JP3268733B2 - Bonding method and bonding apparatus for ingot and mounting stay, and ingot cutting method using the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and a device for bonding an ingot to a mounting stay and a method for cutting an ingot using the device.

[0002]

2. Description of the Related Art An Si single crystal ingot for producing a silicon (Si) wafer has a regular lattice plane. However, the unprocessed ingot picked up from the crucible is processed into a cylindrical shape, but the crystal orientation with respect to the central axis of each ingot varies. A carbon intermediate stay is bonded to the ingot, and a mounting stay is bonded to the upper surface of the intermediate stay via a glass insulating plate. Therefore, if the wafer is formed by mounting the ingot on a wire saw and cutting the ingot with a wire, the positional relationship between the cut surface of the wafer and the lattice plane is not constant, and the characteristics of the cut wafer vary.

[0003] In order to solve the above problem, a goniometer for ingots is conventionally mounted on a wire saw. Then, with the ingot mounting stay attached to the gonio angle setting device with bolts, the orientation measurement device measures the horizontal and vertical displacements of the crystal orientation from the center axis of the ingot, and then sets the gonio angle setting device. Thus, the crystal orientation of the ingot is adjusted to an appropriate position with respect to the traveling direction of the wire. This adjustment involves displacing the crystal orientation in a vertical plane perpendicular to the wire by rotating the ingot and the mounting stay in a horizontal plane using a gonio angle setting device, and rotating the ingot and the mounting stay in the vertical plane. The crystal orientation is displaced in the horizontal plane. That is, the conventional ingot cutting process is performed according to the procedure shown in FIG. 33, and after the ingot to which the mounting stay is adhered is attached to the wire saw, gonio adjustment is always performed before the process.

[0004]

Accordingly, since it is necessary to attach a gonio angle setting device to each wire saw, there is a problem that the equipment cost of the processing apparatus cannot be reduced.
In addition, since it is necessary to attach the ingot to the gonio angle setting device, it is necessary to manually tighten the bolts to attach the ingot. There is a problem that the ingot mounting operation cannot be automated and the operation rate of the wire saw cannot be improved.

The present invention has been made in view of the problems existing in the prior art, and an object of the present invention is to preliminarily establish an ingot and a mounting stay based on the crystal orientation of the ingot at a bonding stage. Adhesion is performed with the positions adjusted to each other, and it is not necessary to attach a gonio angle setting device to the processing machine by carrying it into the processing machine, so that the equipment cost of the entire processing apparatus can be reduced and the ingot for the processing machine can be reduced. It is an object of the present invention to provide a method of bonding an ingot to a mounting stay, a bonding apparatus, and an ingot cutting method using the same, which are capable of automating a mounting operation of a processing machine and improving an operation rate of a processing machine.

[0006]

[0007]

[0008]

According to the first aspect of the present invention, in order to achieve the above-mentioned object, a column-shaped inn is provided.
Ingot crystal with the center axis of the ingot kept horizontal
Place the ingot inside it so that the bearing is in the horizontal plane.
Rotate around the axis to adjust the position.
The orientation of the ingot
Make sure that the mounting axes of the mounting stays are parallel
And either the mounting stay or the ingot should be horizontal
Position in the crystal and adjust the crystal orientation of the ingot by X-ray diffraction.
Measurement based on the crystal orientation data.
Adjusting the position of the got and the relative position of the ingot and the mounting stay
Adjust the position and glue the ingot and the mounting stay
In the method of bonding the ingot to the mounting stay, the column-shaped ingot is rotated with its central axis horizontal and around the axis at a predetermined position, and the end face of the ingot is irradiated with X-rays in a horizontal plane and is reflected by X. When the output data of the line is maximum and the crystal orientation of the ingot is displaced in the horizontal plane,
The rotation of the ingot is stopped, and then the tilt angle of the crystal orientation in the horizontal plane with respect to the central axis of the ingot is calculated from the output data of the reflected X-rays at a plurality of measurement points, and the mounting axis of the mounting stay is determined as the crystal orientation from the tilt angle. The mounting stay or the ingot is adjusted in a horizontal plane so as to be parallel, and the mounting stay is bonded to the ingot.

According to the second aspect of the present invention, the columnar shape is
While keeping the center axis of the ingot horizontal,
The ingot so that the crystal orientation of the
Is rotated about its center axis to adjust the position.
With respect to the crystal orientation of the aligned ingot,
The mounting axes of the mounting stays attached to the
So that either the mounting stay or the ingot
Adjust the position in the horizontal plane and change the crystal orientation of the ingot
Measured using diffraction and based on crystal orientation data
Adjusting the position of the ingot and the ingot and the mounting stay
Adjust the relative position of the ingot and connect the ingot to the mounting stay.
In the method of bonding the ingot to be attached and the mounting stay, the column-shaped ingot is rotated at a predetermined position with its central axis horizontal, and X-rays are irradiated on the end surface of the ingot in a horizontal plane. After rotating the ingot until the output data of the reflected X-rays is maximized and the crystal orientation of the ingot is displaced in the horizontal plane, the intermediate stay made of cuttable material is moved to its mounting axis at the center of the ingot. Adhered to the upper part of the ingot according to the axis, supporting the mounting stay on the upper surface of the intermediate stay so as to be displaceable in the horizontal plane,
The tilt angle of the crystal orientation in the horizontal plane with respect to the center axis of the ingot is calculated from the output data of the reflected X-rays at a plurality of measurement points, and the mounting stay is adjusted from the tilt angle so that the mounting axis of the mounting stay is parallel to the crystal orientation. And the mounting stay is bonded to the intermediate stay.

[0010] According to the third aspect of the present invention, the second aspect is provided.
In this method, after the intermediate stay is bonded to the ingot, the ingot and the intermediate stay are transported to a drying chamber to dry the adhesive, and then the mounting stay is bonded to the intermediate stay.

[0011] According to the fourth aspect of the present invention, the first aspect is provided.
In any one of (1) to ( 3) , a means is adopted in which a plurality of ingots or intermediate stays are sequentially bonded to a single mounting stay.

[0012] ingot in the invention of claim 5, wherein, forming the crystal orientation measuring means for measuring the crystal orientation of the ingot by using a diffraction of X-rays, a cylindrical based on the measurement data of the crystal orientation measuring means Crystal orientation adjustment means for adjusting the position by rotating the ingot about its central axis so that the crystal orientation of the ingot is located in a horizontal plane while keeping the central axis of the ingot horizontal, and the crystal orientation of the ingot is
While located in a horizontal plane, the top or bottom of the ingot
Contact the intermediate stay made of cuttable material on the surface via adhesive
And the mounting axis of the intermediate stay is aligned with the center axis of the ingot.
Adhering horizontally to fit the intermediate stay bonding mechanism, based on the measurement data of the crystal orientation measuring unit for ingot adjusted position by the crystal orientation adjusting means, before
Remove the mounting stay that is in contact with the upper or lower surface of the intermediate stay.
Mounting stay position adjusting means for adjusting the position of either the mounting stay or the ingot in a horizontal plane so that the mounting axis of the ingot is parallel to the crystal orientation of the ingot; and the crystal orientation adjusting means and the mounting stay position adjustment. The ingot and the mounting stay adjusted by the means are provided with a mounting stay bonding mechanism for bonding the ingot and the mounting stay to each other via the intermediate stay .

According to the sixth aspect of the present invention, there is provided the fifth aspect.
In the above, the crystal orientation adjusting means may have a cylindrical shape.
Rotation to rotate the gotto while supporting its center axis horizontally
Means having a support mechanism is adopted.

According to the seventh aspect of the present invention, there is provided the sixth aspect.
In the above, the crystal orientation measuring means detects that the crystal orientation of the ingot is located in the horizontal plane by irradiating the end face of the ingot with X-rays in the horizontal plane and the output data of the reflected X-rays is maximized. , The inclination of the crystal orientation in the horizontal plane with respect to the central axis of the ingot is calculated from the output data of the reflected X-rays at a plurality of measurement points.

In the invention according to claim 8 , claim 7 is
In the previous SL crystal orientation measuring means and the X-ray emitter for emitting X-rays in a horizontal plane relative to the end face of the ingot which is supported on the rotary support mechanism, and the light receiver of the reflected X-ray, the X-ray receiving Determining means for determining whether or not the output data of the reflected X-rays received by the detector is maximum, and measuring a plurality of tilt angles of the crystal orientation in the horizontal plane with respect to the central axis of the ingot adjusted by the crystal orientation adjustment means. And angle calculation means for calculating from the output data of the reflected X-rays of the point.

According to the ninth aspect of the present invention, the eighth aspect of the present invention is provided.
In, the crystal orientation adjustment means, the ingot is rotated by the rotation support mechanism to a position where the output data of the reflected X-rays from the crystal orientation measurement means is maximized, and the crystal orientation is positioned in a horizontal plane, The mounting stay position adjusting means, in a state where the crystal orientation of the ingot is located in a horizontal plane, makes the mounting stay contact the upper or lower part of the ingot horizontally, and the crystal orientation of the ingot from the crystal orientation measuring means with respect to the central axis of the ingot. A horizontal angle adjusting mechanism is provided for adjusting the position of the mounting stay in the horizontal plane based on the inclination angle in the horizontal plane.

According to the tenth aspect of the present invention,
In 5 , the intermediate stay bonding mechanism includes an oscillating mechanism that reciprocates the intermediate stay or the ingot in the center axis direction of the ingot with the adhesive interposed between the intermediate stay and the upper surface or the lower surface of the ingot. That means.

