JP2001237577A - Heat dissipation structure of housing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simply easily form a holding structure and seal part, to facilitate the manufacture, and to obtain necessary and sufficient heat dissipation. SOLUTION: First and second case members 13 and 15 which store a substrate 19 with a mounted electronic component 17 in an internal space S are made of resin material, and a heat dissipation component 41 provided to the 1st case member 13 is mounted in a through hole 31 of the 1st case member 13. One end of the heat dissipation component 41 is provided in the internal space S and the other end of the heat dissipation component 41 is exposed to outside the 1st case member 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiating structure of a housing for housing a substrate on which electronic components are mounted and for radiating heat of the electronic components to the outside.

[0002]

2. Description of the Related Art Conventionally, in a housing constituting a control unit of an automobile or the like, an electronic component such as an IC generates heat, so that a structure of the housing for dissipating heat to the outside of the housing is required.

As shown in FIG. 8, the heat radiating structure of the housing in the prior art 1 has a resin housing 111 in which a space S is formed. The housing 111 has a first case member 113 and a second case member 115.

[0004] A substrate 119 on which an electronic component 117 is mounted is provided on the inner surface of the first case member 113. Second
Of the electronic component 117 and the electronic component 11
7 are fixed to the first case member 113 via a case seal member 121 so as to cover the substrate 119 on which the semiconductor chip 7 is mounted.

[0005] In an internal space S formed by a combination of the first case member 113 and the second case member 115, an electronic component 117 and a substrate 119 on which the electronic component 117 is mounted are accommodated. Heat generated from the electronic component 117 is radiated to the outside via the first and second case members 113 and 115.

A connector 133 is provided on one side of the second case member 115. Connector part 1
33 has a fitting portion 133a formed of the same material as the second case member 115, and a conductive contact 135 connected to a circuit of the substrate 119 and extending to the fitting portion 133a. The mating portion of the mating connector portion (not shown) is fitted into the mating portion 133a.
The conductive contact of the mating connector contacts the contact portion of the contact 135 located at a.

FIG. 9 shows a heat dissipation structure of a housing according to prior art 2. In this case 211, the second case member 215 is formed of a metal plate with respect to the case 111 of the related art 1, and the first and second case members 213 and 2 are formed.
15 is fixed by screws 226. The connector 23 provided with the contact 235
3, the fitting part 233a is formed of a resin material.

FIG. 10 shows a heat dissipation structure of a housing according to prior art 3. In the case 311, the first case member 313 is formed of a metal plate by die casting, and the first and second case members 313 and 315 are fixed by screws 316. This is different from the case 111.

In addition, the first case member 313 and the substrate 3
19, the second case member 315, the electronic component 317, the case seal member 321, the connector part 333, the fitting part 333
a, contacts 335, etc.
Has the same function as.

[0010] As reference technical documents, Japanese Patent Laid-Open No.
-118968, or JP-A-8-17906
No. 5 publication.

[0011]

However, in the heat dissipation structure of the housing according to the prior art 1, since the housing 111 is formed by resin molding, the heat conductivity is low due to the characteristics of the material itself, and the heat dissipation effect is low. Therefore, heat radiation is inferior.

Further, in the heat radiation structure of the housing in the prior art 2, since the second case member 215 is made of a metal sheet, the weight becomes heavy.

Further, in the case heat dissipation structure of the prior art 3, since the first case member 313 is formed by die casting, the weight is heavier than that of the housing 211 of the prior art 2.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a heat radiating structure for a housing which can cope with complicated shape specifications, can be easily manufactured, and has a sufficient heat radiating effect.

[0015]

According to the present invention, there are provided a first case member and a second case member having at least two members, and formed by a combination of the first and second case members. In a heat dissipation structure of a housing, an electronic component and a substrate on which the electronic component are mounted are accommodated in an internal space, and heat generated from the electronic component is radiated outside the first and second case members. Each of the second case members is made of a resin material, has a heat dissipating component provided on the first case member, and the first case member has a through hole to which the heat dissipating component is attached, One end of the heat dissipating component is provided in the internal space, and the other end of the heat dissipating component is exposed outside the first case member.

[0016]

According to the heat dissipation structure of the housing of the present invention, the housing is made of a resin material having a low heat conductivity and a low heat dissipation effect. Provide and use.

