JPH10256279A - Support substrate and manufacture therefor, electronic part device, and support-substrate surface treatment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve reflow crack resistance which depends on bonding material by increasing adhesion between an electronic part and a support substrate. SOLUTION: A support substrate (a lead frame, an insulating substrate or the like), on which the electronic part (a semiconductor chip, a transistor or the like) is mounted, is dipped into a solvent, containing 0.001 to 10wt.% of silane coupling agent for 0.5 to 10 minutes, then taken out, and dried while being heated. A semiconductor chip is attached to the surface-treated support substrate by using organic bonding material (silver paste, silver-filler containing film-type adhesive or the like). As a silane-coupling agent, γ- glycidoxipropyltrimethoxy silane, γ-aminopropyltriethoxy silane or the like may be used.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a support substrate for mounting an electronic component such as a semiconductor device, a method of manufacturing the support substrate, an electronic component device, and a surface treatment method of the support substrate.

[0002]

2. Description of the Related Art As a method of bonding an electronic component such as a semiconductor element to a support substrate, a method of supplying a die bonding material onto the support substrate and bonding the electronic component has been used. As the die bonding material used for this purpose, for example, Au-Si eutectic, solder, resin paste, resin film adhesive and the like are known. Among them, the Au-Si eutectic is expensive and has a high modulus of elasticity, and has a problem that the bonded portion must be vibrated. Further, there is a problem that the solder cannot withstand the temperature higher than the melting point temperature and has a high elastic modulus. Resin pastes and resin film adhesives are inexpensive, have high heat resistance, and have a low modulus of elasticity. Therefore, they are most often used as adhesives for bonding electronic components to a support substrate.

[0003]

In recent years, the demand for high-density mounting due to the miniaturization and thinning of electronic devices has been rapidly increasing in recent years. The mounting type has become mainstream. This surface-mount type semiconductor package is mounted by heating by infrared reflow, vapor phase reflow, solder dip, or the like in order to solder it to a printed board or the like.
At this time, since the entire package is exposed to a high temperature of 210 ° C. to 260 ° C., if moisture exists inside the package, cracks (so-called “reflow cracks”) occur in the package due to rapid vaporization of the moisture. Since the reflow crack significantly reduces the reliability of the package, it has become a serious problem and technical problem especially in a thin package. An object of the present invention is to increase the adhesive strength between an electronic component and a support substrate to improve the reflow crack resistance caused by the bonding material.

[0004]

The mechanism of occurrence of reflow cracks caused by the bonding material is estimated to be as follows. In other words, (1) the bonding material absorbs moisture during storage of the package, (2) this moisture is vaporized by heating during mounting of reflow soldering, and (3) the vapor pressure causes destruction or peeling of the bonding material,
(4) Reflow cracks occur. The present inventors have focused on increasing the adhesive strength between the electronic component and the support substrate and made various studies. As a result, the surface of the support substrate was treated with a silane coupling agent to increase the adhesive force between the electronic component and the support substrate. It has been found that reflow crackability can be improved.

That is, the present invention provides a support substrate on which electronic components are mounted via an organic bonding material, the surface of which is treated with a silane coupling agent. The present invention also provides a method of manufacturing a support substrate, wherein at least a surface of the support substrate on which the electronic component is mounted via the organic bonding material is in contact with the organic bonding material, using a silane coupling agent. Further, the present invention provides an electronic component device including a support substrate having a surface treated with a silane coupling agent, an organic bonding material layer formed on an electronic component mounting portion of the support substrate, and an electronic component mounted on the organic bonding material layer. Also provide. The present invention also provides a surface treatment method for a support substrate, wherein the support substrate on which an electronic component is mounted is treated with a silane coupling agent via an organic bonding material.

The silane coupling agent which can be used here is usually of the formula YSiX ₃ (where Y is a functional group
And X is a monovalent group which has hydrolyzability and is bonded to Si). Examples of the functional group in Y include groups such as vinyl, amino, epoxy, chloro, mercapto, methacryloxy, cyano, carbamate, pyridine, sulfonyl azide, urea, styryl, chloromethyl, ammonium salt, and alcohol. X includes, for example, chloro, methoxy, ethoxy, methoxyethoxy and the like.

