JPH1032137A - Electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily transmit the heat of a furnace to a soldered part, when the furnace, where a capacitor having a surface mounting plate is soldered, is heated up. SOLUTION: This electronic part is composed of a capacitor main body 5, on which a plurality of leads 3 are led to from the same edge face and an insulating mounting plate 8 on which a metal terminal 10, whereon its one surface is brought into contact with the edge face of the main body 5 and a lead 3 is electrically connected to the other surface. The first slits 30 are provided on both sides of the metal terminal from the edges 8b and 8c of the mounting plate and up to the midway of the metal terminal. The mounting plate 8 has a hole, where the lead is inserted to the position corresponding to a plurality of leads, or the second slits 9, which are almost in parallel with each other, and reaches each lead from one side edge 8a. The edge 10a, positioned between the first slits of the metal terminal, reaches the edges 8b and 8c of the mounting plate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting lead-type electronic components on a printed circuit board.
The present invention relates to a so-called leadless electronic component having a mounting insulating plate attached to its end face.

[0002]

2. Description of the Related Art As a conventional leadless electronic component of this type, for example, there is an electrolytic capacitor as disclosed in Japanese Patent Application Laid-Open No. Sho 59-212213. In this leadless aluminum electrolytic capacitor, as shown in FIG.
A capacitor body 5 formed by pulling out further extending leads 3 and 3 through a sealing member 4 for sealing an open end of the case 2
A concave groove 7, which is in contact with the end face of the capacitor body 5 from which the leads 3, 3 are drawn out and through which the leads 3, 3 penetrate, and the through holes 6, 6 provided on the outer surface, 7 and an insulating mounting plate 8 having
The leading ends of the leads 3, 3 penetrating 6 are bent as round bars or flattened so as to fit in the concave grooves 7, 7.
The part from the bent part is a part to be soldered to the printed circuit board.

However, in this capacitor, the grooves 7, 7
Since only the outer portions of the peripheral surfaces of the leads 3 and 3 bent inside are used as the surface to be soldered to the board, the soldering area is reduced, and in the step of surface mounting the capacitor on the printed board, It is difficult to position the capacitor. Since the contact area between the capacitor and the conductor of the printed circuit board is small, the amount of molten solder adhering to each other is small, and therefore, it is not possible to obtain sufficient adhesive strength.
In addition, when the leads 3 and 3 are bent, stress is easily applied to the internal capacitor element 1 to easily deteriorate the characteristics. To reduce this, cuts are made in advance at the portions where the leads 3 and 3 are to be bent. Although it is also easy to bend, when a shock or vibration is applied to the capacitor mounted on the printed circuit board, the lead may be broken at the bent portion.

Further, such a capacitor has a problem that a lead must be inserted into a small-diameter through hole when a mounting plate is connected to a capacitor element. This insertion work
It is extremely inefficient if done manually, and if automation is to be attempted, the interrelationship between the capacitor element and the mounting plate requires very high precision, especially if the leads are fine wires, the two leads are not necessarily parallel. It is not easy to handle. For this reason, if we automate such tasks,
No matter how sophisticated the device is, the leads are not inserted into the through-holes but are compressed into a flat mass between the end surface of the capacitor body and the mounting plate, and such a product is sent out as a finished product Sometimes. In the mass production process, if even one such defective product is found, all of the products of the lot are discarded, and the damage caused by this is extremely large.

In order to solve the above-mentioned problems of the electrolytic capacitor with a mounting plate, it is conceivable to provide slits 9 in the mounting plate 8 instead of the through holes 6 as shown in FIG. . In the figure, metal plate terminals 10 and 10 are joined to the outer surface of the mounting plate 8 by insert molding.
Slits 9, 9 parallel to each other are provided toward 0, 10. The length of the leads 3, 3 of the capacitor body 5 is substantially equal to the thickness of the mounting plate 8, and the interval between the slits 9, 9
Is almost equal to the interval.

When connecting the mounting plate 8 and the capacitor body 5, the leads 3, 3 are introduced into the slits 9, 9 from the mounting plate side edge 8a, and the positions of the mounting plate 8 and the capacitor body 5 are adjusted. While maintaining a predetermined relationship, the leads 3, 3 are laser-welded to the metal plate terminals 10, 10, respectively.

[0007]

The capacitor shown in FIG. 3 is easy to produce because it is not necessary to insert a lead into a small-diameter through hole, and it is not necessary to bend the lead. Disconnection of the lead can be avoided. In addition, since a metal plate terminal having a large area exists, soldering to a printed circuit board conductor is easy. For example, when an electronic component such as a capacitor is surface-mounted on a printed circuit board, cream solder is applied to a predetermined portion of the surface of the printed circuit board by screen printing, the electronic component is placed thereon, and passed through a heating furnace. Dissolve the cream solder,
The metal plate terminals can be soldered to the printed circuit board. However, in such a heating process of soldering,
The metal plate terminals are located between the mounting plate and the printed circuit board, which are relatively difficult to heat. On the other hand, excessive heating may adversely affect the characteristics of electronic components, for example, the characteristics of capacitors, and it is desired that the furnace temperature be slightly lower and the furnace passage time be as short as possible. Accordingly, an object of the present invention is to facilitate transmission of the furnace temperature to a soldering portion between an electronic component mounting plate and a printed circuit board during heating for soldering.