In a housing made of an electronic component having a heat generating portion or a resin exposed to a thermal environment, a through-hole is provided with an individual component sealing member or a sealing member integrated with a case sealing member between the housings to provide waterproofness. In addition, heat generated from the electronic components by the heat radiating component is released to the outside of the housing by mounting the heat radiating component.

[0018]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a first embodiment of a heat dissipating structure of a housing according to the present invention;
FIG. 1 to FIG. 3 show a heat radiation structure of the housing in the first embodiment.

Referring to FIGS. 1 to 4, in the heat radiation structure of the housing, a resin housing 11 having a space S formed therein is formed.
Is adopted. The housing 11 has a first case member 13 and a second case member 15.

On the inner surface of the first case member 13, a substrate 19 on which a plurality of electronic components 17 are mounted is installed. Second
The case member 15 is fixed to the first case member 13 via a case seal member 21 such as a rubber material so as to cover a substrate 19 on which the electronic component 17 is mounted.

Therefore, the housing 11 has a space S inside when the first and second case members 13 and 15 are combined.
Is formed, and the electronic component 17 and the electronic component 1
The substrate 19 on which the device 7 is mounted is housed.

More specifically, with reference to FIG. 4, the first case member 13 includes a base portion 13a formed of a resin material into a rectangular plate shape, and a base portion 13a.
and a plurality of case engaging pieces 23 extending from the periphery of the base frame 13b to the base frame 13b from the periphery of the base frame 13b. I have.

An annular sealing groove 25 is formed on the open end face of the base frame portion 13b.
A substrate installation groove 27 formed on one surface of the base portion 13a inside the substrate and a through hole 31 formed at a central portion of one surface of the base portion 13a are formed. Base frame 1
3b, a sealing groove 25 is formed deeply, and a substrate installation groove 27 is formed to have a thickness equal to or slightly deeper than the thickness of the substrate 19.

The case seal member 21 has an annular frame shape, and has a concave cross section. The case seal member 21 is fitted in the seal groove 25 with the concave opening in the same direction as the opening side of the seal groove 25, and the first and second case members 13 and 15 are combined. At this time, it serves as a waterproof seal for preventing water from entering the internal space S from the outside.

The second seal member 15 includes a cover portion 15a formed of a resin material into a rectangular cup shape, and a connector portion 33 provided on one side surface of the cover portion 15a.
And The connector part 33 is formed by a fitting part 33a integrally formed of the same material as the cover part 15a.
And a conductive contact 35 connected to the circuit of the substrate 19 and extending to the fitting portion 33a.

A mating portion of a mating connector portion (not shown) is mated with the mating portion 33a, and a contact portion of the contact 35 located at the mating portion 33a is provided with a conductive contact of the mating connector portion. Are in contact.

As shown in FIG. 4, in the heat radiation structure of the housing in this embodiment, the contacts 35 of the connector 33 are connected to the substrate 19. The case sealing member 21 is fitted into the sealing groove 25 of the base frame portion 13b. Then, an adhesive 37 (see FIG. 4) is applied to one surface of the base portion 13a, and the back surface of the substrate 19 is fixed by the adhesive 37.

Also, on the open end face of the cover portion 15a,
When the first and second case members 13 and 17 are combined with each other, a protrusion 15b is formed to extend so as to be pressed into the concave portion of the case seal member 21 fitted into the sealing groove 25. Have been.

The through-hole 31 is provided with a heat-dissipating component 41 made of, for example, a metal having excellent thermal conductivity and having a T-shaped cross section. This heat dissipation component 41
Plays a role of radiating heat generated from the electronic component 17 from the inside to the outside.

One end of the heat dissipating component 41 is provided in the internal space S, and the other end is exposed outside the base portion 13a at the outside opening of the through hole 31. In the heat dissipation structure of the housing according to the first embodiment, one end of the heat dissipation component 41 is in contact with the back surface of the substrate 19 on which the electronic component 17 is mounted. The heat radiating component 41 is attached to the through hole 31 via a ring-shaped component sealing member 43 such as an O-ring.

Next, the relationship among the through hole 31, the heat dissipating component 41, and the component sealing member 43 will be specifically described. Through hole 3
No. 1 has a different diameter dimension in the upper and lower directions in the axial direction. That is, on the inner wall of the through hole 31, the width of the lower portion of the through hole 31 formed in the middle portion in the axial direction in the direction perpendicular to the axis is smaller than that of the upper portion of the through hole 31. have.

