JPH10178266A - Manufacture of circuit board and method and device for printing solder paste - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily print solder paste on the intermediate member of a circuit board at the time of mounting second electromechanical parts by putting a solder mask having solder paste printing hole forming areas on the solder paste printing surface of the intermediate member and moving a squeegee along the bulges of the solder mask. SOLUTION: A solder mask 20 is put on the intermediate member of a circuit board and a squeegee 30 is moved along the mask 20. The mask 20 has bulges 21a-21d and, in a solder-connected parts mounting area, solder paste printing pattern hole forming areas 22a-22h which are closely adhered to the solder paste printing surface of the intermediate member. The squeegee 30 has recesses 31a-31d so as to avoid the bulges 21a-21d of the mask 20 and solder paste 40 is pushed out of printing holes 23a-23h so that the paste 40 can adhere to the solder-connected parts mounting area of a circuit board 1 by pressurizing the paste 40 by driving the squeegee 30 so that the recesses 31a-31d can move along the bulges 21a-21d.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a circuit board, a solder paste printing method and a solder mask device used in the method for manufacturing a circuit board, and more particularly to a method for dividing a large insulating substrate into a plurality of regions. The present invention relates to a method and an apparatus for mounting an electric circuit element having the same configuration in a region, dividing the electric circuit element into each divided region, and manufacturing a plurality of circuit boards having the same configuration.

[0002]

2. Description of the Related Art Bonding connection parts such as semiconductor elements (bare chips) mounted on an insulating substrate on which a thin or thick wiring pattern is formed and electrically connected by wire bonding, and the bonding connection parts and bonding wires In order to manufacture a circuit board having a convex portion made of a sealing resin for protecting the circuit board and a soldered electrical component (hereinafter referred to as a soldered connection component), one large-sized insulating substrate is connected to a plurality of circuits. A method of dividing the circuit board into parts and mounting the electric components in the respective divided areas, dividing the divided parts into the respective divided areas to form a plurality of circuit boards having the same configuration, is a method of forming a plurality of circuit boards on one large board. Therefore, there is an advantage that the number of operation steps can be reduced or the operation efficiency can be increased because the mounting operation of the electric components for the operation can be performed collectively.

A method of manufacturing a circuit board includes a method of mounting two types of electrical components having different mounting methods on a surface on the same side as a surface on which a sealing resin is formed. After mounting, there is a method in which soldering is performed by a reflow method, and thereafter, a bonding connection component is mounted, wire-bonded, and resin-sealed.

[0004] This method has an advantage that the solder paste can be printed easily and with high precision because the printing surface when printing the solder paste is flat without any protrusions of the sealing resin. . However, in order to connect bonding connection parts with bonding wires after soldering,
If the terminal for wire bonding on the substrate is contaminated by solder flux, uncleaned residue, or the like, the reliability of connection may be reduced. For this reason, this method has a drawback in that a rigorous cleaning operation step is required after the reflow soldering to remove the solder flux and the cleaning residue so that there is no residue.

For this reason, it is desirable to mount the bonding connection component before mounting the solder connection component.

[0006] As described above, in a circuit board on which a bonding connection component and a solder connection component are mixed and mounted, the solder connection component mounted before mounting the solder connection component is precisely soldered to the vicinity of the sealing resin convex portion. JP-A-63-268288 discloses a method for printing a paste.
As described in Japanese Patent Application Laid-Open Publication No. H10-209, there is a method of printing using a solder mask in which a relief hole is processed so as to avoid a convex portion due to a sealing resin.

However, a method of printing a solder paste on a substrate using a solder mask processed so as to avoid the sealing resin convex portion is required to divide the substrate to form a plurality of circuit boards having the same configuration. In a circuit board manufacturing process in which a plurality of sets of electric components are mounted in a plurality of partitioned areas each of which is formed by dividing one large board, there is a lack of a device for facilitating printing of a solder paste on each partitioned area.

[0008]

As described above, the conventional method for manufacturing a circuit board and the method and apparatus for printing a solder paste therefor use one large insulating board which is divided into a plurality of circuit boards. A board is used to mount electric components twice in two different mounting methods on a plurality of divided areas for each circuit board (for example, after mounting a first electric component by wire bonding connection). It lacks a device for facilitating the printing of the solder paste for the second electrical component mounting (when the second electrical component is mounted by reflow soldering connection).

One object of the present invention is to perform solder paste printing for mounting a second electric component on a circuit board intermediate member having a plurality of projections formed by mounting the first electric component. An object of the present invention is to propose a solder paste printing method that can be easily performed and a solder mask device therefor. Specifically, by mounting the bonding connection component, it is possible to easily perform solder paste printing for mounting the solder connection component on the circuit board intermediate member on which the plurality of sealing resin protrusions are formed. It is to propose a solder paste printing method and a solder mask device therefor.

