JP2000226672A - Electroless gold plating method - Google Patents
Electroless gold plating methodInfo
- Publication number
- JP2000226672A JP2000226672A JP2823199A JP2823199A JP2000226672A JP 2000226672 A JP2000226672 A JP 2000226672A JP 2823199 A JP2823199 A JP 2823199A JP 2823199 A JP2823199 A JP 2823199A JP 2000226672 A JP2000226672 A JP 2000226672A
- Authority
- JP
- Japan
- Prior art keywords
- electroless nickel
- nickel plating
- electroless
- plating film
- gold plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemically Coating (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、素材上に無電解ニ
ッケルめっき下地を形成し、この無電解ニッケルめっき
下地上に無電解金めっき膜を形成する無電解金めっき方
法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroless gold plating method for forming an electroless nickel plating base on a material and forming an electroless gold plating film on the electroless nickel plating base.
【０００２】[0002]
【従来の技術】プリント配線板、リードフレーム、ＴＡ
Ｂ、半導体デバイスなどの接点端子、電極などに代表さ
れるように、電子デバイスにおいては無電解金めっきが
必要とされることが多い。無電解金めっきは、被めっき
物の素材を溶解することによって電子の受け渡しを行
い、析出するものであるため、下地および素材の腐食を
必然的に伴う。この下地および素材の腐食による機能の
低下を防止するために、素材上にバリアー層として無電
解ニッケルめっき膜を形成した後に無電解金めっき膜を
施す方法が用いられてきた。特に、プリント配線板の無
電解金めっき処理においては、プリント配線板の銅素材
上に無電解ニッケルめっき下地を３μｍから５μｍ形成
した後に無電解金めっき膜を形成するのが一般的であ
る。しかし、無電解ニッケルめっき膜の厚さが７μｍ以
下の場合、無電解ニッケルめっき膜は粒状に析出してい
るため、各粒の境界には凹状の粒界が存在する。この粒
界部分には無電解金めっきが形成される際、金の析出反
応が集中するため、無電解ニッケルめっき膜の溶出が顕
著となり、さらに凹状となる。この凹部には、はんだ付
けの際に用いられるフラックスが溜まりやすく、はんだ
付け後もフラックスが残留する。この結果、はんだと無
電解ニッケルめっき膜との接合面積が減少するばかり
か、破壊の起点となりやすいため、はんだとの密着力を
低下させる原因となる。2. Description of the Related Art Printed wiring boards, lead frames, TAs
Electroless devices often require electroless gold plating, as typified by B, contact terminals and electrodes of semiconductor devices and the like. Electroless gold plating transfers and deposits electrons by dissolving a material of an object to be plated, and thus involves corrosion of a base and a material. In order to prevent the deterioration of the function due to the corrosion of the base and the material, a method of forming an electroless nickel plating film as a barrier layer on the material and then applying an electroless gold plating film has been used. In particular, in the electroless gold plating of a printed wiring board, it is common to form an electroless gold plating film after forming an electroless nickel plating underlayer of 3 μm to 5 μm on a copper material of the printed wiring board. However, when the thickness of the electroless nickel plating film is 7 μm or less, since the electroless nickel plating film is precipitated in a granular form, a concave grain boundary exists at the boundary of each grain. When the electroless gold plating is formed at the grain boundary, the deposition reaction of gold is concentrated, so that the electroless nickel plating film is remarkably eluted, and further becomes concave. The flux used at the time of soldering easily accumulates in this concave portion, and the flux remains after soldering. As a result, not only does the bonding area between the solder and the electroless nickel plating film decrease, but it also tends to be a starting point of destruction, which causes a decrease in the adhesion to the solder.
