JPH10321501A - Aligner - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an aligner with high throughput by simultaneously performing the alignment of substrate to be exposed and mask and the exposure of substrate to be exposed with a scanning-type exposure device. SOLUTION: By dividing a stage 3 for holding a substrate 1 to be exposed into a 1st group and a 2nd group, the substrate 1 to be exposed on the stage 3 of the 2nd group (or 1st group) is aligned to a mask 2, while the substrate 1 to be exposed held on the stage 3 of 1st group (or 2nd group) is exposed. When the substrate 1 to be exposed held on the stage 3 of 1st group (or 2nd group) has been completely exposed, the substrate 1 to be exposed held on the stage 3 of 2nd group (or 1st group) can be immediately exposed so that throughput can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an exposure apparatus, and more particularly to a scanning type exposure apparatus which performs exposure by relatively moving a substrate to be exposed and a mask with respect to a projection optical system.

[0002]

2. Description of the Related Art In recent years, liquid crystal panels have been widely used as display elements for word processors, personal computers, televisions and the like. The liquid crystal panel is formed by forming a large number of thin films such as a metal and a semiconductor on a light-transmitting substrate such as a glass and patterning the thin films into a desired shape by photolithography. The electrode forming surfaces are faced to each other and bonded together with a predetermined gap,
A liquid crystal is sealed in the gap.

As an apparatus for performing the photolithography, a projection type exposure apparatus that exposes a pattern formed on a mask to a photoresist layer on a substrate to be exposed through a projection optical system has been used. In the exposure apparatus, so-called scanning exposure is performed while moving the substrate to be exposed and the mask in the same direction, and a pattern on the mask is transferred to a predetermined region of the substrate to be exposed.

In recent years, as the size of the liquid crystal display device has increased, the size of the substrate to be exposed has been increasing. Therefore, conventionally, in order to enlarge the exposure area, the exposure area is divided and exposed.

[0005] However, when the exposure area is divided and exposed as described above, a seam is generated between adjacent exposure areas. Therefore, in order to increase the joint accuracy, a great improvement in alignment accuracy is required. There has been a problem that the cost of the apparatus is increased. Furthermore, since it is necessary to repeatedly perform the scanning exposure a plurality of times, there is a problem that the throughput is reduced.

In order to collectively transfer a large exposure area, it is conceivable to increase the size of the projection optical system. For this purpose, it is necessary to manufacture a large-sized optical element with very high precision. In addition, there is a problem that the manufacturing cost is increased and the size of the apparatus is increased. Further, there is a problem that the aberration increases due to the enlargement of the projection optical system.

[0007] Japanese Patent Application Laid-Open No. 7-57986 discloses an exposure apparatus capable of exposing the entire surface of a substrate to be exposed in one scan by combining a plurality of projection optical systems.

[0008]

However, generally, in the conventional exposure apparatus as described above, it is necessary to perform exposure after the substrate to be exposed and the mask are accurately aligned. That is, the exposure apparatus alternately performs alignment between the substrate to be exposed and the mask and exposure of the substrate to be exposed.

That is, in the exposure apparatus disclosed in Japanese Patent Application Laid-Open No. 7-57986, though the throughput is improved as compared with the case where the exposure area is divided and exposed, alignment is performed between the substrate to be exposed and the mask. During this period, exposure was not performed, and the apparatus could not be operated efficiently.

Although it is conceivable to simply combine a large number of projection optical systems in order to simply improve the throughput, the members of the projection optical system are very expensive and very precisely constructed. As the number increases, the maintenance cost increases and the trouble occurrence rate increases.

The present invention has been made in view of the above-mentioned problems, and an exposure apparatus capable of further improving the throughput by operating the apparatus more efficiently without increasing the number of optical systems. To provide.

[0012]

According to a first aspect of the present invention, an exposure apparatus synchronizes a substrate to be exposed with a mask and relatively moves the mask with respect to an optical system, thereby changing the pattern of the mask. In an exposure apparatus for transferring onto a substrate, a stage for holding the substrate and a mask holder for holding a mask corresponding to the substrate include a first group and a second group.
It is characterized by being provided separately from the group.

Therefore, while aligning the substrate to be exposed held by the first group of stages and the mask held by the mask holder, exposing the substrate to be exposed held by the second group of stages to light. And throughput can be improved.

According to a second aspect of the present invention, in the exposure apparatus of the first aspect, the optical system is fixedly arranged, and the first group of stages and the mask holder and the second optical system are sandwiched by the optical system. Two groups of stages and a mask holder are arranged, and exposure is performed by alternately moving the first group and the second group of stages and the mask holder with respect to the optical system. is there.