In the eleventh aspect of the present invention,
In 6 , the crystal orientation measuring means and the intermediate stay bonding machine
Between the structure is transporting carriage is reciprocally So設with the rotation support mechanism for rotating supporting the ingot.

In the twelfth aspect of the present invention,
In 11 , a plurality of support rollers for carrying in and out of the ingot are provided on the transport trolley, and the rotation support mechanism is provided above the support rollers and holds the ingot carried into the support rollers from both sides. A plurality of clamping rollers that are slightly lifted from the support rollers and positioned at predetermined positions, at least one of which is a driving roller that imparts rotation to the ingot.

[0020] In the invention according to claim 13 , the claim
In 5 , the intermediate stay bonding mechanism is provided below the crystal orientation adjusting means, and the mounting stay position adjusting means is integrally incorporated in the intermediate stay bonding mechanism.

In the fourteenth aspect of the present invention,
13 , the intermediate stay bonding mechanism is mounted on the upper end of the lifting support rod supported vertically by a lifting mechanism at a predetermined position of the machine base, and an adhesive is applied to the upper surface. A clamp mechanism for clamping the intermediate stay, wherein the mounting stay position adjusting means is interposed between the machine base and the lifting support rod, and rotates the lifting support rod about a vertical axis to clamp the clamp. This is a tilt angle adjustment mechanism that rotates a mounting stay, which is gripped by a mechanism and has an adhesive applied on the upper surface, in a horizontal plane.

In the invention according to claim 15 , the claim
13 or 14 , an intermediate stay is stacked and stocked on the machine base, and an intermediate stay storing and feeding mechanism for feeding and feeding the intermediate stays one by one; and an intermediate stay for conveying the fed intermediate stay to an adhesive coating mechanism. A transport mechanism and an intermediate stay loading mechanism for loading the intermediate stay on the transport mechanism into the clamp mechanism are provided. On the other side of the machine base, the intermediate stay storing and feeding mechanism, the adhesive applying mechanism, and the intermediate stay are described. An attachment stay storage / supply mechanism, an adhesive application mechanism, and an attachment stay carry-in mechanism configured similarly to the transport mechanism are provided.

In the sixteenth aspect of the present invention,
In any of 5,13,14, the attachment stay position adjusting means takes the means of a plurality of Ingo' preparative contact <br/> adhesive attachment stay moving mechanism to a single mounting stay.

According to the seventeenth aspect of the present invention,
16 , the mounting stay moving mechanism comprises: a rotating support shaft that is reciprocated about a vertical axis at a predetermined position on the machine base; a rotating support plate horizontally supported on an upper end of the rotating support shaft; It is constituted by a clamp mechanism that is supported by the support plate so as to be able to reciprocate horizontally and that clamps the mounting stay.

[0025] In the invention of claim 18, a method of cutting by transferring the ingot forms a cylindrical to a wire saw, before carrying on the wire saw, pre Lee
The crystal orientation of the ngot is measured using X-ray diffraction,
Based on the measurement data of the crystal orientation, so the crystal orientation of the ingot while keeping parallel to its central axis of the ingot is located within a horizontal plane, and the position adjustment by rotating the ingot around its axis, variable cutting member Intermediate stay consisting of
Align the mounting axis of the ingot with the center axis of the ingot
As adhered to the top or bottom of the ingot, with respect to the crystal orientation of the position adjusting ingot mounting axis of the mounting stay attached to the ingot is parallel,
Either the mounting stay or ingot position adjustment in the horizontal plane, after bonding the <br/> attached stearyl over to the intermediate stay adhered to the ingot, and carries the ingot to a wire saw, the workpiece mounting position of the wire saw In this method, a mounting stay is mounted in a predetermined posture in which the axis of the mounting stay is perpendicular to the running direction of the wire, and cutting is performed by a wire saw.

[0026]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of the present invention will be described.
An embodiment will be described with reference to FIGS.

First, referring to FIG. 7 and FIG. 11, an Si single crystal ingot 11 bonded in this embodiment, an intermediate stay 12 made of a cutable material such as carbon, and an insulating plate 1
3 and the mounting stay 14 will be described.

As shown in FIG. 11, a lower circular arc surface of the intermediate stay 12 is adhered to the upper outer peripheral surface of the ingot 11 shaped like a horizontal column by an adhesive, and a glass insulating plate 13 is formed on the upper surface thereof. Are attached horizontally, and a mounting stay 14 is horizontally attached to the upper surface of the insulating plate 13 with an adhesive. The insulating plate 13 is attached to the mounting stay 1 in advance.
4 is adhered. Also, in FIG.
Of the crystal lattice plane 15, that is, the crystal orientation 16 is inclined with respect to the central axis 17, the horizontal plane 18, and the vertical plane 19 of the ingot 11. The amount of displacement in the horizontal direction from the center axis 17 at both end faces of the ingot 11 in the crystal orientation 16 is indicated by reference numeral 20 and the amount of displacement in the vertical direction is indicated by reference numeral 21. Is at most ± 3 ° with respect to the center axis 17 of the ingot 11. The mounting axis of the mounting stay 14 refers to a virtual axis 23 in the longitudinal direction of the mounting stay 14 in FIG. 7, and the left and right sides of the stay 14 in FIG. 7 are parallel to the virtual axis 23. The bonding method and the bonding apparatus of this embodiment adjust the position of the crystal orientation 16 of the ingot 11 and the mounting axis 23 of the mounting stay 14 in parallel, and appropriately bond the ingot 11 and the mounting stay 14.

Next, ingot 1 using a wire saw
An outline of the entire processing apparatus 1 will be described with reference to FIGS. The automatic warehouse 25 accommodates the unprocessed ingot 11, the ingot 11 to which the intermediate stay 12 or the mounting stay 14 is adhered, and transports the ingot to a belt conveyor type transport device 26 by a loading / unloading device (not shown). . At the end of the transport device 26, the ingot 11
In addition to adjusting the crystal orientation 16 and the mounting axis of the intermediate stay 12 and the mounting stay 14, an ingot and mounting stay bonding device 27 for bonding the intermediate stay 12 and the mounting stay 14 to the ingot 11 in two steps is provided. ing. An orientation measuring device 28 for measuring the crystal orientation 16 of the ingot 11 is provided near the bonding device 27.

In the middle of the transfer device 26, another transfer device 29 is connected. In the middle of the transfer device 29, there is provided a drying chamber 30 for drying and hardening the bonded portion of the ingot 11, the intermediate stay 12, and the insulating plate 13. Have been. The ingot 11 provided with the mounting stay 14 taken out of the transport device 29 is placed on a transport trolley 32 toward the wire saw 31 and supplied to the wire saw 31. The ingot 11 that has been processed by the wire saw 31 is sent to a single-wafer cleaning system 33, where it is separated into a large number of wafers and cleaned.

Next, referring to FIG. 1 to FIG.
Will be described. This bonding device 27 is schematically viewed,
Rotation support mechanism 3 for clamping and rotating ingot 11
8 and a transport carriage 39 for transporting the rotary support mechanism 38 back and forth between the bonding position of the intermediate stay 12 and the azimuth measuring device 28.
And a crystal orientation adjustment mechanism 40 that rotates the ingot 11 during an orientation measurement operation to be described later to adjust its crystal orientation 16 so as to be positioned in a horizontal plane, and also serves as the rotation support mechanism 38. Further, the bonding device 27 positions the intermediate stay 12 on the upper part of the ingot 11 whose position has been adjusted by the crystal orientation adjusting mechanism 40, and the mounting stay 14 on the upper surface of the intermediate stay 12 at an appropriate position. A horizontal angle adjusting mechanism 91 is provided for adjusting the position and adjusting the mounting axis 23 in the horizontal plane of the mounting stay 14 with respect to the crystal orientation 16 of the ingot 11.

Therefore, the rotation support mechanism 38 and the carrier 3
9 will be described. As shown in FIG. 2, a pair of parallel left and right guide rails 41 fixed to the ground are provided with a horizontal movable platen 4.
2 are supported so as to be able to reciprocate in the horizontal direction. In FIG. 2, a pair of left and right bearing plates 43 are fixed upright on the upper surface of the movable platen 42. Between the two bearing plates 43, a plurality of (in this embodiment, seven as shown in FIG. 5) support rollers 44 are provided. It is supported so that it can idle. As shown in FIG. 1, a guide roller 45 is supported at a predetermined position between the rightmost support roller 44 and the end of the transfer device 26, and the ingot 11 is placed on the support roller 44 from the transfer device 26 side. Can be transported.
As shown in FIG. 1, a position restricting member 46 is fixed to the upper surface of the end of the movable plate 42 so as to regulate the position of the left end surface of the ingot 11 in FIGS.
As shown in FIGS. 2 to 5, a pair of support plates 47 are erected and fixed on the upper surface of the movable plate 42, and a pair of upper and lower ingot clamp rollers 48 are supported between the support plates 47 so as to freely rotate. I have. A pair of supports 49 is provided on the upper surface of the movable plate 42.
And a pair of guide bars 50 are supported on the support 49 in parallel and horizontally at a predetermined interval,
A support plate 52 is provided on both guide rods 50 via a plurality of supports 51.
Are supported along the guide rod 50 so as to be able to reciprocate in the horizontal direction. The support plate 52 is provided with a rod 54 of a cylinder 53.
Is reciprocated horizontally. A pair of upper and lower drive rollers 55 that rotatably contact the outer peripheral surface of the ingot 11 to rotate the ingot are supported on both side walls of the support board 52. These clamping roller 48 and driving roller 55
Is set such that the center of the ingot 11 is higher than the center of the ingot 11 when the ingot 11 is conveyed on the support roller 44 when the ingot 11 is gripped. Then, when the pair of upper and lower clamping rollers 48 and the driving roller 55 grip the ingot 11 on the support roller 44, the ingot 11 is slightly lifted upward and separates from the roller 44. As shown in FIGS. 1 and 5, a servo motor 56 is fixed to one side wall of the support plate 52, and a drive pulley 57 of the motor 56 is driven by a driven pulley 58 attached to a shaft end of the drive roller 55. , A belt 59 is mounted, and the drive roller 55 is rotated by a servo motor 56. Reference numeral 60 denotes an idler pulley. A rotary encoder 61 is attached to the servomotor 56, and detects the rotation angle of the ingot 11 in proportion to the rotation speed.

