JPH10329133A - Method for bonding ingot to fitting stay and bonding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To automate an operation to fit an ingot to a wire saw and thereby improve the operating efficiency of the wire saw. SOLUTION: An ingot 11, supported on a conveying truck 39, is conveyed and is positioned and fixed at a reference position for measurement corresponding to an orientation measuring device 28. A measuring head 114 is rotated and radiation is emitted to the reference end face of the ingot 11 from four directions to measure the crystal orientation of the ingot 11 based on an output from reflected radiation. Based on data on the measurement of the crystal orientation, the orientation is adjusted using a crystal orientation adjustment mechanism 40 and a horizontal angle adjustment mechanism, and a fitting stay is bonded to the surface of the ingot 11 through an intermediate stay 12 in such a state that an axial line for fitting the fitting stay is set in parallel with the crystal orientation of the ingot 11. The fitting stay is held by the work fitting mechanism of a wire saw and the ingot 11 is cut in the form of wafer along a lattice face.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for bonding an ingot and a mounting stay.

[0002]

2. Description of the Related Art An Si single crystal ingot for producing a silicon (Si) wafer has a regular lattice plane. However, the unprocessed ingot picked up from the crucible is processed into a columnar shape, but the crystal orientation with respect to the central axis of each ingot varies. A carbon intermediate stay is bonded to the ingot, and a mounting stay is bonded to the upper surface of the intermediate stay via a glass insulating plate. Therefore, if the wafer is formed by mounting the ingot on a wire saw and cutting the ingot with a wire, the positional relationship between the cut surface of the wafer and the lattice plane is not constant, and the characteristics of the cut wafer vary.

[0003] In order to solve the above-mentioned problem, a goniometer for ingots is conventionally mounted on a wire saw. Then, with the ingot mounting stay attached to this gonio angle setting device with bolts, the orientation measurement device measures the horizontal and vertical displacements of the crystal orientation from the central axis of the ingot, and then sets the gonio angle setting device. Therefore, the crystal orientation of the ingot is adjusted to be at an appropriate position with respect to the traveling direction of the wire. In this adjustment, the crystal orientation is displaced in a vertical plane perpendicular to the wire by rotating the ingot and the mounting stay in a horizontal plane by the gonio angle setting device, and the ingot and the mounting stay are rotated in the vertical plane. Then, the crystal orientation is displaced in the horizontal plane. That is, the conventional ingot cutting process is performed in accordance with the procedure shown in FIG. 31, and after the ingot to which the mounting stay is adhered is attached to the wire saw, gonio adjustment is always performed before processing.

[0004]

Accordingly, since it is necessary to attach a gonio angle setting device to each wire saw, there is a problem that the equipment cost of the processing apparatus cannot be reduced.
In addition, since it is necessary to attach the ingot to the gonio angle setting device, it is necessary to manually tighten the bolts for the ingot installation work, which is troublesome and requires time to adjust the orientation of the ingot. There is a problem that the ingot mounting operation cannot be automated and the operation rate of the wire saw cannot be improved.

The present invention has been made in view of such problems existing in the prior art, and an object of the present invention is to preliminarily establish an ingot and a mounting stay at the bonding stage based on the crystal orientation of the ingot. Adhering them in a state where they are adjusted to each other and carrying them into the processing machine eliminates the need to attach a gonio-angle setting device to the processing machine, thereby reducing the equipment cost of the entire processing equipment and ingots into the processing machine. It is an object of the present invention to provide a method and an apparatus for bonding an ingot and a mounting stay which can improve the operation rate of a processing machine by automating a mounting operation of the processing machine.

[0006]

According to the first aspect of the present invention,
In order to achieve the above object, the crystal orientation of the ingot is measured using X-ray diffraction with the cylindrical ingot positioned at the measurement reference position, and the ingot is measured based on the crystal orientation measurement data. The ingot is rotated about its central axis so that the crystal orientation of the ingot is located in a horizontal plane while keeping the central axis of the ingot horizontal at a position away from the measurement reference position, and the crystal orientation of the ingot is adjusted to this ingot. The ingot is attached to the mounting stay in a state where one of the mounting stay and the ingot is rotated in a horizontal plane so as to be parallel to the mounting axis of the mounting stay attached to the ingot and the orientation is adjusted.

[0007] According to the second aspect of the present invention, the first aspect is provided.
In a state in which the center axis of the ingot is horizontal and one end face of the ingot is fixed at the measurement reference position as a measurement reference plane, the measurement head for measuring the crystal orientation of the ingot is rotated about a central axis parallel to the center axis of the ingot. Let
The X-rays are radiated from a plurality of directions to the measurement reference plane of the ingot, and the crystal orientation of the ingot is measured by the output of the reflected X-rays.

[0008] According to the third aspect of the present invention, the first aspect is provided.
Or in 2, the measurement data includes the ingot rotation angle data until the crystal orientation of the ingot is rotated about the central axis of the ingot and the crystal orientation is located in the horizontal plane, and the same plane of the crystal orientation with respect to the central axis of the ingot. Means for the inclination data within the vehicle.

According to the fourth aspect of the present invention, the third aspect is provided.
In the above, the ingot is rotationally adjusted about its central axis according to the rotation angle data, and an intermediate stay made of a cuttable material is adhered to the adjusted upper surface or lower surface of the ingot by aligning its mounting axis with the central axis of the ingot. After that, either the ingot or the mounting stay supported so as to be relatively displaceable in the horizontal plane with respect to the intermediate stay, in a state where the rotation is adjusted in the horizontal plane by the inclination data, the mounting stay is bonded to the intermediate stay. Is taking steps.

[0010] In the fifth aspect of the present invention, the fourth aspect is provided.
In this method, after the adhesive between the ingot and the intermediate stay is dried, a means for bonding the mounting stay to the intermediate stay is adopted.

[0011] According to the sixth aspect of the present invention, there is provided the third aspect.
In the rotation angle data, after adjusting the rotation of the ingot about its central axis, the adjusted ingot or an intermediate stay made of a pre-cuttable material is adhered, and the relative displacement in the horizontal plane with respect to the upper surface or the lower surface of the ingot. A means is adopted in which one of the mounting stays that is supported as possible is rotated and adjusted in a horizontal plane based on the inclination data, and the mounting stay is bonded to the upper surface or the lower surface of the ingot via an intermediate stay.

In the invention according to claim 7, claim 6 is provided.
In the upper surface of the intermediate stay has an arc-shaped concave groove that fits into the cylindrical ingot along its mounting axis, the adhesive between the intermediate stay and the mounting stay in an undried state, after adjustment to the ingot The mounting stay is bonded via the intermediate stay, and at this time, the intermediate stay is bonded so that the mounting axis of the intermediate stay is parallel to the center axis of the ingot due to the engagement between the arc-shaped concave groove and the ingot. Has taken.

[0013] In the invention according to claim 8, claim 4 is provided.
In any one of the constitutions (1) to (7), means for giving an oscillating operation in the direction of the center axis of the ingot to the stay side or the ingot side when the intermediate stay is attached or the mounting stay is attached.

According to the ninth aspect of the present invention, there is provided the first aspect of the present invention.
In any of the above-mentioned items 8, a plurality of ingots or intermediate stays are sequentially bonded to a single mounting stay.

According to a tenth aspect of the present invention, there is provided a positioning means for positioning the ingot at a measurement reference position for measuring the crystal orientation of the cylindrical ingot, and the crystal orientation of the ingot positioned at the measurement reference position is represented by X. Crystal orientation measuring means for measuring using diffraction of the line, moving means for retracting the ingot from the measurement reference position after the crystal orientation measurement, at the position retracted from the measurement reference position, the measurement data of the crystal orientation measurement means A first adjusting means for rotating and adjusting the ingot about its central axis so that the crystal orientation of the ingot is positioned in a horizontal plane while keeping the central axis of the ingot horizontal, and Either the ingot or the mounting stay attached to the ingot is measured by the crystal orientation measuring means. The second adjusting means for adjusting the rotation of the mounting stay in the horizontal plane so that the mounting axis of the mounting stay is parallel to the crystal orientation of the ingot, and the first adjusting means and the second adjusting means. And a mounting stay bonding mechanism for bonding the mounting stay to the ingot.

According to an eleventh aspect of the present invention, in the tenth aspect, the crystal orientation measuring means has a rotatable measuring head, and the central axis of the ingot is set to be horizontal, and one end surface of the ingot is set to a measurement reference plane. With the measurement head fixed to the measurement reference position, the measurement head is rotated about a central axis parallel to the central axis of the ingot, and X-rays are emitted from a plurality of directions with respect to the measurement reference plane of the ingot and the reflected X-ray output is output. Is used to measure the crystal orientation of the ingot.

According to a twelfth aspect of the present invention, in the tenth or the eleventh aspect, the measurement data is such that the crystal orientation of the ingot is rotated around the central axis of the ingot until the crystal orientation is positioned in the horizontal plane. And the tilt angle data of the crystal orientation with respect to the central axis of the ingot in the same plane. The first adjusting means performs the adjusting operation based on the rotating angle data, and the second adjusting means performs the adjusting operation based on the tilt angle data. Has taken.

According to a thirteenth aspect of the present invention, in the twelfth aspect, an intermediate stay made of a severable material is provided on an upper surface or a lower surface of the ingot adjusted by the first adjusting means so that its mounting axis is aligned with the center axis of the ingot. There is provided an intermediate stay bonding mechanism for horizontally bonding together, and the mounting stay bonding mechanism is configured to bond the mounting stay to the intermediate stay bonded to the ingot.

According to a fourteenth aspect of the present invention, in the twelfth aspect, the second adjusting means adjusts one of an ingot and a mounting stay to which an intermediate stay made of a severable material is bonded in advance. The mounting stay bonding mechanism is configured to bond the mounting stay adjusted to the ingot via an intermediate stay.

According to a fifteenth aspect of the present invention, in the thirteenth aspect or the fourteenth aspect, a means is provided in which one surface of the intermediate stay is formed with an arc-shaped concave groove which fits into a cylindrical surface of the ingot along a mounting axis thereof. I am taking.

