JP3883643B2 - 配線形成方法およびそれに用いられる2層基板 - Google Patents
配線形成方法およびそれに用いられる2層基板 Download PDFInfo
- Publication number
- JP3883643B2 JP3883643B2 JP12153397A JP12153397A JP3883643B2 JP 3883643 B2 JP3883643 B2 JP 3883643B2 JP 12153397 A JP12153397 A JP 12153397A JP 12153397 A JP12153397 A JP 12153397A JP 3883643 B2 JP3883643 B2 JP 3883643B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- layer
- forming
- sheet
- metal material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Chemically Coating (AREA)
- ing And Chemical Polishing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12153397A JP3883643B2 (ja) | 1997-04-25 | 1997-04-25 | 配線形成方法およびそれに用いられる2層基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12153397A JP3883643B2 (ja) | 1997-04-25 | 1997-04-25 | 配線形成方法およびそれに用いられる2層基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH10303533A JPH10303533A (ja) | 1998-11-13 |
| JPH10303533A5 JPH10303533A5 (enExample) | 2005-04-07 |
| JP3883643B2 true JP3883643B2 (ja) | 2007-02-21 |
Family
ID=14813603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12153397A Expired - Fee Related JP3883643B2 (ja) | 1997-04-25 | 1997-04-25 | 配線形成方法およびそれに用いられる2層基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3883643B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004080141A1 (ja) * | 2003-03-04 | 2004-09-16 | Zeon Corporation | 多層プリント配線板の製造方法および多層プリント配線板 |
| KR100967362B1 (ko) | 2008-02-28 | 2010-07-05 | 재단법인서울대학교산학협력재단 | 스트레칭 및 벤딩이 가능한 배선구조체 및 이의 제조방법 |
| KR101372505B1 (ko) * | 2010-01-18 | 2014-03-11 | 서울대학교산학협력단 | 스트레칭 및 벤딩이 가능한 배선구조체 및 이의 제조방법 |
| KR101133049B1 (ko) | 2010-07-22 | 2012-04-04 | 삼성전기주식회사 | 인쇄회로기판 및 인쇄회로기판 제조방법 |
| KR101081588B1 (ko) | 2010-08-03 | 2011-11-08 | 삼성전기주식회사 | 도금층 형성방법 및 이를 이용한 회로기판 제조방법 |
-
1997
- 1997-04-25 JP JP12153397A patent/JP3883643B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10303533A (ja) | 1998-11-13 |
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