【０００３】[0003]
【発明が解決しようとする課題】上記の従来技術では、
はんだ付けを行った時に、はんだとの密着力が低下する
といった欠点がある。はんだとの密着力が低下した場
合、特にプリント配線板では、ボールグリッドアレイ
（以下ＢＧＡと称す）チップスケールパッケージ（以下
ＣＳＰと称す）といった熱応力が溜まりやすく、強度が
必要とされる部品のはんだ付け工程において、はんだ付
け不良が増加し、歩留まりを悪化させる。さらに、はん
だ付け工程内で不良とならない場合であっても、十分な
接続信頼性を得ることが困難となる。In the above prior art,
When soldering is performed, there is a disadvantage that the adhesion to the solder is reduced. When the adhesive strength with the solder is reduced, especially in a printed wiring board, thermal stress such as a ball grid array (hereinafter, referred to as BGA) and a chip scale package (hereinafter, referred to as CSP) tends to accumulate, and the soldering of components requiring strength is required. In the attaching step, defective soldering increases, and the yield is deteriorated. Further, even if no failure occurs during the soldering process, it is difficult to obtain sufficient connection reliability.
【０００４】そこで、ＢＧＡやＣＳＰなどの部品の実装
においては、はんだ付け部のはんだ量を多くしたり、は
んだフィレット形状を工夫することにより、はんだ付け
部に集中する熱応力を吸収する方法が検討されてきた
が、部品の接続信頼性を向上させるまでには至っていな
い。また、部品とプリント配線板とをはんだ付けした後
に、部品とプリント配線板とをエポキシ樹脂などで接着
補強する方法が実施されているが、エポキシ樹脂の挿入
・硬化といった工数が増加するデメリットがある。Therefore, when mounting components such as BGA and CSP, a method of absorbing the thermal stress concentrated on the soldered portion by increasing the amount of solder in the soldered portion or devising the shape of the solder fillet is studied. However, it has not been improved to improve the connection reliability of components. In addition, after soldering the component and the printed wiring board, a method of bonding and reinforcing the component and the printed wiring board with an epoxy resin or the like has been implemented, but there is a disadvantage that the number of steps such as insertion and curing of the epoxy resin increases. .
【０００５】本発明は、無電解ニッケルめっき下地とは
んだとの密着力を向上させ、ＢＧＡやＣＳＰなどの強度
が必要とされる部品のはんだ付け工程における歩留まり
を改善し、十分な接続信頼性を確保することを目的とす
るものである。[0005] The present invention improves the adhesion between the electroless nickel plating base and the solder, improves the yield in the soldering process of components requiring strength such as BGA and CSP, and improves the connection reliability. The purpose is to secure.
【０００６】[0006]
【課題を解決するための手段】この課題を解決するため
に本発明は、素材上に形成する無電解ニッケルめっき膜
表面の十点平均粗さを０．５μｍから１．５μｍとし、
この無電解ニッケルめっき膜上に無電解金めっき膜を形
成する構造を有したものである。According to the present invention, there is provided an electroless nickel plating film formed on a material having a ten-point average roughness of 0.5 μm to 1.5 μm.
It has a structure in which an electroless gold plating film is formed on this electroless nickel plating film.
【０００７】これにより、はんだ付けした際の無電解ニ
ッケル膜とはんだとの密着力を向上させることが可能と
なり、強度が必要とされる部品のはんだ付け工程での歩
留まりを良化させ、はんだ付け部の接続信頼性を向上さ
せることができる。This makes it possible to improve the adhesion between the electroless nickel film and the solder at the time of soldering, to improve the yield in the soldering process for components requiring strength, and to improve the yield. The connection reliability of the unit can be improved.
