JPH10233370A5 - - Google Patents

Info

Publication number
JPH10233370A5
JPH10233370A5 JP1997052307A JP5230797A JPH10233370A5 JP H10233370 A5 JPH10233370 A5 JP H10233370A5 JP 1997052307 A JP1997052307 A JP 1997052307A JP 5230797 A JP5230797 A JP 5230797A JP H10233370 A5 JPH10233370 A5 JP H10233370A5
Authority
JP
Japan
Prior art keywords
substrate
reflector
processed
required number
lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997052307A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10233370A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP5230797A priority Critical patent/JPH10233370A/ja
Priority claimed from JP5230797A external-priority patent/JPH10233370A/ja
Publication of JPH10233370A publication Critical patent/JPH10233370A/ja
Publication of JPH10233370A5 publication Critical patent/JPH10233370A5/ja
Pending legal-status Critical Current

Links

JP5230797A 1997-02-20 1997-02-20 半導体基板の熱処理装置 Pending JPH10233370A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5230797A JPH10233370A (ja) 1997-02-20 1997-02-20 半導体基板の熱処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5230797A JPH10233370A (ja) 1997-02-20 1997-02-20 半導体基板の熱処理装置

Publications (2)

Publication Number Publication Date
JPH10233370A JPH10233370A (ja) 1998-09-02
JPH10233370A5 true JPH10233370A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2004-10-07

Family

ID=12911139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5230797A Pending JPH10233370A (ja) 1997-02-20 1997-02-20 半導体基板の熱処理装置

Country Status (1)

Country Link
JP (1) JPH10233370A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6307184B1 (en) * 1999-07-12 2001-10-23 Fsi International, Inc. Thermal processing chamber for heating and cooling wafer-like objects
US6838115B2 (en) 2000-07-12 2005-01-04 Fsi International, Inc. Thermal processing system and methods for forming low-k dielectric films suitable for incorporation into microelectronic devices
WO2004025697A2 (en) 2002-09-10 2004-03-25 Fsi International, Inc. Thermal process station with heated lid
KR100377011B1 (ko) * 2002-11-01 2003-03-19 코닉 시스템 주식회사 급속 열처리 장치의 히터 모듈
JP4618705B2 (ja) 2003-09-18 2011-01-26 大日本スクリーン製造株式会社 熱処理装置
JP5063995B2 (ja) 2006-11-22 2012-10-31 大日本スクリーン製造株式会社 熱処理装置
JP4879003B2 (ja) * 2006-12-05 2012-02-15 大日本スクリーン製造株式会社 熱処理装置
JP5169106B2 (ja) * 2007-09-26 2013-03-27 ウシオ電機株式会社 光照射式加熱処理装置
JP5362251B2 (ja) * 2008-04-16 2013-12-11 大日本スクリーン製造株式会社 熱処理装置
US8298629B2 (en) 2009-02-25 2012-10-30 Crystal Solar Incorporated High throughput multi-wafer epitaxial reactor
US8673081B2 (en) 2009-02-25 2014-03-18 Crystal Solar, Inc. High throughput multi-wafer epitaxial reactor
US9255346B2 (en) 2011-05-27 2016-02-09 Crystal Solar, Incorporated Silicon wafers by epitaxial deposition
JP6687436B2 (ja) * 2015-04-30 2020-04-22 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
KR102161165B1 (ko) * 2018-05-18 2020-09-29 에이피시스템 주식회사 히터 블록, 열 처리 장치 및 방법
KR102102202B1 (ko) * 2018-11-07 2020-04-21 세메스 주식회사 기판 처리 장치 및 시스템
CN116698197B (zh) * 2023-08-04 2024-05-03 盛吉盛半导体科技(北京)有限公司 一种具有应用于集成电路设备的反射部件的测温装置

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