Next, the intermediate stay bonding mechanism 71 will be described. A pair of guide rails 73 is fixed to the upper part of the column 72 in the vertical direction, and a horizontal support arm 74 is supported by the two guide rails 73 so as to be able to move up and down along the rails 73. A bracket 75 is fixed to the distal end of the support arm 74, and guide rails 76 are supported on both ends of the bracket 75 horizontally and substantially parallel to the central axis 17 of the ingot 11, as shown in FIG. A guided member 77 is fitted to the guide rail 76 so as to be able to reciprocate. A holder 78 is attached to the guided member 77.
2 and the intermediate stay 12 is clamped and fixed by a pair of right and left clamp plates 79 in FIG. The clamp plates 79 are opened and closed by a cylinder 80 to clamp and release the clamp of the intermediate stay 12.

At the upper end of the support arm 74, FIG.
As shown in FIG. 2, a motor 82 is fixed downward, and a pin 84 attached to a lower end portion of an eccentric shaft 83 extends in a horizontal direction formed on the upper surface of the holder 78, and a guide rail 76 is provided.
Are engaged with a groove 781 orthogonal to. Accordingly, when the eccentric shaft 83 is rotated by the motor 82, the holder 78 can reciprocate along the guide rail 76 by the pin 84. An oscillating mechanism 89 for ensuring the state of adhesion of the intermediate stay 12 to the ingot 11 by the motor 82, the eccentric shaft 83, the guide rail 76, the holder 78 and the like.
Is configured.

A ball screw 85 is provided inside the column 72.
Are vertically supported, and the screw 85 is rotated forward and reverse by a lifting servomotor 86 fixed to the upper portion of the column 72. An elevating support 87 is supported by the ball screw 85 so as to be able to ascend and descend. Therefore, when the servomotor 86 is rotated and the elevating support 87 is moved up and down, the support arm 74 and the holder 78 holding the intermediate stay 12 are moved up and down along the guide rail 73.

Next, the horizontal angle adjusting mechanism 91 constituting the position adjusting means will be described with reference to FIGS. 2 and 6. A horizontal support plate 92 is provided at an intermediate portion of the column 72 as shown in FIG.
A horizontal angle adjusting plate 93 is supported on the upper surface of the support plate 92 by a connecting shaft 94 so as to be rotatable in a horizontal plane. An angle adjusting servomotor 95 is horizontally supported on the support plate 92, and a screw rod in which a first screw 97 and a second screw 98 are connected in series via a universal joint 96 is connected to an output shaft of the motor 95. Have been. An operating piece 99 is screwed into the first screw 97, and a rotor 100 fixed to the lower end of the operating piece 99 is rotatably engaged with a hole 921 formed in the horizontal support plate 92. An operating piece 101 is screwed into the second screw 98, and a rotor 102 is fixed to a lower end of the operating piece 101, and the rotor 102 is attached to the horizontal angle adjusting plate 9.
3 is fitted in an engagement hole 931 formed in the third hole.

Therefore, the first screw 9 is
When the 7 and the second screw 98 are rotated, the horizontal angle adjusting plate 93 is rotated.
Is horizontally rotated about a shaft 94, and the mounting stay 14
Of the horizontal direction on the intermediate stay 12, that is, the mounting axis 23 can be adjusted in parallel with the crystal orientation 16 of the ingot 11.

The first screw 97 and the second screw 98 are differential screws having different pitches.
Can be finely adjusted in the horizontal plane. In addition,
The mounting stay 12 is a mounting stay carrying-in bonding mechanism 1 shown in FIG.
03 is carried into the horizontal angle adjustment plate 93. The mounting stay carrying-in / adhesion mechanism 103 includes a horizontal guide rail 104.
A movable column 105 that is horizontally moved by a driving mechanism (not shown), a lifting body 107 that is vertically moved by a lifting mechanism (not shown) along a guide rail 106 mounted on the column 105, and a horizontal movement of the lifting body 107 And an electromagnet 108 attached to the lower surface. Then, the mounting stay 12 is sucked and gripped by the electromagnet 108 and transferred to a desired position, that is, the upper surface of the intermediate stay 12.

[0039] Next, the azimuth measuring device 28 by utilizing the diffraction of X-rays to measure the crystal orientation of the ingot will be described. As shown in FIGS. 1 and 5, the ingot 11 supported on the support rollers 44 of the rotation support mechanism 38 moves the horizontal movable plate 42 of the transport carriage 40 along the guide rails 41 so that the The ingot 11 can be carried into the measurement position of. The azimuth measuring device 28 includes an X-ray projector 111 for irradiating an X-ray at a predetermined inclination angle toward an end face of the ingot 11 in a horizontal plane, and an X-ray receiver 112 for receiving the irradiated X-ray. It is established. X-ray emitter 111 and light receiver 112 are bracket 1
13 are connected at a predetermined angle. The bracket 113 is fixed to a rotary table 114, and when the table 114 is rotated or moved up and down by the X-ray irradiation position adjusting device 115, the X-ray irradiation angle and the irradiation position with respect to the end surface of the ingot 11 can be adjusted. The X-ray receiver 112 is connected to a discriminator 116 for judging whether or not the output data of the reflected X-ray is maximum, and an angle calculator 117. The angle calculator 117 can calculate the tilt angle θ of the crystal orientation 16 in the horizontal plane with respect to the central axis 17 of the ingot 11 based on the output data of the reflected X-rays at four points on the end face of the ingot 11. The calculation of the tilt angle θ is the same as that disclosed in, for example, JP-A-3-255948.

As shown in FIG. 14, the bonding device 27 has a control device 118, through which the motors 56, 82, 86, 95, the drive motor 119 of the transfer device 26, and the transfer truck 39 are provided. Of the feed motor 120 and the crystal orientation measuring device 28 are operated. Further, an angle calculation device 117 is connected to the control device 118, and the motors 56, 95
The rotation angles of the ingot 11 and the horizontal angle adjustment plate 93 are read.

Next, referring to FIGS. 12 and 13, the mounting stay 14 for the ingot 11 provided on the wire saw 31 will be described.
The work mounting mechanism 121 for holding the workpiece will be described. As shown in FIG. 12, the support block 122 is fixed to a lifting column of a wire saw (not shown), and a fixed holder 123 is fixed to the block 122 by bolts or the like.
A movable holder 124 is connected to a lower surface of the holder 123 by a connecting shaft 125 shown in FIG. A mechanism 126 for adjusting the horizontal angle of the movable holder 124 is provided between the fixed holder 123 and the movable holder 124.

The mechanism 126 includes an operation knob 129 for rotating a first screw 127 and a second screw 128 provided on the fixed holder 123 side, and the knob 129 is a first screw 1
27 by a universal joint 130. The first screw 127 is provided with an operating piece 131, the second screw 128 is provided with an operating piece 133, and the operating pieces 131 and 133 are provided with rotors 132 and 134, respectively. The rotation of the movable holder 124 in the horizontal direction about the shaft 125 can be adjusted.

A mounting stay 14 to which the ingot 11 is fixed is mounted on the lower surface of the movable holder 124. A support tube 142 is fixed to the support block 122 downward, and an elevating rod 143 passes through the support tube. At the lower end of the rod 143, a mounting stay 1 is provided.
A mounting piece 144 having a mounting groove 144a into which the mounting groove 4 can be inserted.
Are integrally formed. A spacer 145 is interposed between the mounting stay 14 and the movable holder 124. The cylinder 141 is provided in one of the mounting grooves 144a.
The pusher 141b which is advanced and retracted by a is provided, and the mounting stay 14 is positioned in the horizontal direction by being pressed against the inner surface of the other mounting groove 144a as a reference.

FIG. 12 shows the inside of the support block 122.
As shown in the figure, a pair of left and right cam members 146 and 147 are accommodated in the lateral direction, and an air cylinder 149 is fixed downward on the upper part of the mounting cylinder 148 fixed on the upper surface of the block 122. The operating rod 1 is attached to the rod 150 of the cylinder.
The cam follower 152 and the cam pin 153 are connected to the lower end of the operating rod 151.
The pair of cam members 146 and 147 have cam grooves 15.
4, 156 and cam surfaces 155, 157 are formed, the cam followers 152 are in contact with the cam surfaces 155, 157, and the cam pins 153 are engaged with the cam grooves 154, 156.

Accordingly, when the operating rod 151 is lowered by the cylinder 149, the cam follower 152 and the cam pin 153 are moved downward, and the cam follower 152 is pressed against the cam surfaces 155, 157. Therefore, the cam member 1
The lifting rod 143 is lifted by the inclined cam surfaces 158 and 159 of 46 and 147, the mounting stay 14 is sandwiched by the mounting pieces 144, and is vertically positioned and clamped.