Since the optical system is very susceptible to external vibrations and the like, fixing the optical system can eliminate problems such as occurrence of a shift of the optical axis.

According to a third aspect of the present invention, in the exposure apparatus according to the first aspect, exposure is performed by moving the optical system with respect to the stages and the mask holders of the first and second groups. It is characterized by performing.

As described above, by adopting a structure in which the optical system is moved, the transport path of the substrate to be exposed can be simplified, so that the apparatus can be downsized.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An exposure apparatus according to the present invention will be described below with reference to FIGS. The present invention can be applied to both a lens projection type exposure apparatus and a mirror projection type exposure apparatus.

(Embodiment 1) A first embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a perspective view showing a main part of the exposure apparatus of the present invention, and FIG.
FIG. 2 is a view of the exposure apparatus shown in FIG. 1 as viewed from the y-axis direction.

In FIG. 1, reference numeral 1 denotes a substrate to be exposed, 2 denotes a mask, and 3 denotes a stage for holding the substrate 1 to be exposed. The stage 3 is an alignment stage that can be finely moved in the xy plane to align the held substrate 1 to be exposed and the mask 2 corresponding thereto. Also,
The mask 2 is held by a mask holder (not shown). Further, the stage 3 and a mask holder (not shown) are provided so as to be synchronously movable in the x direction in the figure.

Reference numeral 4 denotes a lamp house, 5 denotes an aperture, 6 denotes a lens unit, and 7 denotes a right-angle prism, which are fixedly arranged. The lens unit 6 and the right-angle prism 7 constitute a projection optical system, and these are provided one by one via an aperture 5.

Further, the projection optical system including the lens units 6a to 6d and the right-angle prisms 7a to 7d provided for each of the four substrates to be exposed, scans the area to be exposed. The substrate is arranged such that the entire surface of the substrate to be exposed is exposed.

Reference numeral 8 denotes a positioning means for aligning the substrate 1 and the mask 2 held on the stage 3 and comprises, for example, a laser interference type focus unit. The positioning means 8 is fixedly arranged at a position different from the projection optical system including the lamp house 4, the lens unit 6, and the right-angle prism 7. Also,
As shown in FIG. 2, the alignment means 8 is provided one by one at a target position with respect to the lamp house 4 and the projection optical system. In FIG. 1, one of the positioning means 8 is omitted.

FIGS. 3A to 3D and FIG. 4A to FIG.
2D is a top view of the exposure apparatus in FIG. 1 as viewed from the z-axis direction, and omits an aperture 5, a lens unit 6, a right-angle prism 7, a positioning unit 8, and a mask holder. 3 and 4, reference numeral 9 denotes a transporter for placing the substrate to be exposed on the stage 3 or removing the substrate from the stage 3, and is provided on both sides of the lamp house 4.

As shown in FIGS. 3 and 4, the stage 3
Is a transporter 9a provided on the right side of the lamp house 4 in the figure.
A first group of stages 3a for holding the substrate to be exposed mounted thereon by the first and second substrates for holding the substrate to be exposed mounted by the transporter 9b provided on the left side of the lamp house 4 in the figure.
Stage 3b of each group, and stage 3a of each group,
A mask and a mask holder (not shown) are provided corresponding to 3b. Note that a transporter for removing the substrate to be exposed from the stage 3a is 9c, and a transporter for removing the substrate to be exposed from the stage 3b is 9d.

The operation of the exposure apparatus according to the present embodiment will be described below with reference to FIGS. In the following description, the flow of the substrate to be exposed 1a before being exposed to the carrier 9a will be mainly described.

First, as shown in FIG. 3A, a substrate to be exposed 1a is loaded onto a transporter 9a by a transport system (not shown).

Next, as shown in FIG. 3B, the exposed substrate 1c, which has been exposed in the previous step, is
Simultaneously, the substrate to be exposed 1a is mounted on the stage 3a by the transporter 9a.

Next, as shown in FIG. 3 (c), the substrate 1a to be exposed placed on the stage 3a is moved to a mask held by a mask holder (not shown) by using a positioning means (not shown). Align for

Next, as shown in FIG. 3D, the stage 3a and the substrate 1a held by the stage 3a are transferred to the lamp house 4 in synchronization with a mask holder (not shown) and a mask held by the mask holder. Move towards.

Incidentally, during the time shown in FIGS. 3 (a) to 3 (c),
Exposure of the substrate to be exposed 1b held on the stage 3b is performed.

