JPH10209251A - Taping method and device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately detect incomplete cutting when a sticky tape is cut by a tape cutter along a frame in a taping device for integrating a semiconductor wafer which is, for example, a workpiece with the ring-like frame for supporting, carrying and processing it by the sticky tape. SOLUTION: In a taping method for integrating a workpiece with a frame 80 by a sticky tape 2, the workpiece and frame 80 are chucked and supported by a specific holding part and the sticky tape 2 is stuck, and a circuit 35, which energizes by the contact of a tape cutter 31 for cutting the sticky tape along the frame 80 with the frame 80 held by the frame holding part is constituted so that, uncutting of tapes is detected by a fact that, during tape cutting by the tape cutter 31, the circuit 35 comes out of continuity.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for attaching a semiconductor wafer, which is, for example, a workpiece, and a ring-shaped frame for supporting and transporting the semiconductor wafer for processing and the like by using an adhesive tape. Related to the device.

[0002]

2. Description of the Related Art Conventionally, as a tape attaching device for integrating a semiconductor wafer and a frame with an adhesive tape, for example, the one disclosed in Japanese Patent Application Laid-Open No. Hei 6-177243 is known. FIGS. 8 to 1 show the tape attaching device 1.
As shown in FIG. 2, the tape feeding section 20, the tape winding section 30, and the tape attaching area 60 located between them.
A tape cutter 31 movably provided at a standby position and an operation position for tape cutting in the tape application region 60; a tape application movable roller 22; tape separation movable rollers 23 and 24; The table 4 which advances and retreats in the direction perpendicular to the feed direction of the adhesive tape on the sticking area 60
0.

The table 40 is used as a work area 50.
(Extended position), the frame 80 is placed in the frame placement area 41,
The wafer 70 is mounted on the wafer mounting area 42.

[0004] When the button A of the table 40 is pressed, the frame 80 and the wafer 70 are attracted to the table 40, and the table 40 moves in the direction of the arrow 90 and advances to the tape application area 60.

[0005] Then, the tape application movable roller 22 is moved forward in the same direction as the adhesive tape 2 feeding direction so that the adhesive tape 2 is applied to the frame 80 and the wafer 70 positioned in the tape application area 60, When it reaches the position of the tape sticking movable roller 22a indicated by the broken line, it is moved backward in the reverse direction to return to the original position.

As a result, the pressure-sensitive adhesive tape 2 is bonded to the frame 80 and the wafer 70 in a state of a pressure-sensitive adhesive tape 2a indicated by a dashed line. And the tape cutter 31
Is lowered to the operation position, and the cutter 32 is
And the adhesive tape 2 is cut along the frame 80 into a circular shape. Thereafter, the tape cutter 31 is returned to the standby area.

The used and unnecessary adhesive tape cut by the tape cutter 31 is peeled off the frame 80 by the movement of the tape peeling movable rollers 23 and 24, and is moved to the winding shaft 25 of the tape winding section 30. While being wound up, the unused adhesive tape 2 is pulled out from the tape feeding section 20 to the tape application area 60.

[0008] The table 40 is retreated to the work area 50, and the frame 80 and the wafer 70 stuck together with the adhesive tape 2 are taken out by the operator and transferred to the next step. Thus, the tape attaching step is repeatedly performed.

[0009]

However, the adhesive tape 2 is moved to the frame 80 by the tape cutter 31.
When the cutting edge of the cutter 32 of the tape cutter 31 has poor sharpness due to wear or the like or is retracted when cutting along the line, as shown in FIG. A slight gap α may occur, and the adhesive tape 2 may not be completely cut. If there is such an uncut portion, it becomes an obstacle when the used and unnecessary adhesive tape 2 is peeled off from the frame 80 by the tape peeling movable rollers 23 and 24, and if the uncut portion of the tape is forcibly peeled off, the wafer There is a problem that it causes cracks.

As described above, the conventional tape applying apparatus has a problem to be solved in completely cutting the adhesive tape.

[0011]

The gist of the present invention for solving the above-mentioned problems of the tape applying method according to the present invention is a tape attaching method in which a workpiece and a frame are integrated with an adhesive tape. And a frame are adsorbed and supported on a predetermined holding portion, and an adhesive tape is adhered, and a circuit for energizing the tape held by the frame holding portion with a tape cutter for cutting the adhesive tape along the frame is provided. This is a tape application method for detecting non-cutting of the tape by detecting that the circuit becomes non-conductive during tape cutting by a tape cutter.