On the other hand, when the cam follower 152 and the cam pin 153 are lifted by the cylinder 149, the cam pins 153 and 156 are inclined by the cam pin 153, so that the two cam members 146 and 147 are moved in the approaching direction. Therefore, the lifting rod 143 is moved downward,
The clamp of the mounting stay 14 is released.

Furthermore, by rotating the operation knob 129 in advance, the mounting error in the horizontal direction of the movable holder 124 and the mounting piece 144 can be corrected so as to match the running direction of the wire 34. . That is, the mounting piece 144
Is finely adjusted so that the mounting groove 144a extends in a direction perpendicular to the running direction of the wire 34 of the wire saw. Next, a method of bonding the intermediate stay 12 and the mounting stay 14 to the ingot 11 configured as described above will be described with reference to the flow of FIG.

First, the single ingot 11 taken out of the automatic warehouse 25 is transported by the transport device 26, and a plurality of support rollers 44 on the transport vehicle 39 as shown in FIG.
And is stopped at a predetermined position by the position regulating tool 46. (Step S1) Next, as shown in FIG. 2, the cylinder 53 is actuated, the driving roller 55 is pressed against the outer peripheral surface of the ingot 11, separated from the support roller 44, and the ingot 11 is moved to the four rollers 48, 48, Clamped by 55,55.
When the clamping operation of the ingot 11 is completed, the transport trolley 39, that is, the movable platen 42 is transferred into the azimuth measuring device 28 together with the rotation support mechanism 38 that clamped the ingot 11. When the end face of the ingot 11 is moved to a normal crystal measurement position of the X-ray projector 11 and the light receiver 112 as shown by a chain line in FIGS. 1 and 5, the movable plate 42 is fixed by a braking device (not shown). (Step S2) Next, the azimuth measuring device 28 is started, and the end face of the ingot 11 is irradiated with X-rays in a horizontal plane and reflected, and the reflected X-rays are received by the light receiver 112. While continuing this measurement operation, the servo motor 56 is started to rotate the drive pulley 57, and both the drive rollers 55 are rotated via the belt 59, and the ingot 11 is rotated while being supported by the four rollers 48, 55. .

In this state, the position where the output data of the reflected X-ray becomes maximum is determined by the determiner 116, and it is confirmed that the crystal orientation 16 is located in the horizontal plane. That is, in FIG. 9, the crystal orientation 16 of the ingot 11 is inclined with respect to the horizontal plane 18, but when the ingot 11 is rotated in the direction of the arrow,
As shown in FIG. 10, when the crystal orientation 16 moves to the horizontal plane 18, the output data of the X-ray becomes maximum, and this is detected and the rotation is stopped. (Step S3) Next, in a state where the output data of the X-ray becomes maximum, the detection position of the encoder 61 for detecting the rotation angle of the ingot 11 in proportion to the rotation speed of the servomotor 16 is initialized, and By rotating the ingot 11 by 90 degrees from the initialization position, output data of the reflected X-rays for a total of four times is obtained. Based on the four output data, the angle calculator 117 calculates the inclination θ (see FIG. 8) of the crystal orientation 16 in the horizontal plane 18 with respect to the central axis 17 of the ingot 11 in the horizontal plane 18. (Step S4) When the azimuth measurement is completed, the irradiation of X-rays from the X-ray projector 111 is stopped, and the ingot 11 is transported from the azimuth measurement position to the lower side of the bonding device 71 along the movable rail 42 along the guide rail 41. . In this state, the ingot 11 is located below the intermediate stay 12, as shown in FIG. (Step S5) Next, the motor 86 is started in FIG.
3 is moved downward along the guide rail 73, and as shown in FIG. 3, the intermediate stay 12 is brought into contact with the upper surface of the ingot 11 so that their axes are substantially aligned with each other, and the intermediate stay 12 is interposed between the intermediate stay 12 and the ingot 11 by an adhesive. The stay 12 is bonded. At this time, when the motor 82 of the oscillation mechanism 89 is activated and the eccentric shaft 83 is rotated, the holder 77 is reciprocated in the direction parallel to the central axis 17 of the ingot 11 along the guide rail 76 and is contained in the adhesive. Air bubbles are eliminated, and the intermediate stay 12 is quickly and reliably bonded. (Step S6) When the bonding of the intermediate stay 12 is completed, the cylinder 80
After the clamping of the intermediate stay 12 by the clamp plate 79 is released, the motor 86 is driven in reverse to raise the support arm 74 as shown in FIG.
To the upper standby position and stopped.

Incidentally, the inclination angle θ of the crystal orientation 16 with respect to the center axis 17 in the horizontal plane of the ingot 11 is calculated. The servo motor 95 of the horizontal angle adjusting mechanism 91 is rotated based on the tilt angle θ, and as shown in the plane of FIG.
Is finely adjusted so that the inclination angle α with respect to is the same as the inclination angle θ.

Next, the mounting plate 14 with the insulating plate 13 previously adhered to the lower surface and the adhesive applied to the lower surface of the insulating plate 13 is lightly gripped by the carry-in device 103 and moved to the upper surface position of the intermediate stay 12 of the ingot 11. And the side of the mounting stay 14 is placed on the horizontal angle adjusting plate 9.
3 is pressed against the end face to adjust the angle. For this reason,
The crystal orientation 16 of the ingot 11 and the mounting axis 23 in the horizontal plane of the mounting stay 14 are parallel. (Step S
7) In this state, the loading device 103 unclamps the mounting stay 14, places the mounting stay 14 on the upper surface of the intermediate stay 12, and adheres the plate 13 to the intermediate stay 12. (Step S8) Also, in FIG. 4, after the cylinder 53 is operated to release the clamping of the ingot 11 by the driving roller 55, the ingot 11 is attached to the supporting roller 4 together with the mounting stay 14.
4 is rolled, moved onto the transport device 26, and carried out. (Step S9) Further, it is guided to the drying chamber 30 through the transfer device 29, and the bonded portion is dried. Then, the transport device 2
9. It is sent to the wire saw 31 via the transport cart 32.

In this completed bonding state, as shown in FIG. 11, the crystal orientation 16 of the ingot 11 and the mounting stay 14
Is perpendicular to the plane of the drawing and in the horizontal plane 18, and the central axis 17 of the ingot 11 is inclined by θ with respect to the crystal orientation 16 in the horizontal plane. The ingot 11 is transferred from the carrier 32 to the work mounting mechanism 121 of the wire saw 31 by a transfer device (not shown). At this time, the mounting stay 14 of the ingot 11 is
As shown in FIG. 2, it is inserted into the mounting piece 144 of the work mounting mechanism 121 and is positioned simultaneously with the clamp. Then, the ingot 11 is cut into many thin wafers by the wires 34 of the wire saw. Mounting stay 1
4 is attached only to the mounting piece 144 of the work mounting mechanism 121, and the axis 23 of the mounting stay 14, ie, the ingot 1
Since one crystal orientation 16 is positioned in a direction orthogonal to the traveling (horizontal) direction of the wire 34 of the wire saw 31, the cut surface of the processed wafer is parallel to the crystal lattice plane.

For this reason, as shown in the flow of FIG. 16, after the ingot 11 is attached to the wire saw 31, machining can be started immediately without gonio adjustment. The operation and effect of the method of bonding the ingot 11 and the mounting stay 14 configured as described above will be described below. (1) In the first embodiment, since the two members are bonded and fixed so that the mounting axis 23 of the mounting stay 14 is parallel to the crystal orientation 16 of the ingot 11, the mounting stay 14 is shown in FIG. Only by attaching the wire saw 31 to the work mounting mechanism 121, the ingot 11 can be cut immediately and accurately. Therefore, it is not necessary to equip the wire saw 31 with the gonio angle setting device, and the cost of equipment can be greatly reduced. (2) In the first embodiment, while keeping the center axis 17 of the ingot 11 horizontal, the crystal orientation 16 of the ingot 11 is temporarily moved in a horizontal plane, and the mounting stay is set so as to be parallel to the crystal orientation 16. Since the mounting axis 23 of 14 is moved and adjusted in a horizontal plane and adhered to each other, the ingot 11 and the mounting stay 14 are both carried out in a horizontal state, and can be gripped by the work mounting mechanism 121 of the wire saw 31 in the same posture. Installation work can be performed quickly. (3) In the first embodiment, the rotation support mechanism 38 of the ingot 11 is also used as a part of the azimuth measuring device 28 and is also used as the azimuth adjustment mechanism 40 for displacing the crystal orientation 16 of the ingot in a horizontal plane. The structure of the bonding system can be simplified. (4) In the first embodiment, the ingot 11 is positioned at a predetermined position by the clamping roller 48 and the driving roller 55 and is separated from the support roller 44 at the same time, so that azimuth measurement and rotation adjustment can be performed accurately and smoothly. Next, a second embodiment of the present invention will be described with reference to FIGS.

As shown in the plane of FIG.
8. A belt conveyor type ingot carrying device 161 and an ingot carrying device 162
The pallet 163 on which the ingot 11 is supported is placed on the belt conveyor of the ingot carrying device 161 as shown in FIG. As shown in FIG.
As shown in (b), the intermediate stay 12 and the mounting stay 14
The ingot 11 to which is adhered is carried out while being supported by the pallet 164.

