JPH10256208A - Substrate treatment device and substrate treatment method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a standing type substrate treatment device which can shorten a treatment time. SOLUTION: When this device performs a predetermined treatment a substrate 9 in standing state at a treatment part 2 during transportation to the upper, the substrate 9 is located at a transport starting position under the treatment part 2 and is transported to the upper by being held by a first holding part 31. After the substrate 9 passes through the inside of the treatment part 2, the upper part of the substrate 9 is held by a second holding part 32 to transport to the upper. When the second holding part 32 holds the substrate 9, holding of the substrate 9 by the first holding part 21 finished, the first holding part 31 returns immediately to the lower transport starting position and is capable of accepting a next substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to cleaning, coating, and development of a glass substrate used for manufacturing a liquid crystal display, a plasma display, and the like, a semiconductor substrate used for manufacturing a semiconductor device (hereinafter, collectively referred to as "substrate"). The present invention relates to a substrate processing apparatus and a substrate processing method used when performing the various processes described above.

[0002]

2. Description of the Related Art In a substrate processing apparatus for performing a predetermined process on a substrate, conventionally, the substrate is held and handled in a posture in which a normal line of a main surface of the substrate is substantially vertical (hereinafter, referred to as a "horizontal posture"). Have been. This is because the substrate can be easily supported and transported by handling the substrate in a horizontal position.

However, as the size of the substrate increases due to recent demand trends and the like, handling the substrate in a horizontal position is becoming a problem. For example, when handling a large substrate, it is difficult to support the substrate in a horizontal posture without bending. This poses a new problem not encountered when handling a small substrate. Further, when a large substrate is handled in a horizontal posture, the apparatus itself becomes large in the horizontal direction, and the floor area occupied by the apparatus increases, which makes it difficult to maintain and manage the apparatus rationally.

Therefore, attempts have been made to handle the substrate in a vertical position, and in particular, the substrate is processed in a position in which the normal to the main surface of the substrate is oriented in the horizontal direction (hereinafter referred to as "vertical position"). Processing equipment is being developed.

[0005]

When the substrate is handled in a vertical position or a vertical position with a slight inclination, of course, various problems occur when the substrate is handled in a horizontal position.

One of these problems is that it takes a long time to put a substrate into an apparatus. This means that if the substrate is transported in a horizontal position as in the conventional case, the substrate is ready to be loaded into the apparatus only by placing the substrate on a plurality of rollers as the transport means, This is because if the substrate is held, simple loading using such a roller becomes impossible. That is, it is necessary to restrain the substrate in the vertical posture so as not to fall down, and since the transporting means includes a holding means such as a chuck, the following means until the holding means returns to the position where the transport is started. The substrate loading operation cannot be started, and rapid substrate loading becomes impossible. As a result, there arises a problem that the number of substrates that can be processed per unit time in the operation of the entire apparatus decreases.

The present invention has been made in view of the above problems, and is directed to a substrate processing apparatus and a substrate processing method for handling a substrate, wherein the substrate can be easily and quickly handled and can be processed per unit time. It is an object of the present invention to provide a substrate processing apparatus and a substrate processing method capable of increasing the quantity.

[0008]

According to a first aspect of the present invention, there is provided a substrate processing apparatus for transporting a substrate in a predetermined direction, passing the substrate through a processing unit, and performing predetermined processing by the processing unit. A processing unit for performing a predetermined process on a substrate passing through a passageway, and a first transport unit for receiving and supporting the substrate at a substrate receiving position outside the processing unit, and loading the substrate into the processing unit And a second transport unit for receiving the substrate supported by the first transport unit and carried into the processing unit, and transporting the substrate out of the processing unit; and a substrate from the first transport unit by the second transport unit. Drive means for moving the first transport means to the substrate receiving position in response to the receipt of the first transfer means.

According to a second aspect of the present invention, there is provided a substrate processing apparatus for transporting a substrate in a predetermined direction, passing the substrate through a processing unit, and performing predetermined processing by the processing unit, the substrate processing apparatus having a passage through which the substrate passes. A processing unit for performing a predetermined process on the substrate passing therethrough, a first support unit for receiving and supporting the substrate at a substrate receiving position outside the processing unit, and a first support unit for supporting the substrate and loading the substrate A second support unit for receiving and supporting the substrate, a biasing unit for biasing the first support unit in the predetermined direction, and a biasing unit for biasing the first support unit in the predetermined direction. Movement restricting means for moving the first support means and the second support means in the predetermined direction while restricting the movement of the first support means and the substrate receiving position against the urging force of the urging means. And driving means for moving to

According to a third aspect of the present invention, there is provided a substrate processing apparatus for supporting a substrate in a vertical position, transporting the substrate in a vertical direction, passing the substrate through a processing unit, and performing predetermined processing by the processing unit. A processing unit for performing predetermined processing on the substrate passing through the passage, a first support unit for receiving and supporting the substrate at a substrate receiving position below the processing unit, and a first support unit. Second supporting means for receiving and supporting the substrate which is supported and carried into the processing section, urging means for urging the first supporting means upward, and first supporting means urged by the urging means Movement restricting means for moving the first support means and the second support means in the vertical direction while restricting the movement in the vertical direction, and the first support means against the urging force of the urging means. Driving means for moving the substrate to the substrate receiving position. That.