According to a sixteenth aspect of the present invention, in the fourteenth aspect, an arcuate groove is formed on one surface of the intermediate stay along a mounting axis thereof so as to fit into a cylindrical surface of the ingot. The mechanism is to bond the mounting stay to the ingot via the intermediate stay in a state where the adhesive between the intermediate stay and the mounting stay is not dried, and at this time, the intermediate stay is connected to the arc-shaped concave groove and the ingot. The fitting is such that the attachment axis of the intermediate stay is bonded so as to be parallel to the center axis of the ingot.

In the seventeenth aspect of the present invention, in the thirteenth aspect, the intermediate stay bonding mechanism and the mounting stay bonding mechanism include an adhesive interposed between the intermediate stay and the ingot and between the intermediate stay and the mounting stay. In this state, the intermediate stay and the mounting stay or the ingot are provided with an oscillating mechanism for reciprocating in the center axis direction of the ingot.

In the eighteenth aspect of the present invention, in the fourteenth aspect or the sixteenth aspect, the mounting stay bonding mechanism is configured such that an adhesive is interposed between the intermediate stay and the ingot and between the intermediate stay and the mounting stay. The mounting stay or the ingot is provided with an oscillating mechanism that reciprocates in the center axis direction of the ingot. In the invention according to claim 19, in claim 13,
The moving means is a means for transporting the ingot horizontally between the measurement position corresponding to the crystal orientation measuring means and the intermediate stay bonding mechanism while supporting the central axis of the ingot horizontally.

In the twentieth aspect of the present invention, in the nineteenth aspect, the positioning means includes a stopper for positioning a measurement reference surface of the ingot provided on the carriage.
And a stopping means at a measuring position of the transporting vehicle.

According to a twenty-first aspect of the present invention, in the twentieth aspect, the first adjusting means is provided on a carriage, and the first adjusting means is provided on or after the ingot is moved from the measurement reference position to the intermediate stay bonding mechanism. Means of adjusting the rotation is taken.

In the invention according to claim 22, in any one of claims 19 to 21, there is provided means for providing ingot carrying-in / out means for carrying in / out of the ingot to / from the carriage.

According to a twenty-third aspect of the present invention, in the twenty-second aspect, the intermediate stay bonding mechanism and the mounting stay bonding mechanism are arranged at different positions, and the ingot is transferred between the two by the ingot carrying-in / out means. That means.

According to a twenty-fourth aspect of the present invention, in any one of the thirteenth to twenty-third aspects, the second adjusting means includes a mounting stay moving mechanism capable of adhering a plurality of ingots or intermediate stays to a single mounting stay. It is taking the means that it is.

According to a twenty-fifth aspect of the present invention, in the twenty-fourth aspect, the second adjusting means includes a rotary support shaft reciprocally rotated about a vertical axis at a predetermined position on the machine base, and an upper end of the rotary support shaft. A rotation support plate horizontally supported by the part,
A means is provided which is supported by the rotary support plate so as to be able to reciprocate in the horizontal direction, and is constituted by a clamp mechanism for clamping the mounting stay.

[0030]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of the present invention will be described.
An embodiment will be described with reference to FIGS.

First, referring to FIGS. 7 and 11, a cylindrical Si single crystal ingot 1 adhered in this embodiment will be described.
1. An intermediate stay 12, an insulating plate 13, and a mounting stay 14 made of a cuttable material such as carbon will be described.

As shown in FIG. 11, an arc-shaped concave groove 12a is formed on the lower surface of the intermediate stay 12 along the mounting axis thereof so as to fit into the cylindrical surface of the ingot 11, and the upper portion of the ingot 11 placed in a horizontal cylindrical shape is formed. An intermediate stay 12 is bonded to the cylindrical surface with an adhesive at the arc-shaped concave groove 12a, and an insulating plate 13 made of glass is horizontally bonded to an upper surface thereof.
A mounting stay 14 is horizontally adhered to the upper surface of the insulating plate 13 by an adhesive. The insulating plate 13 is bonded to the mounting stay 14 in advance. In FIG. 7, the normal to the crystal lattice plane 15 of the ingot 11, that is, the crystal orientation 16 is inclined with respect to the central axis 17, the horizontal plane 18, and the vertical plane 19 of the ingot 11. The amount of displacement in the horizontal direction from the center axis 17 at both end surfaces of the ingot 11 in the crystal orientation 16 is indicated by reference numeral 20 and the amount of displacement in the vertical direction is indicated by reference numeral 21. Is at most ± 3 ° with respect to the center axis 17 of the ingot 11. The mounting axis of the mounting stay 14 refers to a virtual axis 23 in the longitudinal direction of the mounting stay 14 in FIG. 7, and the left and right side surfaces of the stay 14 in FIG. 7 are parallel to the virtual axis 23. The bonding method and the bonding apparatus according to this embodiment adjust the position of the crystal orientation 16 of the ingot 11 and the mounting axis 23 of the mounting stay 14 in parallel, and appropriately bond the ingot 11 and the mounting stay 14.

Next, ingot 1 using a wire saw
An outline of the entire processing apparatus 1 will be described with reference to FIGS.

The automatic warehouse 25 stores the raw ingot 1
1. The ingot 11 to which the intermediate stay 12 or the mounting stay 14 is adhered is housed, and the ingot is transported to a belt-conveying transport device 26 by a loading / unloading device (not shown). At the end of the transfer device 26, the crystal orientation 16 of the ingot 11 and the mounting axis 23 of the intermediate stay 12 and the mounting stay 14 are adjusted, and the intermediate stay 12 and the mounting stay 14 are bonded to the ingot 11 in two steps. A bonding device 27 for attaching the ingot to the mounting stay is provided. An orientation measuring device 28 as crystal orientation measuring means for measuring the crystal orientation 16 of the ingot 11 is provided near the bonding device 27.

Another transfer device 29 is connected in the middle of the transfer device 26, and a drying chamber 30 is provided in the middle of the transfer device 29 for drying and hardening the bonded portion of the ingot 11, the intermediate stay 12, and the insulating plate 13. Have been. The ingot 11 provided with the mounting stay 14 taken out of the transport device 29 is placed on a transport trolley 32 toward the wire saw 31 and supplied to the wire saw 31. The ingot 11 that has been processed by the wire saw 31 is sent to a single-wafer cleaning system 33, where it is separated into a large number of wafers and cleaned.

Next, referring to FIG. 1 to FIG.
Will be described.

This bonding device 27 is schematically viewed as a rotation support mechanism 38 for clamping and rotating the ingot 11 while keeping its center axis 17 horizontal, and an intermediate stay on which the rotation support mechanism 38 is mounted. The carriage 39 as a moving means provided reciprocally between the bonding position of No. 12 and the measurement position corresponding to the azimuth measuring device 28, and the ingot 11 is rotated based on the measurement data after the azimuth measurement described later. And a crystal orientation adjusting mechanism 40 as first adjusting means that also adjusts the crystal orientation 16 to be located in a horizontal plane and also serves as the rotation support mechanism 38. Further, the bonding device 27 includes an intermediate stay bonding mechanism 71 that bonds the intermediate stay 12 to the upper portion of the ingot 11 whose position has been adjusted by the crystal orientation adjusting mechanism 40, and an upper surface of the intermediate stay 12 based on the measurement data. The horizontal as a second adjusting means for rotating the mounting stay 14 in the horizontal plane and adjusting the position so that the mounting axis 23 in the horizontal plane of the mounting stay 14 is parallel to the crystal orientation 16 located on the horizontal plane of the ingot 11. An angle adjusting mechanism 91 is provided.

Therefore, the rotation support mechanism 38 and the carrier 3
9 will be described. As shown in FIG. 2, between a bonding position corresponding to the intermediate stay bonding mechanism 71 and a measurement position corresponding to the azimuth measuring device 21, along a pair of parallel left and right guide rails 41 fixed to the ground. A horizontal movable plate 42 is supported so as to be able to reciprocate in the horizontal direction. A pair of left and right bearing plates 43 in FIG. 2 are fixed upright on the upper surface of the movable platen 42, and a plurality of bearing plates 43 (in this embodiment, FIG.
As shown in FIG. 7, seven support rollers 44 are rotatably supported. As shown in FIG. 1, a guide roller 45 is supported at a predetermined position between the rightmost support roller 44 and the end of the transfer device 26, and the ingot 1 is moved from the transfer device 26 side.
1 can be transferred onto the support roller 44. That is, the guide roller 45 and the support roller 44 constitute an ingot carrying-in / out means. As shown in FIG. 1, a stopper 46 is erected and fixed on the upper surface of the end of the movable plate 42 on the measuring device 21 side so as to position the left end surface serving as a measurement reference surface of the ingot 11 in FIGS. It has become.

As shown in FIGS. 2 to 5, a pair of support plates 47 are erected and fixed on the upper surface of the movable plate 42, and a pair of upper and lower ingot clamp rollers 48 are freely rotatable between the support plates 47. Supported. On the upper surface of the movable plate 42, a pair of support members 49 are erected and fixed, and a pair of guide bars 50 are supported on the support body 49 in parallel and horizontally at a predetermined interval. A support board 52 is supported on the 50 via a plurality of supports 51 so as to reciprocate in a horizontal direction along the guide rod 50. This support plate 52 is provided with a cylinder 53
Is reciprocated in the horizontal direction by the rod 54. A pair of upper and lower drive rollers 55 that rotatably contact the outer peripheral surface of the ingot 11 and rotate the ingot 11 are supported on both side walls of the support board 52. These clamping rollers 48
The height of the drive roller 55 is set such that the center of the ingot 11 is higher than the center of the ingot 11 when the ingot 11 is conveyed on the support roller 44 when the ingot 11 is gripped. Then, when the pair of upper and lower clamping rollers 48 and the driving roller 55 grip the ingot 11 on the support roller 44, the ingot 11 is slightly lifted upward and separated from the roller 44.

A servo motor 56 is fixed to one side wall of the support board 52 as shown in FIGS.
A belt 59 is mounted between the driven pulley 57 of the above and a driven pulley 58 attached to the shaft end of the driving roller 55, and the driving roller 55 is rotated by a servomotor 56. Reference numeral 60 denotes an idler pulley. A rotary encoder 61 is attached to the servomotor 56, and detects the rotation angle of the ingot 11 in proportion to the rotation speed.

Next, the intermediate stay bonding mechanism 71 will be described.

