JPH10321979A - Ｐｃボードへ部品を取りつけるためのプラットフォーム - Google Patents

Ｐｃボードへ部品を取りつけるためのプラットフォーム

Info

Publication number
JPH10321979A
JPH10321979A JP10130036A JP13003698A JPH10321979A JP H10321979 A JPH10321979 A JP H10321979A JP 10130036 A JP10130036 A JP 10130036A JP 13003698 A JP13003698 A JP 13003698A JP H10321979 A JPH10321979 A JP H10321979A
Authority
JP
Japan
Prior art keywords
platform
circuit board
printed circuit
output
electrical contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP10130036A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10321979A5 (enExample
Inventor
K Cock James
ジェイムス・ケー・コック
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of JPH10321979A publication Critical patent/JPH10321979A/ja
Publication of JPH10321979A5 publication Critical patent/JPH10321979A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0262—Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10196—Variable component, e.g. variable resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
JP10130036A 1997-05-14 1998-05-13 Ｐｃボードへ部品を取りつけるためのプラットフォーム Withdrawn JPH10321979A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/856,312 US6175509B1 (en) 1997-05-14 1997-05-14 Space efficient local regulator for a microprocessor
US856,312 1997-05-14

Publications (2)

Publication Number Publication Date
JPH10321979A true JPH10321979A (ja) 1998-12-04
JPH10321979A5 JPH10321979A5 (enExample) 2005-09-29

Family

ID=25323316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10130036A Withdrawn JPH10321979A (ja) 1997-05-14 1998-05-13 Ｐｃボードへ部品を取りつけるためのプラットフォーム

Country Status (2)

Country Link
US (1) US6175509B1 (enExample)
JP (1) JPH10321979A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2351571A (en) * 1999-06-23 2001-01-03 Ford Motor Co Electronic device having a single-sided circuit board
WO2002037248A3 (en) * 2000-10-30 2003-01-16 Sun Microsystems Inc A power distribution system with a dedicated power structure and a high performance voltage regulator
WO2002037909A3 (en) * 2000-10-30 2003-01-23 Sun Microsystems Inc Method and apparatus for distributing power to integrated circuits
JP2018032767A (ja) * 2016-08-25 2018-03-01 株式会社デンソーテン 位置決め構造

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000208905A (ja) * 1999-01-14 2000-07-28 Nec Corp プリント基板
JP4050025B2 (ja) * 2001-09-27 2008-02-20 カルソニックカンセイ株式会社 回路基板取付部構造
US20030122216A1 (en) * 2001-12-28 2003-07-03 Rabadam Eleanor P. Memory device packaging including stacked passive devices and method for making the same
US20060131070A1 (en) * 2004-12-16 2006-06-22 Wong Hong W Power delivery mechanism
US7085143B1 (en) * 2005-05-23 2006-08-01 International Business Machines Corporation In-module current source
US7408786B2 (en) * 2005-06-13 2008-08-05 Research In Motion Limited Electrical connector and system for a component in an electronic device
KR100714648B1 (ko) * 2005-12-02 2007-05-07 삼성전자주식회사 인쇄 회로 기판
FI120068B (fi) * 2006-04-20 2009-06-15 Abb Oy Sähköinen liitos ja sähkökomponentti
US20090080163A1 (en) * 2007-05-17 2009-03-26 Lockheed Martin Corporation Printed wiring board assembly
CN107122012B (zh) * 2016-02-24 2023-09-19 台达电子工业股份有限公司 电力传输装置及其制作方法
TWI593173B (zh) * 2016-02-24 2017-07-21 達創科技股份有限公司 電力傳輸裝置及其製作方法
JP6935405B2 (ja) * 2016-09-06 2021-09-15 三洋電機株式会社 バスバーの接続方法、プリント基板、及びスイッチ装置
US10333235B1 (en) * 2018-03-15 2019-06-25 Sten R. Gerfast Selecting switching functions using screw-force, on modules having traces
EP4248719A1 (de) * 2020-11-18 2023-09-27 Sew-Eurodrive GmbH & Co. KG Elektrogerät und anordnung von elektrogeräten

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4008365A (en) 1975-03-03 1977-02-15 Broadhill Development Corporation Bus tray electrical distribution system
US4758927A (en) * 1987-01-21 1988-07-19 Tektronix, Inc. Method of mounting a substrate structure to a circuit board
US4867696A (en) 1988-07-15 1989-09-19 Amp Incorporated Laminated bus bar with power tabs
US5471151A (en) * 1990-02-14 1995-11-28 Particle Interconnect, Inc. Electrical interconnect using particle enhanced joining of metal surfaces
US4981449A (en) 1990-04-27 1991-01-01 Amp Incorporated Connector for mating multi-layer blade-shaped members
US5313367A (en) * 1990-06-26 1994-05-17 Seiko Epson Corporation Semiconductor device having a multilayer interconnection structure
JP2913891B2 (ja) * 1990-12-04 1999-06-28 三菱電機株式会社 多層配線基板
US5184284A (en) * 1991-09-03 1993-02-02 International Business Machines Corporation Method and apparatus for implementing engineering changes for integrated circuit module
JPH07502141A (ja) * 1991-09-30 1995-03-02 ゼネラル・ダイナミックス・インフォメーション・システムズ・インコーポレーテッド めっきしたしなやかなリード線
US6024589A (en) * 1997-05-14 2000-02-15 Hewlett-Packard Company Power bus bar for providing a low impedance connection between a first and second printed circuit board

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2351571A (en) * 1999-06-23 2001-01-03 Ford Motor Co Electronic device having a single-sided circuit board
US6239982B1 (en) 1999-06-23 2001-05-29 Visteon Global Technologies, Inc. Electronic device having a single-sided circuit board
GB2351571B (en) * 1999-06-23 2003-02-19 Ford Motor Co Electronic device having a single-sided circuit board
WO2002037248A3 (en) * 2000-10-30 2003-01-16 Sun Microsystems Inc A power distribution system with a dedicated power structure and a high performance voltage regulator
WO2002037909A3 (en) * 2000-10-30 2003-01-23 Sun Microsystems Inc Method and apparatus for distributing power to integrated circuits
GB2386478A (en) * 2000-10-30 2003-09-17 Sun Microsystems Inc A power distribution system with a dedicated power structure and a high performance voltage regulator
GB2386478B (en) * 2000-10-30 2004-05-19 Sun Microsystems Inc A power distribution system with a dedicated power structure and a high performance voltage regulator
US6791846B2 (en) 2000-10-30 2004-09-14 Sun Microsystems, Inc. Power distribution system with a dedicated power structure and a high performance voltage regulator
US6794581B2 (en) 2000-10-30 2004-09-21 Sun Microsystems, Inc. Method and apparatus for distributing power to integrated circuits
US7162795B2 (en) 2000-10-30 2007-01-16 Sun Microsystems, Inc. Power distribution system with a dedicated power structure and a high performance voltage regulator
JP2018032767A (ja) * 2016-08-25 2018-03-01 株式会社デンソーテン 位置決め構造

Also Published As

Publication number Publication date
US6175509B1 (en) 2001-01-16

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