As shown in FIG. 19, the rotation support mechanism 38, the ingot carrying device 161 and the ingot carrying device 162
A first ingot carrying-in / out mechanism 165 is provided above the. The first ingot loading / unloading mechanism 165 includes a gate-shaped frame 166, a horizontal moving mechanism 167 mounted on the frame 166, a cylinder type lifting mechanism 168 mounted on the horizontal moving mechanism 167, and the lifting mechanism 168. 16
8 is provided with a gripping mechanism 169 attached to the control unit 8. The pallet 16 of the ingot carrying device 161
After grasping the ingot 11 on 3 and lifting it upward,
The ingot 11 moves in the horizontal direction and can be supplied to a delivery position P1 (see FIG. 22) of a second ingot carrying-in / out mechanism 181 described later. Further, the ingot 11 is moved onto the second ingot carrying-in / out mechanism 181 and is gripped and lifted upward with the intermediate stay 12 and the mounting stay 14 bonded thereto, and then is moved in the horizontal direction to move the ingot carrying-out device 162. The ingot 11 is carried out onto the pallet 164.

An intermediate stay storage and supply mechanism 171 and a mounting stay storage and supply mechanism 172 are provided between the rotation support mechanism 38 and the ingot carrying device 161 and the ingot carrying device 162. Both storage and supply mechanism 171, 1
Reference numeral 72 has a function of feeding out the stays 12 and 14 one by one and supplying them to the intermediate stay transport mechanism 173 and the mounting stay transport mechanism 174. An adhesive applying mechanism 175 for applying an adhesive to the upper surface of the intermediate stay 12 transported by the intermediate stay transporting mechanism 173 is provided beside the storage and supply mechanisms 171 and 172 of the intermediate stay 12 and the mounting stay 14.
Is provided. Similarly, the mounting stay storage supply mechanism 1
An adhesive application mechanism 176 for applying an adhesive to the upper surface of the mounting stay 14 conveyed by the mounting stay conveying mechanism 174 is provided on the side of 72. As shown in FIGS. 18 and 19, the intermediate stay to which the adhesive has been applied corresponds to the intermediate stay transport mechanism 173.
Alternatively, an intermediate stay carry-in mechanism 177 for carrying in the clamp mechanism 221 that holds the mounting stay 14 is provided. Similarly, a mounting stay loading mechanism 178 is provided corresponding to the mounting stay transporting mechanism 174 to transport the mounting stay coated with the adhesive to the clamp mechanism 221.

Next, the rotation support mechanism 38 of the second embodiment,
The configurations of the transport carriage 39 and the crystal orientation adjusting mechanism 40 will be sequentially described. As shown in FIG. 22, on the upper surface of the machine base 37, the ingot 11 before the stay is bonded is transferred from the transfer position P1 to the bonding position P2 where the stay is bonded, and the ingot after bonding is transferred from the bonding position P2 to the transfer position P1. A second ingot transport mechanism 181 is provided. The second
The ingot transport mechanism 181 includes a column 182 erected on the machine base 37, a pair of horizontal support arms 183 horizontally supported on the column 182 so as to be tiltable about a shaft 404 as a fulcrum,
A cylinder 400 is provided between the arm 183 and the machine base 37. The second ingot transport mechanism 181 includes a pair of drive pulleys 184 and driven pulleys 185 supported at each of the front and rear ends of a support arm 183, and a pair of drive belts 186 wound around the pulleys 184 and 185. , A plurality of rollers 401 driven by a drive belt 186. Then, the ingot 11 carried into the transfer position P1 by the gripping mechanism 169 of the first ingot carrying-in / out mechanism 165.
By rotating the drive belt 186 by the drive motor 187, the roller 401 is driven to move to the bonding position P2.

Next, the second ingot transport mechanism 181
The rotation support mechanism 38 which grips and rotates the ingot 11 carried into the bonding position P2 by the above, and the transport carriage 39 which mounts this mechanism and moves the ingot 11 from the bonding position P2 to the azimuth measuring position P3 and in the opposite direction. explain.

As shown in FIGS. 21 and 22, support plates 191 are fixed on both sides of the upper surface of the horizontal movable plate 42 provided on the machine base 37, and a pair of support members are provided on the upper left and right sides of the support plate 191. The shafts 192 are supported horizontally and parallel to each other, and drive rollers 193 are fitted and fixed to the both support shafts 192, respectively. The transport height 402 of the ingot 11 formed by the pair of drive rollers 193 is lower than the transport height 403 of the ingot 11 supported by the rollers 401 mounted on the pair of horizontal support arms 183. A pulley 194 is provided at the base end of each of the support shafts 192.
And an idler pulley 194 is supported on the left side surface of the support plate 191, and a belt 195 is wound around each pulley 194. One of the six pulleys 194 is rotated by a motor 196,
The drive roller 193 is positively and reversely rotated to rotate the ingot 11.

As shown in FIG. 21, the horizontal movable plate 42
A support plate 197 is erected on the upper surface of the device, and a bracket 198 is attached to the plate.
99 is supported so as to be rotatable up and down around a shaft 200. A pressing roller 201 is provided at the tip of the lever 199.
Are supported, and the lever 199 is vertically reciprocated by the cylinder 202. Therefore, the ingot 11 is moved by the drive belt 186 to the second ingot carrying-in / out mechanism 18.
1 is moved from the transfer position P1 to the bonding position P2 and is moved onto the drive roller 193. In this state, the piston of the cylinder 400 supporting the horizontal support arm 183 is lowered, and the horizontal support arm 183 rotates downward about the shaft 404. As a result, the ingot 11 is placed on the pair of drive rollers 193, and the cylinder 202 is actuated to press the holding roller 201 against the upper outer peripheral surface of the ingot 11, whereby the ingot 11 is moved to the three rollers 193, 193. , 201. At the same time, the brackets 410 and 411 fixed to the support plate 191
The cylinders 412 and 413 attached to the inset 11 are operated, and the clampers 414 and 415 clamp the ingot 11 from both sides so as to receive the upward pressing force during the work of bonding the stay.

As shown in FIG. 22, bearings 203 and 204 are supported on the upper surface of the machine base 37 at a predetermined interval, and a ball screw 205 is horizontally supported by the bearings 203 and 204. The ball screw 205 includes the horizontal movable platen 42.
Ball screw nut 2 on the bracket attached to the lower surface of the
06 is fitted and fixed. A drive motor 207 is provided near the bearing 203 so that the ball screw 205 can rotate. Accordingly, the rotation of the motor 207 causes the ball screw 205 to rotate, and the rotation support mechanism 38 on the horizontal movable platen 42 reciprocates between the bonding position P2 and the azimuth measurement position P3 via the nut 206. For this reason, the ingot 11 supported by the rotation support mechanism 38 is connected to the azimuth measuring device 28.
And heading can be measured.

Next, a description will be given, with reference to FIGS.

A fixed shaft cylinder 211 is vertically fixed to the machine base 37, and a bearing 2 is mounted inside the cylinder 211.
The rotary cylinder 213 is rotatably supported at a predetermined position via the rotary cylinder 12. On the inner peripheral surface of the rotary cylinder 213,
A pair of spline cylinders 214 are fitted, and both cylinders 213 and 214 are fixed by bolts 215. An elevating support shaft 216 is vertically reciprocally movable in the spline cylinder 214 and is spline-fitted to the spline cylinder 214. An elevating lever 217 has a shaft 2 inside the machine base 37.
18 is supported so as to be able to swing around a fulcrum,
When the elevating lever 217 is reciprocated up and down by 19, the elevating support shaft 216 moves up and down.

Next, a clamp mechanism 221 for alternately clamping the intermediate stay 12 or the mounting stay 14 provided at the upper end of the lifting support shaft 216 will be described with reference to FIG. The clamp mechanism 221 includes a clamp table 222 fixed to the upper end of the lifting support shaft 216, and a clamp table 222.
, A movable clamp claw 224 attached to the clamp table 22,
2 and a cylinder 225 that reciprocates the movable clamp claw 224 in the horizontal direction.

Next, the lifting support shaft 216 and the clamp mechanism 2
The structure of a horizontal angle adjusting mechanism 91 that rotates the mounting member 14 around the vertical axis to adjust the horizontal angle of the mounting stay 14 held by the mechanism will be described with reference to FIGS.

As shown in FIG. 22, a ring 226 is fitted around the lower end of the rotary cylinder 213, and a rotating lever 227 is attached to the ring. The rotation lever 227 is provided at a predetermined position on the machine base 37.
8 and is adjusted based on the azimuth measurement data so that the mounting axis 23 of the mounting stay 14 is parallel to the central axis 17 located in the horizontal plane of the ingot 11.

Next, based on FIGS. 24 to 26, the intermediate stay 12 and the mounting stay 14 are alternately supplied to the upper surface of the clamp table 222 of the clamp mechanism 221 respectively. 17
2, transport mechanisms 173, 174, adhesive application mechanism 175,
176 and the stay carrying mechanisms 177 and 178 will be sequentially described.

As shown in FIG. 24, a large number of intermediate stays 12 are accommodated in a frame 231 provided on the machine base 37 in a vertically stacked manner. On both front and rear sides of the frame 231, a locking lever 233 is attached via a bracket 232 to a shaft 2.
It is supported by a cylinder 235 so as to be able to rotate up and down around 34.

The intermediate stay transport mechanism 173 includes a support frame 241 provided on the machine base 37, a roller conveyor 242 provided on the support frame, a drive belt 243 for rotating each roller, and a drive motor 405. The intermediate stays fed one by one from the intermediate stay storage and supply mechanism 171 by the operation of the locking lever 233 are moved onto the roller conveyor 242 and can be moved to the adhesive application mechanism 175 side.

