be rotation-corrected at 30 is 30 °, and becomes 0 at the end of the rotatable time of the suction nozzle 5, and also in this case, the inertia added to the electronic component 1 By minimizing the force and impact force, it is possible to prevent mounting errors of the electronic component 1 on the printed circuit board 3 and improve the yield.

[0026]

As is apparent from the above description, according to the present invention, when the nozzle rotation correction unit is rotated to obtain the rotation correction angle, the rotation correction is performed by using all the correction possible times of the suction nozzles which are temporarily stopped. By setting the acceleration of the nozzle rotation correction unit calculated based on the recognition result by the component recognition unit to be minimized, the inertial force and impact force applied to the component suctioned by the suction nozzle is minimized, It is possible to prevent a mounting error of the component from being mounted on the mounting target and improve the yield.

Also, among the component mounting angles set for each component, the rotation angle rotated by the nozzle rotation correction unit and the maximum allowable angle of suction deviation during suction with the suction nozzle allowable by the component recognition unit. The maximum rotation correction angle is determined by the sum, and based on the rotation correction angle, by setting the acceleration at the time of rotating the suction nozzle to be the minimum, the inertia force applied to the component suctioned by the suction nozzle is calculated. It is possible to minimize the impact force, prevent mounting errors of the component on the mounting target, and improve the yield.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a configuration diagram of a nozzle rotating unit.

FIG. 3 is a layout diagram of each part around the mounting head.

FIG. 4 is a graph showing an acceleration curve when the suction nozzle is rotated by 75 °.

FIG. 5 is a graph showing an acceleration curve when the suction nozzle is rotated by 15 °.

FIG. 6 shows another embodiment of the present invention in which the allowable value of the component suction deviation in the component recognition unit of the electronic component mounting apparatus is 30 ° and the angle of rotation correction by the nozzle rotation correction unit is 15 °. It is a graph showing an acceleration curve.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 2 Component supply part 3 Printed circuit board 4 Component mounting part 5 Suction nozzle 6 Mounting head 6a Rotating body 6b Cam 6c Cam groove 7 Component supply cassette 9 Component recognition camera 10 Component recognition part 12 Nozzle rotation part 13 Nozzle rotation correction part 20 Nozzle unit 20b Nozzle unit groove 20c Vertical moving member 21 Plate cam 22 Roller bearing 24 Lever 25a V notch P1 to P16 Stop position of suction nozzle A Component supply position B Component mounting position

Continued on the front page (72) Inventor Kunio Sakurai 1006 Kadoma Kadoma, Osaka Pref.Matsushita Electric Industrial Co., Ltd. Person Yoichi Makino 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture F-term within Matsushita Electric Industrial Co., Ltd. 5E313 AA01 AA11 CC03 CC04 CC07 CC08 CD02 CD06 EE03 EE24 EE37 FF05 FF24 FF26 FF28 FF29 FF31

Claims (2)

[Claims] A component supply unit for supplying a component, a component mounting unit for providing a component to which a component to be mounted on which the component is mounted, and a plurality of suction nozzles for suctioning components of the component supply unit. A mounting head that is vertically movable and intermittently rotatable so that these suction nozzles move between a component suction position on the component supply unit side and a component mounting position on the mounting object side, and a component suction position and a component mounting position. At a position where the suction nozzle is temporarily stopped, a nozzle rotating unit for rotating a predetermined suction nozzle at a component mounting angle to a component mounting object, and a component for recognizing a component sucked by the predetermined suction nozzle. At the position where the suction nozzle is temporarily stopped in the middle of the component recognition unit and the component mounting position, the suction nozzle is rotated based on the component mounting angle and the recognition result of the component recognition unit to mount the component. A nozzle rotation correction unit for correcting the angle, and based on the rotation angle of the nozzle rotation correction unit calculated based on the recognition result of the component recognition unit, the acceleration for rotating the suction nozzle is set to be minimum. Characteristic component mounting device. 2. A component supply unit for supplying a component, a component mounting unit for providing a component to which a component to be mounted on which the component is mounted, and a plurality of suction nozzles for suctioning components of the component supply unit. A mounting head that is vertically movable and intermittently rotatable so that these suction nozzles move between a component suction position on the component supply unit side and a component mounting position on the mounting object side, and a component suction position and a component mounting position. At a position where the suction nozzle is temporarily stopped, a nozzle rotating unit for rotating a predetermined suction nozzle at a component mounting angle to a component mounting object, and a component for recognizing a component sucked by the predetermined suction nozzle. At the position where the suction nozzle is paused halfway between the component recognition unit and the component mounting position, the suction nozzle is rotated by the rotation correction angle based on the component mounting angle and the recognition result of the component recognition unit. A nozzle rotation correction unit for rotating and correcting the component mounting angle is provided, and among the component mounting angles set for each component, the rotation angle rotated by the nozzle rotation correction unit and the suction nozzle allowable by the component recognition unit The maximum rotation correction angle is determined based on the sum of the allowable maximum angle of the suction deviation at the time of suction, and the acceleration when rotating the suction nozzle is set to be minimum based on the rotation correction angle. Component mounting device.