According to a fourth aspect of the present invention, in the substrate processing apparatus of the second or third aspect, the movement restricting means comprises:
An interval adjusting member for maintaining an interval between the first support means and the second support means constant.

According to a fifth aspect of the present invention, in the substrate processing apparatus according to any one of the second to fourth aspects, the movement restricting means is configured to move the first support means and the second support means at the same speed. Includes a constant-velocity moving mechanism that realizes movement.

According to a sixth aspect of the present invention, there is provided a substrate processing method for transporting a substrate in a predetermined direction, passing the substrate through a processing section, and performing predetermined processing by the processing section, wherein the first support means moves the substrate to a substrate receiving position outside the processing section. Receiving and supporting the substrate by carrying the substrate into the processing unit, supporting the substrate supported by the first support unit and carried into the processing unit by the second support unit, and supporting the substrate by the second support unit. Releasing the support of the substrate by the first support means in accordance with the support of the step, and supporting the substrate by the second support means, carrying the substrate out of the processing unit, and moving the first support means to the substrate receiving position. And

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION

<1. Overview of Overall Configuration and Operation> FIG. 1 is a perspective view showing a part of a substrate processing apparatus 1 according to an embodiment of the present invention, with a part thereof being omitted. FIG. FIG. 2 is a cross-sectional view showing a cross section at the center of the device using a plane parallel to the YZ plane in FIG. 1.

The substrate processing apparatus 1 places the substrate 9 in such a posture that the normal line of the processing surface is horizontal, that is, the processing surface is a plane including a vertical line (hereinafter, simply referred to as “vertical posture”). No, here, the processing surface at that time is defined as the XZ plane, the horizontal direction in the XZ plane is the X direction, and the vertical direction is the Z direction.
Direction, a direction perpendicular to the X-Z plane is defined as a Y-direction), and is transported vertically downward (Z-direction) from the bottom to the top to perform a cleaning process on the substrate 9. The processing unit 2 includes a processing unit 2 that performs a predetermined cleaning process, a transport unit 3 that transports the substrate 9 so as to pass through the processing unit 2, and a loading unit 4 that sets the substrate 9 to be transported. Further, a container 511 is provided below the processing unit 2.

In the loading section 4, first, as shown in FIG.
(Two-dot chain line A). Then the arrow Rot
1 (two-dot chain line B). And the substrate 9
Is thrown into the container 511 along the arrow Thr2 and reaches the position indicated by the two-dot chain line C. After that, the substrate 9 is rotated and moved as shown by an arrow Rot2, placed at a position of the substrate 9 indicated by a solid line (referred to as a “transfer start position”), and delivered to the transfer 3.

As shown in FIG. 2, the transfer section 3 for transferring the substrate 9 has a first holding section 31 and a second holding section 32 for holding the substrate 9.

First, the substrate 9 placed at the transfer start position by the input unit 4 is received by the first holding unit 31 and is pushed up from below as shown in FIG. It is carried to. Then, when the upper end of the substrate 9 passes through the processing unit 2, the second holding unit 32 adsorbs the upper part of the substrate 9, lifts the substrate 9 further upward, and carries it out (see FIGS. 2C and 2D). ). That is, the transport unit 3 transports the substrate 9 from below to above using the first and second holding units 31 and 32 so as to pass through the inside of the processing unit 2. At this time,
The processing unit 2 performs a cleaning process on the passing substrate 9.

The processing section 2 has a passage 2a through which the substrate 9 passes. Although not shown, a pair of processing sections 2 are arranged along both sides of the processing surface of the substrate being transported from below to above. Brush, pure water injection nozzle, ultrasonic cleaning nozzle,
A cleaning tool such as an air knife and a roller (described later) for guiding the substrate 9 are built in. While the substrate 9 is transported inside the processing unit 2 from below to above, the both sides of the substrate 9 are Brush cleaning, pure water spray cleaning, ultrasonic cleaning, and drying are performed. Here, the cleaning brush is a roll brush that rotates so as to rub the surface of the substrate 9 that passes through the processing unit 2 from below to above. Further, the cleaning liquid used in the processing unit 2 is received and collected in the lower container 511.

<2. Configuration of Input Unit 4> The input unit 4 receives the substrate 9 to be processed by the substrate processing apparatus 1 in the first vertical position and converts the substrate 9 into the inclined position (FIG. 3).
1 and not shown in FIG. 1), and a transfer unit 42 which receives the substrate 9 received by the receiving unit 43 in an inclined posture, converts the substrate 9 into a vertical posture, and transfers it to the transport system 3.

