JP4535907B2 - Positioning device with discrimination function - Google Patents

Description

  The present invention relates to a positioning device with a discriminating function that discriminates a semiconductor wafer as a workpiece and other types of different support plates, and determines their handling positions.

  A semiconductor wafer (hereinafter simply referred to as a “wafer”) is subjected to back surface processing by a mechanical method such as grinding or polishing, or a chemical method utilizing etching, and the thickness thereof is reduced. Further, when a wafer is processed using these methods, a protective tape is attached to the surface of the wafer in order to protect the wafer surface on which the wiring pattern is formed. Then, the wafer that has been subjected to the polishing process with the protective tape attached is rotationally scanned with the periphery sandwiched between the projector and the light receiving sensor, and the position information of the periphery is acquired. Based on this position information, the center position of the wafer is obtained (for example, see Patent Document 1).

Further, in recent years, with the rapid progress of applications, there has been a demand for thinning of wafers, and thinning is performed to 150 μm or less. Therefore, since the rigidity of the wafer itself decreases as the wafer becomes thinner, a support plate using a material that is substantially the same shape and thick or hard as the wafer is bonded to the wafer.
JP-A-8-279547

  However, the conventional method has the following problems.

  That is, when the wafer and the support plate are bonded together, the handling positions of both members must be aligned in advance so as to be in a predetermined direction. However, when alignment of objects to be bonded with different materials is performed with the same apparatus, there is a disadvantage that the alignment stage must be set for each member. Further, when the support plate is transparent, there is a problem that the position of the support plate cannot be detected in the conventional apparatus using the light projector and the light receiving sensor CCD because the light is transmitted through the support plate.

  The present invention has been made in view of such circumstances, and provides a positioning device with a discrimination function capable of discriminating a support plate of a type different from that of a semiconductor wafer and determining each handling position. Main purpose.

  The present invention has the following configuration in order to achieve the above object.

1st invention is the positioning device with a discrimination function which determines each handling position of a support plate from which a kind differs from a work,
Holding means for placing and holding a workpiece and a support plate as positioning objects;
Discriminating means for discriminating whether the object placed and held on the holding means is a workpiece or a different type of support plate;
In accordance with the determination result of the determining means, the position determining means for determining the handling position of the object placed and held on the holding means and performing positioning;
It is provided with.

  (Operation / Effect) According to the first invention, the holding means places and holds the workpiece and the support plate, which are positioning objects. The discriminating unit discriminates whether the object held by the holding unit is a workpiece or a different type of support plate. The position determining means determines the position to handle the object placed and held on the holding means according to the determination result of the determining means, and performs positioning.

  That is, according to this configuration, it is determined whether the object placed and held on the holding means is a workpiece or a support plate, and the handling position for each object is determined according to the determination result, and alignment is performed. Can do. In other words, it is possible to discriminate the types of different materials using the same device, so a series of processing from the discrimination of the types of objects that require alignment to the alignment is automatically and continuously performed. Can be done. As a result, it is not necessary to individually perform alignment settings for each object, so that work efficiency can be improved.

According to a second invention, in the first invention, the determination unit projects a light onto an object placed and held on the holding unit;
A light receiving unit for receiving reflected light from the object;
It is preferable that a received light amount determining unit that determines the workpiece and the support plate according to a change in the received light amount of the light receiving unit.

  (Operation / Effect) According to the second invention, the light projected from the light projecting unit is reflected by the object, and the reflected light is received by the light receiving unit. At this time, since the reflectance of light differs depending on the object, the amount of reflected light received by the light receiving unit changes. Therefore, it is possible to determine whether the object is a workpiece or a support plate according to the change level of the received light amount of the object.

In a third aspect based on the first aspect, the determining means measures a capacitance of an object placed and held on the holding means, and
It is preferable that a capacitance discriminating unit that discriminates a workpiece and a support plate according to the measurement result of the measuring unit is included.

  (Operation / Effect) According to the third invention, since the electrostatic capacity is different for different types of objects, depending on the measured change level of the electrostatic capacity, the object is a workpiece or a support plate. It can be determined whether there is. In addition, since the capacitance varies depending on the thickness of the object, the thickness of the object can also be determined.

