JPH1032138A - Electronic part - Google Patents

Electronic part

Info

Publication number
JPH1032138A
JPH1032138A JP20528096A JP20528096A JPH1032138A JP H1032138 A JPH1032138 A JP H1032138A JP 20528096 A JP20528096 A JP 20528096A JP 20528096 A JP20528096 A JP 20528096A JP H1032138 A JPH1032138 A JP H1032138A
Authority
JP
Japan
Prior art keywords
mounting plate
edge
metal plate
leads
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20528096A
Other languages
Japanese (ja)
Other versions
JP3744611B2 (en
Inventor
Seiichi Nishino
誠一 西野
Kozaburo Okubo
公三郎 大久保
Hiroyuki Nakagawa
博幸 中川
Takashi Yokoyama
孝 横山
Takeshi Nonoguchi
武 野々口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichicon Corp
Original Assignee
Nichicon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichicon Corp filed Critical Nichicon Corp
Priority to JP20528096A priority Critical patent/JP3744611B2/en
Priority to US08/844,496 priority patent/US5880926A/en
Publication of JPH1032138A publication Critical patent/JPH1032138A/en
Application granted granted Critical
Publication of JP3744611B2 publication Critical patent/JP3744611B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads

Abstract

PROBLEM TO BE SOLVED: To facilitate transfer of heat in a furnace to a soldered part when a capacitor, having a surface mounting fitting plate, is heated up in a soldering furnace. SOLUTION: This electronic part is composed of a capacitor main body 5, on which a plurality of leads 3 are led out from the same edge face, and an insulating mounting plate 8 on which a metal terminal 10, whereon its one surface is brought into contact with the edge face of the main body 5 and a lead 3 is electrically connected to the other surface. A recessed groove 27, reaching the outer edge of the mounting plate along the circumference of the metal terminal, is provided on the other surface of the mounting plate 8. The mounting plate 8 has a hole, where the lead can be inserted to the position corresponding to the leads, or it has second slits 9 which reach the lead from the edge 8a and positioned in nearly parallel with each other. The edge 10a of the metal terminal reaches the edge part of the mounting plate, and instead of the recessed groove the first slit 30 is provided to the midway of the metal terminal along both edges of the metal terminal from the edge of the mounting plate.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】この発明は、リード線形式の
電子部品のプリント基板への取付を容易にするために、
その端面に実装用の絶縁板を取付けた、いわゆるリード
レスの電子部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting lead-type electronic components on a printed circuit board.
The present invention relates to a so-called leadless electronic component having a mounting insulating plate attached to its end face.

【０００２】[0002]

【従来の技術】従来のこの種のリードレス電子部品とし
て、例えば特開昭５９−２１１２１３号公報に示されて
いるような電解コンデンサが存在する。このリードレス
アルミ電解コンデンサは、図２に示すように、コンデン
サ素子１を金属ケース２内に収納し、コンデンサ素子１
より伸びるリード３、３をケース２の開口端を封口する
封口部材４を通して引き出してなるコンデンサ本体５
と、このコンデンサ本体５のリード３、３を引き出した
端面に当接され、かつリード３、３が貫通する貫通孔
６、６及び外表面に設けた貫通孔６、６につながる凹溝
７、７を有する絶縁性取付板８とからなり、貫通孔６、
６を貫通したリード３、３の先端部を丸棒のまま、又は
偏平加工を施して凹溝７、７内に納めるように折曲げ、
この折曲げ部から先をプリント基板への半田付部とする
ものである。2. Description of the Related Art As a conventional leadless electronic component of this type, for example, there is an electrolytic capacitor as disclosed in Japanese Patent Application Laid-Open No. Sho 59-212213. In this leadless aluminum electrolytic capacitor, as shown in FIG.
A capacitor body 5 formed by pulling out further extending leads 3 and 3 through a sealing member 4 for sealing an open end of the case 2
A concave groove 7, which is in contact with the end face of the capacitor body 5 from which the leads 3, 3 are drawn out and through which the leads 3, 3 penetrate, and the through holes 6, 6 provided on the outer surface, 7 and an insulating mounting plate 8 having
The leading ends of the leads 3, 3 penetrating 6 are bent as round bars or flattened so as to fit in the concave grooves 7, 7.
The part from the bent part is a part to be soldered to the printed circuit board.