[0008]

An electronic component according to the present invention comprises: an electronic component main body having a plurality of leads drawn out from the same end face;
The electronic component body comprises an insulating mounting plate provided with a metal plate terminal in which one surface is in contact with the end surface and the lead is electrically connected to the other surface. Further, the mounting plate has a hole which can insert the lead at a position corresponding to each of the plurality of leads or a second slit which can insert the lead and is substantially parallel to each other and which reaches each of the leads from one side edge. You may have.

As a feature of the present invention, first slits are provided at both sides of the metal plate terminal from an edge of the mounting plate to a middle position of the metal plate terminal. Further, it is preferable that an edge of the metal plate terminal located between the first slits reaches an edge of the mounting plate.

According to the present invention, when electronic components are surface-mounted on a printed circuit board, cream solder is applied to a conductor portion of the printed circuit board at a position where the electronic components are connected, and a predetermined positional relationship is applied to this portion. When the electronic components are placed so that the metal plate terminals are in contact with each other and are passed through the furnace and are soldered, the first slits are provided in the mounting plate portions on both sides of the metal plate terminals, so that the electronic components can be mounted on the printed circuit board. The atmosphere in the furnace easily flows into the contact surface of the plate, and the solder is easily melted. The mounting plate of the electronic component is integrally formed by inserting a metal plate terminal with a synthetic resin, and the surface of the metal plate terminal facing the conductor surface of the printed board is exposed on the same surface as the resin surface, and the thickness of the metal plate terminal is increased. May be embedded in the synthetic resin, which is preferable in that the terminal plate is firmly bonded to the synthetic resin portion of the mounting plate. There is almost no portion where the furnace atmosphere flows into the inside of the contact surface of the mounting plate. In such a case, the furnace atmosphere flows into the first slit and the solder is easily melted.

Further, since the edge of the metal plate terminal located between the first slits reaches the edge of the mounting plate, the edge of the metal plate terminal having high thermal conductivity is brought into the furnace atmosphere. When exposed, the temperature rises, the heat is rapidly transmitted to the entire terminal, and the solder is easily melted. After soldering is completed, the quality of the soldering of the edge of the metal plate terminal to the printed circuit board conductor can be visually observed. Become like

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIG. The electronic component of this embodiment is a cylindrical aluminum electrolytic capacitor. In the figures (a) and (b),
A mounting plate 8 made of an insulating material is in contact with the end face of the capacitor body 5. This mounting plate 8 is shown in FIGS.
As shown solely in FIG. 1, convex edge portions 20 and 21 are provided on the upper surface, metal plate terminals 10 and 10 are provided from the side edges 8b and 8c facing the lower surface toward the center direction, respectively, and the opposing plane is soldered. Protrusions 22, 23, 24, 25, 26 having a small protrusion amount equivalent to the thickness of the solder layer at the time of attachment are protrudingly provided at the four corners on the lower surface and at positions separating between the metal plate terminals 10, 10.
The first slits 30, 30 are formed along the both sides of the metal plate terminals 10, 10 from the edges 8b, 8c, respectively.
The second slits 9, 9 are formed up to an intermediate position of 0 and parallel to each other from the other side edge 8a toward the metal plate terminals 10, 10, respectively. As shown in FIG.
Leads 3 having a length substantially equal to the thickness of the mounting plate 8 are led out from the end face of the capacitor body 5 at intervals equal to the interval between the second slits 9, 9. The innermost portions of the two slits 9, 9 are laser-welded to the metal plate terminals 10, 10. In the figure, 10a
Are the edges of the metal plate terminal 10 and the edges 8b, 8 of the mounting plate 8
It slightly protrudes from c.

The projections 20 and 21 are used when connecting the mounting plate 8 to the capacitor body 5. That is, the leads 3, 3 are introduced along the second slits 9, 9 to reach the metal plate terminal position, and the periphery of the end face of the capacitor body 5 comes into contact with the protruding edges 20, 21, so that the leads 3, 3 3 is restricted to that position, and the metal plate terminal 1
0 and 10 are welded. Thereby, welding can be performed without giving excessive force to the leads 3, 3. Further, the second slits 9, 9 are slightly different from the slits 9, 9 described above with reference to FIG. 3 in that the width increases toward the edge 8a of the mounting plate.

In FIG. 1D, reference numeral 11 denotes a metal plate terminal 10.
The metal plate terminal inserted when the mounting plate 8 is molded is strongly connected to the mounting plate body made of an insulator (heat-resistant synthetic resin).