Another object of the present invention is to divide a large insulating substrate into a plurality of regions to be divided, mount bonding connection components in each of the divided regions, and then mount and divide the soldering connection components to divide the plurality of regions. It is to propose a simple circuit board manufacturing method for forming a circuit board.

[0011]

SUMMARY OF THE INVENTION According to the present invention, a wiring pattern and an electrode portion are formed in each of a plurality of divided regions of a large insulating substrate, and an electric circuit mounted in each of the divided regions on the substrate. One large circuit board intermediate member having a plurality of convex portions formed by the components is formed, and a solder paste is printed on a substrate on the same side as the surface on which the convex portions are formed, and the soldering connection components are soldered. In the circuit board manufacturing method and the solder paste printing method, between the bulge formed between the bulge formed along the alignment of the convex portion in each of the partitioned regions of the circuit board intermediate member to receive the convex portion A solder mask having a solder paste printing hole forming surface that is formed and continuously spreads in each partitioned area is superimposed on the solder paste printing surface of the circuit board intermediate member, and is recessed so as to avoid the swelling. Moving the squeegee in the direction along the bulge, thereby printing the solder paste on the solder mask on each of the divided areas of the circuit board intermediate member, and then using the printed solder paste to form a solder connection component. Is soldered.

A solder mask in which a bulge is formed so as to receive a convex portion of a plurality of electrical components mounted in advance on an insulating substrate and a squeegee in which a concave portion is formed so as to avoid the bulge are provided by a plurality of squeegees. It is easy to print the solder paste accurately between the rows of the convex portions.

In particular, a solder paste for mounting a soldered component between convex portions of a sealing resin is printed on a circuit board intermediate member in which a plurality of electric components are wire-bonded and resin-sealed on an insulating substrate. It is effective to do.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a circuit board on which a bonding connection component and a solder connection component manufactured according to the present invention are mounted. FIG. 2 is a perspective view of a circuit board intermediate member in which a bonding connection component and a solder connection component are mounted in a plurality of partitioned areas partitioned on one large insulating substrate. FIG. 3 is a perspective view showing a solder paste printing process for mounting a soldering connection component on a circuit board intermediate member in which a bonding connection component is mounted on each of a plurality of partitioned areas partitioned on one large insulating substrate. It is.

The circuit board 10 (10) manufactured according to the present invention
a to 10n) are shown in FIG.
As shown in FIG. 2, a plurality of rows of a plurality of divided areas are divided into one large insulating substrate 1 so as to obtain a small insulating substrate 1a corresponding to each of the circuit boards 10a to 10d. The bonding connection component mounting area 11a (11a1 to 11a4) is formed for each row of the partitioned area.
To 11d and the soldering connection component mounting area 12a (12a1
12a4) to 12h are partitioned to form wiring patterns and connection electrodes. Bonding connection component mounting areas 11a (11a1 to 11a4) to 11d and soldering connection component mounting areas 12a (12a1 to 12a4) to 1 for each partitioned area
2h are arranged so as to form a line that is parallel and linearly continuous to the method of moving the squeegee for solder paste printing (in the direction of the arrow). In this embodiment, the soldering connection component mounting areas 12a (12a1 to 12a4) to
12h is a bonding connection component mounting area 11a-11
It is arranged on both sides of d so as to be linearly arranged in parallel with it.

A bonding connection component 13a is mounted on each of the bonding connection component mounting regions 11a to 11d in each of the divided regions, and after being connected to the connection electrodes by bonding, resin sealing is performed. 1
4a to 14d are formed. When mounting a plurality of bonding connection components in each partitioned area, they may be arranged in the squeegee moving direction.

The soldering connection component mounting areas 12a (12a1 to 12a4) and 12b (12b1 to 12b)
12b4) to 12h, a solder paste is printed using a solder mask device, and the soldering connection parts 15a1 to 15a1
5a4, 15b1 to 15b4... Are mounted by reflow soldering using this solder paste.

In this solder paste printing, as shown in FIG. 3, bonding connection parts for each of the wiring boards 10a to 10d are mounted on the insulating substrate 1 and the sealing resin projections 14a to 1d are formed.
The solder mask 20 is superimposed on the circuit board intermediate member on which the solder mask 4d is formed, and the squeegee 30 is moved along the solder mask 20 in the direction of the arrow, whereby the solder mask 2
The solder paste 40 on the substrate 0 is pressed and extruded onto the soldering surface of the circuit board intermediate member.

