JPH10308374A - 洗浄方法及び洗浄装置 - Google Patents

洗浄方法及び洗浄装置

Info

Publication number
JPH10308374A
JPH10308374A JP10073255A JP7325598A JPH10308374A JP H10308374 A JPH10308374 A JP H10308374A JP 10073255 A JP10073255 A JP 10073255A JP 7325598 A JP7325598 A JP 7325598A JP H10308374 A JPH10308374 A JP H10308374A
Authority
JP
Japan
Prior art keywords
cleaning
wafer
nozzle
cleaned
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10073255A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10308374A5 (enExample
Inventor
Toshimi Hamada
聡美 濱田
Toshiro Maekawa
敏郎 前川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP10073255A priority Critical patent/JPH10308374A/ja
Publication of JPH10308374A publication Critical patent/JPH10308374A/ja
Publication of JPH10308374A5 publication Critical patent/JPH10308374A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP10073255A 1997-03-06 1998-03-06 洗浄方法及び洗浄装置 Pending JPH10308374A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10073255A JPH10308374A (ja) 1997-03-06 1998-03-06 洗浄方法及び洗浄装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP6916797 1997-03-06
JP9-69167 1997-03-06
JP10073255A JPH10308374A (ja) 1997-03-06 1998-03-06 洗浄方法及び洗浄装置

Publications (2)

Publication Number Publication Date
JPH10308374A true JPH10308374A (ja) 1998-11-17
JPH10308374A5 JPH10308374A5 (enExample) 2005-07-14

Family

ID=26410364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10073255A Pending JPH10308374A (ja) 1997-03-06 1998-03-06 洗浄方法及び洗浄装置

Country Status (1)

Country Link
JP (1) JPH10308374A (enExample)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100345258C (zh) * 2002-12-25 2007-10-24 株式会社瑞萨科技 半导体器件的制造方法
WO2008111205A1 (ja) * 2007-03-15 2008-09-18 Fujitsu Microelectronics Limited 半導体装置の製造方法、ウエハ、及びウエハの洗浄装置
JP2011066301A (ja) * 2009-09-18 2011-03-31 Dainippon Screen Mfg Co Ltd 基板洗浄装置および基板洗浄方法
CN102140669A (zh) * 2011-03-17 2011-08-03 上海集成电路研发中心有限公司 硅片电镀铜后的清洗方法
JP2011181644A (ja) * 2010-03-01 2011-09-15 Ebara Corp 基板洗浄方法及び基板洗浄装置
CN102574169A (zh) * 2009-08-26 2012-07-11 南安普敦大学 清洁装置和方法及其监测
KR20130043071A (ko) 2011-10-19 2013-04-29 가부시키가이샤 에바라 세이사꾸쇼 기판 세정 방법 및 기판 세정 장치
JP2015020323A (ja) * 2013-07-18 2015-02-02 キヤノン株式会社 記録ヘッド用基板の洗浄方法
US9011605B2 (en) 2011-05-25 2015-04-21 Ebara Corporation Substrate cleaning method and roll cleaning member
US9058977B2 (en) 2012-12-06 2015-06-16 Ebara Corporation Substrate cleaning apparatus and substrate cleaning method
TWI501342B (zh) * 2011-06-10 2015-09-21 Ebara Corp 洗淨性能預測方法及基板洗淨方法
US9640384B2 (en) 2012-12-28 2017-05-02 Ebara Corporation Substrate cleaning apparatus and substrate cleaning method
US10737301B2 (en) 2012-12-28 2020-08-11 Ebara Corporation Substrate cleaning apparatus
CN112815247A (zh) * 2020-12-28 2021-05-18 安徽明威照明器材有限公司 具有自动除尘功能的筒灯
CN112879829A (zh) * 2020-12-28 2021-06-01 安徽明威照明器材有限公司 具有自动除尘功能的插地式景观灯
JP2022103614A (ja) * 2020-12-28 2022-07-08 株式会社荏原製作所 基板洗浄装置、基板の洗浄方法
CN115090596A (zh) * 2022-07-12 2022-09-23 江苏芯梦半导体设备有限公司 基于兆声波技术的晶圆清洗设备及清洗方法

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100345258C (zh) * 2002-12-25 2007-10-24 株式会社瑞萨科技 半导体器件的制造方法
WO2008111205A1 (ja) * 2007-03-15 2008-09-18 Fujitsu Microelectronics Limited 半導体装置の製造方法、ウエハ、及びウエハの洗浄装置
CN102574169A (zh) * 2009-08-26 2012-07-11 南安普敦大学 清洁装置和方法及其监测
JP2011066301A (ja) * 2009-09-18 2011-03-31 Dainippon Screen Mfg Co Ltd 基板洗浄装置および基板洗浄方法
JP2011181644A (ja) * 2010-03-01 2011-09-15 Ebara Corp 基板洗浄方法及び基板洗浄装置
CN102140669A (zh) * 2011-03-17 2011-08-03 上海集成电路研发中心有限公司 硅片电镀铜后的清洗方法
US9011605B2 (en) 2011-05-25 2015-04-21 Ebara Corporation Substrate cleaning method and roll cleaning member
TWI501342B (zh) * 2011-06-10 2015-09-21 Ebara Corp 洗淨性能預測方法及基板洗淨方法
KR20130043071A (ko) 2011-10-19 2013-04-29 가부시키가이샤 에바라 세이사꾸쇼 기판 세정 방법 및 기판 세정 장치
US9058977B2 (en) 2012-12-06 2015-06-16 Ebara Corporation Substrate cleaning apparatus and substrate cleaning method
US9640384B2 (en) 2012-12-28 2017-05-02 Ebara Corporation Substrate cleaning apparatus and substrate cleaning method
US10737301B2 (en) 2012-12-28 2020-08-11 Ebara Corporation Substrate cleaning apparatus
JP2015020323A (ja) * 2013-07-18 2015-02-02 キヤノン株式会社 記録ヘッド用基板の洗浄方法
CN112815247A (zh) * 2020-12-28 2021-05-18 安徽明威照明器材有限公司 具有自动除尘功能的筒灯
CN112879829A (zh) * 2020-12-28 2021-06-01 安徽明威照明器材有限公司 具有自动除尘功能的插地式景观灯
JP2022103614A (ja) * 2020-12-28 2022-07-08 株式会社荏原製作所 基板洗浄装置、基板の洗浄方法
CN112879829B (zh) * 2020-12-28 2024-04-19 安徽明威照明器材有限公司 具有自动除尘功能的插地式景观灯
CN112815247B (zh) * 2020-12-28 2024-04-26 安徽明威照明器材有限公司 具有自动除尘功能的筒灯
CN115090596A (zh) * 2022-07-12 2022-09-23 江苏芯梦半导体设备有限公司 基于兆声波技术的晶圆清洗设备及清洗方法
CN115090596B (zh) * 2022-07-12 2023-09-05 江苏芯梦半导体设备有限公司 基于兆声波技术的晶圆清洗设备及清洗方法

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