The receiving section 43 will be described with reference to FIGS. The side surface 511a of the container 511 on the Y direction side is formed obliquely so as to spread upward.
A shaft J3 is rotatably attached to an end of the upper end opening of the eleventh side on the side surface 511a side in parallel with the X-axis direction. Axis J3
, A frame 431 for guiding the substrate 9 is fixed. The frame 431 includes a substantially U-shaped frame portion 431 a slightly larger than the outer shape of the substrate 9, and a substantially U-shaped substrate 431.
b, both ends of which are joined so that they are perpendicular to each other, and the joined portion is attached to the shaft J3. A thread-wound roller 432 for guiding the substrate 9 is attached to each of two opposing sides of the frame 431a. Also, the base 431b
A cylinder 434 is attached to the
a expands and contracts in a direction along the frame portion 341a. At the end of the rod 434a, a plate 433 whose end is bent into an L-shape to serve as a support portion 433a capable of supporting the substrate 9 is attached, and can be moved by the cylinder 434 in the direction along the frame portion 431a. Have been. Further, a motor 435 for rotating and driving the shaft J3 is attached to the outside of the container 511. By driving the motor 435, the entire frame 431 can be rotated around the shaft J3.

Next, the delivery section 42 will be described with reference to FIGS. An axis J2 (shape omitted, shown by a dashed line) is rotatably attached to the bottom of the container 511 in parallel with the X-axis direction. A guide frame 421 for guiding the substrate 9 is fixed to the axis J2. The guide frame 421 has a substantially rectangular shape slightly larger than the outer shape of the substrate 9 and one side thereof is attached to the axis J2. On the two sides of the guide frame 421 adjacent to the axis J2, thread-wound rollers 422 for guiding the substrate 9 are attached along each of the two sides. In addition, a roller 4 is provided on one side attached to the shaft J2.
A support end surface 424 projecting toward the mounting surface side of 22 is formed, and a concave portion 425 is formed at the center of one side thereof. The concave portion 425 acts as a relief for the support portion 433 a of the plate 433 of the receiving portion 43 and the contact holding base 316 (described later) of the first holding portion 31 when the substrate 9 is delivered. Further, a motor 423 for rotating and driving the shaft J2 is attached to the outside of the container 511.
, The entire guide frame 421 is rotatable about the axis J2.

The frame 431 is provided with a frame 431a.
Between a vertical position in which the vertical direction is substantially vertical and an inclined position in a direction substantially parallel to the inclined surface 511a.
Are driven by the corresponding motors 435 and 423 between a vertical position in which the guide frame 421 is in a substantially vertical direction and an inclined position in a direction substantially parallel to the inclined surface 511a. When both are in the inclined posture, the frame 43
The roller 432 of 1a and the roller 422 of the guide frame 421 are disposed so as to be located on substantially the same plane.

<3. Configuration and Operation of Transport Unit> Next, the configuration and operation of the transport unit 3 of the substrate processing apparatus 1 will be described in detail with reference to FIGS.

The transport section 3 includes a driving section 30 and a first holding section 3
The drive unit 30 includes a linear actuator 301 and a cylinder 3 which are driving sources for moving the first and second holding units 31 and 32.
50, a vertically extending rod-shaped interval adjusting member 302 which is directly moved in the up-down direction by a linear motion actuator 301, and stoppers 304, 305 which limit the moving range of the first and second holding portions 31, 32. Note that the members indicated by thick solid lines in FIG. 2, that is, the processing unit 2, the container 511, the stoppers 304 and 305, and the linear actuator 301 are fixedly attached to a frame (not shown) of the apparatus.

As shown in FIG. 5, the first holding portion 31 contacts the lower end of the gap adjusting member 302 and
1, a pair of belts 312 connected to the left and right ends of the plate 311 and a pulley 313 and a pulley 314 around which the pair of belts 312 are respectively applied.
The weight 315 is attached to each of the pair of belts 312 at a position facing the attachment position of the plate 311. Accordingly, an urging force for urging the plate 311 in the upward direction via the belt 312 by the weight of the weight 315 is applied to the plate 311,
1 is in contact with the lower end of the gap adjusting member 302. The linear actuator 301 drives the gap adjusting member 302 by, for example, a ball screw and a motor. Even if the urging force by the weight 315 is applied upward, the gap adjusting member 302 is raised only by the urging force. The linear motion actuator 301 is
The distance adjusting member 30 is first driven by driving
Lifting using the second plate 311 is realized. Also,
The plate 311 is, as shown in FIG.
5 prevents it from rising above a certain height. Below the weight 315, there is provided a cylinder 350 that lifts the weight 315 upward from a lower position (shown by a broken line in FIG. 2) against the weight of the weight 315.

