JPH10178054A - 半導体集積回路接続用基板およびそれを構成する部品ならびに半導体装置 - Google Patents
半導体集積回路接続用基板およびそれを構成する部品ならびに半導体装置Info
- Publication number
- JPH10178054A JPH10178054A JP9215111A JP21511197A JPH10178054A JP H10178054 A JPH10178054 A JP H10178054A JP 9215111 A JP9215111 A JP 9215111A JP 21511197 A JP21511197 A JP 21511197A JP H10178054 A JPH10178054 A JP H10178054A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- substrate
- layer
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- JFNWATIZEGZGSY-UHFFFAOYSA-N n,n-diethylethanamine;trifluoroborane Chemical compound FB(F)F.CCN(CC)CC JFNWATIZEGZGSY-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 238000009823 thermal lamination Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9215111A JPH10178054A (ja) | 1996-10-15 | 1997-08-08 | 半導体集積回路接続用基板およびそれを構成する部品ならびに半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8-272246 | 1996-10-15 | ||
| JP27224696 | 1996-10-15 | ||
| JP9215111A JPH10178054A (ja) | 1996-10-15 | 1997-08-08 | 半導体集積回路接続用基板およびそれを構成する部品ならびに半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10178054A true JPH10178054A (ja) | 1998-06-30 |
| JPH10178054A5 JPH10178054A5 (enExample) | 2004-10-07 |
Family
ID=26520676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9215111A Pending JPH10178054A (ja) | 1996-10-15 | 1997-08-08 | 半導体集積回路接続用基板およびそれを構成する部品ならびに半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10178054A (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001294843A (ja) * | 2000-04-13 | 2001-10-23 | Toray Ind Inc | 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シートならびに半導体装置 |
| WO2002017379A1 (en) * | 2000-08-25 | 2002-02-28 | Toray Industries, Inc. | Semiconductor joining substrate-use tape with adhesive and copper-clad laminate sheet using it |
| US8217275B2 (en) | 2006-12-04 | 2012-07-10 | Panasonic Corporation | Sealing material and mounting method using the sealing material |
| JP2013058764A (ja) * | 2007-10-05 | 2013-03-28 | Hitachi Chemical Co Ltd | 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体 |
| JP2019039005A (ja) * | 2012-08-23 | 2019-03-14 | スリーエム イノベイティブ プロパティズ カンパニー | 構造用接着フィルム |
| WO2022202427A1 (ja) * | 2021-03-24 | 2022-09-29 | 太陽インキ製造株式会社 | 熱硬化性樹脂組成物、ドライフィルム、硬化物、プリント配線板および電気電子部品 |
-
1997
- 1997-08-08 JP JP9215111A patent/JPH10178054A/ja active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001294843A (ja) * | 2000-04-13 | 2001-10-23 | Toray Ind Inc | 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シートならびに半導体装置 |
| WO2002017379A1 (en) * | 2000-08-25 | 2002-02-28 | Toray Industries, Inc. | Semiconductor joining substrate-use tape with adhesive and copper-clad laminate sheet using it |
| US6982484B2 (en) | 2000-08-25 | 2006-01-03 | Toray Industries, Inc. | Semiconductor joining substrate utilizing a tape with adhesive and copper-clad laminate sheet |
| US8217275B2 (en) | 2006-12-04 | 2012-07-10 | Panasonic Corporation | Sealing material and mounting method using the sealing material |
| JP2013058764A (ja) * | 2007-10-05 | 2013-03-28 | Hitachi Chemical Co Ltd | 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体 |
| JP2019039005A (ja) * | 2012-08-23 | 2019-03-14 | スリーエム イノベイティブ プロパティズ カンパニー | 構造用接着フィルム |
| WO2022202427A1 (ja) * | 2021-03-24 | 2022-09-29 | 太陽インキ製造株式会社 | 熱硬化性樹脂組成物、ドライフィルム、硬化物、プリント配線板および電気電子部品 |
| JPWO2022202427A1 (enExample) * | 2021-03-24 | 2022-09-29 | ||
| CN117120551A (zh) * | 2021-03-24 | 2023-11-24 | 太阳控股株式会社 | 热固化性树脂组合物、干膜、固化物、印刷布线板以及电气电子部件 |
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