A pair of guide rails 7 are provided on the upper part of the column 72.
3 is fixed in the vertical direction, and a horizontal support arm 74 is supported on both guide rails 73 so as to be able to move up and down along the rails 73. A bracket 7 is provided at the tip of the support arm 74.
The guide rails 76 are horizontally fixed to both ends of the ingot 11 as shown in FIG.
It is supported almost in parallel. A guided member 77 is fitted to the guide rail 76 so as to be able to reciprocate.
7, a holder 78 is attached, and the intermediate stay 12 carried in by a conveying means (not shown) is brought into horizontal contact with the lower surface of the holder 78, and the intermediate stay 12 is clamped and fixed by a pair of right and left clamp plates 79 in FIG. You. The clamp plates 79 are opened and closed by a cylinder 80 to clamp and release the intermediate stay 12.

At the upper end of the support arm 74, FIG.
As shown in FIG. 2, a motor 82 is fixed downward, and a pin 84 attached to the lower end of an eccentric shaft 83 extends in the horizontal direction formed on the upper surface of the holder 78, and the guide rail 7
6 is engaged with a groove 781 orthogonal to the groove 6. Accordingly, when the eccentric shaft 83 is rotated by the motor 82, the holder 78 can reciprocate along the guide rail 76 by the pin 84. The motor 82, the eccentric shaft 83, the guide rail 76
And an oscillator mechanism 8 for ensuring the adhesion of the intermediate stay 12 to the ingot 11 by the holder 78 and the like.
9 are configured.

A ball screw 85 is provided inside the column 72.
Are vertically supported, and the screw 85 is rotated forward and reverse by a lifting servomotor 86 fixed to the upper portion of the column 72. A lifting support 87 is supported by the ball screw 85 so as to be able to move up and down. The support 87 is locked by an engagement piece 88 attached to the base end of the support arm 74. Accordingly, when the servomotor 86 is rotated and the lifting support 87 is moved up and down, the support arm 74 and the holder 78 holding the intermediate stay 12 are moved up and down along the guide rail 73.

Next, the horizontal angle adjusting mechanism 91 will be described with reference to FIGS. 2 and 6. A horizontal support plate 92 is attached to the middle of the column 72 as shown in FIG. A horizontal angle adjusting plate 93 is supported by a connecting shaft 94 so as to be rotatable in a horizontal plane. An angle adjusting servomotor 95 is horizontally supported on the support plate 92, and a screw rod in which a first screw 97 and a second screw 98 are connected in series via a universal joint 96 is connected to an output shaft of the motor 95. Have been. An operation piece 99 is screwed into the first screw 97, and a rotor 100 fixed to the lower end of the operation piece 99 is rotatably engaged with a hole 921 formed in the horizontal support plate 92. An operating piece 101 is screwed into the second screw 98,
A rotor 102 is fixed to a lower end of the operating piece 101,
The rotor 102 is fitted in an engagement hole 931 formed in the horizontal angle adjustment plate 93.

Therefore, the first screw 9 is
When the 7 and the second screw 98 are rotated, the horizontal angle adjusting plate 93 is rotated.
Is horizontally rotated about a shaft 94, and the mounting stay 14
Of the horizontal direction on the intermediate stay 12, that is, the mounting axis 23 can be adjusted in parallel with the crystal orientation 16 of the ingot 11.

The first screw 97 and the second screw 98 are differential screws having different pitches.
Can be finely adjusted in the horizontal plane. In addition,
The mounting stay 12 is a mounting stay carrying-in bonding mechanism 1 shown in FIG.
By the number 03, the wafer is carried into the horizontal angle adjustment plate 93 above the ingot 11. This mounting stay carrying-in bonding mechanism 1
Reference numeral 03 denotes a movable column 105 that is horizontally moved by a driving mechanism (not shown) along a horizontal guide rail 104, and an elevating body 107 that is vertically moved by an elevating mechanism (not shown) along a guide rail 106 mounted on the column 105. And an electromagnet 108 attached to the lower surface of the horizontal portion of the elevating body 107. Then, the mounting stay 12 is sucked and gripped by the electromagnet 108 and transferred to a desired position, that is, the upper surface of the intermediate stay 12.

Next, the azimuth measuring device 28 for measuring the crystal orientation of an ingot by using X-ray diffraction will be described.

As shown in FIGS. 1 and 5, the reference end surface of the ingot 11 is brought into contact with the stopper 46 on the carriage 40, and the rollers 48, 48
The central axis 17 of the ingot 11 is positioned at a predetermined height position by 55 and 55 and clamped. In that state,
The horizontal movable plate 4 of the carriage 40 is moved by the feed motor 120.
2 is moved along the guide rail 41 and the azimuth measuring device 2
The carriage 40 is stopped at a predetermined measurement position corresponding to 8. Thereby, the ingot 11 is positioned at the measurement reference position Ko corresponding to the azimuth measuring device 28. That is, the stopper 46 and the control means of the feed motor 120 or the stop means by the sensor or the like constitute a means for positioning the ingot 11.

The azimuth measuring device 28 has a measurement reference position Ko.
A horizontal rotating shaft 113 parallel to the central axis 17 of the ingot 11 positioned at the position is rotatably supported, and a measuring head 114 is provided which is rotated about the rotating shaft 113. X-ray is applied to the measurement head 114 in the ingot 1
An X-ray projector 111 that irradiates the reference end surface at a predetermined inclination angle, and an X-ray receiver 11 that receives the irradiated X-ray
2 are provided, and the X-ray projector 111 and the light receiver 112 are attached at a predetermined angle. The measuring head 114 is rotated by a motor 115 connected to an end of a rotating shaft 113. The measuring device 116 for measuring the output of the reflected X-ray and the arithmetic unit 117 are connected to the X-ray receiver 112.
The arithmetic unit 117 rotates the measuring head 114 by 90 degrees while the ingot 11 is fixed, and
The measurement data of the crystal orientation 16 of the ingot 11 is calculated based on the output data of the X-ray reflected by irradiating one end face from four directions. This measurement data includes the rotation angle data α and the ingot 1 of the ingot 11 until the crystal orientation 16 of the ingot 11 is rotated about the central axis 17 of the ingot 11 and the crystal orientation 16 is located in the horizontal plane.
The ingot 1 when the crystal orientation 16 is replaced with the horizontal plane based on the inclination data of the crystal orientation 16 in the same plane with respect to the central axis 17 of the No. 1
1 is the inclination data β in the horizontal plane of the crystal orientation 16 with respect to the central axis 17 of the rotation axis. The calculation of the rotation angle data α and the inclination data β is described in, for example, JP-A-3-255948 and JP-A-6-258262. The calculation is performed by using a known technique disclosed in Japanese Patent Application Laid-Open No. H11-157572.

As shown in FIG. 14, the bonding device 27 has a control device 118 through which the motors 56, 82, 86, 95, 115 and the transport device 26 are connected.
Drive motor 119 and the feed motor 120 of the carriage 39
And the azimuth measuring device 28 is operated. Also, the control device 11
An arithmetic unit 117 is connected to 8 to read the measurement angle from the motor 115 and the rotation angles of the ingot 11 and the horizontal angle adjustment plate 93 from the motors 56 and 95.

Next, referring to FIGS. 12 and 13, the mounting stay 14 of the ingot 11 provided on the wire saw 31 will be described.
The work mounting mechanism 121 for holding the workpiece will be described.

As shown in FIG. 12, the support block 122 is fixed to an elevating column of a wire saw (not shown), and a fixed holder 123 is fixed to the block 122 by bolts or the like. On the lower surface of the holder 123, a movable holder 124 is rotatable in a horizontal plane.
25. The fixed holder 123
A mechanism 126 for adjusting the horizontal angle of the movable holder 124 is provided between the movable holder 124 and the movable holder 124.

The mechanism 126 has an operation knob 129 for rotating the first screw 127 and the second screw 128 provided on the fixed holder 123 side, and the knob 129 is the first screw 1
27 is connected by a universal joint 130. The first screw 127 is provided with an operating piece 131, the second screw 128 is provided with an operating piece 133, and the operating pieces 131 and 133 are provided with rotors 132 and 134, respectively. The rotation of the movable holder 124 about the shaft 125 in the horizontal direction can be adjusted.

The mounting stay 14 to which the ingot 11 is fixed is mounted on the lower surface of the movable holder 124.

The support block 122 includes a support cylinder 142.
Is fixed downward, and a lifting rod 143 is provided in the support tube.
Is pierced. At the lower end of the rod 143, a mounting piece 144 having a mounting groove 144a into which the mounting stay 14 can be inserted is integrally formed. A spacer 145 is interposed between the mounting stay 14 and the movable holder 124. A pusher 141b is provided in one of the mounting grooves 144a to be advanced and retracted by the cylinder 141a, and the mounting stay 14 is pressed against the inner surface of the other mounting groove 144a by reference thereto.
Horizontal positioning is performed.

FIG. 12 shows the inside of the support block 122.
As shown in the figure, a pair of left and right cam members 146 and 147 are accommodated in the lateral direction, and an air cylinder 149 is fixed downward on the upper part of the mounting cylinder 148 fixed on the upper surface of the block 122. The operating rod 1 is attached to the rod 150 of the cylinder.
A cam follower 152 and a cam pin 153 are connected to the lower end of the operating rod 151.
The pair of cam members 146 and 147 have cam grooves 15.
4, 156 and cam surfaces 155, 157 are formed, the cam followers 152 are in contact with the cam surfaces 155, 157, and the cam pins 153 are engaged with the cam grooves 154, 156.

Accordingly, when the operating rod 151 is lowered by the cylinder 149, the cam follower 152 and the cam pin 153 are moved downward, and the cam follower 152 is pressed against the cam surfaces 155 and 157. Therefore, the cam member 1
The lifting rod 143 is lifted by the inclined cam surfaces 158 and 159 of 46 and 147, the mounting stay 14 is sandwiched by the mounting pieces 144, and is vertically positioned and clamped.

Conversely, when the cam follower 152 and the cam pin 153 are lifted by the cylinder 149, the cam grooves 154 and 156 are inclined by the cam pin 153, so that the two cam members 146 and 147 are moved in the approaching direction. Therefore, the lifting rod 143 is moved downward,
The clamp of the mounting stay 14 is released.

Further, by rotating the operation knob 129 in advance, the mounting error of the movable holder 124 and the mounting piece 144 in the horizontal direction can be corrected so as to match the running direction of the wire 34. . That is, the mounting piece 144
Is finely adjusted so that the mounting groove 144a extends in a direction perpendicular to the running direction of the wire 34 of the wire saw.