Further, as shown in FIG. 1, the first holding part 31 is a contact holding base 31 for holding the substrate 9 in contact with the lower side.
6. A pair of belts 317 connected to the left and right ends of the contact holding base 316, and a combination of a pulley 318 and a pulley 319 around which each of the pair of belts 317 is wound.
Each of the pair of pulleys 319 is connected to a corresponding one of the pair of pulleys 314 via a pair of shafts J1 (shape not shown), and rotates in conjunction therewith. In addition, 1
The pair of shafts J1 penetrates the container 511 as shown in FIG. 1, and a pair of shaft seals 330 is provided so that the cleaning liquid received in the container 511 at this penetrating position does not leak.

With the configuration of the first holding portion 31 as described above, when the plate 311 is in contact with the lower end of the gap adjusting member 302 from below, the vertical movement of the gap adjusting member 302 is paired with the plate 311. Belt 3
12, a rotational movement of a pair of shafts J1 via a pulley 314, and a rotational movement of the pair of shafts J1 is a vertical movement of a contact holding table 316 via a pair of pulleys 319 and a belt 317, respectively. Is converted to

In this embodiment, all the pulleys have the same size, and the plate 311 and the contact holder 316 move without changing their relative positional relationship. . Further, the substrate 9 is supported by the above-described guide frame 422, and as shown in FIG.
When the contact holding table 31 is arranged in a vertical posture
6 fits into the concave portion 425 of the guide frame 422, and the substrate 9 can be pushed up from below as shown in FIG. 4, and the substrate 9 is pushed up by the contact holding base 316, so that the substrate 9 rises while being guided by the rollers 422. It has become. A roller for guiding the substrate 9 is also provided inside the processing unit 2, whereby the substrate 9 is stably transported into the processing unit 2. Further, even when the distance adjusting member 302 is at the raised position by driving the linear motion actuator 301 and the contact holding table 316 is also at the raised position, the distance adjusting member 3 is operated by operating the cylinder 350 to lift the weight 315.
Regardless of the position of 02, the contact holding base 316 can be lowered to a lower position.

As shown in FIG. 5, the second holding portion 32 includes a movable body portion 321 which is guided by a guide (not shown) and can move up and down along an arrow Pul, and a suction member 323 which sucks and holds the substrate 9. The suction unit 322 includes a shaft 324 that connects the suction unit 322 to the moving body 321, a stopper 304 that regulates a lower limit of the movement of the moving body 321, and a cam mechanism 326.

As shown in FIGS. 2B and 2C, the second holding section 32 receives the substrate 9 transported from below the processing section 2 by the first holding section 31 to the upper side, and transfers the substrate 9 to the second holding section 32. When the substrate 9 is received, the suction unit 322 is moved from a state in which the suction unit 322 is retracted from the substrate 9 to a state in which the suction unit 322 is brought into contact with the substrate 9.
3 is used to hold by suction.

This suction holding operation is realized by a cam mechanism 326 fixed to the apparatus main body shown in FIG.
1 and 5, the position of the cam mechanism 326 is schematically shown by a rectangular parallelepiped.

FIG. 6 is a view showing the outline of the configuration of the cam mechanism 326 and the state of movement of the suction member 323. In this figure, the inside of the moving main body 321 is not shown in detail. FIG. 6A shows the second holding unit 32.
FIG. 6B is a view showing a state in which the second holding unit 32 is in a lower limit position in contact with the stopper 304. FIG.
2 is a diagram showing a state in which the substrate 9 is pushed up by the suction member 2 and the suction member 323 is trying to suck the substrate 9.

The cam mechanism 326 includes a cam plate 327 fixed to the apparatus main body and a cam follower 328 having a roller shape. The cam follower 328 is connected to a shaft 324. In the state shown in FIG. 6A, the tension spring 325 provided inside the moving main body 321 attracts the cam follower 328 to the substrate 9 via the shaft 324, whereby the cam follower 328 327. Here, as shown in FIG. 6B, when the moving main body 321 rises in the direction of arrow F1, the cam follower 32
8 moves in contact with the cam plate 327 as shown by the arrow F2. As a result, the suction member 323 via the shaft 324
Moves toward the substrate 9 (in the direction of arrow F <b> 3) with respect to the moving main body 321, and comes into contact with the substrate 9. At this time, air is sucked from the tip of the suction member 323 by suction driving means (not shown), and the suction member 323 sucks and holds the substrate 9. Thereafter, the moving main body 321 further rises and the cam follower 3
28 is separated from the cam plate 327, and the substrate 9 is transported so as to be pulled upward from the processing unit 2. Note that a stopper (not shown) is provided on the shaft 324 so that it does not move to the substrate 9 side from the position shown in FIG. 6B. Therefore, the substrate 9 is sucked and conveyed without applying large vibration.