【０００３】しかし、このコンデンサでは、凹溝７、７
内に折曲げて納めたリード３、３の周面の外側部分のみ
が基板への半田付面となるために半田付面積が小さくな
り、コンデンサをプリント基板に面実装する工程におい
て、プリント基板に対するコンデンサの位置決めが困難
である。そして、コンデンサとプリント基板の導体との
接触面積が狭いために相互間に付着する溶融半田量が少
なく、従って、接着強度を十分にとることができない。
また、リード３、３を折曲げる際に内部のコンデンサ素
子１にストレスが加わって特性を劣化させ易く、これを
軽減するためにリード３、３の折曲げ予定箇所に切り込
みを入れるなど、予め折曲げ易くすることも行われてい
るが、これにより、プリント基板に実装したコンデンサ
に衝撃や振動が加わった場合に、リードが折曲げ部で断
線することがある。However, in this capacitor, the grooves 7, 7
Since only the outer portions of the peripheral surfaces of the leads 3 and 3 bent inside are used as the surface to be soldered to the board, the soldering area is reduced, and in the step of surface mounting the capacitor on the printed board, It is difficult to position the capacitor. Since the contact area between the capacitor and the conductor of the printed circuit board is small, the amount of molten solder adhering to each other is small, and therefore, it is not possible to obtain sufficient adhesive strength.
In addition, when the leads 3 and 3 are bent, stress is easily applied to the internal capacitor element 1 to easily deteriorate the characteristics. To reduce this, cuts are made in advance at the portions where the leads 3 and 3 are to be bent. Although it is also easy to bend, when a shock or vibration is applied to the capacitor mounted on the printed circuit board, the lead may be broken at the bent portion.

【０００４】更にこのようなコンデンサには、コンデン
サ素子に取付板を結合する際に、リードを小径の貫通孔
に挿通しなければならぬ問題がある。この挿通作業は、
手作業で行えば極めて非能率的なものとなり、自動化し
ようとすればコンデンサ素子と取付板の相互関係に非常
な高精度を要し、特にリードが細線の場合は２本のリー
ドが必ずしも平行になっていないので、その取扱いが困
難である。そのためにこのような作業を自動化すると、
装置が如何に精巧であっても、リードが貫通孔に挿通さ
れずにコンデンサ本体端面と取付板との間で偏平な塊状
に圧縮された形となり、このようなものが完成品として
送出されることがある。量産工程では、このような不良
品が１個でも発見されると、そのロットの製品の全てを
廃棄することになるので、これによる損害は非常に大き
い。Further, such a capacitor has a problem that a lead must be inserted into a small-diameter through hole when a mounting plate is connected to a capacitor element. This insertion work
It is extremely inefficient if done manually, and if automation is to be attempted, the interrelationship between the capacitor element and the mounting plate requires very high precision, especially if the leads are fine wires, the two leads are not necessarily parallel. It is not easy to handle. For this reason, if we automate such tasks,
No matter how sophisticated the device is, the leads are not inserted into the through-holes but are compressed into a flat mass between the end surface of the capacitor body and the mounting plate, and such a product is sent out as a finished product Sometimes. In the mass production process, if even one such defective product is found, all of the products of the lot are discarded, and the damage caused by this is extremely large.

【０００５】上述のような取付板付きの電解コンデンサ
の問題点を解決するために、図３に示すように貫通孔
６、６の代わりにスリット９、９を取付板８に設けるこ
とが考えられる。同図において、取付板８の外表面に
は、インサート成形により金属板端子１０、１０が接合
されており、取付板８の一側縁８ａから金属板端子１
０、１０へ向けて互いに平行なスリット９、９が設けら
れている。コンデンサ本体５のリード３、３の長さは取
付板８の厚さにほぼ等しく、その間隔はスリット９、９
の間隔にほぼ等しい。In order to solve the above-mentioned problems of the electrolytic capacitor with a mounting plate, it is conceivable to provide slits 9 in the mounting plate 8 instead of the through holes 6 as shown in FIG. . In the figure, metal plate terminals 10 and 10 are joined to the outer surface of the mounting plate 8 by insert molding.
Slits 9, 9 parallel to each other are provided toward 0, 10. The length of the leads 3, 3 of the capacitor body 5 is substantially equal to the thickness of the mounting plate 8, and the interval between the slits 9, 9
Is almost equal to the interval.