Specific examples of the silane coupling agent include vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (2-methoxyethoxy) silane, vinyltriacetoxysilane, γ-chloropropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ- (2-aminoethyl) -aminopropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ) Ethyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, N, N-dimethylaminophenyltriethoxysilane, trimethoxysilylbenzoic acid, chloromethylphenethyltrimethoxysilane, 2-styryle Le triethoxysilane, aminoethyl aminomethyl phenethyltrimethoxysilane,
γ-chlorophenyltrimethoxysilane, N-phenylaminopropyltrimethoxysilane, allyltriethoxysilane, 3-aminopropylmethyldiethoxysilane, 3-aminotrimethoxysilane, bis (2-hydroxyethyl) aminopropyltriethoxysilane, Bis [3- (triethoxysilyl) propyl] amine bis [3- (trimethoxysilyl) propyl] ethylenediamine;

2-chloroethyltriethoxysilane, chloromethyltriethoxysilane, chlorophenyltriethoxysilane, 3-cyanopropyltriethoxysilane, N, N-diethyl-3-aminopropyltrimethoxysilane, N, N-diethylamino Phenyltriethoxysilane, 1- (dimethylchlorosilyl) -2- (chloromethylphenyl) ethane, isosinane-propyltriethoxysilane, mercaptoethyltriethoxysilane, methacryloxyethyldimethyl (3-trimethoxysilylpropyl) ammonium chloride , N-methylaminopropyltriethoxysilane, 3- (N-styrylmethyl-2-aminoethylamino) propyltrimethoxysilane hydrochloride, 1-trichlorosilyl-2- (chloromethylphenyl) ) Ethane, beta-trichlorosilyl -
4-ethylpyridine, triethoxysilylpropylethyl carbamate, N- (triethoxysilylpropyl)
Urea, 1-trimethoxysilyl-2- (aminomethyl)
Phenylethane, 1-trimethoxysilyl-2- (chloromethyl) phenylethane, 2- (trimethoxysilyl) ethylphenylsulfonyl azide, trimethoxysilylpropylallylamine, trimethoxysilylpropyldiethylenetriamine, p-aminophenyltrimethoxysilane, 2-styrylethyltrimethoxysilane,
Examples thereof include aminoethylmethylphenethyltrimethoxysilane and the like, and these can be used in combination.

The silane coupling agent includes epoxy resin, phenol resin, bismaleimide resin, cyanate ester resin, acrylic resin, methacrylic resin, polystyrene, polyimide, polyamide, polyester, siloxane polyimide, polyetherimide, polyesterimide and the like. May be contained. When these resins are used, a curing agent, a curing accelerator, a catalyst, and the like may be used as necessary.

When the above-mentioned silane coupling agent itself is in a liquid state, it can be used as it is as a treatment liquid used for treating the surface of the supporting substrate, but it is usually used as a solution of water or an organic solvent. Preferably, it is used. The organic solvent is not particularly limited as long as it can dissolve the silane coupling agent and other components. In addition to alcohols such as methanol, ethanol, propyl alcohol, and isopropyl alcohol, acetone, methyl ethyl ketone, methyl isobutyl ketone, benzene, toluene, xylene, dimethylformamide, dimethylacetamide, N-methyl-2-pyrrolidone, methyl cellosolve, ethyl cellosolve, and dioxane , Tetrahydrofuran, ethylene glycol dimethyl ether and the like, and these may be used as a mixture of two or more kinds including water. The concentration of the silane coupling agent in the treatment liquid is 0.001 to 10% by weight, preferably 0.01 to 5% by weight. If it is less than 0.001% by weight, the effect of improving the adhesive strength is small, and if it is more than 10% by weight, the reliability of the package is reduced. The temperature and time of the treatment are not particularly limited, but are usually 0 to 100.
C., 0.5 seconds to 10 minutes, preferably 20 to 50 ° C., 5
Seconds to 3 minutes. The support substrate treated with the treatment liquid is preferably used after drying. The drying condition at this time is not particularly limited as long as a solvent such as water and alcohol can be removed, but the drying can be usually performed at room temperature to 150 ° C. for 5 seconds to 2 hours.

As a method of treating the supporting substrate with the silane coupling agent, a method of dipping the entire substrate into a treatment liquid, a method of coating commonly used such as spraying, brush coating, spin coating and the like are used. You.
With respect to the surface of the support substrate to be processed, only the portion in contact with the organic bonding material may be processed, or the entire support substrate may be processed. Further, before the treatment with the silane coupling agent, the support substrate may be pretreated. Examples of the pretreatment method include degreasing cleaning with an organic solvent, cleaning with an alkali, cleaning with an acid, and the like, and a preferable method is appropriately selected depending on the type of the supporting substrate. This is particularly effective when the dispersion of the adhesive force is large. This treatment serves to keep the surface state of the support substrate constant, and is preferably performed immediately before the treatment with the silane coupling agent.

An electronic component is adhered to the supporting substrate subjected to the surface treatment in this manner via an organic bonding material to obtain an electronic component device. In this case, the electronic component may be bonded after the organic bonding material layer is formed on the support substrate in advance, or the organic bonding material layer may be formed on the bonding surface side of the electronic component and then bonded to the support substrate. Alternatively, the support substrate, the organic bonding material, and the electronic component may be bonded together. In any case, the positional relationship between the support substrate, the organic bonding material, and the electronic component is a positional relationship in which the organic bonding material exists between the support substrate and the electronic component.