Next, the ingot 1 configured as described above
A method for bonding the intermediate stay 12 and the mounting stay 14 to the first stay 1 will be described with reference to the flowchart of FIG.

First, the single ingot 11 taken out of the automatic warehouse 25 is carried by the carrier 26 and has a plurality of support rollers 44 on the carrier 39 as shown in FIG.
And the reference single surface is brought into contact with the stopper 46 and stopped at a predetermined position. (Step S1) Next, as shown in FIG. 2, the cylinder 53 is actuated, the driving roller 55 is pressed against the outer peripheral surface of the ingot 11, is separated from the support roller 44, and the ingot 11 is divided into four rollers 48, 48, a roller. It is clamped by 55, 55.
When the clamping operation of the ingot 11 is completed, the carriage 39, that is, the movable plate 42 is transferred toward the azimuth measuring device 28 together with the rotation support mechanism 38 that clamps the ingot 11. (Step S2) When the reference end face of the ingot 11 is moved to the regular measurement reference position Ko corresponding to the X-ray projector 11 and the light receiver 112 as shown by a chain line in FIGS. 1 and 5, the movable plate 42 is not shown. Secure with a braking device. (Step S3) Next, the azimuth measuring device 28 is started, and the end face of the ingot 11 is irradiated with X-rays from one direction and reflected, and the reflected X-rays are received by the light receiver 112. The measuring head 114 is rotated by 90 degrees by the motor 115, and the measuring operation is repeated from the other three directions. The measuring device 116 sends output data of the reflected X-rays from the light receiver 112 in four directions to the arithmetic device 117. (Step S4) When the azimuth measurement is completed, the arithmetic unit 117 calculates the rotation angle data α and the inclination data β (see FIG. 8) of the crystal orientation 16 based on each irradiation direction data and the output data.
(Step S5) After the azimuth measurement is completed, the ingot 11 is
At the same time, it is transported along the guide rail 41 from the measurement reference position Ko to the bonding device 71. (Step S6) During the conveyance or at the position where the ingot 11 is conveyed to the bonding position corresponding to the bonding device 71, the rotation adjustment about the central axis 17 is performed by the rotation angle data α from the arithmetic unit 117. . That is, the servo motor 56 is started to rotate the driving pulley 57 and the belt 59
, The two drive rollers 55 are rotated, and the ingot 11 is rotated by the angle α while being supported by the four rollers 48 and 55. Thereby, the crystal orientation 16 of the ingot 11 is located on the horizontal plane 18. (Step S7) Next, the motor 86 is started in FIG.
The arm 74 on which the arm 2 is mounted is moved downward along the guide rail 73, and as shown in FIG. 3, the intermediate stay 12 is placed on the upper surface of the ingot 11 so that their axes are substantially aligned with each other. The intermediate stay 12 is bonded. At this time, when the motor 82 of the oscillation mechanism 89 is activated and the eccentric shaft 83 is rotated, the holder 77 is reciprocated in the direction parallel to the central axis 17 of the ingot 11 along the guide rail 76 and is contained in the adhesive. Air bubbles are eliminated, and the intermediate stay 12 is quickly and reliably bonded. (Step S8) When the bonding of the intermediate stay 12 is completed, the cylinder 80
After the intermediate stay 12 is released from being clamped by the clamp plate 79, the motor 86 is driven in reverse to raise the support arm 74 as shown in FIG.
To the standby position above and stop.

When the adhesive between the ingot 11 and the intermediate stay 12 has dried, the insulating plate 1
3 is adhered to the lower surface of the insulating plate 13 and the mounting stay 14 coated with an adhesive is carried in toward the upper surface of the intermediate stay 12 of the ingot 11 while being lightly gripped by the carrying device 103. It is placed via an adhesive. Also in this case, the mounting stay 14 is lightly adhered to the upper surface of the intermediate stay 12 while being reciprocated in the direction of the center axis 17 of the ingot 11 via an oscillating mechanism (not shown). (Step S9) Next, the servo motor 95 of the horizontal angle adjustment mechanism 91 is rotated based on the tilt angle data β from the arithmetic unit 117, and FIG.
Is finely adjusted so that the inclination angle θ of the horizontal angle adjustment plate 93 with respect to the center axis 17 in the horizontal plane becomes the same as the angle β as shown in the plane of FIG. The intermediate stay 12 and the mounting stay 14
Before the adhesive between them is not dried, the side surface of the mounting stay 14 is pressed against the end surface of the horizontal angle adjustment plate 93 whose angle has been adjusted, and the azimuth adjustment in the horizontal plane is performed. Thereby, the crystal orientation 16 of the ingot 11 and the mounting stay 1
4 is parallel to the mounting axis 23 in the horizontal plane. (Step S10) In this state, the loading device 103 unclamps the mounting stay 14 and retreats. The intermediate stay 12 and the mounting stay 1
When the adhesive between the ingot 11 and the ingot 11 is dried, the cylinder 53 is actuated to drive the ingot 11 in FIG.
Is released, the ingot 11 is rolled on the support rollers 44 together with the mounting stay 14, moved to the transport device 26, and carried out. (Step S11) Then, the ingot 11 is guided to the drying chamber 30 through the transfer device 29 to completely dry the bonded portion.
9. It is sent to the wire saw 31 via the transport cart 32.

In this completed bonding state, as shown in FIG. 11, the crystal orientation 16 of the ingot 11 and the mounting stay 14
Is perpendicular to the plane of the drawing and in the horizontal plane 18, and the central axis 17 of the ingot 11 is inclined by β with respect to the crystal orientation 16 in the horizontal plane. The ingot 11 is transferred from the carrier 32 to the work mounting mechanism 121 of the wire saw 31 by a transfer device (not shown). At this time, the mounting stay 14 of the ingot 11 is
As shown in FIG. 2, it is inserted into the mounting piece 144 of the work mounting mechanism 121 and is positioned simultaneously with the clamp. Then, the ingot 11 is cut into many thin wafers by the wires 34 of the wire saw. Mounting stay 1
4 is simply mounted on the mounting piece 144 of the work mounting mechanism 121, and the mounting axis 23 of the mounting stay 14, that is, the crystal orientation 16 of the ingot 11 is positioned in a direction orthogonal to the traveling (horizontal) direction of the wire 34 of the wire saw 31.
The cut surface of the processed wafer is parallel to the crystal lattice plane.

For this reason, as shown in the flow of FIG. 16, after the ingot 11 is attached to the wire saw 31, machining can be started immediately without gonio adjustment.

The ingot 1 constructed as described above
The operation and effect of the method of bonding the mounting stay 1 and the mounting stay 14 will be described below.

(1) In the first embodiment, the mounting axis 14 of the mounting stay 14 is set with respect to the crystal orientation 16 of the ingot 11.
Since both members are adhesively fixed so that the members 3 are parallel to each other, the mounting stay 14 is connected to the wire saw 31 shown in FIG.
By simply attaching the ingot 11 to the work mounting mechanism 121, the ingot 11 can be cut immediately and accurately.
Therefore, it is not necessary to equip the wire saw 31 with the gonio-angle setting device, and the equipment cost can be greatly reduced.

(2) In the first embodiment, while keeping the center axis 17 of the ingot 11 horizontal, the ingot 1
1 is once moved in the horizontal plane, and the mounting axis 23 of the mounting stay 14 is moved in the horizontal plane so as to be parallel to the crystal orientation 16 and is adhered to each other in a state where it is adjusted. The mounting stay 14 is carried out in a horizontal state together, and the wire saw 3 is held in the same posture.
The work can be gripped by the first work mounting mechanism 121 and mounting work can be performed quickly.

(3) In the first embodiment, the azimuth measurement is performed while the ingot 11 is positioned and fixed at the measurement reference position Ko, so that the azimuth measurement can be performed accurately. Since the azimuth adjustment can be performed in a later step based on the measurement data α and β, the azimuth adjustment and the bonding mechanism can be installed in a place with good workability, and can be easily adapted to various systems.

(4) In the first embodiment, the ingot 11 is formed by the clamping roller 48 and the driving roller 55.
Is positioned at a predetermined position, and at the same time, the support rollers 44
Since it is separated from the top, direction measurement and rotation adjustment can be performed accurately and smoothly.

Next, a second embodiment of the present invention will be described with reference to FIGS.

As shown in the plane of FIG. 18, the rotation support mechanism 38 as the first adjusting means, and the carriage 3 as the moving means
9 is provided with an ingot carrying device 161 and an ingot carrying device 162 of a belt conveyor type, and a belt conveyor of the ingot carrying device 161 has a structure shown in FIG.
As shown in FIG. 0 (a), a pallet 163 on which the ingot 11 is supported is placed and transported to a predetermined position. As shown in FIG. 20B, the ingot 11 to which the intermediate stay 12 and the mounting stay 14 are bonded is carried out onto the ingot carrying device 162 while being supported by the pallet 164.

As shown in FIG. 19, the rotation support mechanism 38, the ingot carrying device 161 and the ingot carrying device 162
A first ingot carrying-in / out mechanism 165 as an ingot carrying-in / out means is provided above. The first ingot loading / unloading mechanism 165 includes a gate-shaped frame 166,
A horizontal moving mechanism 167 mounted on the frame 166,
It comprises a cylinder type lifting mechanism 168 mounted on the horizontal moving mechanism 167 and a gripping mechanism 169 mounted on the lifting mechanism 168. Then, after grasping and lifting the ingot 11 on the pallet 163 of the ingot carrying device 161, the ingot 11 moves in the horizontal direction, and a transfer position P1 of a second ingot carrying mechanism 181 described later.
(See FIG. 22). Further, the ingot 11 is moved onto the second ingot carrying-in / out mechanism 181 and is gripped and lifted upward with the intermediate stay 12 and the mounting stay 14 bonded thereto, and then is moved horizontally to move the ingot carrying-out device 162. Pallet 16
The ingot 11 is carried out to the upper side 4.

