JPH10197556A - Inspection device for inspected circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inspection device for inspected circuit boards which is capable of cleaning the foremost part of a pin simply while the configuration remains relatively simply and can put the pin in certain contact with a terminal. SOLUTION: A circuit board inspection device is composed of a pin board 1 where a plurality of pins 3, 3A... are implanted in a board 2, an elevation part 8 to move the pin board 1 in the vertical direction, and a mounting device 9A for a circuit board to be inspected P enclosing the pin board 1 and elevation part 8 and having a part 12 for mounting the circuit board P at the opening provided in the oversurface. Within the mounting device, a duct 13 is formed so that the pin board surface at the tip of the pin is included in the wall surface of the duct, and an opening 13a for air delivery is formed at one side of the duct 13 while an opening for exhaust 13c is formed at the other side, and an air sending device 14 is installed at the opening 13a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for inspecting a substrate to be inspected, and more particularly, to the contact between a substrate to be inspected and a pin of a pin board when inspecting a printed wiring board (substrate to be inspected) on which electronic components and the like are mounted. Regarding improvement.

[0002]

2. Description of the Related Art In general, printed circuit boards having various circuits such as an ALB circuit, an airbag control circuit, a power supply circuit, an amplifier circuit, and a high-frequency circuit are used for a car electronics device, a television receiver, an audio device, and the like. Built-in. These printed wiring boards are used to check whether the circuit operates properly before being incorporated into actual equipment.
Whether or not there is a defect in an electronic component or a circuit is inspected by an inspection device.

For such an inspection, an inspection apparatus as shown in FIGS. 3 and 4, for example, is used. In the figure,
Reference numeral 1 denotes a pin board for inspection, which is constructed by planting a plurality of pins 3 and 3A on a board 2 made of, for example, an insulating member so as to be exposed on both sides of the board 2. The pins 3 and 3A are basically configured to be substantially the same. Specifically, for example, a conductive sleeve 4 mounted in the hole 2a of the board 2 and one of the sleeves 4 are provided. A first pin body 5 slidably inserted into the opening, a second pin body 6 inserted and fixed into the other opening of the sleeve 4, and a first pin body 6 in the sleeve. And a coiled spring 7 disposed between the pin body 5 and the second pin body 6. In particular, the main difference between the pins 3 and 3A is that the tip of the first pin body 5 has a sharply pointed portion 5a and a crown-shaped contact portion 5b. In addition, these pins 3 and 3
A is electrically connected to a measuring device via a lead wire (not shown).

[0004] The pin board 1 is provided with elevating parts 8, 8 such as air cylinders, for example, which are configured to move up and down by a fixed stroke in relation to the inspection timing. The pin board 1 and the elevating units 8, 8
Are covered by a mounting device 9 for a printed wiring board (substrate to be inspected). The mounting device 9 mainly comprises a box-shaped main body 10 which covers the pin board 1 and the elevating portions 8, 8, and a plurality of pins 3 and 3A of the pin board 1 are provided on an upper surface 10a of the main body 10. An opening 11 having a size that can be inserted is formed. Further, a frame-shaped attachment portion 12 of the substrate to be inspected, for example, is arranged around the opening 11.

[0005]

The inspection of a substrate to be inspected by the inspection apparatus is performed as follows. First, as shown in FIG. 3, a printed wiring board (substrate to be inspected) P is set on the mounting portion 12 of the mounting device 9. next,
The pin boards 1 are raised to the positions indicated by the dotted lines in the figure by driving the elevating units 8, 8, and the pins 3, 3A are elastically pressed against predetermined portions of the printed wiring board P. In this state,
The tip portions 5a and 5b of the first pin body 5 in A are pressed against the terminals and are brought into electrical contact therewith. In this state, various inspections are performed by a measuring device (not shown).

According to this inspection device, since the springs 7 are built in the pins 3 and 3A, even if the pin contact surface of the printed wiring board P has some unevenness, the unevenness is not Absorbed by 7,
By appropriately moving the pin board 1 up and down, the first
And the terminals are connected to the tips 5a, 5b of the pin body 5 of FIG.

However, on the surface of the electronic component on the printed wiring board P, a residue of the flux used to promote the solderability to the terminal to the conductive land forms a film, so that the pin board is formed. As a result of the contact operation 1, the flux residue F adheres to the tips 5a and 5b of the first pin body 5 as shown in FIG. 4, and the electrical contact with the terminals is impaired. In addition, the reliability of the test is impaired.