The configuration of the transport unit 3 and the operation of each component have been described above. Next, the transfer operation of the substrate 9 from the first holding unit 31 to the second holding unit 32 by these components will be described. This will be described in detail with reference to FIG.

As shown in FIG. 2A, when the substrate 9 is placed on the contact holder 316 of the first holder 31 in a vertical position,
Distance adjusting member 302 by linear motion actuator 301
Is raised, and the weight 315 is lowered to urge the plate 311 to move up, and the contact holding table 316 operating together with the plate 311 pushes up the substrate 9.

As shown in FIG. 2B, the gap adjusting member 302 has a movable body 321 of the second holding portion 32 at its upper end.
Contact As a result, the moving main body 321 starts moving upward away from the stopper 304. Further, the suction member 323 moves toward the substrate 9 by the operation of the cam mechanism 326 described above, and sucks the substrate 9 (FIG. 2C). At this time, since the distance between the moving main body 321 and the plate 311 keeps the distance between the upper end and the lower end of the distance adjusting member 302, the plate 31
The contact holding table 316 that moves together with the moving body 1
While moving at a constant interval and a constant positional relationship relative to 1, they move at the same speed. Accordingly, the relative positional relationship between the substrate 9 pushed up by the first holding unit 31 and the suction member 323 of the second holding unit 32 in the vertical direction does not change, and the suction member 323 is smoothly rubbed against the substrate 9. Can be adsorbed.

Further, when the distance adjusting member 302 rises, the plate 311 and the contact holding table 316 are prevented from rising by the action of the stopper 305 as shown in FIG. Since the plate 311 is only lifted upward by the weight 315 and is in contact with the lower end of the gap adjusting member 302 as shown in FIG. 5, the plate 311 separates from the gap adjusting member 302 and rises together with the contact holding base 316. Stop.

Thereafter, the substrate 9 is transported while being held only by the second holding section 32, and is processed by the processing section 2 as shown in FIG.
From above. On the other hand, in response to the second holding unit 32 holding the substrate 9, the cylinder 350 extends to lift the weight 315, and the contact holding table 316 is lowered to the transfer start position, so that the next substrate can be received. It is said.

As described above, the interval adjusting member 30 of the substrate processing apparatus 1
The substrate transport operation by the transport unit 3 having the substrate 2 has been described. By transporting the substrate 9 by using the distance adjusting member 302 in this manner, the movement of the substrate 9 follows the movement of the distance adjusting member 302. . As a result, the transfer of the substrate 9 by the first and second holding units 31 and 32 can be performed smoothly and stably. In addition, the interval adjusting member 30
The substrate 9 can be transported at a constant speed by raising 2 at a constant speed by using the linear actuator 301. As a result, the substrate 9 can be stably conveyed without unevenness even though it is delivered.

The processing surface of the substrate 9 to be cleaned includes an element surface 91 on which a thin film electrode or the like of a liquid crystal display element is to be formed, and a back surface 92 which is a back surface thereof.
A first holding portion 31 that contacts and holds the lower end surface of the substrate 9;
Holding part 32 that sucks and holds the upper end of the back surface 92 of
2D, the holding position of the substrate 9 is changed. In particular, the suction position of the substrate 9 by the second holding unit 32 is set to the back surface 92 as shown in FIG. The entire element surface 91 to be cleaned can be cleaned, and the element surface 91 is not contaminated after cleaning.

In this apparatus, the total height of the apparatus can be suppressed to about twice the height L1 of the substrate 9 and the height L2 of the processing section 2.

Further, in this device 1, the contact holding table 31
6 is realized by converting the rotational movement of the axis J1 from the outside of the container 411,
The use of the shaft seal 330 can easily prevent the leakage of the processing liquid.

In the above embodiment, the plate 31
1 to make the weight contact the distance adjusting member 302.
However, the same operation can be realized by applying torque to the pulley 313, the pulley 314, or the like using a torque motor instead of the weight 315. In this case, the cylinder 350 is in some way a plate 311
May be lowered.

In the above embodiment, the plate 31
Although the up-down motion 1 is converted into rotary motion using the belt 312, pulleys 313, 314, etc., any type of device that can convert linear motion into rotary motion, such as a rack and pinion mechanism, is used. You may.

The configuration of the stopper is not limited to, for example, the stopper 305 directly restricting the range in which the plate 311 is raised, but may be changed to one that restricts the range in which the weight 315 moves.

In the above embodiment, the cam mechanism 326 is used.
Although the cam plate 327 and the cam follower 328 are used in the present embodiment, the present invention is not limited to the illustrated embodiment, and any structure may be used as long as the similar movement of the suction member 323 is realized. Good.