An intermediate stay storage and supply mechanism 171 and a mounting stay storage and supply mechanism 172 are provided between the rotation support mechanism 38 and the ingot carry-in device 161 and the ingot carry-out device 162. Both storage supply mechanism 171, 1
Reference numeral 72 has a function of feeding out the stays 12 and 14 one by one and supplying them to the intermediate stay transport mechanism 173 and the mounting stay transport mechanism 174. An adhesive applying mechanism 175 for applying an adhesive to the upper surface of the intermediate stay 12 transported by the intermediate stay transporting mechanism 173 is provided beside the storage and supply mechanisms 171 and 172 of the intermediate stay 12 and the mounting stay 14.
Is provided. Similarly, the mounting stay storage supply mechanism 1
An adhesive application mechanism 176 for applying an adhesive to the upper surface of the mounting stay 14 conveyed by the mounting stay conveying mechanism 174 is provided on the side of 72. As shown in FIGS. 18 and 19, in correspondence with the intermediate stay transport mechanism 173, a clamp mechanism 221 that grips the intermediate stay 12 to which the adhesive is applied and the later-described intermediate stay 12 or the mounting stay 14.
An intermediate stay carrying-in mechanism 177 for carrying in to the vehicle is provided. Similarly, a mounting stay loading mechanism 178 for loading the mounting stay 14 on which the adhesive is applied into the clamp mechanism 221 is provided corresponding to the mounting stay transport mechanism 174.

Next, the rotation support mechanism 38 of the second embodiment,
Configurations of the transporting trolley 39 and the crystal orientation adjusting mechanism 40 will be sequentially described.

As shown in FIG. 22, on the upper surface of the machine base 37, the ingot 11 before the stay is bonded is transferred from the transfer position P1 to the bonding position P2 where the stay is bonded, and the bonded ingot is transferred from the bonding position P2 to the transfer position. A second ingot transport mechanism 181 for transporting to P1 is provided. The second ingot transport mechanism 181 includes a column 182 erected on the machine base 37, and a pair of horizontal support arms 183 horizontally supported on the column 182 so as to be tiltable around a shaft 404.
And a cylinder 400 interposed between the arm 183 and the machine base 37. The second ingot transport mechanism 181 has a pair of drive pulleys 184 and driven pulleys 185 supported on both front and rear ends of a support arm 183, respectively, and a pair of drive belts 186 wound around both pulleys 184 and 185. , A plurality of rollers 401 driven by a drive belt 186. Then, the gripping mechanism 1 of the first ingot loading / unloading mechanism 165
The roller 401 is driven by rotating the drive belt 186 by the drive motor 187 on the ingot 11 carried into the transfer position P1 by the transfer roller 69, and the bonding position P2
Can be moved to At this time, the reference end surface of the ingot 11 is positioned by the stopper 191a provided on the carrier 39.

Next, the second ingot transport mechanism 181
The rotation support mechanism 38 which grips and rotates the ingot 11 carried to the bonding position P2 by the above and the transport carriage 39 which mounts this mechanism and moves the ingot 11 from the bonding position P2 to the azimuth measuring position P3 and in the opposite direction. explain.

As shown in FIGS. 21 and 22, on the upper surface of a horizontal movable plate 42 provided on the machine base 37, support plates 191 are erected and fixed on both sides. The support shafts 192 are supported horizontally and parallel to each other, and drive rollers 193 are fitted and fixed to the support shafts 192, respectively. The transport height 402 of the ingot 11 formed by the pair of drive rollers 193 is located lower than the transport height 403 of the ingot 11 supported by the rollers 401 mounted on the pair of horizontal support arms 183. Pulleys 19 are provided at the base ends of the support shafts 192.
The idler pulley 194 is supported on the left side surface of the support plate 191, and a belt 195 is wound around each pulley 194. One of the six pulleys 194 is rotated by a motor 196 to positively and reversely rotate the driving roller 193 to rotate the ingot 11. The stopper 191a is attached to the support plate 191 on the front end side.

As shown in FIG. 21, the horizontal movable plate 42
A support plate 197 is erected on the upper surface of the device, and a bracket 198 is attached to the plate.
99 is supported so as to be rotatable up and down around a shaft 200. A pressing roller 201 is provided at the tip of the lever 199.
Are supported, and the lever 199 is vertically reciprocated by the cylinder 202. Therefore, the ingot 11 is moved by the drive belt 186 to the second ingot carrying-in / out mechanism 18.
1 is moved from the transfer position P1 to the bonding position P2 and is moved onto the drive roller 193. In this state, the piston of the cylinder 400 supporting the horizontal support arm 183 is lowered, and the horizontal support arm 183 rotates downward about the shaft 404. As a result, the ingot 11 is placed on the pair of drive rollers 193, and the cylinder 202 is actuated to press the pressing roller 201 against the upper outer peripheral surface of the ingot 11, thereby moving the ingot 11 into the three rollers 193, 193. , 201 for gripping. At the same time, the brackets 410 and 411 fixed to the support plate 191
The cylinders 412 and 413 attached to the indenter are operated, and the clampers 414 and 415 clamp the ingot 11 from both sides so as to receive an upward pressing force during the work of bonding the stay.

As shown in FIG. 22, bearings 203 and 204 are supported on the upper surface of the machine base 37 at predetermined intervals, and a ball screw 205 is horizontally supported by the bearings 203 and 204. The ball screw 205 has the horizontal movable plate 42
Nut of ball screw 2 on the bracket attached to the lower surface of
06 is fitted and fixed. A drive motor 207 is provided near the bearing 203 so that the ball screw 205 can rotate. Accordingly, the rotation of the motor 207 causes the ball screw 205 to rotate, and the rotation support mechanism 38 on the horizontal movable plate 42 reciprocates between the bonding position P2 and the azimuth measurement position P3 via the nut 206. For this reason, the ingot 11 supported by the rotation support mechanism 38 is connected to the azimuth measuring device 28.
To the predetermined position, and the orientation measurement is performed in a state where the end surface of the ingot 11 is positioned at the measurement reference position Ko by the confirmation of the sensor S.

Next, a description will be given of a bonding mechanism in which the bonding of the intermediate stay 12 and the mounting stay 14 to the lower surface of the ingot 11 are performed in the same station with reference to FIGS.

A fixed shaft cylinder 211 is fixed upright on the machine base 37 in the vertical direction.
A rotary cylinder 213 is rotatably supported at a predetermined position via the rotary cylinder 12. The upper and lower sides of the inner surface of the rotary cylinder 213
A pair of spline cylinders 214 are fitted, and both cylinders 213 and 214 are fixed by bolts 215. An elevating support shaft 216 is vertically reciprocally movable in the spline cylinder 214 and is spline-fitted to the spline cylinder 214. The elevating lever 217 has a shaft 2 inside the machine base 37.
18 is supported so as to be swingable with the fulcrum 18 as a fulcrum.
When the elevating lever 217 is reciprocated up and down by 19, the elevating support shaft 216 moves up and down.

Next, a clamp mechanism 221 for alternately clamping the intermediate stay 12 or the mounting stay 14 provided at the upper end of the lifting support shaft 216 will be described with reference to FIG. The clamp mechanism 221 includes a clamp table 222 fixed to the upper end of the lifting support shaft 216, and a clamp table 222.
, A movable clamp pawl 224 attached to the clamp table 22,
2 and a cylinder 225 that reciprocates the movable clamp claw 224 in the horizontal direction.

Next, the lifting support shaft 216 and the clamp mechanism 2
The structure of a horizontal angle adjusting mechanism 91 as a second adjusting means for rotating the mounting stay 14 gripped by the mechanism by rotating the rotating shaft 21 about a vertical axis is shown in FIGS.
3 will be described.

As shown in FIG. 22, a ring 226 is fitted around the lower end of the rotary cylinder 213, and a rotating lever 227 is attached to the ring. The rotation lever 227 is provided at a predetermined position on the machine base 37.
8 and is adjusted based on the azimuth measurement data so that the mounting axis 23 of the mounting stay 14 is parallel to the central axis 17 located in the horizontal plane of the ingot 11.

Next, based on FIGS. 19 and 21, the intermediate stay 12 and the mounting stay 14 are alternately supplied to the upper surface of the clamp table 222 of the clamp mechanism 221, respectively. 17
2, transport mechanisms 173, 174, adhesive application mechanism 175,
176 and the stay carrying mechanisms 177 and 178 will be sequentially described.

A large number of intermediate stays 12 are accommodated in a frame 231 provided on the machine base 37 in a vertically stacked manner. Locking levers 233 are attached to the front and rear sides of the lower end of the frame 231 so as to be freely opened and closed by a cylinder or the like (not shown). The intermediate stay transport mechanism 173 includes a support frame 241 provided on the machine base 37 and the support frame 241.
And a drive motor (not shown) for driving the roller conveyor 242. The intermediate stays 12 fed one by one from the intermediate stay storage and supply mechanism 171 by operating the locking lever 233 are moved onto the roller conveyor 242 and can be moved to the adhesive application mechanism 175 side.

Next, the adhesive applying mechanism 175 will be described. A moving body 253 is supported on a top surface of a frame 251 provided on the machine base 37 along a guide rail 252 so as to be able to reciprocate back and forth. 254. The moving body 253 supports a lifting body 255 by a cylinder 257 so as to be able to move up and down. The lifting body 2
A dispenser nozzle 258 is attached downward on the side surface of the nozzle 55, and a predetermined amount of adhesive is supplied to the dispenser nozzle 258 via a flexible pipe 260 from an adhesive supply mechanism (not shown) provided on the frame 251 side. It has become.

Next, the structure of the intermediate stay loading mechanism 177 will be described. An adhesive is applied to the intermediate stay 12 moved to the adhesive applying mechanism 175 by the adhesive applying mechanism 175. The intermediate stay loading mechanism 177 for transporting the intermediate stay to the clamp mechanism 221 is disposed between the roller conveyors 242 as shown in FIG.
Up and down pair of clamp claws 261 that can clamp
And an up / down cylinder 262 that supports the clamp claw 261 and reciprocates vertically, and a forward / backward moving cylinder 263 that reciprocates the clamp claw 261 horizontally.

The intermediate stay storage / supply mechanism 171, intermediate stay transport mechanism 173, adhesive application mechanism 175 and intermediate stay carry-in mechanism 177 configured as described above are composed of the mounting stay storing / supplying mechanism 172 and the mounting stay transport mechanism 17.
4. Adhesive application mechanism 176 and mounting stay loading mechanism 17
8, since they are configured in exactly the same way, the same reference numerals are given and their explanation is omitted.

Next, the operation of the apparatus configured as described above will be described with reference to the flowchart of FIG.