When the thus configured electronic component, that is, the aluminum electrolytic capacitor is surface-mounted on the printed circuit board 31, as shown in FIG. A cream solder 33 is applied to the portion 32 by, for example, screen printing, and the electronic components are placed on the portion in such a manner that the metal plate terminals 10 and 10 come into contact with each other in a predetermined positional relationship. I do. When the electronic components are placed, the lower surfaces of the protrusions 22 to 26 are in contact with the surface of the printed circuit board, whereby the dimensions between the metal plate terminals 10 and 10 and the conductor 32 are regulated, so that the cream solder 33 is suitable. It is present as a layer having a large thickness, preventing the cream solder 33 from protruding extremely, and the convex portion 26 partitions between the metal plate terminals 10 and 10 to prevent electrical conduction by solder. The melting point of solder is 220-230 °
C, and the furnace temperature is around 280 ° C.
After passing through the substrate for 0 seconds, the soldering is completed.

When the printed circuit board 31 passes through the furnace,
Since the first slits 30 are provided in the mounting plate portions on both sides of the metal plate terminals 10, the furnace atmosphere flows into the contact surface between the printed board 31 and the mounting plate 8 through the first slits 30. The first slit 3
The heat is easily transferred by the contact heat transfer of the hot gas or the radiant heat transfer from the heat source through the inside of the inside, and the solder is melted in a shorter time than that without the first slit 30. Therefore, the passage time in the furnace is shortened, and the adverse effects of heat on the electronic components can be reduced accordingly. Further, since the second slit 9 reaches the metal plate terminal 10 from the edge 8a of the mounting plate, the atmosphere in the furnace flows even through the inside of the second slit 9, and heating also proceeds from this portion. . As described above, since the second slit 9 is wider toward the end edge 8a of the mounting plate, the atmosphere in the furnace is more likely to flow in, so that the heating proceeds more rapidly, and thus, such The second
With the configuration having the slit 9, the passage time in the furnace is further reduced.

Further, the edge 10 of the metal plate terminal 10
Since a and 10a have reached the edges 8b and 8c of the mounting plate 8, the state in which the soldering has been completed is a state in which the cream solder 33 shown in FIG. As shown in the figure, the edges 10a, 10a of the metal plate terminals 10, 10 can be visually observed, and the quality of the soldering can be determined.

In the above-described embodiment, the present invention is applied to the mounting plate having a slit as shown in FIG. 3, but the present invention is applied to a mounting plate having a through hole as shown in FIG. It is also effective that the present invention is applied to a mounting plate having a structure in which a metal plate terminal is provided on a plate and the tip of a lead is welded to the terminal. Also,
In the above-described embodiment, the present invention is applied to a cylindrical aluminum electrolytic capacitor. However, the present invention can be applied to other electronic components having leads extending from one end surface.

[0019]

According to the first and second aspects of the present invention, the provision of the first slit can reduce the time required for the solder to pass through the heating furnace, thereby reducing the adverse effects of the electronic components due to heat. The effect that can be performed. According to the third aspect of the present invention, since the metal plate terminal reaches the edge of the mounting plate, it is possible to visually determine the quality of soldering after soldering.

[Brief description of the drawings]

1 shows an embodiment of the present invention, wherein (a) is a partially cutaway front view, (b) is a plan view, (c) is a plan view of only a mounting plate, and (d) is a bottom surface of only a mounting plate. Figure, (e) is E in (d)
FIG. 2F is a cross-sectional view of FIG.

FIG. 2 shows an example of a conventional surface-mount type electronic component, in which (a)
Is a partially broken front view, and (b) is a bottom view.

3A and 3B show an improved surface-mounted electronic component not according to the present invention, wherein FIG. 3A is a partially cutaway front view, and FIG. 3B is a bottom view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Capacitor element 3 Lead 5 Capacitor main body 8 Mounting plate 8a-8c Side edge of mounting plate 9 Second slit 10 Metal plate terminal 10a Edge of metal plate terminal 30 First slit

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Hiroyuki Nakagawa Inventor Nichicon Corporation (72) Inventor Takashi Yokoyama Kyoto-city, Kyoto Nichicon Co., Ltd., 3rd floor of Uehara Building, Nichicon Co., Ltd. (72) Inventor Takeshi Nonoguchi Takeshi Nonoguchi, 191-1, Nakaboshi-cho, Nakagyo-ku, Kyoto-shi, Kyoto Uehara Building 3F Nichicon Corporation

Claims (3)

[Claims] An electronic component main body having a plurality of leads drawn out from the same end surface, and a metal plate having one surface in contact with the end surface of the electronic component body and the leads electrically connected to the other surface. An electronic component comprising an insulating mounting plate provided with terminals, and a first slit provided at both sides of the metal plate terminal from an edge of the mounting plate to an intermediate position of the metal plate terminal. . 2. An electronic component body from which a plurality of leads are drawn out from the same end face, and a metal plate in which one face is in contact with the end face of the electronic component body and the leads are electrically connected to the other face, respectively. A terminal provided with a hole through which the lead can be inserted at a position corresponding to each of the plurality of leads or a second slit that can be inserted through the lead and that is substantially parallel to each other and reaches each of the leads from one side edge. An electronic component comprising: a mounting plate made of a product; and a first slit provided at both sides of the metal plate terminal from an edge of the mounting plate to an intermediate position of the metal plate terminal. 3. The electronic component according to claim 1, wherein an edge of the metal plate terminal located between the first slits reaches an edge of the mounting plate. .