The solder mask 20 has bulges 21a to 21d for receiving the respective rows of the sealing resin projections 14a to 14d covering the bonding connection components 13a mounted on the circuit board intermediate member, and the solder connection component mounting. Area 12
In a to 12h, a solder paste printing pattern hole forming region 22a which is in close contact with the solder paste printing surface of the circuit board intermediate member.
~ 22h. The bulges 21a to 21d and the solder paste print pattern hole forming regions 22a to 22h extend linearly and continuously along the component mounting regions 11a to 11d and 12a to 12h. This extension direction is squeegee 3
0 is made to coincide with the moving direction. In the solder paste print pattern hole forming areas 22a to 22h, print holes 23a to 23h for printing the solder paste 40 on the component connection electrodes are formed.

The squeegee 30 is formed with concave portions 31a to 31d so as to avoid the bulges 21a to 21d of the solder mask 20, and the concave portions 31a to 31d are formed.
31d is driven so as to move along the bulges 21a to 21d to press the solder paste 40, and the printing holes 23a to 2d are pressed.
3h, the solder paste 40 is extruded and soldered connection component mounting areas 12a (12a1 to 12a4) of the circuit board 1 are formed.
12b (12b1 to 12b4) to 12h.

In order to reduce the waste of the solder paste 40, the solder paste 40 pressed by the moving squeegee 30 leaks from a gap between the squeegee 30 and the solder mask 20 and is left on the surface of the solder mask 20. It is necessary to prevent it from remaining. For this purpose, the bulges 21a to 21d of the solder mask 20 are
0 is formed linearly and continuously in the movement direction of the squeegee 30, and the recessed portions 31a to 31d of the squeegee 30
It is desirable that the bulges 21a to 21d slide in close contact with the outer periphery thereof.

A solder connection component is mounted on the circuit board intermediate member on which the solder paste 40 is printed, and the solder paste 40
To heat the soldering connection parts.

The large circuit board intermediate member in which the bonding connection component 13 and the solder connection components 15a1 and 15b1 are mounted in each of the divided areas as described above is divided into each of the divided areas, as shown in FIG. Individual circuit boards 10a (to
10n).

In the above-described embodiment, the method of printing the solder paste for mounting the soldering connection component by reflow soldering after mounting the bonding connection component has been described. The present invention is not limited to the connection, and can be widely applied to the manufacture of a circuit board which needs to mount the electric component before mounting the soldered connection component because the mounting method is different.

[0025]

According to the present invention, a soldering connection is made to a circuit board intermediate member in which some electric components are mounted in a plurality of regions partitioning a large insulating substrate and a plurality of projections are formed. Printing of solder paste for mounting components becomes easy. For example, a semiconductor element (bare chip) such as an IC or an LSI is connected to a circuit board by wire bonding and mounted by resin sealing, followed by a resistor, a capacitor, a diode, and a package IC.
In a printing method and apparatus for printing a solder paste for soldering and mounting a soldering connection component on a circuit board, the printing of the solder paste becomes easy.

Therefore, according to the present invention, a large insulating substrate is divided into a plurality of regions, a plurality of types of electrical components are mounted in each of the divided regions by a plurality of mounting operations, and then the substrate is divided into a plurality of regions. A circuit board can be easily formed.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of a circuit board manufactured according to the present invention.

FIG. 2 is a perspective view showing one embodiment of an intermediate member of a circuit board manufactured according to the present invention.

FIG. 3 is a perspective view showing one embodiment of a process of printing solder paste on an intermediate member of a circuit board manufactured according to the present invention.

[Explanation of symbols]

1, 1a: insulating substrate, 10a to 10n: circuit board, 14
a to 14d: sealing resin protrusion, 20: solder mask, 21a
21d: swelling, 22a to 22h: solder paste print pattern hole forming region, 23a23h: printing hole, 30: squeegee, 31: concave portion, 40: solder paste.

Claims (13)

