JPH10135692A - プリント配線板取り付け用台盤 - Google Patents
プリント配線板取り付け用台盤Info
- Publication number
- JPH10135692A JPH10135692A JP8303662A JP30366296A JPH10135692A JP H10135692 A JPH10135692 A JP H10135692A JP 8303662 A JP8303662 A JP 8303662A JP 30366296 A JP30366296 A JP 30366296A JP H10135692 A JPH10135692 A JP H10135692A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- board
- flat plate
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000007246 mechanism Effects 0.000 claims abstract description 20
- 238000003825 pressing Methods 0.000 claims description 24
- 238000012360 testing method Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract 2
- 230000003044 adaptive effect Effects 0.000 abstract 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 229910052742 iron Inorganic materials 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 238000005304 joining Methods 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8303662A JPH10135692A (ja) | 1996-10-29 | 1996-10-29 | プリント配線板取り付け用台盤 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8303662A JPH10135692A (ja) | 1996-10-29 | 1996-10-29 | プリント配線板取り付け用台盤 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10135692A true JPH10135692A (ja) | 1998-05-22 |
| JPH10135692A5 JPH10135692A5 (enExample) | 2004-10-21 |
Family
ID=17923722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8303662A Pending JPH10135692A (ja) | 1996-10-29 | 1996-10-29 | プリント配線板取り付け用台盤 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10135692A (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002204097A (ja) * | 2000-12-28 | 2002-07-19 | Taiyo Yuden Co Ltd | フレキシブル回路基板保持具及びそれを使用したフレキシブル回路基板の保持方法。 |
| KR100724524B1 (ko) | 2006-11-01 | 2007-06-04 | 주식회사 티이피 | 인쇄 회로 기판 고정용 지그 조립체 |
| JP2007258532A (ja) * | 2006-03-24 | 2007-10-04 | Densei Lambda Kk | 基板及びこの基板を用いた生産方式 |
| KR101185521B1 (ko) * | 2011-04-08 | 2012-09-24 | 주식회사 동우정밀 | 인쇄회로기판의 홀가공용 보드 |
| JP2023161740A (ja) * | 2022-04-26 | 2023-11-08 | ニチコン株式会社 | 反射型光電センサおよびその製造方法 |
-
1996
- 1996-10-29 JP JP8303662A patent/JPH10135692A/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002204097A (ja) * | 2000-12-28 | 2002-07-19 | Taiyo Yuden Co Ltd | フレキシブル回路基板保持具及びそれを使用したフレキシブル回路基板の保持方法。 |
| JP2007258532A (ja) * | 2006-03-24 | 2007-10-04 | Densei Lambda Kk | 基板及びこの基板を用いた生産方式 |
| KR100724524B1 (ko) | 2006-11-01 | 2007-06-04 | 주식회사 티이피 | 인쇄 회로 기판 고정용 지그 조립체 |
| KR101185521B1 (ko) * | 2011-04-08 | 2012-09-24 | 주식회사 동우정밀 | 인쇄회로기판의 홀가공용 보드 |
| JP2023161740A (ja) * | 2022-04-26 | 2023-11-08 | ニチコン株式会社 | 反射型光電センサおよびその製造方法 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20040217 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20051220 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060105 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20060531 |