JPH10209040A - 露光装置 - Google Patents
露光装置Info
- Publication number
- JPH10209040A JPH10209040A JP9280574A JP28057497A JPH10209040A JP H10209040 A JPH10209040 A JP H10209040A JP 9280574 A JP9280574 A JP 9280574A JP 28057497 A JP28057497 A JP 28057497A JP H10209040 A JPH10209040 A JP H10209040A
- Authority
- JP
- Japan
- Prior art keywords
- exposure apparatus
- heat insulating
- chamber
- insulating member
- exposure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
- G03F7/70891—Temperature
Landscapes
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Toxicology (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Atmospheric Sciences (AREA)
- Public Health (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9280574A JPH10209040A (ja) | 1996-11-25 | 1997-10-14 | 露光装置 |
| DE69711157T DE69711157T2 (de) | 1996-11-25 | 1997-11-24 | Belichtungsapparat |
| EP97309445A EP0844532B1 (en) | 1996-11-25 | 1997-11-24 | Exposure apparatus |
| KR1019970062553A KR19980042711A (ko) | 1996-11-25 | 1997-11-25 | 노광 장치 |
| US09/907,763 US6714278B2 (en) | 1996-11-25 | 2001-07-19 | Exposure apparatus |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31327596 | 1996-11-25 | ||
| JP8-313275 | 1996-11-25 | ||
| JP9280574A JPH10209040A (ja) | 1996-11-25 | 1997-10-14 | 露光装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10209040A true JPH10209040A (ja) | 1998-08-07 |
| JPH10209040A5 JPH10209040A5 (enExample) | 2005-06-30 |
Family
ID=26553831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9280574A Pending JPH10209040A (ja) | 1996-11-25 | 1997-10-14 | 露光装置 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0844532B1 (enExample) |
| JP (1) | JPH10209040A (enExample) |
| KR (1) | KR19980042711A (enExample) |
| DE (1) | DE69711157T2 (enExample) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000016381A1 (en) * | 1998-09-14 | 2000-03-23 | Nikon Corporation | Exposure apparatus and its manufacturing method, and device producing method |
| US6598283B2 (en) | 2001-12-21 | 2003-07-29 | Cabot Corporation | Method of preparing aerogel-containing insulation article |
| JP2005203754A (ja) * | 2003-12-08 | 2005-07-28 | Asml Netherlands Bv | リソグラフィ装置及びデバイス製造方法 |
| JP2006216866A (ja) * | 2005-02-04 | 2006-08-17 | Canon Inc | 位置決め装置、露光装置およびそれを用いたデバイス製造方法 |
| JP2006261273A (ja) * | 2005-03-16 | 2006-09-28 | Canon Inc | チャンバおよびこれを用いた露光装置 |
| US7359032B2 (en) | 2003-08-29 | 2008-04-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP2009182326A (ja) * | 2008-01-31 | 2009-08-13 | Asml Netherlands Bv | リソグラフィ装置、方法、およびデバイス製造方法 |
| JP2009200494A (ja) * | 2008-02-21 | 2009-09-03 | Asml Holding Nv | 液浸リソグラフィのリフロ及びバッファシステム |
| JP2010258448A (ja) * | 2009-04-24 | 2010-11-11 | Asml Netherlands Bv | 開放気泡プラスチック発泡体部品がある基板支持体を有するリソグラフィ装置 |
| JP2011071509A (ja) * | 2009-09-22 | 2011-04-07 | Asml Netherlands Bv | リソグラフィ装置の支持体又はテーブル、そのような支持体又はテーブルの製造方法、及びそのような支持体又はテーブルを備えるリソグラフィ装置 |
| JP2015095503A (ja) * | 2013-11-11 | 2015-05-18 | キヤノン株式会社 | 露光装置、およびデバイスの製造方法 |
| JP2017515142A (ja) * | 2014-04-30 | 2017-06-08 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置及びデバイス製造方法 |
| JP2021085911A (ja) * | 2019-11-25 | 2021-06-03 | キヤノン株式会社 | 露光装置、および物品製造方法 |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW588222B (en) * | 2000-02-10 | 2004-05-21 | Asml Netherlands Bv | Cooling of voice coil motors in lithographic projection apparatus |
| EP1124161A3 (en) * | 2000-02-10 | 2004-01-07 | ASML Netherlands B.V. | Lithographic projection apparatus having a temperature controlled heat shield |
| EP1178357A1 (en) * | 2000-08-03 | 2002-02-06 | Asm Lithography B.V. | Lithographic apparatus |
| US6630984B2 (en) | 2000-08-03 | 2003-10-07 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
| KR100689705B1 (ko) * | 2001-05-04 | 2007-03-08 | 삼성전자주식회사 | 투영 렌즈 온도 조절 수단을 구비하는 노광장치 |
| EP1477850A1 (en) * | 2003-05-13 | 2004-11-17 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| EP1491955A1 (en) | 2003-06-27 | 2004-12-29 | ASML Netherlands B.V. | Lithographic projection apparatus and device manufacturing method |
| US7061579B2 (en) | 2003-11-13 | 2006-06-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| CN101276150B (zh) * | 2008-03-21 | 2010-06-02 | 上海微电子装备有限公司 | 一种步进重复曝光装置 |