【０００８】[0008]
【発明の実施の形態】本発明の請求項１に記載の発明
は、素材上に無電解ニッケルめっき下地を形成し、この
無電解ニッケルめっき下地上に無電解金めっき膜を形成
する無電解金めっき方法において、素材上に形成する無
電解ニッケルめっき膜表面の十点平均粗さを０．５μｍ
から１．５μｍとする無電解金めっき方法であり、はん
だ付けした際の無電解ニッケル膜とはんだとの密着力を
向上させることが可能となり、強度が必要とされる部品
のはんだ付け工程での歩留まりを良化させ、はんだ付け
部の接続信頼性を向上させる作用を有する。DETAILED DESCRIPTION OF THE INVENTION According to the first aspect of the present invention, there is provided an electroless gold plating method in which an electroless nickel plating base is formed on a material and an electroless gold plating film is formed on the electroless nickel plating base. In the plating method, the ten-point average roughness of the surface of the electroless nickel plating film formed on the material is 0.5 μm
This is an electroless gold plating method with a thickness of 1.5 μm, which makes it possible to improve the adhesion between the electroless nickel film and the solder at the time of soldering. It has the effect of improving the yield and improving the connection reliability of the soldered portion.
【０００９】本発明の請求項２に記載の発明は、素材上
に形成する無電解ニッケルめっき膜の厚さが７μｍから
１５μｍである請求項１に記載の無電解金めっき方法で
あり、請求項１と同様の作用を有する。According to a second aspect of the present invention, there is provided the electroless gold plating method according to the first aspect, wherein the thickness of the electroless nickel plating film formed on the material is 7 μm to 15 μm. It has the same effect as 1.
【００１０】本発明の請求項３に記載の発明は、安定剤
としてイオウ化合物を０．０１ｍＬ／Ｌから０．０５ｍ
Ｌ／Ｌを添加した次亜リン酸ナトリウムを還元剤とする
無電解ニッケルめっき液により、素材上に無電解ニッケ
ルめっき膜を形成した請求項１に記載の無電解金めっき
方法であり、請求項１と同様の作用を有する。According to a third aspect of the present invention, a sulfur compound is used as a stabilizer in an amount of 0.01 mL / L to 0.05 m / L.
2. The electroless gold plating method according to claim 1, wherein the electroless nickel plating film is formed on the material using an electroless nickel plating solution containing L / L-added sodium hypophosphite as a reducing agent. It has the same effect as 1.
【００１１】本発明の請求項４に記載の発明は、化学的
あるいは機械的に研磨することにより表面の十点平均粗
さを０．５μｍから１．５μｍに調整した素材表面上に
無電解ニッケルめっき膜を形成した請求項１に記載の無
電解金めっき方法であり、請求項１と同様の作用を有す
る。According to a fourth aspect of the present invention, there is provided an electroless nickel coating on a surface of a material whose surface is adjusted to a ten-point average roughness from 0.5 μm to 1.5 μm by chemical or mechanical polishing. An electroless gold plating method according to claim 1, wherein a plating film is formed, and has the same function as in claim 1.
【００１２】（実施の形態１）ガラスエポキシ基板に銅
による配線パターンを形成した配線基板に、一般に行わ
れている有機溶剤による脱脂、硫酸による酸洗を行い、
ついでパラジウムによる活性化を行った後、次亜リン酸
ナトリウムを還元剤とする無電解ニッケルめっき液を用
いて、８０℃でめっきを行い無電解ニッケル膜を形成し
た。その後、シアン化金カリウムを主成分とする無電解
金めっき液を用いて、８５℃で１０分間めっきを行い
０．０５μｍの無電解金めっき膜を形成した。その結果
を（表１）に示す。(Embodiment 1) A wiring board in which a wiring pattern made of copper is formed on a glass epoxy board is generally degreased with an organic solvent and pickled with sulfuric acid.
Then, after activation with palladium, plating was performed at 80 ° C. using an electroless nickel plating solution using sodium hypophosphite as a reducing agent to form an electroless nickel film. Thereafter, plating was performed at 85 ° C. for 10 minutes using an electroless gold plating solution containing gold potassium cyanide as a main component to form a 0.05 μm electroless gold plating film. The results are shown in (Table 1).