【０００６】上述の取付板８とコンデンサ本体５とを結
合する際は、リード３、３を取付板側縁８ａからスリッ
ト９、９内へ導入し、取付板８とコンデンサ本体５との
位置を所定関係に保ち、リード３、３をそれぞれ金属板
端子１０、１０へレーザー溶接する。When connecting the mounting plate 8 and the capacitor body 5, the leads 3, 3 are introduced into the slits 9, 9 from the mounting plate side edge 8a, and the positions of the mounting plate 8 and the capacitor body 5 are adjusted. While maintaining a predetermined relationship, the leads 3, 3 are laser-welded to the metal plate terminals 10, 10, respectively.

【０００７】[0007]

【発明が解決しようとする課題】図３に示したコンデン
サは、リードを小径の貫通孔へ挿通しなくてよいので生
産が容易であり、リードを折曲げなくてよいのでコンデ
ンサ素子への悪影響やリードの断線を回避することがで
きる。また面積が広い金属板端子が存在するため、プリ
ント基板導体への半田付が容易である。例えば、このコ
ンデンサのような電子部品をプリント基板に面実装する
場合、プリント基板表面にクリーム半田をスクリーン印
刷で所定箇所に塗布し、その上に電子部品を載せ、加熱
炉内を通過させることによってクリーム半田を溶解し、
金属板端子をプリント基板に半田付けすることができ
る。しかし、このような半田付けの加熱工程において、
金属板端子は取付板とプリント基板との間にあり、これ
は比較的加熱されにくい所である。一方、過度な加熱は
電子部品の特性、例えばコンデンサ特性に悪影響を与え
ることがあり、炉内温度は少しでも低く、炉内通過時間
は少しでも短いことが望まれる。よって、本発明は、半
田付けの加熱の際に電子部品取付板とプリント基板の半
田付け部に、炉内温度が伝わり易くすることを目的とす
る。The capacitor shown in FIG. 3 is easy to produce because it is not necessary to insert a lead into a small-diameter through hole, and it is not necessary to bend the lead. Disconnection of the lead can be avoided. In addition, since a metal plate terminal having a large area exists, soldering to a printed circuit board conductor is easy. For example, when an electronic component such as a capacitor is surface-mounted on a printed circuit board, cream solder is applied to a predetermined portion of the surface of the printed circuit board by screen printing, the electronic component is placed thereon, and passed through a heating furnace. Dissolve the cream solder,
The metal plate terminals can be soldered to the printed circuit board. However, in such a heating process of soldering,
The metal plate terminals are located between the mounting plate and the printed circuit board, which are relatively difficult to heat. On the other hand, excessive heating may adversely affect the characteristics of electronic components, for example, the characteristics of capacitors, and it is desired that the furnace temperature be slightly lower and the furnace passage time be as short as possible. Accordingly, an object of the present invention is to facilitate transmission of the furnace temperature to a soldering portion between an electronic component mounting plate and a printed circuit board during heating for soldering.

【０００８】[0008]

【課題を解決するための手段】本発明の電子部品は、複
数のリードを同一端面より引き出した電子部品本体と、
この電子部品本体の前記端面に一方の面を当接し他方の
面に前記リードが夫々電気的に接続している金属板端子
を設けられた絶縁物製の取付板とよりなる。また、前記
取付板は、前記複数のリードに夫々対応する位置に前記
リードを挿通できる孔又は前記リードを挿通でき且つ一
側縁より夫々前記各リードに達している互いにほぼ平行
な第２スリットを有するものであってもよい。An electronic component according to the present invention comprises: an electronic component main body having a plurality of leads drawn out from the same end face;
The electronic component body comprises an insulating mounting plate provided with a metal plate terminal in which one surface is in contact with the end surface and the lead is electrically connected to the other surface. Further, the mounting plate has a hole which can insert the lead at a position corresponding to each of the plurality of leads or a second slit which can insert the lead and is substantially parallel to each other and which reaches each of the leads from one side edge. You may have.

【０００９】本発明の特徴として、前記取付板の他方の
面に前記金属板端子の周縁部に沿い且つ取付板の外縁に
達する凹溝を設けてある。また、前記金属板端子の端縁
がそれぞれ前記取付板の縁部に達しており、前記取付板
の縁部から前記金属板端子の両側縁に沿って金属板端子
の中途位置まで前記凹溝に代えて第１スリットが設けら
れているものとするのがよい。As a feature of the present invention, a concave groove is provided on the other surface of the mounting plate along the periphery of the metal plate terminal and reaches the outer edge of the mounting plate. Further, the edge of the metal plate terminal reaches the edge of the mounting plate, and the concave groove extends from the edge of the mounting plate to the middle position of the metal plate terminal along both side edges of the metal plate terminal. Instead, a first slit may be provided.