In FIGS. 18, 19 and 22, the ingot 11 is moved by the ingot carrying device 161 to the pallet 1
When it is moved to a predetermined position while being supported by 63, a stop mechanism (not shown) is operated to stop the carry-in device 161.

The first ingot carrying-in / out mechanism 165 is operated in synchronization with the above-mentioned stopping operation, the gripping mechanism 169 is moved as shown by the arrow on the left side in FIG. 19, and the ingot 11 on the pallet 163 is moved to the second ingot. Delivery position P1 of conveyor roller 401 of ingot carrying-in / out mechanism 181
It is carried into. (Step S12) When the loading of the ingot 11 is completed, the drive motor 1
The ingot 11 is moved from the transfer position P1 to the bonding position P2 by the conveyor roller 401 by operating the 87,
The reference end face abuts against the stopper 191a and is positioned. Thereafter, the piston rod of the cylinder 400 is lowered, and the horizontal arm 183 is tilted downward about the shaft 404, whereby the ingot 11 is transferred onto the drive roller 193 of the rotation support mechanism 38. (Step S13) Thereafter, the cylinder 202 is operated and the pressing roller 20
1 is pressed against the upper surface of the ingot 11. At the same time, the cylinders 412 and 413 operate to operate the clampers 414 and 41.
5 clamps the ingot 11 from both sides. In this way, the ingot 11 is transferred to the carrier 39.
(Step S14) In this state, the drive motor 207 is operated, and
Is moved from the bonding position P2 to the azimuth measurement position P3 along the guide rail 41, and the ingot 11 is positioned at the measurement reference position Ko. (Step S15) At the azimuth measurement position P3, the crystal orientation of the ingot 11 is measured in the same manner as in the above-described first embodiment (step S16), and the rotation angle data α and the tilt angle data β are calculated as measurement data. (Step S17) After the azimuth measurement, the carriage 39 is returned from the azimuth measurement position P3 to the bonding position P2 along the guide rail 41. (Step S18) At this position, the ingot 11 is rotated based on the rotation angle data α so that the center axis 17 of the ingot is located in the horizontal plane. (Step S19) On the other hand, the intermediate stay 12 of the intermediate stay storage and supply mechanism 171
Is the roller conveyor 2 by the intermediate stay transport mechanism 173.
Each of the stays is fed out one by one and supplied to the adhesive application mechanism 175 to apply the adhesive to the upper surface of the stay. (Steps S20, S21) The intermediate stay 12 is clamped by the clamp claws 261 of the intermediate stay loading mechanism 177, and is loaded into the clamp table 222 of the clamp mechanism 221 at the standby position, as indicated by a chain line in FIG. Thereafter, the movable clamp pawl 224 is operated by the cylinder 225, and the intermediate stay 1 is interposed between the clamp pawls 223 and 224.
2 is clamped and fixed. (Step S22) Next, the lifting / lowering cylinder 219 is operated, and the lifting / lowering support shaft 21 is moved.
The upper surface of the intermediate stay 12 gripped by the clamp mechanism 221 is pressed and bonded to the lower outer peripheral surface of the ingot 11. At this time, since the drive motor 207 is rotated in the forward and reverse directions, the transport carriage 39 is reciprocated by a predetermined stroke in the front-rear direction, and the adhesion between the intermediate stay 12 and the ingot 11 is reliably performed by the oscillation function. (Step S23) When the bonding of the intermediate stay 12 is completed, the clamp mechanism 22
While the grip of the intermediate stay 12 by 1 is released,
The lifting support shaft 216 and the clamp mechanism 221 are lowered by the lifting cylinder 219.

Next, in step S24, the mounting stay 14 drawn out from the mounting stay storage and supply mechanism 172 is coated with an adhesive on the upper surface by an adhesive coating mechanism 176 in step S25. Mounting stay 14 coated with this adhesive
Is carried into the clamp mechanism 221 by the mounting stay carrying mechanism 178 in step S26, and the mounting stay 14 is pressed and bonded to the lower surface of the intermediate stay 12 by the same operation as the bonding operation of the intermediate stay 12 in step S27. At this time, based on the inclination data β of the measurement data, the lifting mechanism 216 and the clamp mechanism 221 are rotated by the rotation mechanism 228.
Is rotated in a horizontal plane at a predetermined angle, and the mounting axis 23 of the mounting stay 14 is adjusted to be parallel to the central axis 17 of the ingot 11. (Step S28) The ingot 11 to which the intermediate stay 12 and the mounting stay 14 have been bonded is moved from the bonding position P2 to the transfer position P1 in step S29, and thereafter, in step S30.
By the first ingot carrying-in / out mechanism 165, it is carried out from the delivery position P1 to the ingot carrying-out device 162 side.

Next, the operation and effect based on the configuration of the second embodiment will be described.

(1) In the second embodiment, the intermediate stay 12
Since the intermediate stay bonding mechanism and the mounting stay bonding mechanism are configured to perform the bonding work of the mounting stay 14 and the bonding work of the mounting stay 14 at the same station, the structure can be simplified and the working efficiency can be improved. it can.

(2) In the second embodiment, the storage and supply mechanisms 171 and 172 for the intermediate stay and the mounting stay, the transport mechanisms 173 and 174 for the intermediate stay and the mounting stay, the adhesive coating mechanisms 175 and 176, and the intermediate and mounting stays. Since the carry-in mechanisms 177 and 178 for carrying the material into the clamp mechanism 221 are provided, the work of applying the adhesive to the intermediate stay 12 and the mounting stay 14 and the work of carrying in the clamp mechanism 221 can be automated to improve the work efficiency. .

(3) In the second embodiment, the ingot carrying device 161 and the ingot carrying device 162 are provided, and the first ingot carrying mechanism 165 moves the ingot 11 to the second ingot.
Since the loading and unloading to the transfer position P1 of the ingot loading and unloading mechanism 181 is performed, the loading and unloading work of the ingot 11 can be automatically and quickly performed.

(4) In the second embodiment, a lifting / lowering support shaft 216 whose angle is adjusted by a rotating mechanism 228 is provided on the machine base 37, and a clamp mechanism 221 for holding an intermediate stay or a mounting stay above the support shaft 216. Is provided, the configuration of the bonding mechanism can be simplified.

Next, a third embodiment of the present invention will be described with reference to FIGS.

In the third embodiment, the bonding mechanism K1 of the intermediate stay 12 and the bonding mechanism K2 of the mounting stay 14 in the above-described second embodiment are provided separately, and the bonding mechanism K2 of the mounting stay 14 is separated from the bonding mechanism K2. An attachment stay moving mechanism 270 for attaching a plurality of ingots 11 to one attachment stay 14 is provided.

According to FIG. 26, this mounting stay moving mechanism 27
The rotation support plate 272 is horizontally supported by the upper end of a rotation support shaft 271 that is supported by the fixed shaft cylinder 211 and that is rotated by the rotation mechanism 228 at a predetermined position. A pair of guide fittings 273 is fixed to the rotation support plate 272, and a guide rail 274 fixed to the lower surface of the clamp table 222 of the clamp mechanism 221 is guided by the guide fittings 273 and can reciprocate in the longitudinal direction. A rack 275 is fixed to the lower side of the clamp table 222 in the longitudinal direction. A pinion 276 fixed to a shaft of a motor 277 built in a brake 406 provided on a bracket 276 of the rotation support plate 272 is engaged with the rack 275.

Next, the ingot 1 in this embodiment will be described.
28 and FIG. 28 (a) to FIG. 28 (c) showing a plan view of FIG. 27 according to the flow of FIG. 29 regarding the method of bonding the ingot 11 to the intermediate stay 12 and bonding the ingots 11 to the mounting stay 14.
It will be described based on.

The orientation measurement of the ingot 11, the orientation adjustment based on the data α, and the adhesion of the intermediate stay 12 shown in steps S31 to S38 are described in step S31 in FIG.
13 to S19 and S23, the description is omitted.

After the intermediate stay 12 is bonded, the ingot 11 is transported to a bonding position corresponding to the mounting stay bonding mechanism K2 provided with the mounting stay moving mechanism 270 described above. (Step 39) In the mounting stay moving mechanism 270, the clamp mechanism 22
First, the pinion 278 is rotated by the motor 277 so that the rack 275 is moved straight so that the mounting center position for mounting the first ingot 11 is positioned above the rotary support shaft 171. It moves and turns on the brake 406 of the motor 277. (Step S40) Then, as shown in FIG. 28A, the first ingot 11 gripped between the gripping members H of the ingot transport mechanism (not shown) such as a manipulator is rotatably supported at the center in the length direction. Is transported so as to be positioned above the shaft 171,
It is placed on the mounting stay 14 at that position. (Step 4
1) As a result, as shown in FIG. 28A, the center of the ingot 11 in the length direction coincides with the mounting center position of the mounting stay 14. At this position, the lower surface of the intermediate stay 12 bonded to the lower surface of the ingot 11 is bonded to the upper surface of the mounting stay 14 via an adhesive applied thereto, and is lightly bonded with an oscillate. (Step S42) Before the adhesive is dried, the first ingot 11 is fixed on its center axis 17 by the gripping members H, H, and based on the inclination data β measured by the direction measuring device 28. Rotation support shaft 271 by rotating mechanism 228
Is rotated as shown by the two-dot chain line in FIG. 28 (a) to adjust the azimuth. As a result, the crystal orientation of the first ingot 11 and the mounting axis 23 of the mounting stay 14 coincide with each other, and in this adjusted state, the mounting stay 14 and the intermediate stay 12 bonded to the lower surface of the ingot 11 are adjusted. Are bonded. (Step S43) Thereafter, the gripping members H, H of the ingot transport mechanism are separated from the first ingot 11 and retracted.

When the bonding of the first ingot 11 is completed, the mounting stay 14 is reversely rotated by the angle β by the rotating mechanism 228 and returned to the original angle. (Step S
44) Next, if there is a next ingot 11 to be adhered to the same mounting stay 14 in step S45, step S4
Returning to 0, the brake 406 of the motor 277 is released, and the pinion 278 is rotated by the motor 277 to move the rack 275 linearly so that the second ingot 11 of the mounting stay 14 is moved as shown in FIG. The pinion 278 is driven by the motor 277 so that the mounting center position for mounting is moved above the rotation support shaft 171.
Is rotated to linearly move the rack 275, and the brake 406 of the motor 277 is turned on.