The upper part of the heat dissipating component 41 has a flange 41a facing the upper part of the through hole 31 and facing the step receiving part 31a in the axial direction of the through hole 31. A component sealing member 43 is interposed between the flange portion 41a and the step receiving portion 31a, and the heat radiation component 41 is held by the first case member 13.

Therefore, the flange portion 41a and the step receiving portion 31
The space between “a” is tightly sealed by the component sealing member 43 so that water does not enter the inside. Further, the heat generated from the electronic component 17 can be released outside through the heat radiation component 41. In addition, the heat dissipating component 41 includes a flange portion 41a.
Since one end of the heat dissipating component 41 is pressed against the substrate 19 fixed to the base portion 13a without falling off from the base portion 13a, the heat dissipating component 41 can also move to the internal space S. Absent.

Further, the first and second case members 13,
15 has an engagement means which engages when they are combined with each other. The engagement means includes an engagement hole 23 a formed in the case engagement piece 23 of the first case member 13.
And a projection 15b formed on the outer peripheral surface of the cover 15a of the second case member 15.

That is, the case engaging piece 23 is
It is molded integrally with the same resin material as a,
Since it is a thin plate, it can have flexibility. When the first and second case members 13 and 15 are combined by inserting the outer peripheral surface of the cover portion 15a inside the case engaging piece 23, the case engaging piece 2 is formed by the projection 15b.
The tip of No. 3 is pushed and slightly bent outward. Thereafter, when the combination of the first and second case members 13 and 15 is completed, the projection 15 is inserted into the engagement hole 23a of the case engagement piece 23.
Since b enters, the case engagement piece 23 returns to the natural state, and the first and second case members 13 and 15 are engaged with each other to form the integral housing 11.

Therefore, the first and second case members 13,
15 can be prevented from being easily disassembled, and the case seal member 21 and the component seal member 43 can maintain waterproofness.

FIGS. 5A and 5B show a second embodiment of the heat dissipation structure of the housing. In the second embodiment, only the through hole 31 and the heat radiating component 41 are different from the first embodiment.
The description of the parts other than the through hole 31 and the heat radiating component 41 is omitted.

Referring to FIG. 5A, a holding piece 31f extending from the opening edge on the space S side in the axial direction of the through hole 31 is provided on the inner wall of the through hole 31 at an intermediate position in the axial direction of the inner wall. A step receiving portion 31a is formed at the portion. Furthermore, the through hole 31
Is formed with a holding step portion 31m that positions the peripheral edge of the flange portion 41a above the step receiving portion 31a. The heat dissipating component 41 has a flange portion 41a facing the step receiving portion 31a in the axial direction. The holding piece 31f faces the upper peripheral edge of the flange 41a. The flange portion 41a presses and holds the component seal member 43 with the step receiving portion 31a.

Therefore, since the heat dissipating component 41 has the flange 41a between the holding piece 31f and the holding step 31m, the heat dissipating component 41 does not move to the internal space S. In addition,
As a specific example, in order to obtain the holding piece 31f in the form shown in FIG. 5A, as shown in FIG. 5B, the holding piece 31f is formed integrally with the base 13a in a form protruding onto one surface of the base 13a. After that, the protruding holding piece 31f is heat-welded to form the same surface as one surface of the base portion 13a as shown in FIG. 5A, and the heat dissipating component 41 is held by the holding piece 31f. be able to.

FIGS. 6 and 7 show a third embodiment of the heat dissipation structure of the housing. The third embodiment differs from the first embodiment only in the case seal member 21 and the component seal member 43, and a description thereof will be omitted.

Referring to FIGS. 6 and 7, in the heat dissipation structure of the housing, case seal member 21 and component seal member 43 are connected by connecting portion 51, and this connecting portion 51 is connected to case sealing member. The member 21 and the component sealing member 43 are integrally formed with the same sealing material. Connecting part 51
Is a connecting groove 13n formed on one surface of the base portion 13a.
It is fitted in.

In the third embodiment shown in FIGS. 6 and 7, the through-hole 31 is formed at a position deviated from the center of the base portion 13a. As shown, when the through hole 31 is provided in the central portion, the connecting portion 51 may be lengthened and the connecting groove 13n of the base portion 13a into which the connecting portion 51 enters may be lengthened.

Although the heat dissipating component 41 has a cylindrical shape, it is needless to say that the shape of the through-hole 31 may be made to correspond to the shape of the heat dissipating component 41.