【００１０】このような本発明は、プリント基板に電子
部品を面実装する際に、プリント基板側の電子部品を接
続する位置の導体部分にクリーム半田を塗布し、この部
分に所定の位置関係で金属板端子が当接するように電子
部品を載置し、炉内を通過させて半田付けするとき、金
属板端子の周縁部に沿って取付板の面に凹溝を設けてあ
ることによって、プリント基板と取付板の接触面の内部
に凹溝を通して炉内雰囲気が流入し易くなり、半田が溶
融し易くなる。なお、電子部品の取付板は合成樹脂によ
り金属板端子をインサートして一体成形され、金属板端
子はプリント基板の導体面に対向する面が樹脂面と同じ
面に露出し、金属板端子厚さ分が合成樹脂内に埋設状態
とされることがあり、これは端子板が取付板の合成樹脂
部分と強固に結合する上で好ましいことであるが、反
面、半田付け加熱の際にプリント基板と取付板の接触面
の内部に炉内雰囲気が流入する部分が殆どなく、このよ
うな場合に前記凹溝内に炉内雰囲気が流入して半田が溶
融し易くなる。According to the present invention, when electronic components are surface-mounted on a printed circuit board, cream solder is applied to a conductor portion of the printed circuit board at a position where the electronic components are connected, and a predetermined positional relationship is applied to this portion. When the electronic components are placed so that the metal plate terminals are in contact with each other and are passed through the furnace and soldered, printing is performed by providing a concave groove on the surface of the mounting plate along the periphery of the metal plate terminals. The atmosphere in the furnace easily flows into the contact surface between the substrate and the mounting plate through the concave groove, and the solder is easily melted. The mounting plate of the electronic component is integrally formed by inserting a metal plate terminal with a synthetic resin. May be embedded in the synthetic resin, which is preferable in that the terminal plate is firmly bonded to the synthetic resin portion of the mounting plate. There is almost no part where the furnace atmosphere flows into the inside of the contact surface of the mounting plate. In such a case, the furnace atmosphere flows into the concave groove and the solder is easily melted.

【００１１】また、金属板端子の端縁が取付板の縁部に
達していることにより、熱伝導率の高い金属板端子の端
縁が炉内雰囲気に晒されて昇温し、その熱が急速に端子
全体に伝わり、半田が溶融し易くなると共に、半田付け
完了後に金属板端子の端縁のプリント基板の導体に対す
る半田付けの良否を目視により観察できるようになる。
また、取付板の縁部から凹溝に代えて第１スリットが設
けられていることによって、より一層プリント基板と取
付板の接触面の内部に炉内雰囲気が流入し易くなり、半
田が溶融し易くなる。Further, since the edge of the metal plate terminal reaches the edge of the mounting plate, the edge of the metal plate terminal having high thermal conductivity is exposed to the atmosphere in the furnace and the temperature rises, and the heat is reduced. The solder is quickly transmitted to the entire terminal, so that the solder is easily melted, and after the soldering is completed, the quality of the soldering of the edge of the metal plate terminal to the conductor of the printed circuit board can be visually observed.
In addition, since the first slit is provided in place of the concave groove from the edge of the mounting plate, the atmosphere in the furnace easily flows into the inside of the contact surface between the printed circuit board and the mounting plate, and the solder melts. It will be easier.

【００１２】[0012]

