JPH10322064A - Fixing structure for heat generating electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To fix a heat generating electronic part to a heat radiating section in a state where the part is closely adhered to the heat radiating section without using separate parts. SOLUTION: A heat radiating section 2 having a parts housing chamber 2b is formed in part of a chassis 1 that fixes a printed board 4 mounted with electronic parts 3 which generate heat when the parts 3 are used and the parts 3 are housed in the chamber 2b and fixed by injecting a liquid having high thermal conductivity into the chamber 2b and curing the liquid. Therefore, since the parts 3 can be fixed to the heat radiating section 2 without using any different parts and, at the same time, the heat generated from the parts 3 is transmitted to the heat radiating section 2 and radiated from the section 2 and chassis 1, the occurrence of such a case that the performance of the parts 3 is deteriorated or the service life of the parts 3 is shortened by the heat can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fixing structure for an electronic component that generates heat during use, such as a transistor or a diode.

[0002]

2. Description of the Related Art Conventionally, when mounting an electronic component that generates heat during use, such as a transistor or a diode, it is necessary to efficiently release the generated heat to the atmosphere so that the temperature of the electronic component does not increase. .

For this reason, conventionally, heat is radiated from the electronic components by fixing the heat-generating electronic components to a radiator.
Conventionally, a method shown in FIGS. 6 and 7 has been generally adopted as a structure for fixing to a radiator.

[0006] In the fixing structure shown in FIG. 6, a clip formed of a thin plate having elasticity is provided after the electronic component a that generates heat is attached to the heat radiator b and then the electronic component a and the heat radiator b are brought into close contact with each other to enhance the heat radiation effect. An electronic component a and a heat radiator b are sandwiched by a mold fitting c.

In the fixing structure shown in FIG. 7, the electronic component a attached to the radiator b is brought into close contact with the radiator b.
On the mounting surface side of the electronic component a, a fixing metal c bent and formed in accordance with the surface shape of the electronic component a is fixed with a fixing tool d such as a screw.
Is stuck.

[0006]

However, the above-mentioned conventional fixing structure requires a grip-type fitting c, a mounting fitting d, and a fixing tool d such as a screw, so that the number of parts increases and the cost of parts increases. However, as the number of parts increases, it takes time to assemble, so that there are problems such as poor productivity.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned conventional problems, and is intended to provide a heat-generating electronic component in which an electronic component can be attached to a heat radiator without using a separate component and without lowering the heat radiation effect. It is intended to provide a fixing structure.

[0008]

SUMMARY OF THE INVENTION In order to solve the above-mentioned object, according to the present invention, a heat radiating portion formed in a part of a chassis accommodates electronic components which generate heat during use and injects a liquid having high thermal conductivity. Cured and configured.

As a result, the electronic component can be fixed without using another component, and the number of components and the number of assembling steps can be reduced.

[0010]

According to the first aspect of the present invention, a heat radiating portion having a component accommodating chamber is formed on a part of a chassis for fixing a printed circuit board on which electronic components generating heat during use are mounted,
The electronic component is accommodated in the component housing chamber of the heat radiating section, and a liquid having high thermal conductivity is injected into the component housing chamber, and the liquid is cured to fix the electronic component in the heat radiating section. It is.

With the above structure, the printed circuit board is fixed to the chassis, the liquid is injected into the component receiving chamber of the heat radiating section, and the liquid is hardened to complete the fixing of the electronic component. Can fix electronic components,
It is possible to reduce the number of parts and the man-hour required for assembly.

Further, the heat generated in the electronic component during use is transmitted to the heat radiating portion and is radiated from the heat radiating portion and the chassis, so that the performance of the electronic component is deteriorated by the heat and the life is shortened early. Can be prevented.

According to a second aspect of the present invention, an eaves-shaped heat radiating portion is protruded from a part of a chassis for fixing a printed circuit board on which electronic components generating heat during use are mounted, and the heat radiating portion and the printed circuit board are provided. The electronic component is fixed by sandwiching the electronic component between them.

According to the above configuration, since the electronic components can be fixed between the heat radiating portion and the printed board only by fixing the printed board to the chassis, the number of components and the number of steps required for assembly can be reduced.

In addition, the heat generated in the electronic component during use is transmitted to the heat radiating portion and is radiated from the heat radiating portion and the chassis, so that the performance of the electronic component is degraded by the heat and the life is shortened at an early stage. Can be prevented.

Next, as an electronic component fixing structure of the present invention, an embodiment of an engine controller will be described in detail with reference to the drawings shown in FIGS.

FIG. 1 is an exploded perspective view, FIG. 2 is a sectional view taken along the line AA in FIG. 1, FIG. 3 is a perspective view seen from the printed circuit board side in an assembled state, and FIG. 4 is a line BB in FIG. FIG.

In these figures, reference numeral 1 denotes a box-shaped chassis having upper and lower surfaces opened, which is also made of a metal such as aluminum having a high thermal conductivity because it also functions as a heat radiator. 2 are integrally formed.

The heat radiating section 2 has a rectangular parallelepiped component housing chamber 2b formed by partitioning a part of the inner surface of the chassis 1 by a partition wall 2a.
Is open so that the electronic component 3 can be inserted.

Reference numeral 4 denotes a printed circuit board on which electronic components 3 such as a transistor and a diode which generate heat during use and other electronic components (not shown) are mounted.
Is attached by a fixing tool 5 such as a screw so as to close the opening of the lower surface.