In a fourth aspect based on the first aspect, the determination means includes a resistance measurement unit that measures an electrical resistance of an object placed and held on the holding means,
It is preferable that a resistance value discriminating unit for discriminating between the workpiece and the support plate is included according to the measurement result of the measuring unit.

  (Operation / Effect) According to the fourth invention, since the electric resistance varies depending on different types of objects, the object is a workpiece or a support plate according to the measured change level of the resistance value of the object. It can be determined whether there is.

According to a fifth invention, in any one of the first to fourth inventions, the position determining means is configured such that the object is formed of a transparent member, and a laser having a wavelength reflected by the object is a peripheral edge of the object. Irradiating part that irradiates in a state straddling
A detection unit comprising a light receiving unit that receives a laser from the irradiation unit;
Driving means for relatively moving the detection section and the holding means so that the detection section scans the periphery of the object;
An operation unit for obtaining position information of the object according to a change in the amount of light received by the light receiving unit, and obtaining a handling position of the object using the position information;
It is preferable to include a drive mechanism that aligns the handling position of the support plate by rotating the holding means horizontally or / and around the central axis according to the calculation result of the calculation unit.

  (Operation / Effect) According to the fifth aspect of the invention, the light receiving unit is moved to the periphery of the object by moving the detection unit and the holding unit relative to each other while irradiating the object with a laser having a predetermined wavelength reflected by the object of the transparent member. The amount of received light changes. Based on the change level of the amount of received light, the position information of the periphery of the object can be obtained. Moreover, if the said positional information is utilized, the handling position of the target object comprised with transparent members, such as a workpiece | work and a support plate, can be calculated | required.

  The workpiece is preferably a semiconductor wafer. When the workpiece is a semiconductor wafer, the positioning means is required to obtain center position, notch, and orientation flat position information as the position information of the semiconductor wafer.

  According to the positioning device with a determination function according to the present invention, it is determined whether the object placed and held on the holding means is a work or a support plate, and the handling position for each object according to the determination result is determined. Can be determined and aligned. In other words, it is possible to discriminate the types of different materials using the same device, so a series of processing from the discrimination of the types of objects that require alignment to the alignment is automatically and continuously performed. Can be done. As a result, it is not necessary to individually perform alignment settings for each object, so that work efficiency can be improved.

  Embodiments of the present invention will be described below with reference to the drawings. In this embodiment, a support plate laminating apparatus for bonding a support plate and a wafer, which includes a device with a discrimination function for discriminating between a semiconductor wafer (hereinafter simply referred to as “wafer”) and the support plate, will be described as an example. To do.

  FIG. 1 is a perspective view showing the overall configuration of the support plate laminating apparatus.

  This support plate and wafer bonding apparatus includes an object supply unit 1 and a robot arm on which a cassette C1 storing a wafer W as a bonding object and a cassette C2 storing a glass substrate G as a support plate are loaded. 2, a wafer transport mechanism 3, an alignment stage 4, a chuck table 5 on which the wafer W is placed and sucked and held, a tape supply unit 6 that supplies the double-sided adhesive tape T toward the wafer W, and a supply from the tape supply unit 6 The separator s1 on the side to be attached to the wafer W is peeled and collected from the double-sided adhesive tape T with separator, and the double-sided adhesive tape T is attached to the wafer W placed on the chuck table 5 and held by suction. An affixing unit 8; a tape cutting mechanism 9 for cutting out and cutting the double-sided adhesive tape T affixed to the wafer W along the outer shape of the wafer W; A peeling unit 10 that peels off the unnecessary tape T ′ after being attached to the airha W and cut, a tape recovery unit 11 that winds up and collects the unnecessary tape T ′ peeled off by the peeling unit 10, and both sides after the alignment is completed. A bonding unit 13 for bonding the wafer W to which the adhesive tape T is bonded and the glass substrate G are provided. A specific configuration of each structural unit and mechanism will be described below.

  The object supply unit 1 can be loaded with two cassettes C1 and C2 in parallel. In the cassette C1, a large number of wafers W with the wiring pattern surface facing upward are inserted and stored in multiple stages in a horizontal posture. In addition, in the cassette C2, a large number of glass substrates G are inserted and stored in multiple stages in a horizontal posture. The glass substrate G has a disk shape having the same diameter as the wafer W. The support plate is not limited to the glass substrate G, and may be anything that can give rigidity to the extent that it does not bend when bonded to the wafer W after thin processing. For example, quartz, stainless steel, or the like can be applied. Moreover, when using the support plate which consists of these materials, the thickness becomes the range of 700-1500 micrometers in thickness comparable as the wafer W.