Therefore, conventionally, an operator periodically cleans the tips of the pins 3 and 3A of the pin board 1 by using a brush or high-pressure air, or in response to the occurrence of a pseudo defect in the inspection. Although the former method involves cleaning, the former method has the problem of increasing the number of cleaning work steps and increasing the cost, and the latter method has a problem in that the printed circuit board during the period when pseudo defects are occurring However, there is a problem that the reliability cannot be sufficiently maintained.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an apparatus for inspecting a substrate to be inspected, which can easily clean a tip end portion of a pin with a relatively simple structure and can surely contact a pin with a terminal. It is in.

[0010]

SUMMARY OF THE INVENTION Accordingly, in order to achieve the above-mentioned object, the present invention provides a pin board having a plurality of pins planted on the board, and an elevating part for vertically moving the pin board. And a mounting device for the substrate to be inspected which covers at least the pin board and has a mounting portion for the substrate to be inspected in an opening on the upper surface. The pin board surface is formed so as to be included in the wall surface of the duct, and a fluid is caused to flow through the duct to remove an insulating member attached to the pin.

According to a second aspect of the present invention, there is provided a pin board having a plurality of pins planted on the board, an elevating portion for vertically moving the pin board, at least a cover for covering the pin board and an upper surface. And a mounting device for the substrate to be inspected having a mounting portion for the substrate to be inspected at an opening portion of the substrate, wherein a duct is included in the mounting device for the substrate to be inspected, and a pin board surface on a tip end side of the pin is included in a wall surface of the duct. And an opening for air supply in one of the ducts, an opening for discharge in the other, and an air supply device arranged in one opening of the duct, A third invention is characterized in that an air supply device is arranged at one opening of the duct, and a suction device is arranged at the other opening, and a fourth invention is characterized in that the other opening of the duct has the other opening. The filter is arranged in a ventilation path close to the part.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of an inspection apparatus for a substrate to be inspected according to the present invention will be described with reference to FIGS. The same parts as those of the conventional example shown in FIGS. 3 and 4 are denoted by the same reference numerals, and detailed description thereof will be omitted. In this figure, the feature of this embodiment lies in the internal structure of the mounting device 9A for the substrate to be inspected (for example, a printed wiring board) P and its peripheral structure.

The mounting device 9A includes, for example, a pin board 1
And a box-shaped main body 10 that covers the lifting and lowering sections 8, 8;
Opening 11 formed on the upper surface 10a of the
In the printed wiring board P arranged in the peripheral portion of the main body 10, for example, the frame-shaped mounting portion 12 and the internal space of the main body 10 are provided with pin board surfaces on the protruding side of the tips 5a, 5b of the pins 3, 3A. A duct 13 formed to include as a part of
A first opening 13a of a duct 13 formed to open on one side wall 10b of the main body 10, and a duct 1 formed to open on the other side wall 10c of the main body 10.
3, the second and third openings 13b and 13c, the air supply device 14 disposed in the first opening 13a, and the second opening 1
3b, a suction device 16 disposed at the third opening 13c, and a ventilation path of the duct 13 between the second opening 13b and the third opening 13c. And a filter 17 which is provided.

Next, the operation of the inspection apparatus will be described with reference to FIGS.
This will be described with reference to FIG. First, as shown in FIG. 1, the printed wiring board P on which electronic components and the like are mounted is set on the mounting portion 12 of the mounting device 9A such that the terminals are on the duct 13 side. In this state, the opening 11 is closed, and the surface of the pin board 1 on the protruding side of the pins 3 and 3A forms a part of the wall surface of the duct 13. Next, the lifting units 8, 8 are driven to raise the pin board 1 to the position indicated by the dotted line in the figure.
As a result, the tips 5a and 5b of the pins 3 and 3A of the pin board 1 make contact with the terminals of the printed wiring board P so as to be pressed. Next, in this state, various inspections are performed by supplying various signals to the pins 3 and 3A from a measuring device (not shown). After the completion of the inspection, the lifting units 8, 8 are lowered to the position indicated by the solid line in the figure. In this state, the air supply device 14 and the suction device 16 are driven, and the fluid (high-pressure air) generated by the air supply device 14 is supplied to the first opening 1.
When the high-pressure air is sent into the duct 13 through the suction device 3a, the high-pressure air flows in the duct together with the suction operation of the suction device 16, and is discharged from the suction device 16 to the outside of the main body through the filter 17 and the third opening 13c. Is done. When this high pressure air flows,
The flux residue F adhered to the tips 5a and 5b of the pins 3 and 3A is removed, and the flux F is carried to the portion where the filter 17 is arranged by the flow of high-pressure air. Then, as a result of being captured by the filter 17, only air is released from the suction device 16 to the outside of the main body. It should be noted that the residue F such as flux captured by the filter 17 is periodically removed from the second opening 13b after removing the closing member 15, and is cleaned.