When the printed circuit board 4 is mounted on the lower surface opening of the chassis 1, the electronic components 3 having the legs 3 a soldered to the printed circuit board 4 are accommodated in the heat radiating section 2 formed in a part of the chassis 1. As shown in FIG. 4, the syringe 6 is inserted or press-fitted into the chamber 2b through the lower surface opening.
The liquid is injected using such as.

This liquid has good thermal conductivity and is designed to be cured in a short time. After the liquid is cured, the heat radiating portion 2 and the electronic component 3 are integrated and generated in the electronic component. The heat is efficiently transmitted to the heat radiating section 2,
And the heat is radiated from the chassis 1.

Next, the operation of the above-structured electronic component fixing structure will be described. The other electronic components 3 mounted on the printed circuit board 4 in advance, when the printed circuit board 4 is mounted on the lower surface opening of the chassis 1, Heat radiation part 2 formed in a part of
4 is inserted through the lower surface opening into the component storage chamber 2b as shown in FIG.

At this time, if it is difficult to insert the electronic component 3 in size, press-fit it. After the printed circuit board 4 is fixed to the chassis 1, a liquid is injected into the component storage chamber 2 b of the heat radiating unit 2 using a syringe 6 or the like, and the liquid is cured, so that the electronic component 3 is placed in the component storage chamber 2 b. To fix,
By using a material having high thermal conductivity even after curing, heat generated in the electronic component 3 during use is efficiently transmitted to the heat radiating portion 2 and radiated from the heat radiating portion 2 and the chassis 1. Can be prevented from deteriorating in performance due to high temperature and shortening of service life.

The above is a part of the chassis 1 in which the
This is an embodiment in which the heat dissipating portion 2 having the heat dissipating portion 2 is provided and the electronic component 3 is accommodated in the component accommodating chamber 2 b of the heat dissipating portion 2. The electronic component 3 may be fixed by sandwiching the electronic component 3 between the radiator 7 and the printed board 4.

Next, the embodiment will be described in detail with reference to FIG. The same parts as those in the above-described embodiment are denoted by the same reference numerals, and description thereof will be omitted.

Legs 3a are soldered to the printed circuit board 4 so that one side surface of the electronic component 3 that generates heat during use contacts the upper surface of the printed circuit board 4.

When the printed circuit board 4 is mounted on the chassis 1, the printed circuit board 4
The plate-shaped heat radiating portion 7 is located at a position where the electronic component 3 can be sandwiched between
Are protruded integrally with the chassis 1.

According to the electronic component fixing structure according to the above embodiment, when the printed circuit board 4 is fixed to the lower surface opening of the chassis 1 by the fixing tool 5, the printed circuit board 4 and the heat radiating portion 7
Since the electronic component 3 is sandwiched between the electronic component 3 and the electronic component 3, the electronic component 3 can be fixed in a state in which the electronic component 3 is in close contact with the heat radiating portion 7 without using another component. Since the heat is transmitted from the heat radiating portion 7 to the chassis 1 and dissipated, it is possible to prevent the performance of the electronic component 3 from deteriorating due to the heat and shortening the life of the electronic component 3 early.

[0030]

According to the present invention, as described in detail above, the electronic parts that generate heat during use can be fixed in a state in which the electronic parts are in close contact with the heat radiating part without using separate parts. In addition, the cost can be reduced by reducing the number of components, and the productivity can be improved because the assembly can be performed efficiently in a short time.

Further, since the electronic component can be fixed to the heat radiating portion in close contact with the heat radiating portion, the heat generated during use can be radiated more efficiently than the heat radiating portion, thereby deteriorating the performance of the electronic component. In addition, it is possible to eliminate problems such as the shortage of the service life and the shortened life.

Further, in the case where the eaves-like heat radiating portion is provided on the inner surface of the chassis, since the structure is simple, it can be implemented easily and inexpensively.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a fixing structure of a heat-generating electronic component according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along line AA of FIG.

FIG. 3 is a bottom perspective view showing a fixing structure of a heat-generating electronic component according to the embodiment of the present invention;

FIG. 4 is a sectional view taken along the line BB of FIG. 3;

FIG. 5 is an exploded perspective view showing a fixing structure of a heat-generating electronic component according to another embodiment of the present invention.

FIG. 6 is an explanatory view showing a conventional fixing structure of an electronic component that generates heat.

FIG. 7 is an explanatory view showing a conventional fixing structure for an electronic component that generates heat.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chassis 2 Heat radiating part 2a Partition wall 2b Parts accommodation room 3 Electronic component 3a Leg part 4 Printed circuit board 5 Fixture 6 Syringe 7 Heat generating part

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Senzo Ishiwatari 4-3-1 Tsunashima Higashi, Kohoku-ku, Yokohama-shi, Kanagawa Prefecture Inside Matsushita Communication Industrial Co., Ltd. Matsushita Communication Industry Co., Ltd. (72) Inventor Masahito Ogawa 4-3-1 Tsunashima Higashi, Kohoku-ku, Yokohama-shi

Claims (2)

[Claims] 1. A heat radiating portion having a component accommodating chamber is formed in a part of a chassis for fixing a printed circuit board on which an electronic component generating heat during use is mounted, and the electronic component is accommodated in the component accommodating chamber of the heat radiating portion. A fixing structure for an electronic component that generates heat, wherein the electronic component is fixed in a heat radiating portion by containing the liquid, injecting a liquid having high thermal conductivity into the component storage chamber, and curing the liquid. 2. An eaves-shaped heat radiating portion protrudes from a part of a chassis for fixing a printed circuit board on which electronic components generating heat during use are mounted, and the electronic device is disposed between the heat radiating portion and the printed circuit board. A fixing structure for an electronic component that generates heat, wherein the electronic component is fixed by sandwiching the component.