  The robot arm 2 provided in the wafer transfer mechanism 3 is configured to be able to move forward and backward horizontally, and can be driven and swung up and down as a whole. At the tip of the robot arm 2, a horseshoe-shaped vacuum suction holding unit (not shown) is provided, and a gap between the wafers W or the glass substrates G housed in multiple stages in the cassettes C1 and C2 is provided. The wafer W or the glass substrate G is sucked and held from the back surface by inserting the holding portion into the wafer, and the wafer W or the like that is sucked and held is pulled out from the cassettes C1 and C2 and transported to the mechanisms.

  In this embodiment, when the robot arm 2 takes out the wafer W from the cassette C1, the wafer W is transferred in the order of the alignment stage 4, the chuck table 5, and the bonding unit 13.

  Moreover, when the robot arm 2 takes out the glass substrate G from the cassette C2, the glass substrate G is conveyed in the order of the alignment stage 4 and the bonding unit 13. Therefore, the robot arm 2 operates in two systems corresponding to the wafer W and the glass substrate G, which are objects to be bonded.

  As shown in FIGS. 2 to 4, the alignment stage 4 includes a rotation mechanism 31 that holds and rotates a wafer W or a glass substrate G that is an object on a holding table 30 that sucks and holds the object, and an object held on the holding table 30. A discriminating mechanism 32 for discriminating an object, a first peripheral edge measuring mechanism 33 for measuring the peripheral edge of the wafer W held on the holding table 30, and a second peripheral edge measurement for measuring the peripheral edge of the glass substrate G held on the holding table 30. The mechanism 34, the rotation angle of the rotation mechanism 31 and the calculation processing unit 38 that collects and calculates the position data of the peripheral edge of the wafer W corresponding to the rotation angle, and the elevation drive that allows the rotation mechanism 31 to move up and down relative to the rotation axis The mechanism 35 is configured.

  The rotating mechanism 31, the first peripheral edge measuring mechanism 33, the second peripheral edge measuring mechanism 34, the arithmetic processing unit 38, and the controller 39 correspond to the positioning means of the present invention, and the holding table 30 corresponds to the holding means. The determination mechanism 32 corresponds to a determination unit.

  As shown in FIG. 4, the holding table 30 has a rotation pulse motor 37 continuously provided at the lower portion thereof, and the rotation mechanism 31 can be rotated by driving the rotation pulse motor 37. In addition, a pulse of a digital signal is transmitted from the rotation pulse motor 37 to an arithmetic processing unit 38 to be described later at every fixed rotation angle. The constant rotation angle is, for example, 0.036 degrees, and 1000 pulses of a digital signal is transmitted to the arithmetic processing unit 38 provided in the controller 39 when the rotation mechanism 31 rotates once. A suction device (not shown) communicates with the suction hole h of the holding table 30. That is, a suction force for sucking the object placed and held is applied from the suction device to the suction hole h.

  The elevating drive mechanism 35 includes an X-axis stage 40 that can slide in the X-axis direction shown in FIG. 4 and a Y-axis stage 41 that can move in the Y-axis direction. As shown in FIG. 4, the X-axis stage 40 is placed on an X-axis linear guide 42 laid on the base 60 of the apparatus, and driven by an X-axis pulse motor 43 fixed to the base 60. It is provided so as to be movable in the X-axis direction.

  The Y-axis stage 41 is mounted on a Y-axis linear guide 44 laid on the X-axis stage 40 and can be moved in the Y-axis direction by driving a Y-axis pulse motor 45 fixed to the X-axis stage 40. Is provided. A stage receiver 46 and a rotation pulse motor 37 are fixed to the Y-axis stage 41.

  The discriminating mechanism 32 receives light reflected from the light projector 47 that projects light toward the object placed and held on the holding table 30 and the light projected from the light projector 47 is reflected from the back surface of the object. And a light receiving sensor 48. The light received by the light receiving sensor 48 is converted into a received light voltage, further converted into a predetermined digital signal, and transmitted to the arithmetic processing unit 38 of the controller 39.