| US10133197B2 (en) | 2014-07-16 | 2018-11-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| NL2016298A (en) * | 2015-03-23 | 2016-09-30 | Asml Netherlands Bv | Lithographic apparatus, and device manufacturing method |
| CN112925175A (zh) * | 2021-01-29 | 2021-06-08 | 深圳市大族数控科技股份有限公司 | 一种曝光机 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58119638A (ja) * | 1982-01-08 | 1983-07-16 | Seiko Epson Corp | 露光装置 |
| US4564284A (en) * | 1983-09-12 | 1986-01-14 | Canon Kabushiki Kaisha | Semiconductor exposure apparatus |
| JPS62296135A (ja) * | 1986-06-17 | 1987-12-23 | Nec Kyushu Ltd | 縮小投影型露光装置 |
| JP2794587B2 (ja) * | 1989-01-30 | 1998-09-10 | 株式会社ニコン | 投影露光装置 |
| US4989031A (en) * | 1990-01-29 | 1991-01-29 | Nikon Corporation | Projection exposure apparatus |
| JP2753930B2 (ja) * | 1992-11-27 | 1998-05-20 | キヤノン株式会社 | 液浸式投影露光装置 |
| US5376449A (en) * | 1993-07-09 | 1994-12-27 | Martin Marietta Energy Systems, Inc. | Silica powders for powder evacuated thermal insulating panel and method |
| US5601897A (en) * | 1994-10-17 | 1997-02-11 | Owens-Corning Fiberglass Technology Inc. | Vacuum insulation panel having carbonized asphalt coated glass fiber filler |
| JP3506158B2 (ja) * | 1995-04-14 | 2004-03-15 | 株式会社ニコン | 露光装置及び走査型露光装置、並びに走査露光方法 |
-
1997
- 1997-10-14 JP JP9280574A patent/JPH10209040A/ja active Pending
- 1997-11-24 DE DE69711157T patent/DE69711157T2/de not_active Expired - Fee Related
- 1997-11-24 EP EP97309445A patent/EP0844532B1/en not_active Expired - Lifetime
- 1997-11-25 KR KR1019970062553A patent/KR19980042711A/ko not_active Ceased
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6583857B2 (en) | 1998-09-14 | 2003-06-24 | Nikon Corporation | Exposure apparatus and its making method, and device manufacturing method |
| WO2000016381A1 (en) * | 1998-09-14 | 2000-03-23 | Nikon Corporation | Exposure apparatus and its manufacturing method, and device producing method |
| US6598283B2 (en) | 2001-12-21 | 2003-07-29 | Cabot Corporation | Method of preparing aerogel-containing insulation article |
| US7679720B2 (en) | 2003-08-29 | 2010-03-16 | Asml Netherlands B.V. | Apparatus configured to position a workpiece |
| US7359032B2 (en) | 2003-08-29 | 2008-04-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP2005203754A (ja) * | 2003-12-08 | 2005-07-28 | Asml Netherlands Bv | リソグラフィ装置及びデバイス製造方法 |
| JP2006216866A (ja) * | 2005-02-04 | 2006-08-17 | Canon Inc | 位置決め装置、露光装置およびそれを用いたデバイス製造方法 |
| JP2006261273A (ja) * | 2005-03-16 | 2006-09-28 | Canon Inc | チャンバおよびこれを用いた露光装置 |
| US8310651B2 (en) | 2008-01-31 | 2012-11-13 | Asml Netherlands B.V. | Lithographic apparatus, method and device manufacturing method |
| JP2009182326A (ja) * | 2008-01-31 | 2009-08-13 | Asml Netherlands Bv | リソグラフィ装置、方法、およびデバイス製造方法 |
| JP2009200494A (ja) * | 2008-02-21 | 2009-09-03 | Asml Holding Nv | 液浸リソグラフィのリフロ及びバッファシステム |
| US8451422B2 (en) | 2008-02-21 | 2013-05-28 | Asml Netherlands B.V. | Re-flow and buffer system for immersion lithography |
| JP2010258448A (ja) * | 2009-04-24 | 2010-11-11 | Asml Netherlands Bv | 開放気泡プラスチック発泡体部品がある基板支持体を有するリソグラフィ装置 |
| US8400617B2 (en) | 2009-04-24 | 2013-03-19 | Asml Netherlands B.V. | Lithographic apparatus having a substrate support with open cell plastic foam parts |
| JP2011071509A (ja) * | 2009-09-22 | 2011-04-07 | Asml Netherlands Bv | リソグラフィ装置の支持体又はテーブル、そのような支持体又はテーブルの製造方法、及びそのような支持体又はテーブルを備えるリソグラフィ装置 |
| JP2015095503A (ja) * | 2013-11-11 | 2015-05-18 | キヤノン株式会社 | 露光装置、およびデバイスの製造方法 |
| JP2017515142A (ja) * | 2014-04-30 | 2017-06-08 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置及びデバイス製造方法 |
| US9921497B2 (en) | 2014-04-30 | 2018-03-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP2021085911A (ja) * | 2019-11-25 | 2021-06-03 | キヤノン株式会社 | 露光装置、および物品製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR19980042711A (ko) | 1998-08-17 |
| DE69711157D1 (de) | 2002-04-25 |
| EP0844532A2 (en) | 1998-05-27 |
| EP0844532B1 (en) | 2002-03-20 |
| EP0844532A3 (en) | 1999-08-18 |
| DE69711157T2 (de) | 2002-08-14 |
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