JPH1051124A - はんだペースト印刷装置及びはんだペースト印刷方法 - Google Patents

はんだペースト印刷装置及びはんだペースト印刷方法

Info

Publication number
JPH1051124A
JPH1051124A JP19900596A JP19900596A JPH1051124A JP H1051124 A JPH1051124 A JP H1051124A JP 19900596 A JP19900596 A JP 19900596A JP 19900596 A JP19900596 A JP 19900596A JP H1051124 A JPH1051124 A JP H1051124A
Authority
JP
Japan
Prior art keywords
solder paste
mask
substrate
printing
air pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19900596A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1051124A5 (enExample
Inventor
Takayuki Motohashi
隆行 本橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP19900596A priority Critical patent/JPH1051124A/ja
Publication of JPH1051124A publication Critical patent/JPH1051124A/ja
Publication of JPH1051124A5 publication Critical patent/JPH1051124A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP19900596A 1996-07-29 1996-07-29 はんだペースト印刷装置及びはんだペースト印刷方法 Pending JPH1051124A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19900596A JPH1051124A (ja) 1996-07-29 1996-07-29 はんだペースト印刷装置及びはんだペースト印刷方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19900596A JPH1051124A (ja) 1996-07-29 1996-07-29 はんだペースト印刷装置及びはんだペースト印刷方法

Publications (2)

Publication Number Publication Date
JPH1051124A true JPH1051124A (ja) 1998-02-20
JPH1051124A5 JPH1051124A5 (enExample) 2004-07-22

Family

ID=16400528

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19900596A Pending JPH1051124A (ja) 1996-07-29 1996-07-29 はんだペースト印刷装置及びはんだペースト印刷方法

Country Status (1)

Country Link
JP (1) JPH1051124A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008078657A (ja) * 2006-09-20 2008-04-03 Samsung Electro Mech Co Ltd 多層印刷回路基板の製造方法、多層印刷回路基板及び真空印刷装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008078657A (ja) * 2006-09-20 2008-04-03 Samsung Electro Mech Co Ltd 多層印刷回路基板の製造方法、多層印刷回路基板及び真空印刷装置

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