Next, the adhesive applying mechanism 175 will be described. Guide rails 252 are supported on the upper surface of a frame 251 provided on the machine base 37 in parallel in the front-rear direction. 253 is supported and reciprocated in the front-rear direction by the motor 254. The moving body 253 supports an elevating body 255 so as to be able to move up and down along a pair of guide rails 256 so as to be able to move up and down by a cylinder 257. A dispenser nozzle 258 is attached downward to the side surface of the elevating body 255, and a predetermined amount of adhesive is supplied to the dispenser nozzle from an adhesive supply mechanism 259 installed on the frame 251 side via a flexible pipe 260. It has become.

Next, the structure of the intermediate stay loading mechanism 177 will be described with reference to FIGS. The adhesive is applied to the intermediate stay 12 moved to the adhesive applying mechanism 175 by the adhesive applying mechanism 175. An intermediate stay carrying mechanism 177 for carrying this into the clamp mechanism 221 side.
21 is disposed between the roller conveyors 242 as shown in FIG. 21, and a pair of upper and lower clamp claws 261 capable of sandwiching the intermediate stay 12 from above and below, and reciprocates vertically while supporting the clamp claws 261. The vertical cylinder 26 which reciprocates the lifting cylinder 262 and the clamp claw 261 in the horizontal direction.
3.

The intermediate stay storage / supply mechanism 171, the intermediate stay transport mechanism 173, the adhesive applying mechanism 175, and the intermediate stay loading mechanism 177 configured as described above include the mounting stay storing / supplying mechanism 172 and the mounting stay transport mechanism 17.
4. Adhesive application mechanism 176 and mounting stay loading mechanism 17
8, since they are configured in exactly the same way, the same reference numerals are given and their explanation is omitted.

Next, the operation of the above-configured apparatus will be described with reference to the flowchart of FIG. 18, 19, and 22, the ingot carrying device 1 is used.
When the ingot 11 is moved to a predetermined position in a state where the ingot 11 is supported by the pallet 163, a stop mechanism (not shown) is operated to stop the carry-in device 161.

The first ingot carrying-in / out mechanism 165 is operated in synchronization with the above-mentioned stopping operation, the gripping mechanism 169 is moved as shown by the arrow on the left side in FIG. 19, and the ingot 11 on the pallet 163 is moved to the second Delivery position P1 of conveyor roller 401 of ingot carrying-in / out mechanism 181
It is carried into. (Step S11 in FIG. 27) When the loading of the ingot 11 is completed, the drive motor 1
87 is operated to move the ingot 11 from the transfer position P1 to the bonding position P2 by the conveyor roller 401. Thereafter, the piston rod of the cylinder 400 is lowered, and the horizontal arm 183 is tilted downward about the shaft 404, so that the ingot 11 is transferred onto the drive roller 193 of the rotation support mechanism 38. Then, the cylinder 202
Is operated to press the pressing roller 201 against the upper surface of the ingot 11. At the same time, the cylinders 412 and 413 operate and the clampers 414 and 415 clamp the ingot 11 from both sides. Thus, ingot 11
Is transferred to the transport trolley 39. (Step S12) In this state, the drive motor 207 is operated, and
Is moved along the guide rail 41 from the bonding position P2 to the azimuth measuring position P3. (Step S13) The crystal orientation of the ingot 11 is measured at the orientation measurement position P3 in the same manner as in the first embodiment described above, and the ingot is rotated such that the central axis 17 of the ingot is located in a horizontal plane. (Step S <b> 14) Thereafter, the carriage 39 is returned from the azimuth measurement position P <b> 3 to the bonding position P <b> 2 along the guide rail 41. (Step S15) On the other hand, the intermediate stay 12 of the intermediate stay storage and supply mechanism 171
Is the roller conveyor 2 by the intermediate stay transport mechanism 173.
Each of the stays is fed out one by one and supplied to the adhesive application mechanism 175 to apply the adhesive to the upper surface of the stay. (Steps S19 and S20) The intermediate stay 12 is clamped by the clamp claws 261 of the intermediate stay loading mechanism 177, and is loaded into the clamp table 222 of the clamp mechanism 221 at the standby position as shown by a chain line in FIG. afterwards,
The movable clamp pawl 224 is operated by the cylinder 225, and the intermediate stay 12 is clamped and fixed between the clamp pawls 223 and 224. (Step S21) Next, the lifting / lowering cylinder 219 is operated, and the lifting / lowering support shaft 21 is moved.
The upper surface of the intermediate stay 12 gripped by the clamp mechanism 221 is pressed and bonded to the lower outer peripheral surface of the ingot 11. (Step S16) At this time, since the drive motor 207 is rotated forward and backward, the transport carriage 39 is reciprocated by a predetermined stroke in the front-rear direction, and the intermediate stay 12 is rotated.
And the ingot 11 are securely bonded by the oscillation function.

When the bonding of the intermediate stay 12 is completed, the holding of the intermediate stay 12 by the clamp mechanism 221 is released, and the lifting support shaft 21 is lifted by the lifting cylinder 219.
6 and the clamp mechanism 221 are lowered.

Next, in step S22, the mounting stay 14 fed from the mounting stay storage and supply mechanism 172 is coated with an adhesive on the upper surface by the adhesive coating mechanism 176 in step S23. Mounting stay 14 coated with this adhesive
Is carried into the clamp mechanism 221 by the mounting stay carrying mechanism 178 in step S24, and the mounting stay 14 is pressed and bonded to the lower surface of the intermediate stay 12 by the same operation as the bonding operation of the intermediate stay 12 in step S25. At this time, the inclination (corresponding to the inclination α) of the mounting axis 23 of the mounting stay 14 in the horizontal plane with respect to the central axis 17 in the horizontal plane of the ingot 11 is measured by the azimuth measuring device 28 (steps S17 and S18). Therefore, based on the measurement data, the lifting mechanism 21
6 and the clamp mechanism 221 are rotated within a horizontal plane by a predetermined angle, and the mounting axis 23 of the mounting stay 14 is adjusted to be parallel to the central axis 17 of the ingot 11.

The intermediate stay 12 and the mounting stay 14
The ingot 11 to which is adhered is moved from the bonding position P2 to the transfer position P1 in step S26, and then is unloaded from the transfer position P1 to the ingot unloading device 162 by the first ingot transfer mechanism 165 in step S27.

Next, the operation and effect based on the configuration of the second embodiment will be described. (1) In the second embodiment, the intermediate stay bonding mechanism and the mounting stay bonding mechanism are configured so that the bonding work of the intermediate stay 12 and the bonding work of the mounting stay 14 are performed in the same station, so that the structure is simplified. And work efficiency can be improved. (2) In the second embodiment, the storage and supply mechanisms 171 and 172 for the intermediate stay and the mounting stay, the transport mechanisms 173 and 174 for the intermediate stay and the mounting stay, and the adhesive application mechanism 175 and
176 and the intermediate stay and the mounting stay
Since the carry-in mechanisms 177 and 178 for carrying in to 21 are provided,
The work of applying the adhesive to the intermediate stay and the mounting stay and the work of carrying the adhesive into the clamp mechanism 221 can be automated to improve work efficiency. (3) In the second embodiment, the ingot carrying device 161,
Since the ingot carrying device 162 is provided and the ingot is carried in / out to the transfer position P1 of the second ingot carrying-in / out mechanism 181 by the first ingot carrying-in / out mechanism 165, the ingot carrying-in / out work is automatically and promptly performed. Can be. (4) In the second embodiment, the machine base 37 is provided with the elevating support shaft 216 whose angle is adjusted by the rotation mechanism 228, and the clamp mechanism 221 for holding the intermediate stay or the mounting stay is provided above the support shaft 216. Therefore, the configuration of the bonding mechanism can be simplified.

Next, a third embodiment of the present invention will be described with reference to FIGS. In the third embodiment, the bonding mechanism K1 of the intermediate stay 12 in the second embodiment described above is used.
A mounting stay moving mechanism 270 for mounting a plurality of ingots 11 to one mounting stay 14 is provided on the side of the bonding mechanism K2 of the mounting stay 14 while the bonding mechanism K2 of the mounting stay 14 and the mounting stay 14 are separated from each other.

Referring to FIG. 29, this mounting stay moving mechanism 27
The rotation support plate 272 is horizontally supported by the upper end of a rotation support shaft 271 which is supported by the fixed shaft cylinder 211 and is rotated by a rotation mechanism 228 at a predetermined position. A pair of guide members 273 is fixed to the rotation support plate 272, and a guide rail 274 fixed to the lower surface of the clamp base 222 of the clamp mechanism 221 is guided by the guide members 273 and can reciprocate in the longitudinal direction. A rack 275 is fixed to the lower surface side of the clamp table 222 in the longitudinal direction. This rack 27
5 is engaged with a pinion 276 fixed to a shaft of a motor 277 built in a brake 406 provided on a bracket 276 of the rotation support plate 272.

Next, the mounting stay moving mechanism 270 described above is used.
31 (a) to FIG. 31 (a) to FIG.
Description will be made mainly on (c). FIG. 31A shows a state in which the first mounting stay 14 gripped by the clamp mechanism 221 is closer to the left end.
The second ingot 11 is gripped by a rotation transport support mechanism (not shown) (a mechanism similar to the rotation support mechanism 38), and the intermediate stay 12 adhered to the lower surface of the ingot 11.
2 shows a state in which the lower surface of is mounted on the upper surface of the mounting stay 14.
In this state, the rotation support shaft 271 is rotated by the rotation mechanism 228 based on the measurement data of the azimuth measuring device 28 as shown in FIG. After the adjustment, the mounting stay 14 and the intermediate stay 12 bonded to the lower surface of the ingot 11 are bonded.