The gist of the tape applying apparatus according to the present invention is a tape applying apparatus for integrating a workpiece and a frame with an adhesive tape, the tape applying apparatus including a tape supply roller for supplying an unused tape and a tape supplying roller for supplying an unused tape. A tape feed roller for feeding a tape, a tape take-up roller for winding a used tape, a work holding section and a frame holding section, and a tape sticking section for integrally sticking the work and the frame with an adhesive tape. And a tape cutter that cuts the adhesive tape along the frame when positioned at the operation position and the non-operation position and positioned at the operation position, wherein the frame holding portion is formed with an electrical conduction portion, A circuit is formed between the tape cutter and the electric conduction portion through a frame, and the tape cutter is positioned at an operation position and is moved along the frame. It is to detect by non-conduction of electricity uncut tape in cutting the tape.

[0013] Further, an alarm is issued when the tape is not cut, and an operator is notified of the tape being cut. When the tape is not cut, a tape cutter is operated until the tape is completely cut. It is included as a requirement.

According to the tape applying method of the present invention, the cutting edge of the tape cutter for cutting the adhesive tape always comes into contact with the surface of the frame during the cutting operation, and whether or not the adhesive tape has been completely cut is performed. Can be immediately determined by the non-conduction of the circuit. In addition, the tape applying device of the present invention makes it possible to immediately recognize that the adhesive tape has been cut incompletely, and to perform the tape cutting with a tape cutter until the adhesive tape is completely cut. The peeling operation can be prevented from being performed by the tape peeling roller.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a method and an apparatus for attaching a tape according to the present invention will be described with reference to the drawings. Note that, for easy understanding of the invention, portions corresponding to the conventional example will be denoted by the same reference numerals as the conventional example. As shown in FIG. 1, the tape applying device 10 includes a tape supply roller 11 that supplies an unused adhesive tape 2, a tape feed roller 12 that sends an adhesive tape 2, and a tape winding roller that winds a used adhesive tape. 13, a table 40 that advances and retreats at right angles to the feed direction of the adhesive tape 2, and a tape cutter 31 that cuts the adhesive tape 2 along the frame 80 in the tape application area 60.

As shown in FIG. 2, the table 40 in the work area 50 has a frame mounting area 41 on which a ring-shaped frame 80 is mounted and a wafer on which a workpiece holding portion for holding a wafer 70 is formed. A mounting area 42 is provided. The table 40 is configured so as to advance and retreat in a direction perpendicular to the feed direction of the adhesive tape 2 as shown by an arrow 44, and a work area 50 and a tape attaching area 60 are provided.
Are reciprocated from the front side.

The frame mounting area 41 has a suction hole 41 for adsorbing and supporting the frame 80 at a peripheral portion thereof.
a are provided at appropriate intervals, and an electric conduction portion 41b which contacts the frame 80 and conducts electric conduction with the tape cutter 31 via the frame 80 is disposed to form a frame holding portion. Have been. The circuit configuration including the electric conduction portion 41b will be described later.

As shown in FIG. 3, an adhering roller 22 is provided on the right side of the tape adhering area 60 when the apparatus main body is viewed from the front side. The sticking roller 22 is provided with a tape peeling roller 22a in a substantially adjacent state.
And the wafer 70 are integrally adhered with the adhesive tape 2, and the used adhesive tape 2 other than the portion cut along the frame is separated from the frame 80 by moving in a direction opposite to the tape feeding direction. It is.

A tape cutter 31 arranged opposite to the table 40 in the tape attaching area 60 is provided at an upper portion of the apparatus main body. As shown in FIG. 3, the tape cutter 31 has a vertically movable rotary shaft 31a suspended on a cutter base 31d, a support member 31e provided horizontally at a lower end of the rotary shaft 31a, Support member 31e
Is provided with a cutter 31b and a frame roller 31c.

During the cutting operation of the adhesive tape 2, the tape cutter 31 and the electric conduction portion 41 b of the table 40 are connected to the conductive (for example, stainless steel) frame 8.
The presence of 0 forms a circuit 35 for detecting tape uncut.

As shown in FIG. 4, the structure of the circuit 35 for detecting the uncut state of the tape is, for example, as follows.
When the cutter 31b pierces the adhesive tape 2 and comes into contact with the frame 80, the cutter base 31d and the frame 80 are electrically connected to the cutter 31b.
And an electric conduction portion 41b contacting the power supply portion 41c
And the relay 37 are electrically connected to form a closed circuit.

A part of an alarm circuit 36 having a power supply 39 and an alarm 38 is connected to a relay 37 of the circuit 35 for detecting uncut tape. Thus, for example, when a part of the circuit 35 becomes non-conductive and the relay 37 operates, the alarm circuit 36 becomes a closed circuit by the operation of the relay 37 and becomes energized.