Subsequently, as shown in FIG.
The stage 3a and a mask holder (not shown) once pass through the lamp house 4 and move to the left side of the lamp house.

Next, as shown in FIGS. 4B and 4C, the stage 3a and the mask holder (not shown) pass through the lamp house 4 again, and exposure is performed at this time.

Next, as shown in FIG. 4D, when the stage 3a returns to its original position, the exposed substrate 1a is taken out of the stage 3a, and is The substrate to be exposed 1e is newly mounted on the stage 3a.

In the meantime, during the time shown in FIGS.
On the stage 3b, the substrate to be exposed 1b to be held is replaced with the substrate to be exposed 1d before exposure, and alignment between the substrate 1d to be exposed and a mask (not shown) corresponding thereto is performed.

FIG. 5 is a flowchart summarizing these flows. As described above, in the exposure apparatus according to the present embodiment, while exposing the substrate to be exposed held on the first group (or the second group) of the stages, the stage of the second group (or the first group) is exposed. In, the exchange of the substrate to be exposed and the alignment between the substrate to be exposed and the mask are performed. Accordingly, immediately after the exposure of the substrate to be exposed held by the stage of the first group (or the second group) is completed, the exposure of the substrate to be exposed held by the stage of the second group (or the first group) is performed immediately. Becomes possible. Therefore, the throughput can be remarkably improved as compared with a conventional exposure apparatus in which alignment and exposure of a substrate to be exposed and a mask are alternately performed. In particular, the smaller the difference between the time required for the exposure step and the time required for replacing the substrate to be exposed on the stage 3 and for aligning the substrate with the mask and the mask, the higher the operation rate of the apparatus and the higher the throughput. Get higher.

In this embodiment, since the stage 3 passes through the lamp house 4 twice as described above, the exposure may be completed in two exposure steps. In addition, for example, a CCD camera is incorporated in a part of the lamp house 4, and the initial mark of the substrate is read at the first pass, and the exposure is performed according to the read initial mark at the second pass under the conditions suitable for the initial mark. Is also possible.

Further, in the present embodiment, two stages 3a and 3b of the first group and the second group are provided two each, but the number of these stages 3a and 3b is not particularly limited. For example, as shown in FIG. FIG. 6 corresponds to FIG. 3A.

(Embodiment 2) An exposure apparatus according to this embodiment will be described with reference to FIGS. The exposure apparatus according to the present embodiment corresponds to the first embodiment shown in FIG.
Is substantially the same as the configuration of the exposure apparatus described above, except that the lamp house 4, the aperture 5, the lens unit 6, and the right-angle prism 7 move in the x-axis direction in synchronization with each other. 7 (a) to 7 (d) and FIGS. 8 (a) to 8 (d) show the exposure apparatus according to the present embodiment as z
It is the top view seen from the axial direction.

As shown in FIGS. 7 and 8, also in the exposure apparatus of the present embodiment, the stage 3 has a first substrate holding a substrate to be exposed, which is mounted by a carrier 9a provided on the right side in the figure. A second stage for holding a group of stages 3a and a substrate to be exposed mounted by a transporter 9b provided on the left side in the figure.
Stage 3b of each group, and stage 3a of each group,
A mask and a mask holder (not shown) are provided corresponding to 3b. Note that a transporter for removing the substrate to be exposed from the stage 3a is 9c, and a transporter for removing the substrate to be exposed from the stage 3b is 9d.

The operation of the exposure apparatus according to the present embodiment will be described below. The following description is based on the transfer device 9.
The process is performed centering on the flow of the substrate 9a to be exposed before exposure, which is supplied to the substrate 9a.

First, as shown in FIG. 7A, a substrate 1a to be exposed is loaded onto a transporter 9a by a transport system (not shown).

Next, as shown in FIG. 7B, the substrate to be exposed 1c which has been exposed in the previous step is transferred to the transporter 9
Simultaneously, the substrate to be exposed 1a is mounted on the stage 3a by the transporter 9a.

Next, as shown in FIG. 7 (c), the substrate 1a to be exposed placed on the stage 3a is moved to a mask held by a mask holder (not shown) by using a positioning means (not shown). Align for

Next, as shown in FIG. 7D, the lamp house 4 and other optical systems (not shown) move toward the stage 3a.

In the meantime, during the time shown in FIGS.
The lamp house 4 and other optical systems (not shown) move on the substrate 1b held on the stage 3b, and the substrate 1b is exposed.

Subsequently, as shown in FIGS. 8A to 8C, the lamp house 4 and other optical systems (not shown) temporarily move to the right side of the stage 3a.