【発明の実施の形態】本発明の実施の形態を図１を用い
て説明する。この実施の形態の電子部品は円筒形アルミ
電界コンデンサである。同図（ａ）、（ｂ）において、
コンデンサ本体５の端面に絶縁物製の取付板８が当接し
ている。この取付板８は、同図（ｃ）、（ｄ）、（ｅ）
に単独で示すように、上面に凸縁部２０、２１が設けら
れている。そして下面には、対向する側縁８ｂ、８ｃよ
りそれぞれ中心方向に向けて金属板端子１０、１０が設
けられ、また、対向面を半田付けする際の半田層の厚み
に匹敵する小突出量の凸部２２、２３、２４、２５、２
６が下面の四隅と金属板端子１０、１０の間を仕切る位
置とに突設されている。更に下面には、取付板下面に金
属板端子１０、１０の周縁に沿って凹溝２７が設けら
れ、すなわち、この場合は金属板端子１０、１０の外方
端が取付板８の端縁に達しているから凹溝２７が金属板
端子１０、１０の両側と内方端に沿って設けられ、その
凹溝２７の部分が端縁８ｂ、８ｃより夫々に金属板端子
１０、１０の両側に沿って金属板端子の中途まで第１ス
リット３０、３０に形成されている。この第１スリット
３０、３０は省略する場合がありうる。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIG. The electronic component of this embodiment is a cylindrical aluminum electrolytic capacitor. In the figures (a) and (b),
A mounting plate 8 made of an insulating material is in contact with the end face of the capacitor body 5. This mounting plate 8 is shown in FIGS.
As shown solely in FIG. 1, convex portions 20, 21 are provided on the upper surface. On the lower surface, metal plate terminals 10 and 10 are provided from the opposing side edges 8b and 8c, respectively, toward the center, and a small protrusion amount equivalent to the thickness of the solder layer when the opposing surface is soldered. Convex parts 22, 23, 24, 25, 2
6 protrude from the four corners of the lower surface and the position that partitions between the metal plate terminals 10 and 10. Further, on the lower surface, a concave groove 27 is provided on the lower surface of the mounting plate along the periphery of the metal plate terminals 10, 10, that is, in this case, the outer ends of the metal plate terminals 10, 10 are As a result, concave grooves 27 are provided along both sides and the inner ends of the metal plate terminals 10 and 10, and the concave grooves 27 are formed on both sides of the metal plate terminals 10 and 10 from the edges 8b and 8c, respectively. Along the middle of the metal plate terminal, the first slits 30 are formed. The first slits 30 may be omitted in some cases.

【００１３】同図（ａ）に示すように、コンデンサ本体
５の端面からは、取付板８の厚さにほぼ等しい長さのリ
ード３、３が第２スリット９、９の間隔に等しい間隔で
導出されており、これらリード３、３はそれぞれ第２ス
リット９、９の最奥部において金属板端子１０、１０に
レーザー溶接されている。図中、１０ａは金属板端子１
０の端縁であり取付板８の端縁８ｂ、８ｃよりも僅かに
突出している。As shown in FIG. 1A, from the end face of the capacitor body 5, leads 3, 3 having a length substantially equal to the thickness of the mounting plate 8 are arranged at intervals equal to the interval between the second slits 9, 9. The leads 3, 3 are laser-welded to the metal plate terminals 10, 10 at the innermost portions of the second slits 9, 9, respectively. In the figure, 10a is a metal plate terminal 1.
0 and slightly protrudes from the edges 8b and 8c of the mounting plate 8.

【００１４】前記凸縁部２０、２１は、取付板８をコン
デンサ本体５に結合する際に利用される。すなわち、リ
ード３、３が第２スリット９、９に沿って導入されて金
属板端子位置へ到達し、コンデンサ本体５の端面の周縁
部分が凸縁部２０、２１に当接することによってリード
３、３がその位置に規制され、その上で金属板端子１
０、１０に溶接される。これによってリード３、３に過
大な力を与えないで溶接できる。また、第２スリット
９、９は、図３を用いて前述したスリット９、９とは取
付板の端縁８ａに向かって幅が拡大している点で少し相
違する。The protruding edges 20, 21 are used when connecting the mounting plate 8 to the capacitor body 5. That is, the leads 3, 3 are introduced along the second slits 9, 9 to reach the metal plate terminal position, and the periphery of the end face of the capacitor body 5 comes into contact with the protruding edges 20, 21, so that the leads 3, 3 3 is restricted to that position, and the metal plate terminal 1
0 and 10 are welded. Thereby, welding can be performed without giving excessive force to the leads 3, 3. Further, the second slits 9, 9 are slightly different from the slits 9, 9 described above with reference to FIG. 3 in that the width increases toward the edge 8a of the mounting plate.

【００１５】図１（ｄ）における１１は金属板端子１０
に穿設された結合孔であり、取付板８を型成形する際に
インサートされる金属板端子が絶縁物（耐熱性合成樹
脂）からなる取付板本体と強力に結合される。In FIG. 1D, reference numeral 11 denotes a metal plate terminal 10.
The metal plate terminal inserted when the mounting plate 8 is molded is strongly connected to the mounting plate body made of an insulator (heat-resistant synthetic resin).