The alarm 3 in the alarm circuit 36
8 is activated to notify an operator or the like by alarm means such as an alarm sound or flashing light. The alarm circuit 36 is activated only when the tape cutter 31 is performing a tape cutting operation. Thus, immediately after the tape cutter 31 is positioned at the tape cutting operation position, the alarm circuit 36 is activated by the control device, and after the tape cutting operation is completely performed, the tape cutter 31 is retracted to the non-operation position. Immediately before, the alarm circuit 36 is deactivated by the control device.

In this manner, the adhesive tape 2 is completely cut by the tape applying apparatus 10 in which the circuit 35 for detecting the uncut tape is provided in the frame mounting area 41 of the table 40 and the tape cutter 31. Will be described.

Referring to FIGS. 1 and 2, the table 4 in the work area 50 in the tape application device 10 will be described.
0, the frame 80 is mounted on the frame mounting area 41 and supported by suction, and the wafer 70 is mounted on the wafer mounting area 42 with the circuit surface facing down and supported by suction.
0 is advanced to the tape application area 60.

In the tape application area 60, the application roller 22 and the tape separation roller 22a are moved in the same direction as the tape feeding direction from the state shown in FIG.
The upper frame 80 and the wafer 70 are stuck together with the adhesive tape 2.

Then, as shown in FIG. 5, the tape cutter 31 is positioned at the tape cutting operation position. As a result, the tip of the cutter 31b of the tape cutter 31 presses against the adhesive tape 2, pierces the adhesive tape 2 and comes into contact with the frame 80 as shown in FIG. 6, and detects the tape uncut shown in FIG. The circuit 35 becomes a closed circuit.

Immediately thereafter, the alarm circuit 36 is activated by the control device, and the rotating shaft 3 of the tape cutter 31 is turned on.
1a is rotated once in the direction of the arrow. The cutter 31b rotates along the frame 80, and cuts the adhesive tape 2.

During the cutting of the adhesive tape 2 by the cutter 31b, for example, if the cutting edge of the cutter 31b is worn and the sharpness is poor, or if the flatness of the frame 80 is uneven (unevenness), the cutting edge of the cutter 31b is removed. There is a slight gap between the surface of the frame 80.

Then, in the circuit 35 for detecting uncut tape shown in FIG. 4, the electrical conduction between the cutter 31b and the frame 80 is cut off, and the relay 37 of the circuit 35 is turned off.
Works, the alarm circuit 36 becomes a closed circuit in conjunction therewith, and the alarm 38 is immediately activated to issue, for example, an alarm.

Then, the operator is notified that the adhesive tape 2 could not be completely cut during one rotation of the cutter 31b, so the operator again operates the tape application device 10 to rotate the cutter 31b once. The operation is to completely cut the adhesive tape 2, or to replace the old cutter 31b with a new cutter 31b when the cutting edge is significantly worn, and then completely cut the adhesive tape 2.

As described above, the circuit 3 for detecting tape non-cutting
5 and the alarm circuit 36, when an uncut portion occurs during the cutting operation of the adhesive tape, it is detected by the non-conduction of the circuit, and the complete cutting of the adhesive tape 2 is reliably achieved. .

After the adhesive tape 2 is completely cut by the tape cutter 31, the alarm circuit 36 is deactivated by the control device, and then the tape cutter 31 is retracted to the non-operation position. Then, the adhesive roller 22 and the tape peeling roller 22a are moved in a direction opposite to the tape feeding direction to peel the used unnecessary adhesive tape 2 in the tape adhesive area 60 from the frame 80, and thereafter, the adhesive tape The tape 2 is sent out in the tape feed direction by the tape feed roller 12, and is taken up by the tape take-up roller 13 via the tape tension adjusting section 19 for removing the slack of the adhesive tape 2.

Then, as shown in FIG.
The table 40 is retracted from the tape application area 60 to the work area 50 so as to take out the frame 80 and the wafer 70 integrally adhered with the adhesive tape 2 completely cut along the 70 is transferred to the next operation step, for example, a dicing step.

In the tape applying method according to the present invention, when the cutter 31b of the tape cutter 31 is rotated once to cut the adhesive tape 2, an alarm circuit 36 is provided.
When the alarm 38 generates an alarm, the cutter 31b can be automatically set to make another rotation, or the tape cutter can be caused to cut until the cutter 31b is completely cut. If an alarm is generated due to an uncut portion even after cutting is performed again, replacement of the cutter 31b can be prompted.