Next, as shown in FIG. 8D, the lamp house 4 and other optical systems pass through the stage 3a again, and at this time, the exposure of the substrate 1a is performed.

In the meantime, during the time shown in FIGS.
On the stage 3b, the substrate to be exposed 1b to be held is replaced with the substrate to be exposed 1d before exposure, and alignment between the substrate to be exposed and a mask (not shown) corresponding thereto is performed.

FIG. 5 is a flowchart summarizing these flows. As described above, in the exposure apparatus according to the present embodiment, similarly to the first embodiment, the second exposure is performed on the substrate to be exposed held on the stage of the first group (or the second group). In the group (or first group) stages, replacement of the substrate to be exposed and alignment of the mask with the substrate to be exposed are performed. Accordingly, immediately after the exposure of the substrate to be exposed held by the stage of the first group (or the second group) is completed, the exposure of the substrate to be exposed held by the stage of the second group (or the first group) is performed immediately. Becomes possible.
Therefore, the throughput can be remarkably improved as compared with a conventional exposure apparatus in which alignment and exposure of a substrate to be exposed and a mask are alternately performed. In particular, the smaller the difference between the time required for the exposure step and the time required for replacing the substrate to be exposed on the stage 3 and for aligning the substrate with the mask and the mask, the higher the operation rate of the apparatus and the higher the throughput. Get higher.

Also in this embodiment, since the stage 3 passes through the lamp house 4 twice as described above, the exposure may be completed in two exposure steps. Further, for example, a CCD camera may be incorporated in a part of the lamp house 4, and the initial mark of the substrate may be read at the first pass, and the exposure may be performed under the conditions according to the initial mark read at the second pass. It is possible.

Further, similarly to the first embodiment, the number of the stages 3a and 3b of the first group and the second group is not particularly limited, and two stages may be provided respectively.

In the present embodiment, since the lamp unit 4 and the projection optical system are configured to move, the moving path of the substrate to be exposed can be configured linearly. Can be realized.

[0054]

As described above, the exposure apparatus of the present invention synchronizes a substrate to be exposed with a mask and moves the mask relative to an optical system so that a pattern of the mask is placed on the substrate. In a transfer exposure apparatus, a stage for holding the substrate and a mask holder for holding a mask corresponding to the substrate are provided separately in a first group and a second group. While aligning the substrate to be exposed held by the group of stages and the mask held by the mask holder, it becomes possible to expose the substrate to be exposed held by the stage of the second group, improving throughput. The effect that it can be made to play is produced.

Also, the optical system is fixedly arranged, and the first group of stages and mask holders and the second group of stages and mask holders are arranged with the optical system interposed therebetween. If exposure is performed by alternately moving the stages and mask holders of the first and second groups, respectively, the optical system can be fixed, so that problems such as occurrence of displacement of the optical axis are eliminated. It has the effect of being able to do so.

Further, if exposure is performed by moving the optical system with respect to the stages and mask holders of the first and second groups, the transport path of the substrate to be exposed can be simplified. Therefore, there is an effect that the device can be downsized.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a main part of an exposure apparatus of the present invention.

FIG. 2 is a front view of the exposure apparatus shown in FIG.

FIG. 3 is an operation flowchart of the exposure apparatus of the present invention.

FIG. 4 is an operation flowchart of the exposure apparatus of the present invention.

FIG. 5 is a flowchart showing the operation of the exposure apparatus of the present invention.

FIG. 6 is a top view of the exposure apparatus when each group has one stage.

FIG. 7 is an operation flowchart of an exposure apparatus according to another embodiment of the present invention.

FIG. 8 is an operation flowchart of an exposure apparatus according to another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Exposure target substrate 2 Mask 3 Stage 4 Lamp house 5 Aperture 6 Lens unit 7 Right angle prism 8 Alignment means 9 Conveyor

Claims (3)

[Claims] An exposure apparatus for transferring a pattern of a mask onto the substrate by synchronizing a substrate to be exposed and a mask and moving the mask relative to an optical system. An exposure apparatus, wherein a stage and a mask holder for holding a mask corresponding to the substrate are provided separately in a first group and a second group. 2. The optical system according to claim 1, wherein the optical system is fixedly arranged, and the first group of stages and the mask holder are disposed between the optical system and the second group.
2. The exposure apparatus according to claim 1, wherein a group of stages and a mask holder are arranged, and the exposure is performed by alternately moving the first group and the second group of stages and the mask holder with respect to the optical system. Exposure apparatus according to the above. 3. The exposure apparatus according to claim 1, wherein the exposure is performed by moving the optical system with respect to the first and second stages and the mask holder.