【００１６】このように構成された電子部品、すなわち
アルミ電解コンデンサは、プリント基板３１に面実装す
る場合、図１（ｆ）に示すように、プリント基板３１側
の電子部品を接続する位置の導体３２の部分にクリーム
半田３３を、例えばスクリーン印刷によって塗布し、こ
の部分に所定の位置関係で金属板端子１０、１０が当接
するように電子部品を載置し、炉内を通過させて半田付
けする。電子部品を載置したとき、プリント基板表面に
は凸部２２〜２６の下面が当接しており、これによって
金属板端子１０、１０と導体３２の間の寸法が規制され
てクリーム半田３３が適当な厚さの層として存在し、ク
リーム半田３３の極端なはみ出しが防止され、また凸部
２６は金属板端子１０、１０間を区画して半田による電
気的な導通を防止する。半田の融点は２２０〜２３０°
Ｃであり、炉温は２８０°Ｃ前後で、この中を１０〜２
０秒かけて基板を通過させると、半田付けが完了する。When the thus constructed electronic component, that is, the aluminum electrolytic capacitor is surface-mounted on the printed board 31, as shown in FIG. 1 (f), the conductor at the position where the electronic component on the printed board 31 is connected is connected. A cream solder 33 is applied to the portion 32 by, for example, screen printing, and the electronic components are placed on the portion in such a manner that the metal plate terminals 10 and 10 come into contact with each other in a predetermined positional relationship. I do. When the electronic components are placed, the lower surfaces of the protrusions 22 to 26 are in contact with the surface of the printed circuit board, whereby the dimensions between the metal plate terminals 10 and 10 and the conductor 32 are regulated, so that the cream solder 33 is suitable. It is present as a layer having a large thickness, preventing the cream solder 33 from protruding extremely, and the convex portion 26 partitions between the metal plate terminals 10 and 10 to prevent electrical conduction by solder. The melting point of solder is 220-230 °
C, and the furnace temperature is around 280 ° C.
After passing through the substrate for 0 seconds, the soldering is completed.

【００１７】プリント基板３１が炉内を通過するとき、
金属板端子１０、１０の両側の取付板部分に凹溝２７及
び第１スリット３０又は凹溝２７のみを設けてあること
によって、第１スリット３０及びこれに続く凹溝２７内
を通って、第１スリット３０がない場合には凹溝２７内
を通ってプリント基板３１と取付板８の接触面の内部に
炉内雰囲気が流入し易くなり、すなわち第１スリット３
０内を通って熱ガスの接触伝熱や熱源からの放射伝熱に
よる熱の移動が行われやすくなり、凹溝２７及び第１ス
リット３０がないものよりも短い時間で半田が溶融す
る。従って、炉内通過時間が短縮され、その分電子部品
が受ける熱による悪影響を軽減できる。また、第２スリ
ット９が取付板の端縁８ａから金属板端子１０にに達し
ているから、この第２スリット９内を通っても炉内雰囲
気が流入し、この部分からも加熱が進行する。そして前
述したように第２スリット９は取付板の端縁８ａに向か
って幅が広くなっていることにより、炉内雰囲気がより
流入し易いから、加熱がより急速に進行し、従って、こ
のような第２スリット９を有する構成のものではより炉
内通過時間が短縮される。When the printed circuit board 31 passes through the furnace,
Since only the concave groove 27 and the first slit 30 or the concave groove 27 are provided in the mounting plate portions on both sides of the metal plate terminals 10 and 10, the first slit 30 and the concave groove 27 following the first slit 30 are passed through. If the first slit 30 is not provided, the atmosphere in the furnace easily flows into the contact surface between the printed board 31 and the mounting plate 8 through the concave groove 27, that is, the first slit 3
The heat is easily transferred by contact heat transfer of the hot gas or radiant heat transfer from the heat source through the inside of the inside, and the solder is melted in a shorter time than that without the concave groove 27 and the first slit 30. Therefore, the passage time in the furnace is shortened, and the adverse effects of heat on the electronic components can be reduced accordingly. Further, since the second slit 9 reaches the metal plate terminal 10 from the edge 8a of the mounting plate, the atmosphere in the furnace flows even through the inside of the second slit 9, and heating also proceeds from this portion. . As described above, since the second slit 9 becomes wider toward the edge 8a of the mounting plate, the atmosphere in the furnace is more likely to flow in, so that the heating proceeds more rapidly, and thus, the second slit 9 has such a structure. With the structure having the second slit 9, the passage time in the furnace is further shortened.

【００１８】また、金属板端子１０、１０の端縁１０
ａ、１０ａが取付板８の端縁８ｂ、８ｃに達しているこ
とから、半田付けを終了した状態は図１（ｆ）に示すク
リーム半田３３が溶融してほぼそのまま凝固した状態で
あり、同図に見られるように金属板端子１０、１０の端
縁１０ａ、１０ａを目視により観察でき、半田付けの良
否を判断できる。Further, the edge 10 of the metal plate terminal 10
Since a and 10a have reached the edges 8b and 8c of the mounting plate 8, the state in which the soldering has been completed is a state in which the cream solder 33 shown in FIG. As shown in the figure, the edges 10a, 10a of the metal plate terminals 10, 10 can be visually observed, and the quality of the soldering can be determined.