According to this inspection apparatus, when high-pressure air is sent into the duct, the high-pressure air is applied to the tips 5a and 5b of the pins 3 and 3A on the pinboard surface side which constitute a part of the wall surface of the duct 13. Because the air is blown, the tip portions 5a, 5b
The residue F of the flux adhered to the surface can be easily removed. Therefore, the electrical contact between the tips 5a and 5b of the pins 3 and 3A and the terminals of the printed wiring board P can always be kept good, and a highly reliable inspection can be performed.

In particular, if high-pressure air is caused to flow through the duct 13 before or after the inspection of the printed wiring board P, the tips 5a and 5b of the pins 3 and 3A can be kept clean at all times. Not only the reliability can be improved, but also the cleaning work by the operator can be omitted, and an improvement in cost can be expected.

Further, the flux residue F removed by the high-pressure air is captured by the filter 17 and is not discharged out of the main body, so that there is no influence on the environment. The second opening 13b is formed, and by using the opening 13b, the residue F accumulated in the filter 17 can be easily discharged and removed.

In particular, the air supply device 14 is provided in the first opening 13a.
If the suction device 16 is arranged in the third opening 13c,
The high-pressure air is strongly blown to the tips 5a and 5b of the pins 3 and 3A, so that the residue F can be more effectively removed.

The present invention is not limited to the above-described embodiment, but may be omitted, for example, by connecting the air supply device to a high-pressure air pipe laid in a factory. Further, the suction device can be omitted. further,
A fluid other than high-pressure air can be used, and the fluid can be supplied from a plurality of locations in the duct.

[0020]

As described above, according to the present invention, when a fluid is fed into the duct, the fluid is sprayed on the tip of the pin board side pin constituting a part of the wall surface of the duct. Therefore, the residue of the flux attached to the tip of the pin can be easily removed. Therefore, the electrical contact between the tip of the pin and the terminal of the substrate to be inspected can always be kept good, and a highly reliable inspection can be performed.

In particular, if a fluid is caused to flow through the duct before or after the inspection in conjunction with the inspection of the substrate to be inspected, the tip of the pin can be kept clean at all times, further improving the reliability of the inspection. Not only can it be done, but the cleaning work by the operator can be omitted, and improvement in cost can be expected.

Further, the residue of the flux removed by the fluid is captured by the filter and is not discharged out of the main body, so that there is no influence on the environment, and the second opening is formed in the side wall near the filter. Are formed, and by using this opening, the residue F accumulated in the filter can be easily discharged and removed.

In particular, if an air supply device is arranged in the first opening and a suction device is arranged in the third opening, and high-pressure air is used as the fluid, the high-pressure air can be strongly blown to the tip of the pin. And the residue can be more effectively removed.

[Brief description of the drawings]

FIG. 1 is a side sectional view showing one embodiment of a device for inspecting a substrate to be inspected according to the present invention.

FIG. 2 is a plan view of FIG.

FIG. 3 is a side sectional view of a conventional inspection device.

FIG. 4 is a sectional view of a main part of FIG. 3;

[Explanation of symbols]

 P Board to be inspected (printed board) F Residue of flux 1 Pin board 2 Board 3, 3A pin 5a, 5b Pin tip 8 Elevating section 9A Mounting device for board to be inspected 10 Main body 10a Top surface 10b, 10c Side wall 11 Opening 12 Mounting part 13 Duct 13a, 13b, 13c Opening 14 Air supply device 15 Closure 16 Suction device 17 Filter

Claims (4)

[Claims] A pin board having a plurality of pins erected on the board.
A board for moving the pin board up and down, and a mounting device for the board to be inspected which covers the pin board and the lifting and lowering section and has a mounting portion for the board to be inspected in an opening on the upper surface. A duct is formed in the mounting device for the inspection board so that the pin board surface on the tip end side of the pin is included in the wall surface of the duct, and a fluid is caused to flow through the duct to remove the insulating member attached to the pin. Characteristic inspection device for inspected substrates. 2. A pin board having a plurality of pins erected on the board.
A board for moving the pin board up and down, and a mounting device for the board to be inspected which covers the pin board and the lifting and lowering section and has a mounting portion for the board to be inspected in an opening on the upper surface. A duct is formed in the mounting device of the inspection board so that the pin board surface on the tip end side of the pin is included in the wall surface of the duct, and one of the ducts has an air supply opening and the other has a discharge opening. An inspection apparatus for inspecting a substrate to be inspected, wherein an air supply device is formed in one of the openings of the duct. 3. The inspection apparatus for inspecting a substrate to be inspected according to claim 2, wherein an air supply device is arranged in one opening of the duct and a suction device is arranged in the other opening. 4. The method for inspecting a substrate to be inspected according to claim 2, wherein a filter is disposed in a ventilation path near the other opening of the duct.