JPH10284536A - Supporting substrate, method for producing supporting substrate, electronic component device and method for surface treating supporting substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve reflow crack resistance based on a bonding material by improving the adhesive strength of electronic component and supporting substrate. SOLUTION: The supporting substrate (such as lead frame or insulating substrate) for mounting the electronic component (such as semiconductor chip or transistor) is soaked in a solution containing guanidine or its dielectric in 0.001 to 10 wt.% for 0.5 sec to 10 min and this is taken out and dried while being heated. On the provided surface treated supporting substrate, the semiconductor chip is adhered by using the organic bonding material (such as a film- shaped adhesive agent containing silver paste or silver fillers). As the guanidine or its dielectric, guanidine carbonate or dicyandiamide can be used.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a support substrate for mounting an electronic component such as a semiconductor device, a method of manufacturing the support substrate, an electronic component device, and a surface treatment method of the support substrate.

[0002]

2. Description of the Related Art As a method of bonding an electronic component such as a semiconductor element to a support substrate, a method of supplying a die bonding material onto the support substrate and bonding the electronic component has been used. As the die bonding material used for this purpose, for example, Au-Si eutectic, solder, resin paste, resin film adhesive and the like are known. Among them, the Au-Si eutectic is expensive and has a high modulus of elasticity, and has a problem that the bonded portion must be vibrated. Further, there is a problem that the solder cannot withstand the temperature higher than the melting point temperature and has a high elastic modulus. Resin pastes and resin film adhesives are inexpensive, have high heat resistance, and have a low modulus of elasticity. Therefore, they are most often used as adhesives for bonding electronic components to a support substrate.

[0003]

In recent years, the demand for high-density mounting due to the miniaturization and thinning of electronic devices has been rapidly increasing in recent years. The mounting type has become mainstream. This surface-mount type semiconductor package is mounted by heating by infrared reflow, vapor phase reflow, solder dip, or the like in order to solder it to a printed board or the like.
At this time, since the entire package is exposed to a high temperature of 210 ° C. to 260 ° C., if moisture exists inside the package, cracks (so-called “reflow cracks”) occur in the package due to rapid vaporization of the moisture. Since the reflow crack significantly reduces the reliability of the package, it has become a serious problem and technical problem especially in a thin package. An object of the present invention is to increase the adhesive strength between an electronic component and a support substrate to improve the reflow crack resistance caused by the bonding material.

[0004]

The mechanism of occurrence of reflow cracks caused by the bonding material is estimated to be as follows. In other words, (1) the bonding material absorbs moisture during storage of the package, (2) this moisture is vaporized by heating during mounting of reflow soldering, and (3) the vapor pressure causes destruction or peeling of the bonding material,
(4) Reflow cracks occur. The present inventors focused on increasing the adhesive strength between the electronic component and the support substrate, and as a result of various studies, as a result, the surface of the support substrate was treated with guanidine or a derivative thereof to increase the adhesive force with the electronic component and thereby withstand resistance. It has been found that reflow crackability can be improved.

That is, the present invention provides a support substrate in which at least a surface of the support substrate on which an electronic component is mounted via an organic bonding material is in contact with the organic bonding material, is treated with guanidine or a derivative thereof. The present invention also provides a method of manufacturing a support substrate, characterized in that at least a surface of the support substrate, on which an electronic component is mounted via the organic bonding material, in contact with the organic bonding material is treated with guanidine or a derivative thereof. Further, the present invention provides a support substrate having at least a surface in contact with an organic bonding material treated with guanidine or a derivative thereof, an organic bonding material layer formed on an electronic component mounting portion of the support substrate, and an electronic device mounted on the organic bonding material layer. An electronic component device including a component is also provided. The present invention also provides a surface treatment method for a support substrate, wherein the support substrate on which an electronic component is mounted is treated with guanidine or a derivative thereof via an organic bonding material.

Guanidine which can be used in the present invention is

Embedded image Which may be a salt. Guanidine salts include guanidine hydrochloride, guanidine nitrate, guanidine carbonate, guanidine phosphate, guanidine sulfamate and the like.

The guanidine derivative which can be used in the present invention is:

Embedded image Is a compound having a group of

[0008] Such guanidine derivatives include dicyandiamide

Embedded image Dicyandiamide-aniline adduct,

Embedded image Dicyandiamide-methylaniline adduct, dicyandiamide-diaminodiphenylmethane adduct, dicyandiamide-dichlorodiaminodiphenylmethane adduct, dicyandiamide-diaminodiphenylether adduct,
Such as dicyandiamide or a derivative thereof,

Aminoguanidine

Embedded image There are aminoguanidines such as aminoguanidine hydrochloride and aminoguanidine bicarbonate, and salts thereof.