Then, as shown in FIG. 28 (b), the second ingot 11 is placed on the mounting stay 14 in the same manner as when the first ingot 11 is transported and positioned. The center of the ingot 11 in the length direction coincides with the mounting center position of the mounting stay 14.
(Steps S41 and S42) In this state, the rotation mechanism 22 is held based on the data from the azimuth measuring device 28 while holding the second ingot 11 in the same manner as the bonding operation of the first ingot 11 again.
8, the rotation support shaft 271 is rotated as shown by a two-dot chain line in FIG. As a result, the crystal orientation of the second ingot 11 and the mounting axis 23 of the mounting stay 14 coincide with each other. In this adjusted state, the mounting stay 14 and the intermediate stay 12 bonded to the lower surface of the ingot 11 are adjusted. Are bonded. (Step S43)
Thereafter, in the same way, the ingot transport mechanism is retracted,
The mounting stay 14 is returned to the original angle. (Step S4
4) Further, the bonding operation of the third ingot 11 is shown in FIG.
As shown in (c), the first and second ingot 1
1 is performed in the same manner as the bonding operation.

In the third embodiment described above, since the mounting stay moving mechanism 270 is provided between the rotation support shaft 271 and the clamp mechanism 221, a plurality of ingots having a short length are provided for one mounting stay 14. 11 can be easily bonded while adjusting the orientation.

Next, a fourth embodiment of the present invention will be described based on the flow of FIG.

In the present embodiment, the ingot 11 is rotated by the rotation angle data α by the crystal orientation adjusting mechanism 40 similar to that shown in FIG.
After adjusting the rotation, the intermediate stay 1
2 is attached to the ingot 11 via the intermediate stay 12 while the mounting stay 14 with the lightly adhered 2 is rotated and adjusted in the horizontal plane by the inclination data β by the horizontal angle adjusting mechanism 91 similar to FIG. is there.

The azimuth measurement of the ingot 11 and the azimuth adjustment based on the data α shown in steps S47 to S53 are the same as steps S1 to S7 described with reference to FIG.

After the rotation of the ingot 11 has been adjusted, the intermediate stay 12 is adhered with the mounting stay 14 substantially aligned with the axis.
To oscillate. (Step S54) Before the adhesive between the intermediate stay 12 and the mounting stay 14 dries, the adhesion to the ingot 11 and the azimuth adjustment based on the data β are performed. The mounting stay 14 is bonded to the ingot 11 via an adhesive with an oscillating operation on the surface of the intermediate stay 12 on which the circular concave groove 12a is formed.
(Step S55) Thereafter, the rotation of the mounting stay 14 in the horizontal plane is adjusted based on the data β. (Step S5
6) In this state, the ingot 11 is carried out after the adhesive is dried. (Step S57) In this embodiment, the intermediate stay 12 has an arcuate groove 1 that fits into the cylindrical surface of the ingot 11 along its mounting axis.
2a. As a result, the adhesive between the intermediate stay 12 and the mounting stay 14 is not dried, and the ingot 1
When the mounting stay 14 is bonded to the base 1 via the intermediate stay 12, the mounting axis of the intermediate stay 12 is aligned with the center axis 17 of the ingot 11 by the engagement of the intermediate stay 12 with the arc-shaped concave groove 12a and the ingot 11. It is adjusted and adhered. Therefore, the bonding area is large and the bonding strength is increased. Even when the mounting stay 14 is rotated and adjusted in this bonding state, the intermediate stay 12 is adjusted without moving while being fitted to the ingot 11, and only the mounting stay 14 is adjusted, so that the intermediate stay 12 is bonded in the same state as in FIG. Thus, ingot 1
For one, the bonding of the mounting stay 14 can be completed in a single bonding step.

The present invention can be embodied as follows.

(1) In each of the above embodiments, the control device 118 is provided with the intermediate stay 12 with respect to the ingot 11.
And a function of controlling the pressing pressure, the oscillation speed, the number of oscillations, and the oscillation time when the mounting stay 14 is bonded. Then, the bonding data is set by the operation panel or appropriate data is selected from data stored in advance.

(2) The insulating plate 13 is omitted. An alternative insulation function should be provided on the workpiece mounting mechanism side of the processing machine.

(3) The insulating plate 13 and the intermediate stay 12 are omitted.

(4) The means for adjusting the position so that the mounting axis 23 of the mounting stay 14 is parallel to the crystal orientation 16 of the ingot 11 is such that the mounting stay 14 is kept stationary in a predetermined state, and the ingot 11 is The relative position is adjusted by rotating in a horizontal plane.

(5) In the third embodiment, the fourth
As described in the embodiment, the intermediate stays 12 corresponding to the number of ingots are previously bonded on the mounting stays 14 via an adhesive, and preferably, the plurality of ingots 11 are successively interposed before the adhesive is dried. Adhering to the mounting stay 14 via the stay 12 in an adjusted state.

(6) The intermediate stay 12 is bonded to the mounting stay 14 in advance with the orientation substantially adjusted, and the bonding is performed in one step by the actual bonding apparatus in an integrated state.

The technical ideas other than the claims that can be grasped from the above embodiment will be described below together with their effects.

A wire saw provided with a work mounting mechanism 121 for holding the mounting stay 14 in a predetermined direction with the mounting stay 14 bonded to the ingot 11 with the crystal orientation 16 and the mounting axis 23 parallel to each other.

This wire saw can simplify the structure, automate the work of mounting the mounting stay 14, and improve the operation rate.

[0123]

As described above, according to the first and tenth aspects of the present invention, the rotation of the ingot and the rotation of the mounting stay in the horizontal plane are adjusted based on the measurement data of the crystal orientation of the ingot. Since both members are bonded and fixed so that the crystal orientation is parallel to the mounting axis of the mounting stay, the mounting stay can be easily mounted on the work mounting mechanism of the processing machine. This eliminates the need to attach a gonio angle setting device to the processing machine, reducing the equipment cost of the entire ingot cutting machine, and automating the work of attaching the ingot to the processing machine,
The operating rate of the processing machine can be improved.

In addition, since the measurement data of the crystal orientation of the ingot is secured by the orientation measurement, the orientation adjusting mechanism and the bonding mechanism can be installed at a position easy to work away from the measuring device covered with the cover or the like. It can easily cope with various systems.

According to the second and eleventh aspects of the present invention, the ingot can be accurately positioned with respect to the measuring device, and the azimuth is measured while the ingot is fixed. Therefore, an accurate azimuth is always obtained regardless of the size of the ingot. Measurement can be performed. Measurement data becomes highly accurate.

According to the third and twelfth aspects of the present invention, data corresponding to each azimuth adjustment is obtained and can be used as it is as adjustment command data.

According to the inventions of claims 4, 5 and 13, through the intermediate stay, stable attachment between the mounting stay and the ingot can be achieved. In addition, since the intermediate stay is made of a cuttable material, it is possible to reliably cut the ingot having a circular cross section by the processing machine.

According to the inventions of claims 6, 7, 14, 15, and 16, in addition to the effects of claims 4, 5, and 13, the mounting stay can be securely bonded to the ingot in one bonding step.

According to the eighth, seventeenth and eighteenth aspects of the present invention, each stay can be securely bonded.

According to the ninth and twenty-fourth aspects of the present invention, a plurality of ingots can be bonded to a single mounting stay. A plurality of short ingots can be cut at the same time, and the processing efficiency is improved.

According to the nineteenth aspect of the present invention, the ingot can be quickly moved between the measuring position and the bonding position by the transport trolley.

According to the twentieth aspect, the ingot can be reliably positioned with respect to the measuring device.

According to the twenty-first aspect of the present invention, since the ingot moving means also serves as the first adjusting means, the azimuth can be adjusted while moving and the working time is shortened.

In the invention according to claims 22 and 23,
The transfer of the ingot can be automated, and each mechanism can be arranged in various layouts.

According to the twenty-fifth aspect of the present invention, a plurality of ingots can be efficiently adhered to the same mounting stay in a state where the orientations of the ingots are adjusted.

[Brief description of the drawings]

FIG. 1 is a front cross-sectional view showing a bonding apparatus and an orientation measuring apparatus embodying a bonding method of the present invention.

FIG. 2 is a side sectional view of a bonding device and an orientation measuring device.

FIG. 3 is a side sectional view of a bonding device and an orientation measuring device.

FIG. 4 is a side sectional view of a bonding device and an orientation measuring device.

FIG. 5 is a plan sectional view of a rotation support mechanism and an azimuth measuring device.

FIG. 6 is a plan view of a horizontal angle adjustment mechanism.

FIG. 7 is a perspective view of an ingot and a mounting stay.

FIG. 8 is a plan view illustrating an azimuth measuring method.

FIG. 9 is a front view illustrating an azimuth measuring method.

FIG. 10 is a front view illustrating an azimuth measuring method.

FIG. 11 is a front view showing a state where the mounting stay is adhered to the ingot.

FIG. 12 is a longitudinal sectional view of a work mounting mechanism.

FIG. 13 is a partial plan view of a work mounting mechanism.

FIG. 14 is a schematic explanatory view showing a control device.

FIG. 15 is a flowchart showing a method of bonding an ingot and a mounting stay.

FIG. 16 is a flowchart showing a method for processing an ingot.

FIG. 17 is a schematic perspective view of the entire processing apparatus.

FIG. 18 is a plan view showing a second embodiment of the present invention.

FIG. 19 is a front view of the second embodiment.

FIGS. 20A and 20B are perspective views of a pallet and an ingot.

FIG. 21 is a sectional view showing an adhesion mechanism.

FIG. 22 is a sectional view showing an adhesion mechanism.

FIG. 23 is an enlarged sectional view of a bearing structure of a lifting support shaft and a clamp mechanism.

FIG. 24 is a flowchart showing a method of bonding an ingot and a mounting stay.

FIG. 25 is a sectional view showing a third embodiment of the present invention.

FIG. 26 is a sectional view showing a bonding mechanism of the mounting stay.

FIG. 27 is a perspective view showing a bonding mechanism of the mounting stay.

FIGS. 28 (a), (b), and (c) are plan views illustrating a method of attaching a mounting stay.

FIG. 29 is a flowchart showing a method of bonding a plurality of ingots and a mounting stay.

FIG. 30 is a flowchart showing a method of bonding an ingot and a mounting stay according to a fourth embodiment of the present invention.

FIG. 31 is a flowchart of a conventional ingot processing method.