When the bonding of the first ingot 11 is completed, the brake 406 of the motor 277 is released, and the pinion 278 is rotated by the motor 277 to move the rack 275 linearly, as shown in FIG. The substantially central portion of the mounting stay 14 is moved above the rotation support shaft 171 to turn on the brake 406 of the motor 277. Then, the lower surface of the intermediate stay 12 adhered to the lower surface of the second ingot 11 is positioned on the upper surface of the mounting stay 14. In this state, similarly to the bonding operation of the first ingot 11, the rotation support shaft 271 is moved by the rotation mechanism 228 based on the measurement data of the azimuth measuring device 28 while holding the second ingot 11 at a predetermined position. After rotating and adjusting the azimuth as shown in FIG. 31 (b), the intermediate stay 12 is bonded to the mounting stay 14. Further, the bonding operation of the third ingot 11 is performed similarly to the bonding operation of the second ingot 11, as shown in FIG.

In the third embodiment described above, since the mounting stay moving mechanism 270 is provided between the rotation support shaft 271 and the clamp mechanism 221, a plurality of short ingots are provided for one mounting stay 14. 11 can be easily bonded while adjusting the orientation.

Next, a fourth embodiment of the present invention will be described with reference to FIG. In the fourth embodiment, the intermediate stay 1
A drying mechanism 281 is provided between the second bonding mechanism K1 and the bonding mechanism K2 of the mounting stay 14. A device 182 for storing an unnecessary pallet 163 is provided near the ingot carrying device 161. A pallet 164 for supporting the ingot 11 to which the intermediate stay 12 is adhered is provided between the bonding mechanism K1 and the carrying device 161. Pallet supply device 184 for supplying the pallet to the upper surface of the conveyor 280 is provided.
Note that members having the same functions as those of the above-described second embodiment are denoted by the same reference numerals, and description thereof is omitted.

In the fourth embodiment, since the intermediate stay 12 is bonded and then supplied to the drying mechanism 281, the intermediate stay 12 is securely and quickly bonded to the ingot 11, and then is attached to the intermediate stay 12. 14 can be reliably and easily performed.

The present invention can be embodied as follows. (1) In each of the above embodiments, the control device 118 is provided with a function capable of controlling the pressing pressure, the oscillating speed, the number of oscillations, and the oscillating time when the intermediate stay 12 and the mounting stay 14 are bonded to the ingot 11. Then, the bonding data is set by the operation panel or appropriate data is selected from the data stored in advance. (2) The insulating plate 13 is omitted. (3) The insulating plate 13 and the intermediate stay 12 are omitted. (4) The crystal orientation is measured and the orientation is adjusted in ingot 11
Is stopped, the orientation measuring device 28 is rotated to measure the angle of the crystal orientation 16 of the ingot 11, and based on the measurement result, the ingot 11 is positioned so that the crystal orientation 16 is located in the horizontal plane. Adjust rotation. (5) The means for adjusting the position so that the axis 23 of the mounting stay 14 is parallel to the crystal orientation 16 of the ingot 11 is such that the mounting stay 14 is kept stationary in a predetermined state, and the ingot 11 is rotated in a horizontal plane. By doing so, the relative position is adjusted. (6) The intermediate stay 12 is preliminarily adjusted and oriented to the mounting stay 14 and adhered thereto, and is adhered in one step by the actual bonding apparatus in an integrated state.

The technical ideas other than the claims that can be grasped from the above embodiment will be described below together with their effects.
A wire saw provided with a work mounting mechanism 121 for holding the mounting stay 14 in a predetermined direction in a state where the mounting stay 14 is bonded to the ingot 11 with the crystal orientation 16 and the mounting axis 23 parallel to each other.

This wire saw can simplify the structure, automate the work of mounting the mounting stay 14, and improve the operation rate.

[0089]

As described above, claims 1 and 2,
The inventions described in 5, 18 eliminate the need to attach a gonio angle setting device to the processing machine, reduce the equipment cost of the entire ingot cutting machine, and automate the work of attaching the ingot to the processing machine. Thus, the operating rate of the processing machine can be improved.

According to the first, second, seventh and eighth aspects of the present invention, the two members are bonded and fixed so that the mounting axis of the mounting stay is parallel to the crystal orientation of the ingot. Can be easily mounted at the work mounting position.

According to the third aspect of the present invention, the work of bonding the intermediate stay and the mounting stay can be performed quickly. In the invention according to claim 4, 16 or 17 , a plurality of ingots can be bonded to a single mounting stay.

According to the thirteenth or fourteenth aspect , the mounting stay can be easily bonded through the intermediate stay. Since the bonding of the intermediate stay and the bonding of the mounting stay can be performed by the same bonding device, the space can be reduced and the equipment cost can be reduced.

According to the ninth aspect of the present invention, the configuration of the bonding apparatus can be simplified, and the equipment cost can be reduced. In the tenth aspect , the intermediate stay can be securely bonded to the ingot by the oscillating mechanism.

According to the eleventh aspect of the present invention, the ingot can be quickly moved between the crystal orientation measuring means and the intermediate stay bonding mechanism by the carrier cart. Claim
In the invention described in Item 12 , since the ingot is positioned at a predetermined position by the plurality of clamping rollers and is separated from the driving roller at the same time, the azimuth measurement and the rotation adjustment can be performed accurately and smoothly.

According to the fifteenth aspect , the work of supplying the intermediate stay and the mounting stay can be automatically performed.

[Brief description of the drawings]

FIG. 1 is a front cross-sectional view showing a bonding apparatus and an orientation measuring apparatus embodying a bonding method of the present invention.

FIG. 2 is a side sectional view of a bonding device and an orientation measuring device.

FIG. 3 is a side sectional view of a bonding device and an orientation measuring device.

FIG. 4 is a side sectional view of a bonding device and an orientation measuring device.

FIG. 5 is a plan sectional view of a rotation support mechanism and an azimuth measuring device.

FIG. 6 is a plan view of a horizontal angle adjustment mechanism.

FIG. 7 is a perspective view of an ingot and a mounting stay.

FIG. 8 is a plan view illustrating an azimuth measuring method.

FIG. 9 is a front view illustrating an azimuth measuring method.

FIG. 10 is a front view illustrating an azimuth measuring method.

FIG. 11 is a front view showing a state where the mounting stay is bonded to the ingot.

FIG. 12 is a longitudinal sectional view of a work mounting mechanism.

FIG. 13 is a partial plan view of a work mounting mechanism.

FIG. 14 is a schematic explanatory view showing a control device.

FIG. 15 is a flowchart showing a method of bonding the ingot and the mounting stay.

FIG. 16 is a flowchart showing a method for processing an ingot.

FIG. 17 is a schematic perspective view of the entire processing apparatus.

FIG. 18 is a plan view showing a second embodiment of the present invention.

FIG. 19 is a front view of the second embodiment.

FIGS. 20A and 20B are perspective views of a pallet and an ingot.

FIG. 21 is a sectional view showing an adhesion mechanism.

FIG. 22 is a sectional view showing an adhesion mechanism.

FIG. 23 is an enlarged cross-sectional view of a bearing structure of a lifting support shaft and a clamp mechanism.

FIG. 24 is a front view of a stay storage and supply mechanism and an adhesive application mechanism.

FIG. 25 is a plan view of a stay storage and supply mechanism and an adhesive application mechanism.

FIG. 26 is a plan view of a stay carrying mechanism.

FIG. 27 is a flowchart showing a method of bonding an ingot and a mounting stay.

FIG. 28 is a sectional view showing a third embodiment of the present invention.

FIG. 29 is a sectional view showing a bonding mechanism of the mounting stay.

FIG. 30 is a perspective view showing a bonding mechanism of the mounting stay.

FIGS. 31 (a), (b), and (c) are plan views illustrating a method of bonding a mounting stay.

FIG. 32 is a schematic plan view showing a fourth embodiment of the present invention.

FIG. 33 is a flowchart of a conventional ingot processing method.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 11 ... Single crystal ingot, 12 ... Intermediate stay, 14 ... Mounting stay, 15 ... Lattice plane, 16 ... Crystal orientation, 17 ... Central axis of ingot, 27 ... Bonding device, 28 ... Crystal orientation measuring (means) device, 38 ... Rotation support mechanism, 39: transport trolley, 40: crystal orientation adjustment (means) mechanism, 42: horizontally movable plate, 44: support roller, 48: clamp roller, 55
.., A driving roller, 56, a rotation servomotor, 71, an intermediate stay bonding mechanism, 74, a support arm, 86, an elevating servomotor, 89, an oscillating mechanism, 91, a horizontal angle adjustment mechanism constituting a position adjustment means, 93, Horizontal angle adjustment plate,
Reference numeral 95: servo motor for angle adjustment, 103: attachment stay carrying-in / adhesion mechanism, 111: X-ray emitter, 112: X-ray receiver, 116: discriminator, 117: angle calculation device, 118:
A control device that controls each mechanism and device.