  The first peripheral edge measuring mechanism 33 is provided on the side of the holding stage 36 (right side in the figure). The first peripheral edge measuring mechanism 33 condenses the substantially L-shaped cylinder 49, the mirror 51 interposed in the cylinder 49, and the light reflected by the mirror 51 with the lens 52. The light receiving sensor 53 is configured to receive light. The light receiving sensor 53 is a one-dimensional line sensor in which a plurality of light receiving elements are arranged on a straight line, and transmits light receiving data received by the line sensor to an arithmetic processing unit 38 described later.

  Further, the measuring stage 54 of the first peripheral edge measuring mechanism 33 is configured to be movable in the radial direction of the rotating mechanism 31 indicated by the horizontal arrow A shown in FIG. 4 along the linear guide. The measurement stage 54 is provided with a light source 55 that projects light toward the peripheral edge of the wafer W. As the light source 55, a fluorescent tube that projects white light is used.

  The second peripheral edge measuring mechanism 34 is provided on the side of the holding stage 36 (left side in the figure). Further, the second peripheral edge measuring mechanism 34 includes a projector 56 that irradiates a laser having a wavelength reflected on the surface of the glass substrate G vertically toward the peripheral edge of the glass substrate G, and the glass substrate G held on the holding table 30. It is composed of a light projector 56 disposed opposite to the light projector 56. The light receiving sensor 57 is a one-dimensional line sensor in which a plurality of light receiving elements are arranged on a straight line, and transmits light receiving data received by the line sensor to an arithmetic processing unit 38 to be described later. In addition, as a wavelength of a laser, it is 225-670 nm, Preferably it is 225-475 nm.

  The arithmetic processing unit 38 obtains the respective handling positions according to the determination of the object held on the holding table 30, the case where the object is the wafer W, and the case of the glass substrate G. Whether the object placed on the holding table 30 is the wafer W is determined based on a digital signal (measured value) indicating a change in the received light voltage transmitted from the light receiving sensor 48 of the determination mechanism 32. Then, a comparative determination is made as to whether or not the glass substrate G is used. For example, the reference value of the received light voltage associated with the reflectance of the wafer W and the glass substrate G set and inputted in advance to the controller 39 from the operation unit 58 is compared with the measured value, and the one that matches is selected.

  As a result of the determination, when the object is the wafer W, the center position of the wafer W is obtained, and the position of the V notch or the orientation flat formed on the peripheral edge of the wafer is obtained. The wafer center position is obtained by using the received light voltage when the light projected from the light source 55 of the first periphery measuring mechanism 33 to the periphery of the wafer is linearly received by the light receiving sensor 53 while rotating the holding stage 30. Obtain peripheral position information. Then, the distance from a certain point on the surface of the wafer W to the periphery is calculated, and the center position is determined by calculating the variance of the distance data of a predetermined ratio from the larger one of the obtained distance data. The determination of the center position of the wafer W is not limited to this calculation method, and may be obtained using a least square method or the like.

  Further, the determination of the position of the V notch or the like in the arithmetic processing unit 38 is obtained as follows, for example. First, change data of the received light voltage is acquired from the light receiving sensor 53 by one rotation scanning of the wafer W. Here, when the wafer periphery is a continuous arc, the light receiving sensor 53 is shielded by the wafer W, and the light receiving voltage is lowered. However, light such as the V notch is not shielded, and more light is received by the light receiving sensor 53 than other parts. Therefore, the received light voltage becomes high. A portion that is equal to or higher than a predetermined voltage before and after the portion where the peak value of the received light voltage is determined as a V notch or the like.

  Further, when the position of the V notch or the like of the wafer W is obtained, the arithmetic processing unit 38 determines the position (reference position) when the wafer W is taken out and transferred, for example, mounted in a ring frame in the next step. Considering this, a deviation amount between a predetermined reference position of the V notch and the detected position is calculated.