[Explanation of symbols]

11: Single crystal ingot, 12: Intermediate stay, 12a ...
Circular concave groove, 14 ... Mounting stay, 16 ... Crystal orientation, 17 ...
Central axis of ingot, 23 ... mounting axis of mounting stay,
27 bonding apparatus, 28 orientation measuring apparatus (crystal orientation measuring means), 38 rotation support mechanism, 39 carriage (moving means), 40 crystal orientation adjusting mechanism (first adjusting means), 44
... Support rollers constituting ingot carrying-in / out means, 45 ...
Guide roller constituting ingot carrying-in / out means, 46 ... stopper constituting positioning means, 71 ... intermediate stay bonding mechanism, 89 ... oscillating mechanism, 91 ... horizontal angle adjusting mechanism (second adjusting means), 114 ... measuring head, 118 .., A control device constituting the positioning means, 165, a first ingot carrying-in / out mechanism (ingot carrying-in / out means), 171, a rotation support shaft, 191 a, a stopper constituting the positioning means, 2
21: Clamp mechanism, 270: Mounting stay moving mechanism, 2
72: rotation support plate, α, β: measurement data of crystal orientation, K
o: a measurement reference position; S: a sensor constituting a positioning means.

Claims (25)

[Claims] 1. A crystal orientation of an ingot is measured using X-ray diffraction in a state in which a cylindrical ingot is positioned at a measurement reference position, and the ingot is measured based on the crystal orientation measurement data. While rotating the ingot around its central axis so that the crystal orientation of the ingot is located in the horizontal plane while keeping the central axis of the ingot horizontal at a position away from the position, the crystal orientation of the ingot is attached to this ingot A method of bonding an ingot and a mounting stay, wherein the ingot and the mounting stay are bonded in a state where one of the mounting stay and the ingot is rotated in a horizontal plane so as to be parallel to a mounting axis of the mounting stay and the orientation is adjusted. 2. A measuring head for measuring a crystal orientation of an ingot according to claim 1, wherein the ingot is fixed at a measurement reference position with one end surface of the ingot being horizontal with its central axis line horizontal. A method of bonding an ingot and a mounting stay, wherein the ingot is rotated around a central axis parallel to an axis, and is irradiated with X-rays from a plurality of directions with respect to a measurement reference plane of the ingot, and the crystal orientation of the ingot is measured by the reflected X-ray output. 3. The ingot rotation angle data and the ingot rotation data of the ingot until the crystal orientation is positioned in a horizontal plane after the crystal orientation of the ingot is rotated around the central axis of the ingot. A method of bonding an ingot and a mounting stay, which is inclination data of the crystal orientation in the same plane with respect to a central axis. 4. The ingot according to claim 3, wherein the rotation angle data is used to adjust the rotation of the ingot about its central axis, and the adjusted ingot is provided with an intermediate stay made of a cuttable material on the upper or lower surface thereof. After being adhered to the center axis of the ingot, one of the ingot and the mounting stay supported so as to be relatively displaceable in the horizontal plane with respect to the intermediate stay is adjusted in rotation in the horizontal plane by the inclination data, and the intermediate A method of bonding an ingot and a mounting stay to bond the mounting stay to the stay. 5. The method according to claim 4, wherein after the adhesive between the ingot and the intermediate stay is dried, the mounting stay is adhered to the intermediate stay. 6. The ingot according to claim 3, wherein after adjusting the rotation of the ingot about its central axis based on the rotation angle data, the adjusted ingot or an intermediate stay made of cuttable material is adhered in advance to the upper surface of the ingot or An ingot for attaching the mounting stay to the upper surface or lower surface of the ingot via an intermediate stay in a state in which one of the mounting stays supported to be relatively displaceable in the horizontal plane with respect to the lower surface is adjusted in the horizontal plane by the inclination data. And how to attach the mounting stay. 7. The intermediate stay according to claim 6, wherein an upper surface of the intermediate stay has an arc-shaped concave groove that fits into the cylindrical ingot along the mounting axis, and the adhesive between the intermediate stay and the mounting stay is in an undried state. Then, the mounting stay after adjustment is bonded to the ingot via the intermediate stay, and at this time, the mounting axis of the intermediate stay is parallel to the center axis of the ingot due to the engagement of the intermediate stay with the circular concave groove and the ingot. A method of bonding an ingot and a mounting stay to be bonded so as to become. 8. The method of bonding an ingot and a mounting stay according to claim 4, wherein the ingot has an oscillating operation in the direction of the center axis of the ingot on the stay side or the ingot side when the intermediate stay or the mounting stay is bonded. 9. The method for bonding an ingot and a mounting stay according to claim 1, wherein a plurality of ingots or intermediate stays are sequentially bonded to a single mounting stay. 10. A positioning means for positioning an ingot at a measurement reference position for measuring a crystal orientation of a cylindrical ingot, and using an X-ray diffraction to determine the crystal orientation of the ingot positioned at the measurement reference position. A crystal orientation measuring means for measuring the crystal orientation, a moving means for retracting the ingot from the measurement reference position after the crystal orientation measurement, and a central axis of the ingot at the position retracted from the measurement reference position based on the measurement data of the crystal orientation measurement means. First adjusting means for rotating and adjusting the ingot about its central axis so that the crystal orientation of the ingot is positioned in a horizontal plane while maintaining the horizontal, and the ingot adjusted by the first adjusting means or attached to the ingot. One of the attached mounting stays based on the measurement data of the crystal orientation measuring means. Second adjusting means for rotationally adjusting the mounting axis in a horizontal plane such that the mounting axis is parallel to the crystal orientation of the ingot; and mounting the mounting stay to the ingot in a state adjusted by the first adjusting means and the second adjusting means. An ingot and mounting stay bonding device having a stay bonding mechanism. 11. The crystal orientation measuring means according to claim 10, wherein said crystal orientation measuring means has a rotatable measuring head, and fixes the ingot with its center axis horizontal and one end face of the ingot as a measurement reference plane at a measurement reference position. In this state, the measurement head is rotated about a central axis parallel to the central axis of the ingot, and X-rays are irradiated from a plurality of directions with respect to the measurement reference plane of the ingot, and the crystal orientation of the ingot is measured based on the output of reflected X-rays. Bonding device for ingot and mounting stay. 12. The ingot rotation angle data and ingot rotation data of the ingot until the crystal orientation is located in a horizontal plane after the crystal orientation of the ingot is rotated around the central axis of the ingot. Tilt angle data of the crystal orientation in the same plane with respect to the center axis;
The adjusting means is a bonding device for the ingot and the mounting stay, each of which performs an adjusting operation based on the inclination data. 13. The intermediate member according to claim 12, wherein an intermediate stay made of a cutable material is horizontally adhered to an upper surface or a lower surface of the ingot adjusted by the first adjusting means, with its mounting axis aligned with the center axis of the ingot. A device for bonding an ingot and a mounting stay, comprising a stay bonding mechanism, wherein the mounting stay bonding mechanism bonds the mounting stay to an intermediate stay bonded to the ingot. 14. The ingot mounting mechanism according to claim 12, wherein the second adjusting means adjusts one of an ingot and a mounting stay to which an intermediate stay made of a severable material is bonded in advance. An ingot and a mounting stay bonding apparatus for bonding the mounting stay adjusted to the ingot via an intermediate stay. 15. The ingot and mounting stay bonding apparatus according to claim 13, wherein an arc-shaped concave groove is formed on one surface of the intermediate stay along a mounting axis thereof so as to fit into a cylindrical surface of the ingot. 16. The intermediate stay according to claim 14, wherein one surface of the intermediate stay is formed with an arc-shaped concave groove which fits into a cylindrical surface of the ingot along a mounting axis thereof, and wherein the mounting stay bonding mechanism comprises In the state where the adhesive between the stays is not dried, the mounting stay is bonded to the ingot via the intermediate stay, and at this time, the intermediate stay is attached to the ingot by fitting the arc-shaped groove and the ingot. A bonding device for an ingot and a mounting stay that is bonded so that the axis is parallel to the center axis of the ingot. 17. The intermediate stay bonding mechanism and the mounting stay bonding mechanism according to claim 13, wherein the intermediate stay and the mounting stay are bonded with an adhesive interposed between the intermediate stay and the ingot and between the intermediate stay and the mounting stay. A bonding device for an ingot and a mounting stay, comprising an oscillating mechanism for reciprocating the mounting stay or the ingot in the central axis direction of the ingot. 18. The mounting stay bonding mechanism according to claim 14, wherein the mounting stay or the ingot is provided with an adhesive interposed between the intermediate stay and the ingot and between the intermediate stay and the mounting stay. A bonding device for an ingot and a mounting stay, comprising an oscillating mechanism that reciprocates in the center axis direction of the ingot. 19. The transport vehicle according to claim 13, wherein the moving means reciprocates between a measurement position corresponding to the crystal orientation measuring means and an intermediate stay bonding mechanism while supporting the center of the ingot horizontally. Is an ingot and mounting stay bonding device. 20. The ingot and the mounting stay according to claim 19, wherein the positioning means comprises a stopper provided on the carrier for positioning a measurement reference surface of the ingot, and a stopper for stopping at a measurement position of the carrier. Bonding equipment. 21. The ingot according to claim 20, wherein the first adjusting means is provided on a carrier and adjusts the rotation of the ingot during or after moving the ingot from the measurement reference position to the intermediate stay bonding mechanism. Stay bonding device. 22. The bonding apparatus according to claim 19, further comprising an ingot loading / unloading means for loading / unloading the ingot to / from the carrier. 23. The ingot and mounting stay bonding device according to claim 22, wherein the intermediate stay bonding mechanism and the mounting stay bonding mechanism are arranged at different positions, and the ingot is transferred between the two by the ingot carrying-in / out means. . 24. The ingot and the mounting stay according to claim 13, wherein said second adjusting means includes a mounting stay moving mechanism capable of adhering a plurality of ingots or intermediate stays to a single mounting stay. Bonding equipment. 25. A rotating support shaft according to claim 24, wherein said second adjusting means is reciprocated around a vertical axis at a predetermined position on the machine base, and is horizontally supported by an upper end of said rotating support shaft. A bonding device for an ingot and a mounting stay, comprising: a rotation support plate; and a clamp mechanism that is supported by the rotation support plate so as to be able to reciprocate in a horizontal direction and that clamps the mounting stay.