<4. Operation of Entire Apparatus> Next, the overall operation of the substrate processing apparatus 1 having the above configuration will be described with reference to FIG.
This will be described with reference to FIG. These drawings are side views of the substrate processing apparatus 1 in FIG. 1 as viewed in the X direction from the (−X) direction, and include a receiving unit 43, a container 511, a delivery unit 42,
Processing unit 2, contact holding table 316, and suction holding unit 32
2, only the drive system 30 is omitted. In addition, the container 511 is shown in a cross section, and the processing unit 2 is appropriately omitted so that the position of the internal roller 241 can be understood. 7 to 10, two substrates to be continuously processed are shown. Therefore, the reference numeral 9b is assigned to the substrate relating to the first input, and the numeral 9a is assigned to the substrate relating to the subsequent input for convenience. .

First, in the substrate processing apparatus 1 before carrying in the substrate, as shown in FIG. 7, the frame 431 of the receiving portion 43 has a vertical position such that the rollers 432 arranged in two rows are arranged in the Z direction. The substrate 9a conveyed by the conveyance chuck 93 from the outside of the apparatus is guided from the top to the bottom along the arrow C1 on the receiving path in the side of the processing section 2 and guided between the two rows of rollers 432. While accepting. At this time, the shaft 434a of the cylinder 434 is in an extended state. Then, as shown in FIG.
When the lower end of “a” comes into contact with the support portion 433 a at one end of the plate 433, the operation of loading the substrate into the substrate processing apparatus 1 is completed.

When the substrate 9a is set on the frame 431, the frame 431 is driven by the motor 435 to move the axis J3.
Around the arrow C2. At this time, the guide frame 421 disposed below the processing unit 2 is also connected to the motor 42.
By the drive of No. 3, it rotates around the axis J2 along the arrow C3. FIG. 9 shows a state in which these rotation operations are completed.

As shown in FIG. 8, when the frame 431 and the guide frame 421 rotate along the arrows C2 and C3, respectively, as shown in FIG. 9, the rollers 432 of the frame 431 extend on the extension for guiding the substrate 9a. 421
Roller 422 is located. In this state, when the cylinder 434 is driven to draw the shaft 434a into the cylinder 434, the plate 433 and the substrate 9a in contact with the plate 433 are moved downward along the main surface of the substrate 9a in the direction of arrow C4. To a state shown in FIG. At this time, the support portion 433a of the plate 433 enters into the concave portion 425 of the guide frame 421.
Never hit one. Before this operation is completed, the contact holding table 316 is lowered along the arrow C5 (shown in FIG. 9) (details will be described later), and a position for receiving the substrate 9a (a position at which the transfer to the processing unit 2 is started). Placed in

When the substrate 9a is set on the guide frame 421 by the operation of the cylinder 434, the guide frame 421 is rotated around the axis J2 along the arrow C6 by the drive of the motor 423, and the substrate 9a is moved below the processing unit 2. At a position in a vertical posture on the contact holding base 316. At this time, since the contact holding table 316 enters the recess 425 of the guide frame 421, it does not hit the guide frame 421. afterwards,
The operation of the cylinder 434 causes the plate 432 to move in the direction of the arrow C7.
, The receiving portion 43 rotates about the axis J3 in the direction shown by the arrow C8, and returns to the state shown in FIG.

As shown in FIG. 7, when the substrate 9b is placed in a vertical position on the contact holding table 316 below the processing section 2, the linear motion actuator 301 raises the spacing member 302, and Accordingly, the contact holding table 316 urged by the weight of the weight 305 more strongly than the gravity applied to the substrate 9b starts to rise, and the substrate 9b is contact-held while being guided by the rollers 422 of the guide frame 421 as shown in FIG. The substrate 316 is conveyed into the processing unit 2 along the main surface of the substrate 9b in the direction of arrow C9 so that the lower end is pushed by the table 316. At about the same time, a substrate 9a to be processed next is carried into the receiving unit 43.

The contact holding table 316 continues to push up the substrate 9a, and the substrate 9b carried into the processing unit 2 further rises while being guided by the rollers 241 inside the processing unit 2, and as shown in FIG. The upper end is exposed above the processing unit 2. At this time, as described above with reference to FIG. 2, the suction holding section 322 moves to the substrate 9b side and the substrate 9
b and adsorb the substrate 9 further upward along the arrow C10.
b is conveyed. Note that the contact holding table 316 is
The substrate 9b is separated from the contact holding base 316 by the action of the holding unit 322 by the action of the processing unit 05.
It will be conveyed only by. During this time, the processing unit 2 performs a cleaning process on the substrate 9b.