【００１９】上述した実施の形態では、図３に示したよ
うなスリットを有する構成の取付板に本発明を実施した
ものであるが、本発明は図２に示したような貫通孔を有
する取付板に金属板端子を設け、これにリードの先端を
溶接する構成の取付板に実施しても有効である。また、
上述の実施の形態は、本発明を円筒形アルミ電解コンデ
ンサに実施したものであるが、本発明は同様に一端面よ
りリードが導出されている他の電子部品にも実施でき
る。In the above-described embodiment, the present invention is applied to the mounting plate having a slit as shown in FIG. 3, but the present invention is applied to a mounting plate having a through hole as shown in FIG. It is also effective that the present invention is applied to a mounting plate having a structure in which a metal plate terminal is provided on a plate and the tip of a lead is welded to the terminal. Also,
In the above-described embodiment, the present invention is applied to a cylindrical aluminum electrolytic capacitor. However, the present invention can be applied to other electronic components having leads extending from one end surface.

【００２０】[0020]

【発明の効果】請求項１、請求項２に記載の発明は、凹
溝を設けたことにより、半田付けのための加熱炉内通過
時間を短縮できるから、電子部品の熱による悪影響を軽
減できる効果を奏する。請求項３に記載の発明は、金属
板端子が取付板の端縁に達していて第２スリットを設け
てあるから、より一層半田付けのための加熱炉内通過時
間を短縮でき、電子部品の熱による悪影響をより軽減で
きる効果を奏する。また、金属板端子が取付板の端縁に
達しているから、半田付け後の、半田付けの良否を目視
により判断できる効果を奏する。According to the first and second aspects of the present invention, the provision of the concave groove can shorten the time required for the soldering to pass through the heating furnace, thereby reducing the adverse effects of heat on the electronic components. It works. According to the third aspect of the present invention, since the metal plate terminal reaches the edge of the mounting plate and is provided with the second slit, the passage time in the heating furnace for soldering can be further shortened, and the electronic component can be used. This has the effect of further reducing the adverse effects of heat. Further, since the metal plate terminal reaches the edge of the mounting plate, there is an effect that the quality of soldering after soldering can be visually judged.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の一実施の形態を示し、（ａ）は部分破
断正面図、（ｂ）は平面図、（ｃ）は取付板のみの平面
図、（ｄ）は取付板のみの底面図、（ｅ）は（ｄ）のＥ
−Ｅ断面図、（ｆ）は（ａ）のＦ−Ｆ断面部分拡大図で
ある。1 shows an embodiment of the present invention, wherein (a) is a partially cutaway front view, (b) is a plan view, (c) is a plan view of only a mounting plate, and (d) is a bottom surface of only a mounting plate. Figure, (e) is E in (d)
FIG. 2F is a cross-sectional view of FIG.

【図２】従来の面実装型電子部品の一例を示し、（ａ）
は部分破断正面図、（ｂ）は底面図である。FIG. 2 shows an example of a conventional surface-mount type electronic component, in which (a)
Is a partially broken front view, and (b) is a bottom view.

【図３】本発明によらない改良された面実装型電子部品
を示し、（ａ）は部分破断正面図、（ｂ）は底面図であ
る。3A and 3B show an improved surface-mounted electronic component not according to the present invention, wherein FIG. 3A is a partially cutaway front view, and FIG. 3B is a bottom view.

【符号の説明】[Explanation of symbols]

１ コンデンサ素子 ３ リード ５ コンデンサ本体 ８ 取付板 ８ａ〜８ｃ 取付板の側縁 ９ 第２スリット １０ 金属板端子 １０ａ 金属板端子の端縁 ２７ 凹溝 ３０ 第１スリット REFERENCE SIGNS LIST 1 capacitor element 3 lead 5 capacitor body 8 mounting plate 8 a to 8 c side edge of mounting plate 9 second slit 10 metal plate terminal 10 a edge of metal plate terminal 27 concave groove 30 first slit

