JPH10200300A - Method for inspecting mounting board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To correct a printed board while eliminating the effect of slip between a carrying means and the printed board or vibration by putting a considerable number of board correction marks on the printed board and selecting a mark depending on the relative positional relationship of a line sensor, a camera and the printed board. SOLUTION: Board correction marks are classified into two groups A, B on the border of one half the width of a board. the board is corrected by selecting a mark from each group. The marks are selected sequentially in a descending order of the coordinate value in the carrying direction for each group. When a plurality of board correction marks of group A are present between a board correction mark 14b of group B currently used and a board correction mark 15b to be used next, the image of the board correction mark 15b of group B is picked up by means of a line sensor camera 17 and the board is corrected using the board correction mark 14b until a predetermined region being delivered to an image processing means 19 is entered.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection method for a mounting appearance inspection apparatus in the field of electronic component mounting.

[0002]

2. Description of the Related Art In recent years, mounting of electronic parts has been progressing toward high-density mounting as products have become lighter and thinner, and as a result, mounting appearance inspection apparatuses have been actively developed.

Hereinafter, an example of an inspection method of the above-described conventional mounting appearance inspection apparatus will be described with reference to the drawings.

[0004] In the system shown in FIG.
The printed circuit board 2 to be inspected is transported by the line sensor camera 3 installed above the printed circuit board 2 to be inspected, and the image is stored in the image storage means 4, and the image 5 in a certain area is stored. Is processed by the image processing means 6, and the inspection processing is performed by the determination processing means 7 based on the result. First, the position correction of the printed circuit board 2 being transported is performed in the transport direction. This is performed with two board correction marks 8a and 8b arranged at the head of the printed board.

[0005]

However, in the above configuration, since only two board correction marks arranged at the head of the printed board in the transport direction are used, the printed board is transported by the transport means. In the case of performing an appearance inspection, there has been a problem that board correction cannot be performed accurately due to slippage between the belt of the conveying means and the printed board after the correction, vibration of the belt, and the like.

[0006]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a considerable number of board correction marks on a printed board, and a relative positional relationship between a line sensor, a camera, and a printed board on a conveying means. And correcting the substrate by selecting a substrate correction mark according to

According to the mounting board inspection method configured as described above, when carrying out the appearance inspection while transporting the printed board by the transporting means, a considerable number of board correction marks are provided on the printed board, and the line sensor and the line sensor are provided. The board correction mark is selected according to the relative positional relationship between the camera and the printed circuit board on the transfer means, and the board is corrected.Therefore, it is not affected by slippage between the belt of the transfer means and the printed board, vibration of the belt, etc. Substrate correction can be performed.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described based on embodiments with reference to FIGS. 1, 2 and 3. FIG.

In FIG. 1, reference numeral 9 denotes a printed circuit board to be inspected, and reference numerals 10 to 13 denote a number of board correction marks provided on the printed circuit board to be inspected.

First, the substrate correction mark is placed in the Y direction in FIG.
The substrate is divided into two groups A and B with a half of the width W of the substrate as a boundary. Substrate correction is performed using the group A substrate correction marks 10a to 10a.
13a and one of the groups B 10b to 13b. The selection method is as follows. In FIG. 1, each group is selected in the X direction (transport direction) in descending order of its coordinate value. At this time, for example, as shown in FIG.
A plurality of board correction marks (14a, 15a, 1a) of the group A are provided between the board correction mark 14b currently used for the board correction of the group B and the board mark 15b to be used next.
6a) If present, board correction mark 15 of group B
Until “b” is imaged by the line sensor camera 17, stored in the image storage unit 18, and enters a certain area sent to the image processing unit 19, the correction is performed using the preceding substrate correction mark 14 b. The above substrate correction processing is appropriately performed together with the inspection.

When a plurality of line sensor cameras (20, 21) are used, as shown in FIG. Are divided into groups C and D, and the above-described substrate correction is performed in the groups C and D.

[0012]

According to the present invention, when the appearance inspection is performed while the printed circuit board is being conveyed by the conveying means, the substrate is not affected by the slip between the belt of the conveying means and the printed board, the vibration of the belt and the like. Correction can be performed.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of a substrate of the present invention.

FIG. 2 is a configuration diagram showing an embodiment of a mounting board method of the present invention.

FIG. 3 is a plan view showing an embodiment of the relationship between the substrate and the line sensor according to the present invention.

FIG. 4 is a configuration diagram showing a conventional mounting appearance inspection apparatus.

[Explanation of symbols]

 9 Printed circuit board to be inspected 10 Board correction mark

Claims (2)

[Claims] A transport unit that transports the inspection target printed circuit board; a line sensor camera that captures an image of the inspection target printed circuit board being transported by the transport unit; and an image storage unit that stores an image captured by the line sensor camera. An image processing unit that cuts out an image of a certain area from an image stored in the image storage unit and performs an image measurement process, and a determination processing unit that performs a determination based on a result of the image processing unit. In a mounting appearance inspection device that performs inspection, a considerable number of board correction marks are provided on the printed board, and the board correction mark is selected by selecting the board correction mark according to the relative positional relationship between the line sensor, the camera, and the printed board on the conveyance means. A mounting board inspection method characterized by performing. 2. When a plurality of line sensor cameras are used in claim 1, a considerable number of board correction marks are provided on a printed board corresponding to each line sensor camera,
A method for inspecting a mounted board, wherein board correction is performed by selecting a board correction mark according to a relative position of each line sensor, a camera, and a printed board on a transporting means.