In addition, acetylguanidine, diacetylguanidine, propionylguanidine, dipropionylguanidine, cyanoacetylguanidine, guanidine succinate, diethylcyanoguanidine, N-oxymethyl-N'-cyanoguanidine, N, N'-dicarbethoxy There are guanidine, chloroguanidine, bromoguanidine and the like, and these can be used as a mixture.

Guanidine or a derivative thereof for treating the surface of the supporting substrate is usually used as a solution (treatment liquid) in which the above-mentioned guanidine or its derivative is dissolved in water or an organic solvent. However, the above-mentioned treatment liquid includes epoxy resin, phenol resin, bismaleimide resin, cyanate ester resin, acrylic resin, methacrylic resin, polystyrene, polyimide, polyamide, polyester, siloxane polyimide, polyetherimide, polyesterimide, etc. It may contain a resin. When these resins are used, a curing agent, a curing accelerator, a catalyst, and the like may be used as necessary.

Here, the organic solvent is not particularly limited as long as it can dissolve guanidine or its derivative and other components. In addition to alcohols such as methanol, ethanol, propyl alcohol and isopropyl alcohol, acetone, methyl ethyl ketone, methyl isobutyl ketone, benzene, toluene, xylene, dimethylformamide, dimethylacetamide, N
-Methyl-2-pyrrolidone, methyl cellosolve, ethyl cellosolve, dioxane, tetrahydrofuran, ethylene glycol dimethyl ether and the like are used, and these may be used as a mixture of two or more kinds including water.

The concentration of guanidine or a derivative thereof in the treatment solution is 0.001 to 10% by weight, preferably 0.1 to 10% by weight.
01 to 5% by weight. If it is less than 0.001% by weight, the effect of improving the adhesive strength is small, and if it is more than 10% by weight, the reliability of the package is reduced. The temperature and time of the treatment are not particularly limited, but are usually 0 to 100 ° C., 0.
5 seconds to 10 minutes, preferably 20 to 50 ° C., 5 seconds to 3 minutes. The support substrate treated with the treatment liquid is preferably used after drying. The drying condition at this time is not particularly limited as long as a solvent such as water and alcohol can be removed, but the drying can be usually performed at room temperature to 150 ° C. for 5 seconds to 2 hours.

As a method of treating the supporting substrate with the guanidine or a derivative thereof, a method of dipping the entire substrate into a treatment solution, a commonly used coating method such as spraying, brush coating, spin coating and the like are used. You. With respect to the surface of the support substrate to be processed, only the portion in contact with the organic bonding material may be processed, or the entire support substrate may be processed. Further, before the treatment with guanidine or a derivative thereof, the supporting substrate may be pretreated.
Examples of the pretreatment method include degreasing cleaning with an organic solvent, cleaning with an alkali, cleaning with an acid, and the like, and a preferable method is appropriately selected depending on the type of the supporting substrate. This is particularly effective when the dispersion of the adhesive force is large. This treatment has a role of keeping the surface state of the supporting substrate constant, and is preferably performed immediately before the treatment with guanidine or a derivative thereof.

An electronic component is adhered to the support substrate subjected to the surface treatment in this way via an organic bonding material to obtain an electronic component device. In this case, the electronic component may be bonded after the organic bonding material layer is formed on the support substrate in advance, or the organic bonding material layer may be formed on the bonding surface side of the electronic component and then bonded to the support substrate. Alternatively, the support substrate, the organic bonding material, and the electronic component may be bonded together. In any case, the positional relationship between the support substrate, the organic bonding material, and the electronic component is a positional relationship in which the organic bonding material exists between the support substrate and the electronic component.

The supporting substrate used in the present invention includes:
Examples include a lead frame made of metal such as copper or 42 alloy, an insulating substrate such as a polyimide film, and a substrate with wiring such as a glass epoxy substrate and a glass polyimide substrate. In particular, a copper lead frame is preferably used. When a copper lead frame is used as the support substrate, a copper lead frame is obtained in which at least the surface of the copper lead frame that is in contact with the organic bonding material is surface-treated with guanidine or a derivative thereof.