The support substrate used in the present invention includes a lead frame, an insulating substrate, a substrate with wiring, and the like.

As the organic bonding material, epoxy resin, phenol resin, bismaleimide resin, cyanate ester resin, acrylic resin, methacrylic resin,
Polystyrene, polyimide, polyamide, polyester, siloxane polyimide, polyetherimide, and polyesterimide are preferably used. These resins are 2
More than one kind may be mixed and used. In addition, as the organic bonding material, a liquid, a paste, a film, and the like can be used without particular limitation. Further, in the case of a liquid or paste form, an organic solvent may be used. A filler may be used as necessary for the organic bonding material. As the filler, conductive fillers such as silver, gold, copper, iron, aluminum, and carbon, and non-conductive fillers such as boron nitride, aluminum nitride, silica, alumina, and silicon carbide are used. It is not limited, and two or more kinds may be used as a mixture.

The electronic components to be bonded include active elements such as semiconductor chips, transistors, diodes and thyristors, and passive elements such as capacitors, resistors and coils. The electronic component device on which the electronic component is mounted as described above is connected by wire bonding or the like as necessary, and is sealed with a mold resin, a potting resin, or the like to form a package.

[0016]

Embodiments of the present invention will be described below with reference to examples. The treatment liquid (solution of the silane coupling agent) used in the following examples is as follows. <Treatment liquid 1> 0.1% by weight aqueous solution of γ-glycidoxypropyltrimethoxysilane <Treatment liquid 2> 1.0% by weight ethyl alcohol solution of γ-aminopropyltriethoxysilane <Treatment liquid 3> γ- 0.05% by weight methyl alcohol solution of methacryloxypropyltrimethoxysilane <Treatment liquid 4> 3.0% by weight methyl alcohol solution of N- (triethoxysilylpropyl) urea <Treatment liquid 5> 0.1% of vinyltriethoxysilane 01% by weight aqueous solution

Examples 1 to 6 Using the treatment liquids 1 to 5, the surface of the support substrate was treated under the following conditions to produce a surface-treated support substrate. Example Supporting substrate Treatment liquid Treatment method Treatment time Drying conditions 1 42 alloy treatment liquid 1 dip 1 minute 120 ° C, 5 minutes L / F * 2 42 alloy treatment liquid 2 spray 5 minutes 80 ° C, 10 minutes L / F 3 copper L / F treatment liquid 3 dip 30 seconds 100 ° C, 1 minute 4 Copper L / F treatment liquid 4 dip 10 seconds 40 ° C, 30 minutes 5 Poly-wiring treatment liquid with wiring 5 dip 5 minutes 50 ° C, 1 hour Imide substrate 6 FR-4 Glass treatment liquid 2 Dip 1 minute 100 ° C, 5 minutes Epoxy board * L / F: Lead frame

A semiconductor chip (size 8 mm × 8 mm) was bonded to the surface-treated support substrate thus obtained with an organic bonding material. At this time, as an organic bonding material, a silver paste (EN-4000 manufactured by Hitachi Chemical Co., Ltd.) was used for Examples 1, 3, and 5, and a film-shaped adhesive containing a silver filler (Example manufactured by Hitachi Chemical Co., Ltd.) was used for Examples 2, 4, and 6. DF-335) was used. Table 1 shows the measurement results of the adhesive strength.

[0019]

[Table 1] Example adhesive strength (kgf / chip) room temperature 240 ° C ────────────────────── 1 1.6 1.3 2 3.0 or more 3.0 or more 3 1.2 0.9 4 2.8 2 0.05 1.8 1.2 6 2.1 1.2 表面 Surface with silane coupling agent The treated one has high adhesive strength.

[0020]

The support substrate of the first aspect or the electronic component device of the third aspect is expected to have improved reflow resistance. According to the manufacturing method of the second aspect, the electronic component mounting support substrate of the first aspect can be manufactured. According to the surface treatment method of the fourth aspect, the adhesive strength between the electronic component and the support substrate is increased.

Claims (4)

[Claims] 1. A support substrate on which electronic components are mounted via an organic bonding material, the surface of which is treated with a silane coupling agent. 2. A method for manufacturing a support substrate, comprising: treating at least a surface of the support substrate, on which electronic components are mounted, with an organic bonding material via an organic bonding material, with a silane coupling agent. 3. An electronic component comprising: a support substrate having a surface treated with a silane coupling agent; an organic bonding material layer formed on an electronic component mounting portion of the support substrate; and an electronic component mounted on the organic bonding material layer. apparatus. 4. A support substrate on which an electronic component is mounted is treated with a silane coupling agent via an organic bonding material.
Surface treatment method for supporting substrate.