───────────────────────────────────────────────────── フロントページの続き (72)発明者 中川 博幸 京都府京都市中京区御池通烏丸東入一筋目 仲保利町191番地の４ 上原ビル３階 ニ チコン株式会社内 (72)発明者 横山 孝 京都府京都市中京区御池通烏丸東入一筋目 仲保利町191番地の４ 上原ビル３階 ニ チコン株式会社内 (72)発明者 野々口 武 京都府京都市中京区御池通烏丸東入一筋目 仲保利町191番地の４ 上原ビル３階 ニ チコン株式会社内 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Hiroyuki Nakagawa Inventor Nichicon Corporation (72) Inventor Takashi Yokoyama Kyoto-city, Kyoto Nichicon Co., Ltd., 3rd floor of Uehara Building, Nichicon Co., Ltd. (72) Inventor Takeshi Nonoguchi Takeshi Nonoguchi, 191-1, Nakaboshi-cho, Nakagyo-ku, Kyoto-shi, Kyoto Uehara Building 3F Nichicon Corporation

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】 複数のリードを同一端面より引き出した
電子部品本体と、この電子部品本体の前記端面に一方の
面を当接し他方の面に前記リードが夫々電気的に接続し
ている金属板端子を設けられた絶縁物製の取付板とより
なり、前記取付板の他方の面に前記金属板端子の周縁部
に沿い且つ取付板の外縁に達する凹溝を設けたことを特
徴とする電子部品。An electronic component main body having a plurality of leads drawn out from the same end surface, and a metal plate having one surface in contact with the end surface of the electronic component body and the leads electrically connected to the other surface. An electronic device comprising: a mounting plate made of an insulator provided with terminals; and a concave groove provided along the periphery of the metal plate terminal and reaching the outer edge of the mounting plate on the other surface of the mounting plate. parts. 【請求項２】 複数のリードを同一端面より引き出した
電子部品本体と、この電子部品本体の前記端面に一方の
面を当接し他方の面に前記リードが夫々電気的に接続さ
れている金属板端子を設けられ、前記複数のリードに夫
々対応する位置に前記リードを挿通できる孔又は前記リ
ードを挿通でき且つ一側縁より夫々前記各リードに達し
ている互いにほぼ平行な第２スリットを有する絶縁物製
の取付板とよりなり、前記取付板の他方の面に前記金属
板端子の周縁部に沿い且つ取付板の外縁に達する凹溝を
設けたことを特徴とする電子部品。2. An electronic component body from which a plurality of leads are drawn out from the same end face, and a metal plate in which one face is in contact with the end face of the electronic component body and the leads are electrically connected to the other face, respectively. A terminal provided with a hole through which the lead can be inserted at a position corresponding to each of the plurality of leads or a second slit that can be inserted through the lead and that is substantially parallel to each other and reaches each of the leads from one side edge. An electronic component, comprising: a mounting plate made of a product; and a concave groove extending along a peripheral portion of the metal plate terminal and reaching an outer edge of the mounting plate on the other surface of the mounting plate. 【請求項３】 前記金属板端子の端縁がそれぞれ前記取
付板の縁部に達しており、前記取付板の縁部から前記金
属板端子の両側縁に沿って金属板端子の中途まで前記凹
溝に代えて第１スリットが設けられていることを特徴と
する請求項１、または請求項２に記載の電子部品。3. An edge of the metal plate terminal reaches an edge of the mounting plate, and the concave portion extends from the edge of the mounting plate to a middle of the metal plate terminal along both side edges of the metal plate terminal. The electronic component according to claim 1, wherein a first slit is provided instead of the groove.
JP20528096A 1996-04-19 1996-07-15 Electronic components Expired - Lifetime JP3744611B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP20528096A JP3744611B2 (en) 1996-07-15 1996-07-15 Electronic components
US08/844,496 US5880926A (en) 1996-04-19 1997-04-18 Electronic device with mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20528096A JP3744611B2 (en) 1996-07-15 1996-07-15 Electronic components

Publications (2)

Publication Number Publication Date
JPH1032138A true JPH1032138A (en) 1998-02-03
JP3744611B2 JP3744611B2 (en) 2006-02-15

Family

ID=16504370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20528096A Expired - Lifetime JP3744611B2 (en) 1996-04-19 1996-07-15 Electronic components

Country Status (1)

Country Link
JP (1) JP3744611B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007081250A (en) * 2005-09-15 2007-03-29 Tdk Corp Face mounted electronic component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007081250A (en) * 2005-09-15 2007-03-29 Tdk Corp Face mounted electronic component

Also Published As

Publication number Publication date
JP3744611B2 (en) 2006-02-15

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