[0044]

As described above, according to the present invention, according to the present invention, most of the housing is formed of a resin material so that the first and second case members can be held together. And the seal portion can be easily formed, and the total weight can be reduced as compared with the case where the seal member is made of a metal material.

Further, since the heat radiating component has a simple structure, it is easy to manufacture, and a necessary and sufficient heat radiating property can be obtained.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a heat dissipation structure of a housing according to the present invention.

FIG. 2 is a perspective view showing a heat dissipation structure of the housing shown in FIG.

FIG. 3 is a perspective view showing a state in which the heat radiation structure of the housing shown in FIG. 2 is inverted and viewed from the bottom side.

FIG. 4 is an exploded perspective view of the housing shown in FIG. 1;

FIG. 5A is a cross-sectional view illustrating a configuration of a through hole and a heat radiating component, and FIG. It is sectional drawing for demonstrating the holding method with a heat dissipation component.

FIG. 6 is a sectional view showing a third embodiment of the heat dissipation structure of the housing of the present invention.

FIG. 7 is a perspective view showing a case seal member and a component seal member of the heat dissipation structure of the housing shown in FIG. 6;

FIG. 8 is a cross-sectional view illustrating a heat dissipation structure of a housing according to the related art 1.

FIG. 9 is a perspective view showing a heat dissipation structure of a housing according to the conventional technique 2.

FIG. 10 is a cross-sectional view showing a heat dissipation structure of a housing according to the conventional technique 3.

[Explanation of symbols]

 11, 111 housing 13, 113, 213, 313 first case member 13a base portion 13b base frame portion 15, 215, 315 second case member 15a cover portion 15b protrusion 17, 117, 317 electronic component 19, 119 , 319 board 21, 121, 321 case seal member 23 case engagement piece 23a engagement hole 25 sealing groove 27 board installation groove 31 through hole 31a step receiving part 31f holding piece 31m holding step part 41 heat radiation part 41a flange part 43 part Seal member 51 Connecting part

Continued on front page F term (reference) 4E360 AB02 AB13 AB33 AB34 BA02 BA04 BC03 BC04 BC06 BD03 CA02 EA03 EA12 EA18 EA24 EC11 ED03 ED12 ED14 ED23 ED27 EE02 FA02 FA09 GA06 GA24 GA29 GA53 GB92 GC08 5E322 AA11 AB04 AB11 EA10 FA

Claims (7)

[Claims] 1. An electronic component and an electronic component in an internal space formed by a combination of the first and second case members, the electronic component having at least two first case members and a second case member. Wherein the first and second case members are made of a resin material, wherein the first and second case members are each made of a resin material. And a heat radiating component provided in the first case member. The first case member has a through hole in which the heat radiating component is mounted, and one end of the heat radiating component is formed in the internal space. Wherein the other end of the heat dissipating component is exposed outside the first case member. 2. The heat radiating structure for a casing according to claim 1, wherein said one end of said heat radiating component is in contact with said substrate. 3. The heat dissipation structure for a housing according to claim 1, wherein the one end of the heat dissipation component is in contact with the electronic component, and the heat dissipation component is held by the first case member. The heat dissipation structure of the housing. 4. The heat dissipation structure for a housing according to claim 1, wherein the heat dissipation component is mounted in the through hole via a component seal member, and the heat dissipation component is held by the first case member. A heat dissipation structure for a housing. 5. The heat dissipation structure for a housing according to claim 4, wherein the through-hole has a step formed at an intermediate portion in the axial direction of the inner wall, and the heat dissipating component is provided at the step in the axial direction. A heat dissipating structure for a housing, comprising: a facing flange portion, wherein the component sealing member is interposed between the flange portion and the step portion, and the heat dissipating component is held by the first case member. 6. The heat dissipation structure for a housing according to claim 4, wherein the through hole extends from an edge on the inner space side in the axial direction of the through hole and an intermediate portion of the inner wall in the axial direction. A step formed on a portion of the heat dissipating component, wherein the heat dissipating component has a flange facing the step in the axial direction, and the component sealing member is interposed between the flange and the step. Is held by the first case member, and the flange presses the component seal member by the holding piece. 7. The heat radiating structure for a housing according to claim 1, wherein
A housing having a case seal member for waterproofing between the first and second case members, wherein the case seal member and the component seal member for sealing the heat radiating component are integrally formed. Heat dissipation structure.