[0036]

As described above, the tape attaching method of the present invention integrates the workpiece and the frame with the adhesive tape, and allows the workpiece and the frame to be attracted and supported by a predetermined holding portion. A tape cutter that cuts the adhesive tape along the frame and a frame that is held by the frame holding portion and makes contact with the frame to form a circuit that is energized by the tape cutter. Is non-conducting, so that the uncut portion of the tape is detected by the method of detecting the uncut portion of the adhesive tape due to wear of the cutter, etc., and the cutting operation by the tape cutter is completely performed. It has an excellent effect that it becomes possible to do this.

The tape applying apparatus according to the present invention comprises a tape supply roller for supplying an unused tape, a tape feed roller for feeding a tape, a tape take-up roller for winding a used tape, a workpiece holding section and a frame. A tape affixing part that includes a holding part and affixes the workpiece and the frame together with an adhesive tape, and is positioned at the working position and the non-working position and cuts the adhesive tape along the frame when positioned at the working position A tape cutter, and an electrical conduction portion is formed in the frame holding portion, a circuit is formed between the tape cutter and the electrical conduction portion via a frame, and the tape cutter is positioned at an operation position. When cutting the tape along the frame, non-cutting of the tape is detected by non-conduction of electricity, so there is an uncut part in the adhesive tape In which an excellent effect of being able to prevent a disadvantage that cause wafer cracking by performing also the tape peeling regardless.

[Brief description of the drawings]

FIG. 1 is a perspective view of a tape applying device according to the present invention.

FIG. 2 is a schematic plan view of a tape application area and a work area in the tape application apparatus of the present invention.

FIG. 3 is a front view showing a schematic configuration and arrangement of the tape applying apparatus of the present invention.

FIG. 4 is an explanatory diagram showing a schematic configuration of a tape uncut detection circuit 35 and an alarm circuit 36 in the tape sticking apparatus of the present invention.

FIG. 5 is an explanatory view showing a state in which the adhesive tape is cut with a tape cutter by the tape applying device of the present invention.

FIG. 6 is an explanatory diagram showing a state in which a cutter and a frame come into contact with each other when the adhesive tape is cut by the tape applying device of the present invention when the adhesive tape is pierced.

FIG. 7 shows a state in which, after the adhesive tape is completely cut by the tape applying method of the present invention in the tape applying apparatus of the present invention, the table is retracted to the work area, and the frame and the wafer integrated by the adhesive tape are taken out. FIG.

FIG. 8 is a perspective view of a tape sticking device according to a conventional example.

FIG. 9 is an explanatory diagram showing a state of tape sticking by the tape sticking device according to the same example.

FIG. 10 is an explanatory view showing a state of tape cutting by the tape applying device according to the same example.

FIG. 11 is an explanatory view showing a state in which a gap is formed between a blade edge of a cutter and a frame and a non-cut portion is generated during cutting of an adhesive tape by a tape cutter in a tape applying device according to a conventional example.

[Explanation of symbols]

2 adhesive tape, 10 tape application device, 11 tape supply roller, 12 tape feed roller, 13 tape take-up roller, 22 application roller, 22a tape peeling roller, 31 tape cutter, 31b cutter,
31d cutter base, 31e support member, 35 circuit for detecting uncut tape, 36 alarm circuit, 37 relay, 38 alarm, 39, 41c power supply section, 40
Table, 41 frame mounting area, 41b electrical conduction section, 42 wafer mounting area, 50 working area, 60
Tape application area, 70 wafers, 80 frames.

Claims (4)

[Claims] 1. A method for attaching a workpiece and a frame to each other by an adhesive tape, wherein the workpiece and the frame are adsorbed and supported on a predetermined holding portion, and an adhesive tape is attached to the frame. A tape cutter that cuts the adhesive tape along the frame and a frame held by the frame holding portion are configured to make a circuit that is energized by contact with the frame. Detecting uncut, a method for applying a tape. 2. A tape application device for integrating a workpiece and a frame with an adhesive tape, the tape application device comprising: a tape supply roller for supplying an unused tape;
A tape feed roller that feeds the tape, a tape take-up roller that winds up the used tape, and a tape affixing unit that includes a workpiece holding unit and a frame holding unit and that integrally sticks the workpiece and the frame with an adhesive tape. A tape cutter that cuts the adhesive tape along the frame when positioned at the working position and the non-working position and positioned at the working position, wherein the frame holding portion is formed with an electrical conducting portion,
A circuit is formed through the frame between the tape cutter and the electric conduction portion, and when the tape cutter is positioned at the operation position and cuts the tape along the frame, the non-cutting of the tape is detected by non-conduction of electricity. A tape sticking device. 3. The tape sticking apparatus according to claim 2, wherein an alarm is issued when uncut tape is detected to notify an operator of uncut tape. 4. A tape cutter is operated until the tape is completely cut when the uncut tape is detected.
3. The tape sticking device according to 1.