  Next, when the object is the glass substrate G, the center position of the glass substrate G is obtained in the same manner as the wafer W. The center position of the glass substrate G uses a light reception voltage when the laser irradiated to the wafer peripheral portion from the light projector 56 of the second peripheral measurement mechanism 34 is linearly received by the light receiving sensor 57 while rotating the holding stage 30. Then, position information on the periphery of the glass substrate is obtained. Then, the distance from a certain point on the surface of the glass substrate G to the periphery is calculated, and the center position is determined by calculating the variance of the distance data of a predetermined ratio from the larger one of the obtained distance data. The determination of the center position of the glass substrate is not limited to this calculation method, and may be determined using a least square method or the like.

  Returning to FIG. 1, the chuck table 5 vacuum-sucks the wafer W transferred from the wafer transfer mechanism 3 and placed in a predetermined alignment posture. Further, a cutter running groove is formed on the upper surface of the chuck table 5 in order to cut the double-sided adhesive tape T by rotating a cutter blade 12 provided in a tape cutting mechanism 9 described later along the outer shape of the wafer W. ing.

  As shown in FIGS. 5 to 8, the tape supply unit 6 guides the double-sided adhesive tape T with separators s1 and s2 fed from the supply bobbin 14 around the guide roller 15 group and peels the separator s1. The adhesive tape T is configured to be guided to the affixing unit 8 and is configured so as to give an appropriate rotational resistance to the supply bobbin 14 so that excessive tape feeding is not performed.

  In the separator collection unit 7, the collection bobbin 16 that winds up the separator s 1 peeled from the double-sided adhesive tape T is driven to rotate in the winding direction.

  The affixing unit 8 is provided with an affixing roller 17 that faces forward and is horizontally reciprocated by a slide guide mechanism 18 and a screw feed type driving mechanism (not shown).

  The peeling unit 10 is provided with a peeling roller 19 that is horizontally oriented forward, and is reciprocated horizontally by the slide guide mechanism 18 and a screw feed type driving mechanism (not shown).

  The tape collecting unit 11 is configured so that the collecting bobbin 20 that takes up the unnecessary tape T ′ is driven to rotate in the winding direction.

  The tape cutting mechanism 9 is provided with a pair of support arms 22 arranged in parallel at the lower part of a movable table (not shown) that can be driven up and down so as to be able to drive and rotate about a longitudinal axis X located on the center of the chuck table 5. A cutter unit 23 provided on the free end side of the support arm 22 is mounted with the cutter blade 12 with the blade tip facing downward, and the support blade 22 pivots around the longitudinal axis X so that the cutter blade 12 becomes the outer periphery of the wafer W. It is comprised so that it may run along and cut out the double-sided adhesive tape T.

  As shown in FIG. 9, the laminating unit 13 is composed of a rectangular box-shaped main case 21a that is open at the top, and a cover case 21b that is swingably opened and closed. A laminating mechanism is provided. Further, the cover case 21b is tightly closed to the main case 21a and the vacuum pump 22 is operated so that the inside of the chamber can be evacuated and decompressed.

  The laminating mechanism includes a holding table 23 for horizontally mounting and holding the wafer W, a pair of sheet clamps 24 and 25 erected on the front and rear sides of the holding table 23, and a horizontal horizontal A laminating roller 26 that is supported and driven back and forth between the sheet clamps 24 and 25 is provided. For convenience, the right side of the figure is the front and the left side is the rear.

  As shown in FIG. 10, the upper surface of the holding table 23 is configured as a vacuum suction surface, and the wafer W positioned and placed can be sucked and held. In addition, a heater H is embedded in the holding table 23 for heating and softening the adhesive of the double-sided adhesive tape T attached to the wafer W to enhance adhesion.

  The sheet clamps 24 and 25 are used for holding the both front and rear ends of the support sheet ST so as to float and extend along the upper side of the holding table 23. The upper and lower ends of the support sheet T are added to the upper portions of the sheet clamps 24 and 25. In addition, sheet holding portions 24a and 25a that support the support are provided. Here, while the rear (left in the figure) seat clamp 25 is fixedly arranged, the front (right in the figure) seat clamp 24 can swing back and forth around the fulcrum x at its lower end. In addition, a torsion spring (not shown) is assembled to the fulcrum x so that the seat clamp 24 tilts backward when a moment greater than the rearward setting is applied. Yes.