[Claims] A large insulating substrate is divided into a plurality of regions to be divided, a wiring pattern and a connection electrode portion are formed in each region, and a plurality of convex portions formed by electric components mounted on the substrate are formed. A solder paste printing method for printing a solder paste for soldering a soldering connection component on a board on the same side as a surface on which the convex portion is formed, for a large circuit board intermediate member, comprising: A bulge formed along the alignment of the protrusions in each of the divided regions of the intermediate member and receiving the respective protrusions, and a solder paste printing hole formed between the bulges and continuously extending in each of the divided regions. A solder mask having a surface is superimposed on a solder paste printing surface of the circuit board intermediate member, and a squeegee concavely processed to avoid the bulge is moved in a direction along the bulge. Therefore, a solder paste printing method, wherein a solder paste on the solder mask is printed on each of the divided areas of the circuit board intermediate member. 2. A wiring pattern and a connection electrode portion are formed in each of a plurality of divided areas of a large insulating substrate to be divided, and a bonding connection component mounted in each of the divided regions on the substrate and the bonding connection component The sealing resin projections were formed on one large circuit board intermediate member on which a plurality of projections of sealing resin were formed to cover and protect the bonding wires connecting the electrode portions to the bonding wires. In a solder paste printing method of printing a solder paste for soldering a connection component to be soldered on a substrate on the same side as a surface, the sealing resin convex portion in each of the divided regions of the circuit board intermediate member is arranged. A bulge formed along the ridge to receive each of the sealing resin protrusions, and a half having a solder paste printing hole forming surface formed between the bulges and continuously extending to each of the divided areas. A solder mask is superimposed on the solder paste printing surface of the circuit board intermediate member, and the squeegee concavely processed so as to avoid the bulge is moved in a direction along the bulge. A solder paste printing method, wherein printing is performed on each section area of a circuit board intermediate member. 3. The solder paste printing method according to claim 1, wherein a solder mask having a continuous bulge is used for each of the projections of each of the divided areas arranged in the squeegee moving direction. 4. The solder paste printing method according to claim 1, wherein a solder mask is superimposed on the intermediate member of the circuit board so that the bulge comes into close contact with each projection. 5. A wiring pattern or an electrode portion is formed in each of a plurality of divided regions of a large insulating substrate, which are to be divided,
One large circuit board intermediate member in which a plurality of protrusions are formed by electric components mounted on each of the divided regions on the board is formed, and solder is mounted on the same board as the surface on which the protrusions are formed. A circuit board manufacturing method of printing a paste and soldering a soldering connection component, comprising: a bulge formed along the alignment of the protrusions in each of the divided regions of the circuit board intermediate member to receive the protrusions. And a solder mask having a solder paste printing hole forming surface formed between the bulges and continuously extending to each of the divided areas is superimposed on the solder paste printing surface of the circuit board intermediate member so as to avoid the bulges. By moving the concave squeegee in the direction along the bulge, the solder paste on the solder mask is printed on each partitioned area of the circuit board intermediate member. A method for manufacturing a circuit board, comprising: soldering a connection component to be soldered using a solder paste obtained. 6. A wiring pattern and an electrode portion are formed in each of a plurality of divided areas of a large insulating substrate, which are to be divided,
One large circuit formed with a plurality of projections of a sealing resin for covering a bonding connection component mounted on each partition area on the substrate and a bonding wire for connecting the bonding connection component to the electrode portion and protecting the bonding wires. A circuit board manufacturing method for forming a board intermediate member and printing a solder paste on a substrate on the same side as a surface on which the sealing resin convex portion is formed and soldering a soldering connection component, Bulges formed along the array of the sealing resin protrusions in each of the partitioned regions, and formed between the bulges to receive the respective sealing resin protrusions, and continuously spread to the respective partition regions. A solder mask having a solder paste printing hole forming surface is superimposed on a solder paste printing surface of the circuit board intermediate member, and a squeegee concavely processed to avoid the swelling is expanded. The solder paste on the solder mask is printed on each partitioned area of the circuit board intermediate member by moving in the direction along only
A method for manufacturing a circuit board, comprising: soldering a connection component using a printed solder paste. 7. A plurality of circuit boards according to claim 5 or 6, wherein the circuit board intermediate member to which the soldering connection parts are soldered is divided into respective divided areas along the rows of the projections. A circuit board manufacturing method characterized by the following. 8. The method according to claim 5, wherein the soldering position of the soldering connection component is formed so as to be located between the rows of the projections along the squeegee moving direction. Circuit board manufacturing method. 9. The circuit board manufacturing method according to claim 5, wherein the convex portions of each of the regions are linearly arranged in a squeegee moving direction. 10. A solder mask device for printing a solder paste for soldering a soldering connection component on a substrate on the same side as a surface on which a plurality of electric components mounted on an insulating substrate are formed with a convex portion, A plurality of protrusions of the circuit board intermediate member to be masked and formed so as to coincide with each other, and a bulge that receives each of the protrusions is formed between the bulges, and is continuously formed in a region in the squeegee moving direction. A solder mask device, wherein a solder paste printing hole forming area is provided which extends. 11. A plurality of bonding connecting parts mounted on an insulating substrate and a plurality of sealing resin projections for covering and protecting the bonding wires connecting the bonding connecting parts to the electrode portions on the insulating substrate. For the circuit board intermediate member, in a solder mask device for printing a solder paste for soldering a soldering connection component on the same board as the surface on which the sealing resin convex portion is formed, A squeegee movement is formed between the bulges formed between the bulges, which are formed so as to coincide with the plurality of sealing resin ridges of the circuit board intermediate member to be masked by superimposition and receive the respective sealing resin ridges. A solder mask device characterized in that a solder paste printing hole forming region continuously extending in a direction region is provided. 12. The solder mask device according to claim 10, wherein the bulge for receiving the convex portion is formed continuously for a plurality of convex portions. 13. The solder mask device according to claim 10, wherein the bulge for receiving the convex portion is formed continuously with respect to the plurality of convex portions in the squeegee moving direction.