The organic bonding material used in the present invention includes epoxy resin, phenol resin, bismaleimide resin, cyanate ester resin, acrylic resin, methacrylic resin, polystyrene, polyimide, polyamide,
Polyester, siloxane polyimide, polyetherimide, and polyesterimide are preferably used. These resins may be used as a mixture of two or more kinds. Also,
As the organic bonding material, a liquid, a paste, a film, and the like can be used without any particular limitation. Further, in the case of a liquid or paste form, an organic solvent may be used.
A filler may be used as necessary for the organic bonding material. As the filler, conductive fillers such as silver, gold, copper, iron, aluminum and carbon, and non-conductive fillers such as boron nitride, aluminum nitride, silica, alumina and silicon carbide are used. It is not limited, and two or more kinds may be used as a mixture.

Examples of the electronic parts to be bonded include active elements such as semiconductor chips, transistors, diodes and thyristors, and passive elements such as capacitors, resistors and coils. The electronic component device on which the electronic component is mounted as described above is connected by wire bonding or the like as necessary, and is sealed with a mold resin, a potting resin, or the like to form a package.

[0019]

Embodiments of the present invention will be described below with reference to examples. In addition, the processing liquid (solution of guanidine or its derivative) used in the following examples is as follows. <Treatment liquid 1> 0.1% by weight of dicyandiamide in ethylene glycol dimethyl ether solution <Treatment liquid 2> 1.0% by weight of guanidine carbonate in methyl alcohol solution <Treatment liquid 3> 0.1% of dicyandiamide-aniline adduct.
05% by weight acetone solution

Examples 1 to 6 The surface of a supporting substrate was treated using the treatment liquids 1 to 3 under the following conditions to produce a surface-treated supporting substrate.

Example Supporting substrate Treatment liquid Treatment method Treatment time Drying conditions 1 42 alloy treatment liquid 1 dip 1 minute 120 ° C., 5 minutes L / F * 2 42 alloy treatment liquid 2 spray 5 minutes 80 ° C., 10 minutes L / F 3 Copper L / F treatment liquid 3 dip 30 seconds 100 ° C, 1 minute 4 Copper L / F treatment liquid 1 dip 10 seconds 40 ° C, 30 minutes 5 Wiring poly treatment liquid 3 dip 5 minutes 50 ° C, 1 hour Imide substrate 6 FR-4 glass treatment solution 2 dip 1 minute 100 ° C, 5
Minute epoxy board * L / F: Lead frame

A semiconductor chip (size 8 mm × 8 mm) was bonded to the surface-treated support substrate thus obtained with an organic bonding material. At this time, as an organic bonding material, a silver paste (EN-4000 manufactured by Hitachi Chemical Co., Ltd.) was used for Examples 1, 3, and 5, and a film-shaped adhesive containing a silver filler (Example manufactured by Hitachi Chemical Co., Ltd.) was used for Examples 2, 4, and 6. DF-335) was used. Table 1 shows the measurement results of the adhesive strength.

[0023]

[Table 1] Example adhesive strength (kgf / chip) room temperature 240 ° C １ 1 1.8 1.5 2 2.5 2.1 or higher 3 1.7 1.4 4 2.8 2. 0 5 2.3 1.5 6 2.1 1.2 表面 Surface treatment with guanidine or guanidine derivative Those that do have high adhesive strength.

[0024]

The support substrate of claim 1 or 2 and the electronic component device of claim 4 are expected to have improved reflow resistance. According to the manufacturing method of the third aspect, the support substrate of the first or second aspect can be manufactured. According to the surface treatment method of the fifth aspect, the adhesive strength between the electronic component and the support substrate is increased.

Claims (5)

[Claims] 1. A supporting substrate on which an electronic component is mounted via an organic bonding material, wherein at least a surface of the supporting substrate in contact with the organic bonding material is treated with guanidine or a derivative thereof. 2. The copper substrate according to claim 1, wherein the support substrate on which the electronic component is mounted via the organic bonding material is a copper lead frame.
Support substrate. 3. A method of manufacturing a support substrate, wherein at least a surface of the support substrate on which an electronic component is mounted via the organic bonding material, in contact with the organic bonding material, is treated with guanidine or a derivative thereof. 4. A support substrate having at least a surface in contact with an organic bonding material treated with guanidine or a derivative thereof, an organic bonding material layer formed on an electronic component mounting portion of the support substrate, and electrons mounted on the organic bonding material layer. parts,
Electronic component device comprising: 5. A method for treating a surface of a supporting substrate, wherein the supporting substrate on which an electronic component is mounted is treated with guanidine or a derivative thereof via an organic bonding material.