  The laminating roller 26 is configured by covering an outer periphery of a metal roller with an elastic material such as silicon rubber. The laminating roller 26 is provided on the lower side of a movable base 27 that can be moved back and forth and moved up and down inside the main case 21a. It is supported horizontally. Further, the laminating roller 26 can be driven to rotate by a motor 28, and during laminating operation for horizontally moving the laminating roller 26 forward, it is driven to rotate forward at the same peripheral speed as the forward movement speed. Yes.

  Although the detailed structure is not shown, the movable table 27 is supported by a lifting frame that is driven up and down by a pulse motor or the like so as to be horizontally movable back and forth via a guide shaft, and is of a belt type or a screw type. The laminating roller 26 is moved back and forth horizontally by the horizontal driving means, and the laminating roller 26 is moved back and forth horizontally by moving the movable base 27 back and forth, and the laminating roller 26 is moved up and down by raising and lowering a lifting frame (not shown). It is like that.

  Returning to FIG. 3, the controller 39 includes an arithmetic processing unit 38 and performs various arithmetic processes, and also includes a determination mechanism 32, a wafer transport mechanism 3 that constitutes a support plate laminating device, an alignment stage 4, a chuck table 5, and a tape supply unit 6. Each component such as the separator recovery unit 7, the pasting unit 8, the tape cutting mechanism 9, and the pasting unit 13 is controlled in a comprehensive manner.

  Next, after discriminating between the wafer W taken out from the cassettes C1 and C2 and the glass substrate G using the above-described embodiment apparatus, a series of basic operations for bonding both members together is based on the flowchart shown in FIG. I will explain.

  When a bonding command is issued, first, the robot arm 2 in the wafer transfer mechanism 3 is moved toward the cassette C1 or the cassette C2 placed and loaded on the object supply unit 1, and the holding unit at the tip is set to one of the cassettes. The object is inserted into the gap between the objects accommodated in the container, sucked and held from the back surface (lower surface), and the object taken out is transferred to the alignment stage 4 (step S1).

  The arithmetic processing unit 38 determines whether the object placed on the alignment stage 4 is the wafer W or the glass substrate G. That is, the light projected from the light projecting unit 47 of the determination mechanism 32 is reflected by the object, and the reflected light is received by the light receiving sensor 48. Based on the change in the amount of received light, the arithmetic processing unit 38 compares with a reference value obtained and set in advance to determine which is the target (step S2).

  When the object discrimination process is completed, the controller 39 selects either the first periphery measurement mechanism 33 or the second periphery measurement mechanism 34 according to the object (step S3). That is, when the object is the wafer W, the first periphery measuring mechanism 33 is selected (proceeding to step S4), and when the object is the glass substrate G, the second periphery selecting mechanism 34 is selected (proceeding to step S12). .

  When the object is the wafer W, the controller 39 operates the first peripheral measurement mechanism 33 to rotate and scan the holding table 30 with respect to the light source 55 and the light receiving sensor 53, and acquire positional information of the wafer peripheral (step). S4).

  When the acquisition of the position information is completed, the arithmetic processing unit 38 obtains the center position of the wafer W based on the acquired position information (Step S5). Further, an alignment portion such as a V notch is determined from the position information, and a deviation amount with respect to a predetermined reference position is obtained (step S6).

  When the center position and the amount of deviation are obtained by the arithmetic processing unit 38, the controller 39 controls the rotation mechanism 31 to align the wafer W with the handling position (step S8).

  When the alignment of the wafer W is completed, the robot arm 2 sucks and holds the wafer W and transfers it to the chuck table 5 (step S9). When the wafer W is transferred to the chuck table 5, the robot arm 2 takes out the object from a cassette different from the cassette from which the object has been taken out. That is, at this time, the robot arm 2 goes to take out the glass substrate G from the cassette C2, and the processing of the wafer W and the glass substrate G is performed in parallel.

  As shown in FIG. 5, the double-sided adhesive tape T with the separator s 1 on the wafer-facing surface peeled off is supplied from the tape supply unit 6 to the upper side of the wafer W sucked and held on the chuck table 5. The sticking roller 17 is lowered, and the sticking roller 17 rolls forward on the wafer W while pressing the double-sided adhesive tape T downward as shown in FIG. As a result, the double-sided adhesive tape T is attached to the surface of the wafer W.