While the substrate 9b is separated from the contact holding section 316 and is conveyed only by the suction holding section 322, the cylinder 350 is actuated to push up the weight 315 as described above, whereby the arrow C5 in FIG. Contact holder 3 as shown
16 returns to the transfer start position before the substrate transfer, and
The next substrate carried in is immediately positioned on the contact holding base 316 as shown in FIG. 10, and the preparation for carrying the next substrate is immediately prepared. Then, the suction holding unit 32
When the transfer of the substrate by the cleaning unit 2 is completed and the substrate having been subjected to the cleaning process is received from the suction holding unit 322 by the suction type unloading arm 99, the interval holding member 302 is immediately lowered by the driving of the linear motion actuator 301, and the plate 311 Touch the upper side. And almost at the same time cylinder 35
0 contracts, releasing the weight 315 from lifting. Then, the transfer operation of the next substrate by the contact holding table 316 is started immediately. When the transfer of the substrate 9b by the suction holding unit 322 is completed and the spacing member 302 is lowered from the state shown in FIGS. 10 and 2D, the suction holding unit 322 guided by a guide (not shown) is moved to the position shown in FIG. Until the stopper 304 comes into contact with the stopper 304 as shown in a), it descends by its own weight as shown by an arrow C11 in FIG.

In the above, the operations of the motors, cylinders, actuators and the like are controlled as described above by a control unit comprising a microcomputer (not shown).

The structure and operation of the substrate processing apparatus 1 have been described above. However, the substrate processing apparatus 1 is provided with the input section 4 for inputting a substrate from outside the apparatus. Preparations for receiving the next substrate from outside the apparatus and setting it at the transfer start position can be made, and easy and quick processing of the substrate is realized. Particularly, when the substrate 9 is transported so as to pass through the processing unit 2 by passing between the contact holding table 316 of the first holding unit 31 and the suction holding unit 322 of the second holding unit 32 as in this embodiment. When the transfer by the contact holding table 316 is completed and the suction holding section 322 is transferring the substrate, the contact holding table 316 is ready to transfer the next substrate, greatly reducing the time required for loading and unloading the substrate. And the amount of substrates that can be processed per unit time can be increased. In particular, the substrate 9 after passing through the processing unit 2 is directly carried out by the unload arm 99.
, The substrates 9 can be successively put into the processing section 2 one after another, and the processing amount per unit time can be further increased. In addition, since the substrate 9 advances in only one direction in the processing unit 2, the trouble of rotating the brush in the processing unit 2 and changing the operation of the air knife and the cleaning liquid nozzle each time the passing direction of the substrate 9 changes is eliminated. Stable continuous operation processing is possible.

Further, in the substrate processing apparatus 1, the transport chuck 93 outside the apparatus shown in FIG. 4 simply moves to a position above the loading section 4, and there is no need to transport the substrate 9 to a position below the processing section 2. Therefore, the substrate can be easily carried in. In particular, even in the case of the cleaning apparatus of this embodiment, the transport chuck 93 is not exposed to the cleaning liquid falling from the processing unit 2.

Further, in the substrate processing apparatus 1, the substrate 9 is carried into the receiving section 43 in a vertical posture, so that the substrate can be easily handled outside the apparatus, and the input section including the transfer section 42 and the receiving section 43. By 4, it is easy to move the substrate 9 to the transfer start position by tilting the substrate 9 and set the substrate 9 to the vertical posture at the transfer start position. Moreover, at this time, the substrate 9
Moves along the direction of the substrate surface, so that it can move with little air resistance, and is easy to transport.

<5. Modifications> Although the substrate processing apparatus 1 according to one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment.

For example, in the above-described embodiment, the processing unit 2 performs the cleaning process on the substrate 9, but may perform a developing process or a coating process other than the cleaning process.

In the above-described embodiment, the loading section 4 transfers the substrate 9 to the transport section 3 below the processing section 2, but the loading section 4 transfers the substrate 9 from above the processing section 2 to the transport section 3. The processing time can be shortened even if it is passed.

In the above-described embodiment, the substrate 9 is transferred from the loading section 4 to the transport section 3. However, the operation is performed in exactly the reverse manner, and the substrate 9 is loaded from the suction holding section 322 side.
The same effect can be obtained even if the substrate 9 is carried out from the side.

In the above-described embodiment, the processed substrate is removed from the suction holding section 322 and the space holding member 3 is removed.
Unless the second substrate 02 was lowered, the transfer of the next substrate by the contact holder 316 could not be started. However, if another drive source was provided for each, the next substrate by the contact holder 316 could be more easily transferred. It can be started earlier, and the amount of substrates that can be processed per unit time can be further increased.

In the above embodiment, the transfer of the substrate 9 from the receiving section 43 to the transfer section 42 is performed by using the cylinder 434, but the transfer of the substrate 9 using only the weight of the substrate is performed.
May be moved downward.

In the above-described embodiment, the receiving portion 43 rotates around the axis J3 to transfer the substrate 9 to the delivery portion 42.
However, the method of tilting the substrate 9 is not limited to this method. For example, the receiving unit 43 is placed in a vertical posture.
May be gradually inclined as the substrate 9 received is lowered, and guided to the transfer unit 42. Also,
The axis for rotating the substrate in the receiving portion 43 or the transfer portion 42 is provided in a direction intersecting with the moving direction of the substrate, but these need not necessarily intersect on the same plane, but intersect three-dimensionally. There may be.

