JPH10303533A5 - - Google Patents

Info

Publication number
JPH10303533A5
JPH10303533A5 JP1997121533A JP12153397A JPH10303533A5 JP H10303533 A5 JPH10303533 A5 JP H10303533A5 JP 1997121533 A JP1997121533 A JP 1997121533A JP 12153397 A JP12153397 A JP 12153397A JP H10303533 A5 JPH10303533 A5 JP H10303533A5
Authority
JP
Japan
Prior art keywords
sheet
wiring
metal material
insulating layer
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997121533A
Other languages
English (en)
Japanese (ja)
Other versions
JP3883643B2 (ja
JPH10303533A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP12153397A priority Critical patent/JP3883643B2/ja
Priority claimed from JP12153397A external-priority patent/JP3883643B2/ja
Publication of JPH10303533A publication Critical patent/JPH10303533A/ja
Publication of JPH10303533A5 publication Critical patent/JPH10303533A5/ja
Application granted granted Critical
Publication of JP3883643B2 publication Critical patent/JP3883643B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP12153397A 1997-04-25 1997-04-25 配線形成方法およびそれに用いられる２層基板 Expired - Fee Related JP3883643B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12153397A JP3883643B2 (ja) 1997-04-25 1997-04-25 配線形成方法およびそれに用いられる２層基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12153397A JP3883643B2 (ja) 1997-04-25 1997-04-25 配線形成方法およびそれに用いられる２層基板

Publications (3)

Publication Number Publication Date
JPH10303533A JPH10303533A (ja) 1998-11-13
JPH10303533A5 true JPH10303533A5 (enExample) 2005-04-07
JP3883643B2 JP3883643B2 (ja) 2007-02-21

Family

ID=14813603

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12153397A Expired - Fee Related JP3883643B2 (ja) 1997-04-25 1997-04-25 配線形成方法およびそれに用いられる２層基板

Country Status (1)

Country Link
JP (1) JP3883643B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004080141A1 (ja) * 2003-03-04 2004-09-16 Zeon Corporation 多層プリント配線板の製造方法および多層プリント配線板
KR100967362B1 (ko) 2008-02-28 2010-07-05 재단법인서울대학교산학협력재단 스트레칭 및 벤딩이 가능한 배선구조체 및 이의 제조방법
KR101372505B1 (ko) * 2010-01-18 2014-03-11 서울대학교산학협력단 스트레칭 및 벤딩이 가능한 배선구조체 및 이의 제조방법
KR101133049B1 (ko) 2010-07-22 2012-04-04 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판 제조방법
KR101081588B1 (ko) 2010-08-03 2011-11-08 삼성전기주식회사 도금층 형성방법 및 이를 이용한 회로기판 제조방법

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