  Next, when the affixing unit 8 reaches the end position, the cutter blade 12 waiting upward is lowered as shown in FIG. It is.

  When the cutter blade 12 is lowered to a predetermined cutting height position and stopped, the support arm 22 is rotated in a predetermined direction, and the cutter blade 12 is swung around the longitudinal axis X along with this, so that the double-sided adhesive tape T Are cut along the wafer outline.

  When the tape cutting along the outer periphery of the wafer W is completed, as shown in FIG. 8, the cutter blade 12 is raised to the original standby position, and then the peeling unit 10 is cut and cut on the wafer W while moving forward. The remaining unnecessary tape T ′ and separator s2 are rolled up and peeled off.

  When the peeling unit 10 reaches the end position of the peeling operation, the peeling unit 10 and the pasting unit 8 move in the opposite directions and return to the initial position. At this time, the unnecessary tape T 'is wound around the recovery bobbin 20, and a certain amount of the protective tape T is fed out from the tape supply unit 6 (step S10).

  When the tape pasting process is completed, after the suction on the chuck table 5 is released, the wafer W that has undergone the pasting process is transferred to the holding unit of the robot arm 2 and transferred to the holding table 23 of the bonding unit 13. (Step S11). Here, the processing of only the wafer W is completed.

  In addition, after the wafer W in step S 9 is transferred from the alignment stage 4 to the chuck table 5, the robot arm 2 takes out the glass substrate G from the cassette C 2 and transfers it to the alignment stage 4. That is, the processing from step S1 to step S3 is started.

  In the alignment stage 4, the controller 39 operates the discrimination mechanism 32 to discriminate the object (step S2). Here, since the object taken out from the cassette C2 is determined as the glass substrate G, the controller 39 selects based on the determination result to operate the second peripheral edge measuring mechanism 34 (step S3).

  The controller 39 operates the second peripheral edge measuring mechanism 34 to rotationally scan the holding table 30 with respect to the light projector 56 and the light receiving sensor 57, and acquires position information on the peripheral edge of the glass substrate (step S12). When the acquisition of the position information is completed, the arithmetic processing unit 38 obtains the center position of the glass substrate G based on the acquired position information (Step S13).

  When the central position of the glass substrate G is obtained by the arithmetic processing unit 38, the controller 39 controls the rotation mechanism 31 to align the glass substrate G with the handling position (step S14). When the alignment is completed, the glass substrate G is transferred to the holding unit of the robot arm 2 and is superposed on the wafer W previously placed and held on the holding table 23 of the bonding unit 13 (step S15).

  The controller 39 closes and closes the cover case 21b of the laminating unit 13 to the main case 21a and operates the vacuum pump 22 to evacuate and depressurize the chamber, and is above the glass substrate G as shown in FIG. The laminating roller 26 is rolled on the support sheet ST to bond the glass substrate G to the wafer W (step S16). When the bonding is completed, the bonding roller 26 returns to the initial position as shown in FIG. After that, the decompression in the unit is released and the wafer W integrated with the glass substrate G is sucked and held by the lot arm 2 and directly transferred to the next process, or once stored in a cassette and transferred to the next process. (Step S17). Thus, a series of bonding processes for the glass substrate G and the wafer W is completed.

  As described above, by providing the alignment stage 4 with the determination mechanism 32, it is possible to determine the wafer W and the glass substrate G, which are objects to be bonded, and the position of the object handling position according to the determination result. The alignment can be performed automatically and continuously. Therefore, it is not necessary to separately perform the setting for alignment of the alignment stage 4 according to the object, so that the work efficiency can be improved. Further, even if different types of objects are mixed in the cassette, they can be determined and removed in a series of processes. Even if the apparatus is suddenly stopped or restarted without any special setting, the object can be automatically identified and the bonding process can be performed. Furthermore, since there is no need to provide an alignment stage according to the object, the apparatus can be simplified.

  The present invention can also be implemented in the following forms.

  (1) In the above embodiment, the object is determined using the change in the reflected light from the object. However, the electrostatic capacity and the electrical resistance of the object are measured to determine the wafer W and the glass substrate G. May be determined. In this case, the thickness of the object can also be obtained. Therefore, it can be removed when support plates having different thicknesses are mixed.