Further, the transport direction of the substrate 9 is not limited to the vertical direction, but may be inclined. The posture of the substrate is not limited to the vertical posture, and may be a slightly inclined vertical posture. Further, various changes can be made to the processing section 2, the transport section 3, the input section 4, and the like.

[0068]

As described above, according to the first to sixth aspects of the present invention, it is possible to prepare for the transfer of another substrate at the transfer start position while transferring the substrate. Thereby, the number of substrates that can be processed per unit time can be increased.

According to the invention as set forth in claim 4 or 5, the transfer of the substrate from the first support means to the second support means can be carried out smoothly. The uniformity of the applied process can be ensured.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an outline of a configuration of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a view showing a transport operation of the substrate processing apparatus shown in FIG.

FIG. 3 is a perspective view showing a configuration of a receiving unit of the substrate processing apparatus shown in FIG.

FIG. 4 is a perspective view showing a guide frame.

FIG. 5 is a perspective view showing a transport unit of the substrate processing apparatus shown in FIG.

FIG. 6 is a view showing the configuration and operation of a moving main body and a cam mechanism.

FIG. 7 is a side view for explaining the operation of the substrate processing apparatus shown in FIG.

FIG. 8 is a side view for explaining the operation of the substrate processing apparatus shown in FIG.

FIG. 9 is a side view for explaining the operation of the substrate processing apparatus shown in FIG.

FIG. 10 is a side view for explaining the operation of the substrate processing apparatus shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Processing part 3 Conveying part 4 Input part 9, 9a, 9b Substrate 31 First holding part 32 Second holding part 42 Transfer part 43 Receiving part 93 Transfer chuck 350 Cylinder 423 Motor 432 Plate 434 Cylinder 435 Motor C1 C11 Arrow J2, J3 axis

Claims (6)

[Claims] 1. A substrate processing apparatus for transporting a substrate in a predetermined direction, passing the substrate through a processing unit, and performing predetermined processing by the processing unit. A processing unit for performing a predetermined process, a substrate receiving and supporting the substrate at a substrate receiving position outside the processing unit, and a first transporting unit for loading the substrate into the processing unit; A second transport unit that receives the substrate loaded into the processing unit and unloads the substrate out of the processing unit; and controls the first transport unit in response to receiving the substrate from the first transport unit by the second transport unit. And a driving means for moving the substrate to the substrate receiving position. 2. A substrate processing apparatus for transporting a substrate in a predetermined direction, passing the substrate through a processing section, and performing predetermined processing by the processing section, comprising: a passage through which the substrate passes; A first processing unit for receiving and supporting a substrate at a substrate receiving position outside the processing unit, and a substrate supported by the first support unit and carried into the processing unit. Second supporting means for supporting; urging means for urging the first supporting means in the predetermined direction; regulating movement of the first supporting means urged by the urging means in the predetermined direction. A movement restricting means for moving the first supporting means and the second supporting means in the predetermined direction, and a driving means for moving the first supporting means to the substrate receiving position against the urging force of the urging means. Substrate processing, comprising: Equipment. 3. A substrate processing apparatus for supporting a substrate in a vertical position, vertically transporting the substrate, passing the substrate through a processing unit, and performing predetermined processing by the processing unit. A processing unit for performing a predetermined process on a substrate passing therethrough; first support means for receiving and supporting a substrate at a substrate receiving position below the processing unit; and a processing unit supported by the first support means. Second support means for receiving and supporting the substrate carried into the first support means, urging means for urging the first support means upward, and the vertical direction of the first support means urged by the urging means Movement restricting means for moving the first support means and the second support means in the vertical direction while restricting the movement of the first support means and the substrate receiving position against the urging force of the urging means. And driving means for moving the Substrate processing equipment. 4. The substrate according to claim 2, wherein said movement restricting means includes an interval adjusting member for keeping an interval between said first support means and said second support means constant. Processing equipment. 5. The apparatus according to claim 2, wherein said movement restricting means includes a constant speed moving mechanism for realizing movement of said first support means and said second support means at the same speed. The substrate processing apparatus according to any one of the above. 6. A substrate processing method in which a substrate is transported in a predetermined direction, passed through a processing unit, and subjected to predetermined processing by the processing unit, wherein the substrate is received at a substrate receiving position outside the processing unit by the first support means. Supporting and carrying the substrate into the processing unit; supporting the substrate supported by the first support unit and carried into the processing unit by the second support unit; and supporting the substrate by the second support unit. A step of releasing the support of the substrate by the first support means, and a step of supporting the substrate by the second support means and carrying the substrate out of the processing unit, and moving the first support means to the substrate receiving position. A substrate processing method characterized by the above-mentioned.