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) B28D 7/04 B28D 5/04 H01L 21/304 611

Claims (18)

(57) [Claims] 1. Position adjustment by rotating the ingot about its central axis so that the crystal orientation of the ingot is located in a horizontal plane while keeping the central axis of the cylindrical ingot horizontal. to the crystal orientation of the ingot, as the mounting axis of the mounting stay attached to the ingot are parallel, one of the mounting stay or ingot position adjustment in the horizontal plane, Ingo
The crystal orientation of a crystal is measured using X-ray diffraction,
Position adjustment of the ingot based on the position measurement data
Adjust the relative position between the ingot and the mounting stay, and
Ingot and mounting stay for bonding the mounting and mounting stay
In the method of bonding, place the ingot in a cylindrical shape with its center axis horizontal.
Rotate around the axis at a fixed position, and attach it to the end face of the ingot.
Output data of X-rays reflected by irradiating X-rays in a horizontal plane
Becomes maximum and the crystal orientation of the ingot is displaced in the horizontal plane
When the ingot stops rotating, then the ingot
The inclination of the crystal orientation in the horizontal plane with respect to the central axis of
From the reflected X-ray output data at the measurement point
So that the mounting axis of the mounting stay is parallel to the crystal orientation
Adjust the mounting stay or ingot in the horizontal plane, and
The ingot and the mounting stay that attach the mounting stay to the ingot
Bonding method. 2. The center axis of a cylindrical ingot is defined by water.
The crystal orientation of the ingot is kept in the horizontal plane while keeping it flat
So that the ingot is rotated about its central axis
And adjust the position of this ingot crystal
For the orientation, the mounting steps attached to this ingot
So that the mounting axes are parallel to each other.
Adjust the position of one of the
The crystal orientation of a crystal is measured using X-ray diffraction,
Position adjustment of the ingot based on the position measurement data
Adjust the relative position between the ingot and the mounting stay, and
Ingot and mounting stay for bonding the mounting and mounting stay
In the method of bonding, place the ingot in a cylindrical shape with its center axis horizontal.
Rotate around the axis at a fixed position, and attach it to the end face of the ingot.
Output data of X-rays reflected by irradiating X-rays in a horizontal plane
Becomes maximum and the crystal orientation of the ingot is displaced in the horizontal plane
Rotate the ingot until it is
The central axis of the intermediate stay the its mounting axis ingot Tsu preparative that
Glued to the top or bottom of the ingot according to the line,
Place the mounting stay on the upper or lower surface of the intermediate stay in the horizontal plane.
To support the ingot and connect it to the center axis of the ingot.
The tilt angle of the crystal orientation in the horizontal plane
Calculate from the output data and calculate the mounting axis of the mounting stay from the tilt angle.
Set the mounting stay in the horizontal plane so that the line is parallel to the crystal orientation.
Adjust the position with and attach the mounting stay to the intermediate stay
The method of bonding the ingot and the mounting stay. 3. The ingot according to claim 2, wherein
After bonding the table, put the ingot and intermediate stay in the drying room.
Transport and dry the adhesive, and then attach it to the intermediate stay.
The method of bonding the ingot and the mounting stay that bonds each other. 4. The method according to claim 1, wherein
Multiple ingots or intermediate stays are sequentially attached to the mounting stay
The method of bonding the ingot and the mounting stay to be bonded. 5. The method of claim 1, wherein the crystal orientation of the ingot is determined by X-ray diffraction.
And the crystal orientation measurement means for measuring in use, a cylindrical based on the measurement data of the crystal orientation measuring means
While keeping the center axis of the ingot horizontal,
The ingot so that the crystal orientation of the
Crystal orientation that adjusts its position by rotating around its central axis
Adjusting means, and a state in which the crystal orientation of the ingot is located in a horizontal plane
The upper surface or lower surface of the ingot is made of cuttable material.
The intermediate stays are brought into contact with each other via an adhesive, and the intermediate stays are removed.
Align the attached axis with the center axis of the ingot and glue it horizontally.
An intermediate stay bonding mechanism and an ingot whose position is adjusted by the crystal orientation adjusting means.
Based on the data measured by the crystal orientation measuring means
And the mounting axis of the mounting stay mounted on the ingot
So that it is parallel to the crystal orientation of the ingot.
Or one of the ingots in the horizontal plane
Mounting means for adjusting the crystal orientation , the crystal orientation adjusting means and the mounting stay position adjusting means.
The ingot and the mounting stay
And a mounting stay bonding mechanism for bonding to each other via
Bonding device for ingots and mounting stays. 6. The crystal orientation adjusting device according to claim 5, wherein
The step is to place the cylindrical ingot horizontally with its central axis
A rotating support mechanism for supporting and rotating
Bonding device for ngot and mounting stay. 7. The method according to claim 6, wherein
The stage reflects the X-rays on the end face of the ingot by irradiating in the horizontal plane
X-ray output data is maximized,
When it is detected that the crystal orientation of the
In both cases, the crystal orientation is horizontal to the central axis of the ingot.
The tilt angle in the plane is the output data of the reflected X-rays at multiple measurement points
Bonding device for ingot and mounting stay, which is calculated from
Place. 8. The crystal orientation measuring device according to claim 7,
A step is an end of the ingot supported by the rotation support mechanism.
X-ray projector that irradiates the surface with X-rays in a horizontal plane
And a receiver for reflected X-rays, and a receiver for receiving the X-rays.
Judge whether the output data of the reflected X-ray is maximum
The position is adjusted by the determining means and the crystal orientation adjusting means.
In the horizontal plane of the crystal orientation with respect to the central axis of the ingot
Tilt angle from the reflected X-ray output data at multiple measurement points
Ingot comprising angle calculating means for calculating
And mounting stay bonding device. 9. The crystal orientation adjusting device according to claim 8, wherein
The column shows the output data of the reflected X-rays from the crystal orientation measuring means.
Move the ingot to the maximum position by the rotation support mechanism.
To rotate the crystal orientation to the horizontal plane.
The mounting stay position adjusting means is provided for connecting an ingot.
With the crystal orientation in the horizontal plane,
Contact the mounting stay to the lower part or lower part,
In the horizontal plane of the crystal orientation with respect to the central axis of their ingots
The mounting stay is adjusted in the horizontal plane based on the inclination angle at
Ingot with horizontal angle adjustment mechanism and mounting
Stay bonding device. 10. The intermediate stay contact according to claim 5, wherein
The attachment mechanism is between the intermediate stay and the upper or lower surface of the ingot.
The intermediate stay or ingot with the adhesive interposed
Oscilloscope reciprocates in the center axis direction of the ingot.
Bonding device between the ingot and the mounting stay with a seat mechanism
Place. 11. The method according to claim 6, wherein the crystal orientation is measured.
An ingot is supported between the means and the intermediate stay bonding mechanism.
Conveyance carriage with the rotation support mechanism that rotates lifting the forward
The connection between the ingot and the mounting stay
Wearing device. 12. The apparatus according to claim 11, wherein
Is equipped with multiple support rollers for loading and unloading ingots.
The rotation support mechanism is provided above the support roller.
And the ingot carried on the support rollers
And lift it slightly from the support roller to
It has multiple clamping rollers for positioning, of which
At least one of the drive rollers provides rotation to the ingot.
A bonding device for the ingot and the mounting stay. 13. The method according to claim 5, wherein the crystal orientation is adjusted.
The intermediate stay bonding mechanism is provided below the means,
The mounting stay position adjusting means is provided in the intermediate stay bonding mechanism.
Connection between the ingot and the mounting stay that are integrated
Wearing device. 14. The intermediate stay according to claim 13, wherein
The bonding mechanism is lifted by a lifting mechanism at a predetermined position on the machine base.
A lifting support rod movably supported, and the lifting support rod
Attached to the upper end of the pad, and
Composed of a clamp mechanism that clamps the intermediate stay
The mounting stay position adjusting means is connected to the machine base by a lifting support.
Between the lifting rod and the lifting rod
Pivoting around the line and being gripped by the clamping mechanism, and
The mounting stay with the adhesive applied to the upper surface rotates in the horizontal plane
Between the ingot and the mounting stay
Wearing device. 15. The apparatus according to claim 13, wherein
The intermediate stays are stacked and stocked on the table, and the intermediate stays are stocked.
Stay storage and supply mechanism that feeds out one by one
And the conveyed intermediate stay to the adhesive application mechanism
Intermediate stay transport mechanism, and an intermediate stay on the transport mechanism
An intermediate stay loading mechanism for loading
On the other hand, the intermediate stay storage
Same as supply mechanism, adhesive application mechanism and intermediate stay transport mechanism
Mounting stay storage and supply mechanism, adhesive coating machine
And an ingot provided with a mounting stay loading mechanism.
Glue and mounting stay bonding device. 16. A method according to claim 5, wherein
And the mounting stay position adjusting means is a single mounting stay.
A mounting stay moving mechanism that can attach multiple ingots to
Bonding device for ingot and mounting stay. 17. The mounting stay according to claim 16, wherein:
The movement mechanism moves around the vertical axis at a predetermined position on the machine.
The rotating support shaft that is rotated backward and water is applied to the upper end of the rotating support shaft.
A rotating support plate that is supported flat, and
Is supported so that it can reciprocate and clamps the mounting stay.
And an ingot made up of a clamping mechanism
Adhesive device with attached stay. 18. A wire saw for forming an ingot having a cylindrical shape.
In the method of cutting into the wire saw,
Prior to loading, the crystal orientation of the ingot is set in advance by X-ray rotation.
Measurement based on crystal orientation data
The ingot while keeping its center axis parallel.
The ingot is oriented so that the crystal orientation of the got is in the horizontal plane.
Rotate the unit around its center axis to adjust the position,
Connect the intermediate stay made of cut material with its mounting axis
Top or bottom of the ingot according to the center axis of the ingot
The crystal orientation of the ingot that has been positioned and adhered to the part
For the mounting stay attached to this ingot
Set the mounting stay or ingot so that the mounting axis is parallel.
Adjust the position of one of the
The mounting stay was bonded to the intermediate stay
After that, the ingot is loaded into a wire saw,
Attach the mounting stay at the work mounting position of
Attach it in a predetermined position perpendicular to the direction
Ingot cutting characterized by performing cutting processing by
Processing method.