  (2) In the above embodiment, the object is aligned in the non-contact state by rotating in the X-axis direction, the Y-axis direction, and the θ-direction of the holding table 30. It is also possible to carry out mechanically by putting them in contact with each other. However, when the object is the wafer W, it is preferable to perform the contactless process in order to avoid adhesion of dust and the like.

  (3) In the said Example, although the separate periphery measurement mechanisms 33 and 34 were provided according to the target object, when a support plate is transparent like the glass substrate G, the 2nd periphery measurement mechanism using a laser. Only 34 may be used to measure the peripheral edges of both the wafer W and the glass substrate G.

  (4) In the above embodiment, the two types of the wafer W and the glass substrate G are discriminated, but the object can be discriminated even if there are two or more types. Further, the type of discrimination is not limited to the wafer W and the glass substrate G.

It is a perspective view which shows the whole support plate bonding apparatus which concerns on one Example of this invention. It is a top view of an alignment stage. It is a front view including the electrical configuration of the alignment stage. It is a front view which shows the principal part structure of an alignment stage. It is a side view of a sticking unit. It is a figure explaining operation | movement of a sticking unit. It is a figure explaining operation | movement of a sticking unit. It is a figure explaining operation | movement of a sticking unit. It is a front view which shows the principal part structure of a bonding unit. It is a top view which shows the principal part structure of the bonding unit. It is a figure explaining operation | movement of a bonding unit. It is a figure explaining operation | movement of a bonding unit. It is a flowchart which shows the process of a support plate bonding apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 3 ... Wafer conveyance mechanism 4 ... Alignment stage 13 ... Bonding unit 31 ... Rotation mechanism 32 ... Discriminating mechanism 33 ... 1st periphery measuring mechanism 34 ... 2nd periphery measuring mechanism 38 ... Arithmetic processing part 39 ... Controller W ... Wafer T ... Both sides Adhesive tape

Claims (6)

It is a positioning device with a discrimination function that determines the handling position of each support plate of a different type from the workpiece,
Holding means for placing and holding a workpiece and a support plate as positioning objects;
Discriminating means for discriminating whether the object placed and held on the holding means is a workpiece or a different type of support plate;
In accordance with the determination result of the determining means, the position determining means for determining the handling position of the object placed and held on the holding means and performing positioning;
A positioning device with a discriminating function, comprising: In the positioning device with a discrimination function according to claim 1,
The determination unit includes a light projecting unit that projects light onto an object placed and held on the holding unit;
A light receiving unit for receiving reflected light from the object;
A received light amount determining unit for determining the workpiece and the support plate according to a change in the received light amount of the light receiving unit;
A positioning device with a discriminating function, comprising: In the positioning device with a discrimination function according to claim 1,
The determination unit includes a measurement unit that measures the capacitance of an object placed and held on the holding unit;
According to the measurement result of the measurement unit, a capacitance determination unit that determines a workpiece and a support plate,
A positioning device with a discriminating function, comprising: In the positioning device with a discrimination function according to claim 1,
The determination unit includes a resistance measurement unit that measures an electrical resistance of an object placed and held on the holding unit;
According to the measurement result of the measurement unit, a resistance value determination unit that determines a workpiece and a support plate,
A positioning device with a discriminating function, comprising: In the positioning device with a discrimination function according to any one of claims 1 to 4,
The position determining means is configured such that the object is made of a transparent member, and an irradiation unit that irradiates a laser having a wavelength reflected by the object across a periphery of the object;
A detection unit comprising a light receiving unit that receives a laser from the irradiation unit;
Driving means for relatively moving the detection section and the holding means so that the detection section scans the periphery of the object;
An operation unit for obtaining position information of the object according to a change in the amount of light received by the light receiving unit, and obtaining a handling position of the object using the position information;
A drive mechanism for aligning the handling position of the support plate by rotating the holding means horizontally or / and around the central axis according to the calculation result of the calculation unit;
A positioning device with a discriminating function, comprising: In the positioning device with a discrimination function according to any one of claims 1 to 5,
The workpiece is a semiconductor wafer. A positioning apparatus with a discrimination function, wherein the workpiece is a semiconductor wafer.

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