【００１３】[0013]
【表１】 [Table 1]
【００１４】（表１）に示すように、無電解金めっき後
のはんだ付け強度、外観ともに本発明の条件では良好で
ある。一方、比較例に示すように無電解ニッケルめっき
膜が７μｍ以下でははんだ付け強度として不十分であ
る。また、１５μｍ以上では無電解ニッケルめっき膜中
のめっき内部応力によりめっき表面に割れが生じてい
る。As shown in Table 1, both the soldering strength and appearance after electroless gold plating are excellent under the conditions of the present invention. On the other hand, as shown in the comparative example, when the electroless nickel plating film is 7 μm or less, the soldering strength is insufficient. On the other hand, when the thickness is 15 μm or more, cracks are generated on the plating surface due to the internal stress of the plating in the electroless nickel plating film.
【００１５】（実施の形態２）ガラスエポキシ基板に銅
による配線パターンを形成した配線基板に、一般に行わ
れている有機溶剤による脱脂、硫酸による酸洗を行い、
ついでパラジウムによる活性化を行った後、安定剤とし
てイオウ化合物を添加した次亜リン酸ナトリウムを還元
剤とする無電解ニッケルめっき液を用いて、８０℃でめ
っきを行い５μｍの無電解ニッケル膜を形成した。その
後、シアン化金カリウムを主成分とする無電解金めっき
液を用いて、８５℃で１０分間めっきを行い０．０５μ
ｍの無電解金めっき膜を形成した。その結果を（表２）
に示す。(Embodiment 2) A wiring board in which a wiring pattern made of copper is formed on a glass epoxy board is generally degreased with an organic solvent and pickled with sulfuric acid.
Next, after activation with palladium, plating was performed at 80 ° C. using an electroless nickel plating solution containing sodium hypophosphite to which a sulfur compound was added as a stabilizer as a reducing agent to form a 5 μm electroless nickel film. Formed. Thereafter, using an electroless gold plating solution containing gold potassium cyanide as a main component, plating was performed at 85 ° C. for 10 minutes, and 0.05 μm
m of electroless gold plating film was formed. (Table 2)
Shown in
【００１６】[0016]
【表２】 [Table 2]
【００１７】（表２）に示すように、無電解金めっき後
のはんだ付け強度、外観ともに本発明の条件では良好で
ある。一方、比較例に示すようにイオウ化合物の濃度が
０．０１ｍＬ／Ｌ以下あるいは０．０５ｍＬ／Ｌ以上で
ははんだ付け強度として不十分である。As shown in Table 2, both the soldering strength and appearance after electroless gold plating are excellent under the conditions of the present invention. On the other hand, as shown in the comparative examples, when the concentration of the sulfur compound is 0.01 mL / L or less or 0.05 mL / L or more, the soldering strength is insufficient.
【００１８】[0018]
【発明の効果】本発明により、はんだ付けした際の無電
解ニッケル膜とはんだとの密着力が向上し、良好なはん
だ付け性が得られ、はんだ付け強度についても高い値が
得られるようになった。この結果、強度が必要とされる
部品のはんだ付け工程での歩留まりが改善され、はんだ
付け部の接続信頼性も向上させることができた。According to the present invention, the adhesion between the electroless nickel film and the solder at the time of soldering is improved, good solderability is obtained, and a high value of the soldering strength is obtained. Was. As a result, the yield in the soldering step for components requiring strength was improved, and the connection reliability of the soldered portion was also improved.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 村田 宏文 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Ｆターム(参考） 4K022 AA02 AA42 BA03 BA14 BA36 CA02 DA01 DB02 DB08 5E319 AC01 AC17 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hirofumi Murata 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F-term (reference) 4K022 AA02 AA42 BA03 BA14 BA36 CA02 DA01 DB02 DB08 5E319 AC01 AC17
Claims (4)
成し、この無電解ニッケルめっき下地上に無電解金めっ
き膜を形成する無電解金めっき方法において、素材上に
形成する無電解ニッケルめっき膜表面の十点平均粗さを
０．５μｍから１．５μｍとすることを特徴とする無電
解金めっき方法。1. An electroless gold plating method in which an electroless nickel plating base is formed on a material and an electroless gold plating film is formed on the electroless nickel plating base. An electroless gold plating method characterized in that the surface has a ten-point average roughness of 0.5 μm to 1.5 μm.
膜の厚さが７μｍから１５μｍである請求項１に記載の
無電解金めっき方法。2. The electroless gold plating method according to claim 1, wherein the thickness of the electroless nickel plating film formed on the material is 7 μm to 15 μm.
Ｌ／Ｌから０．０５ｍＬ／Ｌを添加した次亜リン酸ナト
リウムを還元剤とする無電解ニッケルめっき液により、
素材上に無電解ニッケルめっき膜を形成した請求項１に
記載の無電解金めっき方法。3. A sulfur compound as a stabilizer in an amount of 0.01 m
With an electroless nickel plating solution using sodium hypophosphite added from L / L to 0.05 mL / L as a reducing agent,
2. The electroless gold plating method according to claim 1, wherein an electroless nickel plating film is formed on the material.
より表面の十点平均粗さを０．５μｍから１．５μｍに
調整した素材表面上に無電解ニッケルめっき膜を形成し
た請求項１に記載の無電解金めっき方法。4. The electroless nickel plating film according to claim 1, wherein the ten-point average roughness of the surface is adjusted from 0.5 μm to 1.5 μm by chemical or mechanical polishing. Electroless gold plating method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02823199A JP4038917B2 (en) | 1999-02-05 | 1999-02-05 | Electroless gold plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02823199A JP4038917B2 (en) | 1999-02-05 | 1999-02-05 | Electroless gold plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000226672A true JP2000226672A (en) | 2000-08-15 |
| JP4038917B2 JP4038917B2 (en) | 2008-01-30 |
Family
ID=12242835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02823199A Expired - Fee Related JP4038917B2 (en) | 1999-02-05 | 1999-02-05 | Electroless gold plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4038917B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002111187A (en) * | 2000-09-28 | 2002-04-12 | Kyocera Corp | Wiring board |
| JP2002111186A (en) * | 2000-09-28 | 2002-04-12 | Kyocera Corp | Wiring board and electronic device using the same |
| JP2008522038A (en) * | 2004-12-03 | 2008-06-26 | スリーエム イノベイティブ プロパティズ カンパニー | Microfabrication using patterned topography and self-assembled monolayers |
| WO2014087878A1 (en) * | 2012-12-07 | 2014-06-12 | 東洋鋼鈑株式会社 | Fuel cell separator, fuel battery cell, fuel cell stack, and method for manufacturing fuel cell separator |
-
1999
- 1999-02-05 JP JP02823199A patent/JP4038917B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002111187A (en) * | 2000-09-28 | 2002-04-12 | Kyocera Corp | Wiring board |
| JP2002111186A (en) * | 2000-09-28 | 2002-04-12 | Kyocera Corp | Wiring board and electronic device using the same |
| JP2008522038A (en) * | 2004-12-03 | 2008-06-26 | スリーエム イノベイティブ プロパティズ カンパニー | Microfabrication using patterned topography and self-assembled monolayers |
| JP4662994B2 (en) * | 2004-12-03 | 2011-03-30 | スリーエム イノベイティブ プロパティズ カンパニー | Microfabrication using patterned topography and self-assembled monolayers |
| WO2014087878A1 (en) * | 2012-12-07 | 2014-06-12 | 東洋鋼鈑株式会社 | Fuel cell separator, fuel battery cell, fuel cell stack, and method for manufacturing fuel cell separator |
| JP2014116121A (en) * | 2012-12-07 | 2014-06-26 | Toyo Kohan Co Ltd | Separator for fuel cell, fuel cell, fuel cell stack, and method of manufacturing separator for fuel cell |
| US10629917B2 (en) | 2012-12-07 | 2020-04-21 | Toyo Kohan Co., Ltd. | Separator for fuel cells, fuel cell, fuel cell stack, and method of manufacturing separator for fuel cells |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4038917B2 (en) | 2008-01-30 |
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